阅读说明：本技术 用于线路板电子感光干膜的高分子聚合物及其制备方法 (High-molecular polymer for electronic photosensitive dry film of circuit board and preparation method thereof ) 是由 江波 于 2021-01-07 设计创作，主要内容包括：本发明公开了用于线路板电子感光干膜的高分子聚合物及其制备方法,包括30％-40％的丙烯酸酯类单体,5％-10％的羧基及羟基功能单体,0.1％-0.5％的引发剂和50％-60％的溶剂。本发明的有益效果是：本发明通过对反应釜内部进行加压,来提高反应温度,从而克服了现有技术因溶剂沸点低而无法提高反应温度从而降低VOC的限制,从而降低对人体的伤害；采用加压提高反应温度的工艺可以大大减少引发剂的用量,在进行溶剂选择范围更加广泛,且降低显影液的更换频率,从而降低了生产成本；同时,将每批生产所需要的原材料一次性的进行制备,并分别灌入到加压反应釜、滴加罐和添加罐中,根据生产进程依次进行添加,从而保证加压反应釜内部气压的稳定,进一步的提高感光干膜的转化率。(The invention discloses a high molecular polymer for an electronic photosensitive dry film of a circuit board and a preparation method thereof, wherein the high molecular polymer comprises 30-40% of acrylate monomers, 5-10% of carboxyl and hydroxyl functional monomers, 0.1-0.5% of an initiator and 50-60% of a solvent. The invention has the beneficial effects that: the reaction temperature is increased by pressurizing the inside of the reaction kettle, so that the limitation that the reaction temperature cannot be increased due to low boiling point of a solvent in the prior art so as to reduce VOC (volatile organic compounds) is overcome, and the harm to a human body is reduced; the process of increasing the reaction temperature by pressurization can greatly reduce the dosage of the initiator, has wider selection range of the solvent, and reduces the replacement frequency of the developing solution, thereby reducing the production cost; simultaneously, the raw materials required by each batch of production are prepared at one time, and are respectively filled into the pressurized reaction kettle, the dropwise adding tank and the adding tank, and the raw materials are sequentially added according to the production process, so that the stability of the internal air pressure of the pressurized reaction kettle is ensured, and the conversion rate of the photosensitive dry film is further improved.)

1. A high molecular polymer for circuit board electron sensitization dry film which characterized in that: according to the mass percentage, the formula comprises 30-40% of acrylate monomers, 5-10% of carboxyl and hydroxyl functional monomers, 0.1-0.5% of initiator and 50-60% of solvent.

2. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 1, wherein: the acrylic ester monomer comprises methyl methacrylate, butyl methacrylate, isobutyl methacrylate, methyl acrylate, ethyl acrylate and butyl acrylate.

3. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 1, wherein: the carboxyl functional monomer is one of methacrylic acid, maleic anhydride, fumaric acid and itaconic acid.

4. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 1, wherein: the hydroxyl functional monomer comprises one of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate and hydroxybutyl acrylate.

5. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 1, wherein: the initiator comprises one of benzoyl peroxide, tert-butyl peroxydiethylhexanoate, tert-butyl peroxybenzoate, azobisisobutyronitrile and azobisisovaleronitrile.

6. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 1, wherein: the solvent comprises acetone and ethanol, wherein the acetone and ethanol are mixed according to a ratio of 4: 1 by mass percent.

7. A method for preparing the high molecular polymer for the dry film electronic photosensitive for circuit boards according to any one of claims 1 to 5, characterized in that: the preparation method comprises the following steps:

firstly, preparing raw materials, namely preparing an acrylate monomer, a carboxyl and hydroxyl functional monomer, an initiator and a solvent of a high-molecular polymer of a photosensitive dry film, stirring and mixing the acrylate monomer, the carboxyl and hydroxyl functional monomer, dividing the solvent into three parts and dividing the initiator into two parts according to a formula;

