阅读说明：本技术 温控装置及其温度控制方法 (Temperature control device and temperature control method thereof ) 是由 潘际今 于 2021-01-22 设计创作，主要内容包括：本申请实施例提供了一种温控装置及温度控制方法,该温控装置包括壳体、控温板、第一导热组件、第二导热组件和控制电路。所述壳体包括相互连接的顶壳和底壳,所述控温板设置于所述壳体内,所述控温板的第一表面朝向所述顶壳,所述控温板的第二表面朝向所述底壳,所述控制电路与所述控温板电连接。本申请实施例通过所述控制电路对所述控温板通电电流和通电方向的控制,可以使得所述控温板的制冷面和制热面进行切换,提高了用户的使用体验。(The embodiment of the application provides a temperature control device and a temperature control method. The casing includes interconnect's top shell and drain pan, the accuse temperature board set up in the casing, the first surface orientation of accuse temperature board the top shell, the second surface orientation of accuse temperature board the drain pan, control circuit with accuse temperature board electric connection. The embodiment of the application can enable the refrigerating surface and the heating surface of the temperature control plate to be switched by controlling the electrifying current and the electrifying direction of the temperature control plate through the control circuit, so that the use experience of a user is improved.)

1. A temperature control device, comprising:

a housing (1), said housing (1) comprising a top shell (11) and a bottom shell (12) connected to each other; the temperature control plate (2) is arranged in the shell (1), a first surface of the temperature control plate (2) faces the top shell (11), and a second surface of the temperature control plate faces the bottom shell (12);

a first heat conducting assembly disposed between the top case (11) and the temperature control plate (2) and contacting the top case (11), the first heat conducting assembly being for connecting the first surface;

a second heat-conducting assembly disposed between the bottom case (12) and the temperature control plate (2);

the control circuit (3), the said control circuit (3) is connected with said temperature control board (2);

wherein, with the control circuit (3) energized in the forward direction, the first surface is refrigerated and the first heat conducting assembly transfers heat from the top shell (11) to the first surface; the second surface heats, and the second heat conduction assembly transfers the heat of the second surface to the bottom shell (12);

under the condition that the control circuit (3) is reversely charged, the first surface heats, the first heat conduction assembly transfers the heat of the first surface to the top shell (11), the second surface cools, and the second heat conduction assembly transfers the heat of the bottom shell (12) to the second surface.

2. The temperature control device according to claim 1, wherein the control circuit (3) comprises a battery, an MCU, a change-over switch and MOS switches, the MOS switches comprise a first MOS switch, a second MOS switch, a third MOS switch and a fourth MOS switch, the change-over switch is connected to the MCU, and the battery and the MCU are both connected with the temperature control board (2) through the MOS switches;

under the condition that the control circuit (3) is charged in a forward direction, the second MOS switch and the third MOS switch are conducted, and the first MOS switch and the fourth MOS switch are disconnected;

under the condition that the control circuit (3) is reversely charged, the second MOS switch and the third MOS switch are conducted, and the first MOS switch and the fourth MOS switch are disconnected.

3. The temperature control device according to claim 1, wherein a side of the top case (11) away from the bottom case (12) is provided with a receiving groove (111), and the receiving groove (111) is used for placing electronic equipment;

the first heat conducting component transfers heat of the electronic equipment to the first surface under the condition that the electronic equipment is placed in the accommodating groove (111) and the control circuit (3) is powered on in a forward direction;

the first heat-conducting component transfers heat of the first surface to the electronic device when the electronic device is placed in the accommodating groove (111) and the control circuit (3) is energized in a reverse direction.

4. A temperature control device according to claim 1, characterized in that the housing (1) is provided with a plurality of air inlets (13) on the side in the first direction and a plurality of air outlets (14) on the side in the second direction of the housing (1).

5. The temperature control device according to claim 3, wherein the bottom surface of the accommodating groove (111) is provided with a heat conducting port (112), and a silicone layer (113) is arranged on the heat conducting port (112).

6. The temperature control device according to claim 4, wherein the first heat conducting component comprises a heat conducting plate (5), an air supply channel (51) is arranged in the heat conducting plate (5), an inlet of the air supply channel (51) is connected with an air supply fan (6), and an outlet of the air supply channel (51) is opposite to the air outlet (14).

7. The temperature control device according to claim 6, characterized in that at least one second temperature sensor (15) is provided on the heat-conducting plate (5), the second temperature sensor (15) being close to the outlet of the air supply channel (51) and being electrically connected to the control circuit (3).