secondly, performing preliminary preparation, namely adding a part of solvent into the pressurized reaction kettle, closing a feed inlet of the pressurized reaction kettle, sealing a column at the feed inlet, pressurizing and heating the inside of the pressurized reaction kettle, and raising the temperature of the inside of the pressurized reaction kettle to 90 ℃;

thirdly, dropwise adding raw materials, pouring the acrylate monomer, the carboxyl and hydroxyl functional monomer, the initiator and the solvent into a stirring tank according to a formula ratio, stirring, conveying to the dropwise adding tank, and uniformly dropwise adding into the pressurized reaction kettle for a certain time between the dropwise adding tank and the pressurized reaction kettle;

fourthly, heating and preserving heat, namely heating the pressurized reaction kettle and ensuring the temperature of the pressurized reaction kettle to be 95-100 ℃ after the stirring mixed liquid in the dripping tank is dripped, and preserving the heat of the pressurized reaction kettle for two-hour to four-hour;

fifthly, supplementing raw materials, adding the prepared residual solvent and the initiator into the pressurized reaction kettle through the adding tank, and preserving the temperature of the pressurized reaction kettle for two to four hours to ensure that the raw materials in the reaction kettle fully carry out chemical reaction;

and sixthly, cooling and discharging, namely, stopping heating when the temperature of the pressurized reaction kettle is kept for two to four hours, cooling the pressurized reaction kettle to reduce the temperature of the inside of the pressurized reaction kettle to 55 ℃, and then decompressing and discharging the pressurized reaction kettle.

8. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 7, wherein: the three parts of solvent are prepared according to the volume ratio of 8:1:1, and the two parts of initiator are prepared according to the volume ratio of 2: 1.

9. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 7, wherein: the conveying pipe between the dropwise adding tank, the adding tank and the pressurizing reaction kettle is a stainless steel pipe body, and the conveying pipe is fixedly provided with electromagnetic valves.

10. The high molecular polymer for the electronic photosensitive dry film of the circuit board according to claim 7, wherein: the dropping time of the stirring mixed liquid in the dropping tank is three hours to six hours.

Technical Field

The invention relates to a high molecular polymer for an electronic photosensitive dry film of a circuit board, in particular to the high molecular polymer for the electronic photosensitive dry film of the circuit board and a preparation method thereof, belonging to the technical field of photosensitive films.

Background

The conventional flexible printed circuit board is produced by mainly providing a circuit protection film on the surface of the circuit board by using two materials, namely a protective adhesive material and liquid solder mask green paint, so as to protect a copper circuit on the surface of the flexible board and increase the bending resistance of the circuit, however, the conventional protective adhesive material and liquid solder mask green paint have the defects of low resolution and poor flexibility in application, and usually need to be matched for use at the same time, so that the production process of the flexible printed circuit board is complicated, and therefore, a photosensitive dry film capable of forming a fine opening pattern and having both resolution and flexibility is frequently used for circuit protection of the flexible printed circuit board at present.

In the production process of the prior art, the process is limited by the factor of low boiling point of the solvent, the prepared photosensitive dry film has high VOC content, the health of human bodies can be influenced when the photosensitive dry film works or lives in the environment with the VOC for a long time, and enterprises reduce the VOC content in products, increase the dosage of the initiator and reduce the molecular weight, so that the formula cost is high; in the production process, an unexposed medicine film exists, the unexposed medicine film needs to be dissolved in water, but the water solubility is not poor, and a developing solution needs to be frequently replaced to dissolve the unexposed medicine film in water, so that the quality of the prepared photosensitive dry film can meet the requirement; meanwhile, in the prior art, the conversion efficiency of the photosensitive dry film in the preparation process is low, a large amount of production raw materials cannot be fully used, the resource waste is serious, and the production cost is too high.

Disclosure of Invention

The present invention aims to solve the above problems and to provide a high molecular polymer for an electrophotographic dry film for a wiring board and a method for producing the same.