8. The temperature control device according to claim 1, wherein the second heat conducting assembly comprises a heat dissipating assembly (4), the heat dissipating assembly (4) comprises a heat dissipating fin (41) and a heat dissipating fan (42), the heat dissipating fan (42) is disposed on one side of the heat dissipating fin (41) close to the bottom case (12), and a heat dissipating port (121) is disposed on the bottom case (12) at a position opposite to the heat dissipating fan (42).

9. Temperature control device according to claim 8, characterized in that at least one first temperature sensor (43) is arranged on the heat sink (41), the first temperature sensor (43) being electrically connected to the control circuit (3).

10. A temperature control method of the temperature control device according to any one of claims 1 to 9, comprising:

acquiring a temperature parameter of the top shell;

determining an electrifying current and a target electrifying direction according to the temperature parameter, and controlling the control circuit to be electrified according to the electrifying current and the target electrifying direction so as to enable the temperature of the top shell to reach a preset temperature;

wherein the target energization direction is forward energization or reverse energization.

11. The method according to claim 10, wherein the determining a target energization direction according to the temperature parameter, and controlling the energization of the control circuit according to the target energization direction, comprises:

under the condition that the temperature parameter is larger than a first preset value, determining that the target electrifying direction is forward electrifying, controlling the second MOS switch and the third MOS switch to be switched on, and controlling the first MOS switch and the fourth MOS switch to be switched off;

and under the condition that the temperature parameter is smaller than a first preset value, determining that the target electrifying direction is reverse electrifying, controlling the first MOS switch and the fourth MOS switch to be switched on, and controlling the second MOS switch and the third MOS switch to be switched off.

Technical Field

The application relates to the technical field of temperature adjusting equipment, in particular to a temperature control device and a temperature control method thereof.

Background

With the continuous development of communication technology, the variety and functions of electronic devices are becoming more and more powerful. Taking a mobile phone as an example, the mobile phone is not only a communication tool, but also has a plurality of use functions such as music, video, games and the like. When a user wants to obtain better game manipulation experience during game playing, the cooperation of the game handle is needed.

Although the game control experience of a user is improved by using the game handle, after the game handle is attached to a mobile phone, the heat dissipation effect of the mobile phone and the game handle is poor, and the game experience of the user is reduced. And when the ambient temperature is lower, the cool touch feeling of the mobile phone and the handle can also reduce the game experience of the user.

Disclosure of Invention

The embodiment of the application provides a temperature control device and a temperature control method thereof, and aims to solve the problem that the traditional temperature control device is poor in use experience.

In order to solve the above problem, the following technical solutions are adopted in the embodiments of the present application:

in a first aspect, an embodiment of the present application provides a temperature control device, including:

a housing including a top case and a bottom case connected to each other;

the temperature control plate is arranged in the shell, a first surface of the temperature control plate faces the top shell, and a second surface of the temperature control plate faces the bottom shell;

the first heat conduction assembly is arranged between the top shell and the temperature control plate and is in contact with the top shell, and the first heat conduction assembly is used for connecting the first surface;

the second heat conduction assembly is arranged between the bottom shell and the temperature control plate;

the control circuit is electrically connected with the temperature control plate;

wherein, with the control circuit energized in a forward direction, the first surface is refrigerated and the first heat conducting assembly transfers heat from the top case to the first surface; the second surface heats, and the second heat conduction assembly transfers the heat of the second surface to the bottom shell;

under the condition that the control circuit is reversely charged, the first surface heats, the first heat conduction assembly transfers the heat of the first surface to the top shell, the second surface cools, and the second heat conduction assembly transfers the heat of the bottom shell to the second surface.

In a second aspect, an embodiment of the present application provides a temperature control method of the temperature control device in the first aspect, including:

acquiring a temperature parameter of the top shell;

determining an electrifying current and a target electrifying direction according to the temperature parameter, and controlling the control circuit to be electrified according to the electrifying current and the target electrifying direction so as to enable the temperature of the top shell to reach a preset temperature;

wherein the target energization direction is forward energization or reverse energization.

In a third aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or an instruction stored on the memory and executable on the processor, and when executed by the processor, the program or the instruction implements the steps of the temperature control method according to the second aspect.

In a fourth aspect, the present application provides a readable storage medium, on which a program or instructions are stored, which when executed by a processor implement the steps of the temperature control method according to the second aspect.

In a fifth aspect, the present application provides a chip, where the chip includes a processor and a communication interface, where the communication interface is coupled to the processor, and the processor is configured to execute a program or instructions to implement the method according to the second aspect.

The technical scheme adopted by the embodiment of the application can achieve the following beneficial effects:

the embodiment of the application provides a temperature control device, including casing, temperature control board, first heat-conducting component, second heat-conducting component and control circuit. The casing includes interconnect's top shell and drain pan, the accuse temperature board set up in the casing, the first surface orientation of accuse temperature board the top shell, the second surface orientation of accuse temperature board the drain pan, control circuit with accuse temperature board electric connection. The temperature control device that this application embodiment provided passes through control circuit is right control temperature control board circular telegram electric current and circular telegram direction can make the refrigeration face and the face of heating of temperature control board switch, have improved user's use and have experienced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic overall structural diagram of a temperature control device according to an embodiment of the present disclosure;

fig. 2 is a schematic diagram illustrating a disassembled structure of a temperature control device according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram of a disassembled structure of a temperature control device provided in an embodiment of the present application (excluding a housing);

fig. 4 is an assembly structure diagram of a temperature control device according to an embodiment of the present disclosure;

fig. 5 is a schematic diagram illustrating a control circuit of a temperature control device according to an embodiment of the present disclosure for controlling a power-on direction of a temperature control plate;

fig. 6 is a flowchart of a temperature control method of a temperature control device according to an embodiment of the present disclosure.

Description of reference numerals:

1-a shell; 11-top shell; 111-a receiving tank; 112-heat conduction port; 113-a silica gel layer; 12-a bottom shell; 121-a heat dissipation port; 13-air inlet; 14-air outlet; 15-a second temperature sensor; 2-temperature control plate; 3-a control circuit; 4-a heat dissipation assembly; 41-a heat sink; 42-a heat dissipation fan; 43-a first temperature sensor; 5-heat conducting plate; 51-an air supply channel; 6-air supply fan.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 4, an embodiment of the present application provides a temperature control device, where the temperature control device may be a game handle, a heat dissipation seat, a heat dissipation clip, and the like, and the temperature control device may be used to control the temperature of an electronic device such as a mobile phone and a tablet computer, and includes:

casing 1, accuse temperature board 2, first heat conduction subassembly, second heat conduction subassembly and control circuit 3.

The housing 1 includes a top case 11 and a bottom case 12 connected to each other.

The temperature control plate 2 is arranged in the shell 1, the first surface of the temperature control plate 2 faces the top shell 11, the second surface of the temperature control plate faces the bottom shell 12, namely, the temperature control plate 2 comprises a first surface close to the top shell 11 and a second surface close to the bottom shell 12, the first heat conduction assembly is arranged between the top shell 11 and the temperature control plate 2 and is in contact with the top shell 11, the first heat conduction assembly is used for the first surface, and the second heat conduction assembly is arranged between the bottom shell 12 and the temperature control plate 2.

The control circuit 3 is electrically connected with the temperature control plate 2, wherein when the control circuit 3 is in a forward direction power-on state of the temperature control plate 2, that is, a positive electrode of a power supply output by the control circuit 3 is electrically connected with the first surface, a negative electrode of the power supply output by the control circuit 3 is electrically connected with the second surface, at this time, the first surface is refrigerated, that is, the first surface is a refrigerating surface, and the first heat conduction assembly transfers heat of the top shell 11 to the first surface; the second surface heats, that is, the second surface is a heating surface, and the second heat conducting assembly transfers heat of the second surface to the bottom case 12.

Under the condition that the temperature control plate 2 is reversely electrified, namely the positive electrode of the power supply output by the control circuit 3 is electrically connected with the second surface, the negative electrode of the power supply output by the control circuit 3 is electrically connected with the first surface, at the moment, the first surface is a heating surface, the first heat conduction assembly transfers the heat of the first surface to the top shell 11, the second surface is a refrigerating surface, and the second heat conduction assembly transfers the heat of the bottom shell 12 to the second surface.

Specifically, referring to fig. 5, the temperature control board 2 may be a semiconductor temperature control board, the control circuit 3 includes a battery, an MCU, a switch and MOS switches, the MOS switches include a first MOS switch, a second MOS switch, a third MOS switch and a fourth MOS switch, that is, the MOS switch 1, the MOS switch 2, the MOS switch 3 and the MOS switch 4 in fig. 5, the switch is connected to the MCU, and the battery and the MCU are both connected to the temperature control board 2 through the MOS switches. When the control circuit 3 is that the temperature control plate 2 is powered on in the forward direction, the second MOS switch and the third MOS switch are turned on, and the first MOS switch and the fourth MOS switch are turned off, at this time, the first surface (i.e., surface a in fig. 5) is a cooling surface, and the second surface (i.e., surface B in fig. 5) is a heating surface, and at this time, the top case 11 can be cooled by cooling of the first surface; through change over switch makes control circuit 3 does when control temperature board 2 reverse circular telegram, second MOS switch and third MOS switch close, just first MOS switch and fourth MOS switch are opened, at this moment the second surface is the refrigeration face, the first surface is the heating face, when external environment temperature is lower, can give through the heating of first surface top shell 11 heaies up.