The invention achieves the aim through the following technical scheme, and the high molecular polymer for the electronic photosensitive dry film of the circuit board comprises, by mass, 30-40% of acrylate monomers, 5-10% of carboxyl and hydroxyl functional monomers, 0.1-0.5% of an initiator and 50-60% of a solvent.

Preferably, the acrylate monomer comprises methyl methacrylate, butyl methacrylate, isobutyl methacrylate, methyl acrylate, ethyl acrylate and butyl acrylate.

Preferably, the carboxyl functional monomer is one of methacrylic acid, maleic anhydride, fumaric acid and itaconic acid.

Preferably, the hydroxyl functional monomer comprises one of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate and hydroxybutyl acrylate.

Preferably, the initiator comprises one of benzoyl peroxide, tert-butyl peroxydiethylhexanoate, tert-butyl peroxybenzoate, azobisisobutyronitrile and azobisisovaleronitrile.

Preferably, the solvent comprises acetone and ethanol in a ratio of 4: 1 by mass percent.

The preparation method of the high molecular polymer for the electronic photosensitive dry film of the circuit board comprises the following steps:

firstly, preparing raw materials, namely preparing an acrylate monomer of a high-molecular polymer of a photosensitive dry film, a carboxyl and hydroxyl functional monomer, an initiator and a solvent, stirring and mixing the acrylate monomer, the carboxyl and hydroxyl functional monomer, dividing the solvent into three parts and dividing the initiator into two parts according to a formula.

And step two, preliminary preparation, namely adding a part of solvent into the pressurized reaction kettle, closing a feed inlet of the pressurized reaction kettle, sealing a column of the feed inlet, pressurizing and heating the inside of the pressurized reaction kettle, and enabling the temperature inside the pressurized reaction kettle to rise to 90 ℃.

And thirdly, dropwise adding raw materials, pouring the acrylate monomer, the carboxyl and hydroxyl functional monomer, the initiator and the solvent into a stirring tank according to the formula proportion, stirring, conveying to the dropwise adding tank, and uniformly dropwise adding into the pressurized reaction kettle for a certain time between the dropwise adding tank and the pressurized reaction kettle.

And fourthly, heating and preserving heat, namely heating the pressurized reaction kettle and ensuring the temperature of the pressurized reaction kettle to be 95-100 ℃ after the stirring mixed liquid in the dropwise adding tank is dropwise added, and preserving the heat of the pressurized reaction kettle for two-hour to four-hour.

And fifthly, supplementing raw materials, adding the prepared residual solvent and the initiator into the pressurized reaction kettle through the adding tank, and preserving the temperature of the pressurized reaction kettle for two to four hours to ensure that the raw materials in the reaction kettle fully carry out chemical reaction.

And sixthly, cooling and discharging, namely, stopping heating when the temperature of the pressurized reaction kettle is kept for two to four hours, cooling the pressurized reaction kettle to reduce the temperature of the inside of the pressurized reaction kettle to 55 ℃, and then decompressing and discharging the pressurized reaction kettle.

Preferably, the three parts of solvent are prepared in a volume ratio of 8:1:1, and the two parts of initiator are prepared in a volume ratio of 2: 1.

Preferably, the delivery pipes between the dropwise adding tank, the adding tank and the pressurized reaction kettle are stainless steel pipe bodies, and the delivery pipes are all fixedly provided with electromagnetic valves.

Preferably, the dropping time of the stirred mixed liquid in the dropping tank is three hours to six hours.

The invention has the beneficial effects that: the reaction temperature is increased by pressurizing the inside of the reaction kettle, so that the limitation that the reaction temperature cannot be increased due to low boiling point of a solvent in the prior art so as to reduce VOC (volatile organic compounds) is overcome, and the harm to a human body is reduced; the process of increasing the reaction temperature by pressurization can greatly reduce the dosage of the initiator, has wider selection range of the solvent, and reduces the replacement frequency of the developing solution, thereby reducing the production cost; simultaneously, the raw materials required by each batch of production are prepared at one time, and are respectively filled into the pressurized reaction kettle, the dropwise adding tank and the adding tank, and the raw materials are sequentially added according to the production process, so that the stability of the internal air pressure of the pressurized reaction kettle is ensured, and the conversion rate of the photosensitive dry film is further improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a process flow diagram of the preparation of the present invention.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Referring to fig. 1, the high molecular polymer for the electronic photosensitive dry film of the circuit board includes, by mass, 30% to 40% of an acrylate monomer, 5% to 10% of a carboxyl and hydroxyl functional monomer, 0.1% to 0.5% of an initiator, and 50% to 60% of a solvent.