The temperature control device that this application embodiment provided sets up in casing 1 and can switch the face of refrigerating and the face of heating temperature control board 2, through control circuit 3 does 2 circular telegram of control temperature board and the control of circular telegram direction can make the face of refrigerating and the face of heating of control temperature board 2 switch. When the temperature control device is connected with the electronic equipment, the heat dissipation or heating of the electronic equipment can be flexibly adjusted, and the use experience of a user is improved.

Optionally, referring to fig. 1 and fig. 2, a side of the top case 11 away from the bottom case 12 is provided with a receiving groove 111, and the receiving groove 111 is used for placing an electronic device;

when the electronic device is placed in the accommodating groove 111 and the control circuit 3 is powered on in the forward direction, the first heat conducting component transfers heat of the electronic device to the first surface;

in a case where the electronic device is placed in the accommodating groove 111 and the control circuit 3 is energized in the reverse direction, the first heat conductive member transfers the heat of the first surface to the electronic device.

Specifically, when the temperature control device performs temperature control of heat dissipation or heating on the electronic device, the electronic device can be clamped in the accommodating groove 111, so as to improve the flexibility of the temperature control device in controlling the temperature of the electronic device. In addition, the control circuit 3 can be further provided with a wireless module connected with the electronic device, and the control circuit 3 can obtain the running state of the electronic device after being communicated with the electronic device, so that the direction of the control circuit 3 for electrifying the temperature control plate 2 can be controlled according to the heat dissipation or heating requirements of the electronic device.

Optionally, a plurality of air inlets 13 are disposed on a side of the housing 1 along a first direction, a plurality of air outlets 14 are disposed on a side of the housing 1 along a second direction, and the first direction and the second direction may be the same direction, where the air inlets 13 and the air outlets 14 are respectively disposed on two sides of the housing 1 along the same direction; the first direction and the second direction may also be perpendicular, and the air inlet 13 and the air outlet 14 are respectively disposed on adjacent sides of the housing 1.

In addition, air intake 13 and air outlet 14 set up can with hot air or cold air in the casing 1 carry out effective replacement, then will flow gaseous the sending to user's hand limit, avoided the user because the inconvenient problem of use that the hand sweat brought in the use, guaranteed the dry and comfortable cleanness on user's hand surface.

Optionally, referring to fig. 1, the housing 1 is rectangular, the first direction is a long side direction of the housing 1, and the second direction is a short side direction of the housing 1.

Specifically, in the case where the housing 1 has a rectangular shape, a user generally holds the short side of the housing 1 while using the temperature control device. Will air intake 13 set up in the long limit of casing 1 can provide for more intake of temperature control device, and will air outlet 14 set up in the minor face of casing 1 can let out the wind and be close to user's arm as far as possible, keeps the arm of user in the use dry and comfortable, improves user's use and experiences. Further, the air outlet 14 may be further disposed on the top case 11, a key of the temperature control device is generally disposed on the top case 11, and when the air outlet 14 is disposed on the top case 11, the air outlet of the air outlet 14 may maintain a cool environment at the key position, so as to improve the experience of a user operating the key.

Alternatively, referring to fig. 1 and 2, the bottom surface of the receiving groove 111 is provided with a heat conduction port 112.

Specifically, in the case that the electronic device is sandwiched in the accommodating groove 111, in order to improve the heat exchange efficiency between the temperature control board 2 and the electronic device, a heat conduction port 112 may be provided at the bottom surface of the accommodating groove 111, so that the cold air or the hot air on the first surface is transferred to the electronic device. Further, in order to ensure that the electronic device is tightly fitted to the bottom surface of the accommodating groove 111, a silicone layer 113 may be further disposed on the heat conducting port 112. The silica gel layer 113 has a good heat conduction effect, and can ensure that on the basis of heat exchange between the temperature control plate 2 and the electronic equipment, the laminating degree between the electronic equipment and the bottom surface of the accommodating groove 111 is improved.