Specifically, the acrylate monomers include methyl methacrylate, butyl methacrylate, isobutyl methacrylate, methyl acrylate, ethyl acrylate and butyl acrylate.

Specifically, the carboxyl functional monomer is one of methacrylic acid, maleic anhydride, fumaric acid and itaconic acid.

Specifically, the hydroxyl functional monomer comprises one of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate and hydroxybutyl acrylate.

Specifically, the initiator comprises one of benzoyl peroxide, tert-butyl peroxydiethylhexanoate, tert-butyl peroxybenzoate, azobisisobutyronitrile and azobisisovaleronitrile.

Specifically, the solvent comprises acetone and ethanol, wherein the ratio of acetone to ethanol is 4: 1 by mass percent.

The preparation method of the high molecular polymer for the electronic photosensitive dry film of the circuit board comprises the following steps:

firstly, preparing raw materials, namely preparing an acrylate monomer of a high-molecular polymer of a photosensitive dry film, a carboxyl and hydroxyl functional monomer, an initiator and a solvent, stirring and mixing the acrylate monomer, the carboxyl and hydroxyl functional monomer, dividing the solvent into three parts and dividing the initiator into two parts according to a formula.

And step two, preliminary preparation, namely adding a part of solvent into the pressurized reaction kettle, closing a feed inlet of the pressurized reaction kettle, sealing a column of the feed inlet, pressurizing and heating the inside of the pressurized reaction kettle, and enabling the temperature inside the pressurized reaction kettle to rise to 90 ℃.

And thirdly, dropwise adding raw materials, pouring the acrylate monomer, the carboxyl and hydroxyl functional monomer, the initiator and the solvent into a stirring tank according to the formula proportion, stirring, conveying to the dropwise adding tank, and uniformly dropwise adding into the pressurized reaction kettle for a certain time between the dropwise adding tank and the pressurized reaction kettle.

And fourthly, heating and preserving heat, namely heating the pressurized reaction kettle and ensuring the temperature of the pressurized reaction kettle to be 95-100 ℃ after the stirring mixed liquid in the dropwise adding tank is dropwise added, and preserving the heat of the pressurized reaction kettle for two-hour to four-hour.

And fifthly, supplementing raw materials, adding the prepared residual solvent and the initiator into the pressurized reaction kettle through the adding tank, and preserving the temperature of the pressurized reaction kettle for two to four hours to ensure that the raw materials in the reaction kettle fully carry out chemical reaction.

And sixthly, cooling and discharging, namely, stopping heating when the temperature of the pressurized reaction kettle is kept for two to four hours, cooling the pressurized reaction kettle to reduce the temperature of the inside of the pressurized reaction kettle to 55 ℃, and then decompressing and discharging the pressurized reaction kettle.

Specifically, the three parts of solvent are prepared according to the volume ratio of 8:1:1, and the two parts of initiator are prepared according to the volume ratio of 2: 1.

Specifically, the dropwise add jar, the conveyer pipe that adds between jar and the pressurized reaction cauldron are the stainless steel body, and equal fixed mounting has the solenoid valve on the conveyer pipe.

Specifically, the dropping time of the stirred mixed liquid in the dropping tank is three hours to six hours.

The electrical components appearing in the present application document are all externally connected to a power supply and a control switch when in use, and the related circuits, electronic components and control modules are all in the prior art, and can be completely realized by those skilled in the art without needless to say, the protection content of the present invention does not relate to the improvement of software and methods.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.