Optionally, referring to fig. 3 and 4, the second heat conducting assembly further includes a heat dissipating assembly 4, the heat dissipating assembly 4 includes a heat dissipating fin 41 and a heat dissipating fan 42, the heat dissipating fan 42 is disposed on one side of the heat dissipating fin 41 close to the bottom case 12, and a heat dissipating port 121 is disposed on the bottom case 12 at a position opposite to the heat dissipating fan 42.

Specifically, electronic equipment is locating pressing from both sides when cooling down in the holding tank 111, the first surface is the refrigeration face, the second surface is the face of heating, the heat that the second surface produced can be stored inside casing 1, probably lead to under the untimely condition of heat dissipation temperature control device high temperature damages, also does not benefit to the user and uses. The heat dissipation assembly 4 is disposed between the temperature control plate 2 and the bottom case 12, that is, the heat dissipation assembly 4 is disposed near the second surface, at this time, the heat dissipation assembly 4 can transmit heat generated by the second surface to the outside of the housing 1 in time, for example, the heat is transmitted to the outside through the air outlet 14, so that the normal use of the temperature control device is ensured.

Optionally, referring to fig. 3 and 4, at least one first temperature sensor 43 is disposed on the heat sink 41, and the first temperature sensor 43 is electrically connected to the control circuit 3.

Specifically, the first temperature sensor 43 may be configured to monitor a surface temperature of the heat sink 41, and when the surface temperature of the heat sink 41 is too high, the first temperature sensor 43 may transmit a surface temperature signal of the heat sink 41 to the control circuit 3, and the control circuit 3 may adjust the power of the heat dissipation fan 42, for example, by increasing the heat dissipation power of the heat dissipation fan 42 to reduce the surface temperature of the heat sink 41, so as to ensure the heat dissipation effect of the heat dissipation assembly 4.

Optionally, referring to fig. 2 to 4, the first heat conducting assembly includes a heat conducting plate 5, an air supply channel 51 is disposed in the heat conducting plate 5, an inlet of the air supply channel 51 is connected to an air supply fan 6, and an outlet of the air supply channel 51 is opposite to the air outlet 14.

Specifically, in order to balance the heat dissipation efficiency between the first surface and the second surface of the temperature control plate 2, for example, when the first surface is a refrigerating surface, and the second surface is a heating surface, under the condition that the refrigerating effect of the first surface is ensured, the first surface is to be as close as possible to the top case 11, and the heat generated by the second surface is to be timely dispersed to the outside of the housing 1, that is, the second surface is to be as close as possible to the bottom case 12. The temperature control plate 2 is generally disposed at a position near the center in the housing 1, and a space is left between the temperature control plate 2 and the top case 11. The heat conducting plate 5 is disposed between the temperature control plate 2 and the top case 11, so that the heat transfer efficiency between the temperature control plate 2 and the top case 11 can be improved, that is, the heat dissipation or heating efficiency of the electronic device can be improved.

In addition, after the external air enters the inside of the housing 1 through the air inlet 13, the air supply fan 6 may send a part of the air into the air supply passage 51, and output the flowing air to the outside through the air outlet 14. When a user operates the temperature control device, the user generally holds the temperature control device by two hands near the air outlet 14, and the part of flowing air can be sent to the hand of the user, so that the problem of inconvenience in use caused by sweating of the hand of the user in the use process is avoided, and the surface of the hand of the user is ensured to be dry and clean.

Optionally, referring to fig. 3, at least one second temperature sensor 15 is disposed on the heat conducting plate 5, and the second temperature sensor 15 is close to the outlet of the air supply passage 51 and electrically connected to the control circuit 3.

Specifically, the second temperature sensor 15 may be configured to monitor an outlet air temperature at an outlet of the air supply passage 51, that is, an air temperature inside the housing 1. When the temperature of the air inside the housing 1 is too high, the temperature of the flowing air delivered to the user's hand from the air outlet 14 is also too high, which reduces the user experience. After the second temperature sensor 15 is electrically connected to the control circuit 3, the air temperature signal inside the housing 1 may be transmitted to the control circuit 3, and the control circuit 3 may adjust the refrigeration effect of the temperature control board 2 and the power of the heat dissipation fan 42, for example, by increasing the voltage value on the temperature control board 2 to improve the refrigeration effect of the temperature control board 2, and by increasing the heat dissipation power of the heat dissipation fan 42, the air temperature inside the housing 1 is reduced, so as to ensure the user experience.

Referring to fig. 6, an embodiment of the present application further provides a temperature control method of the temperature control device, including:

s101, acquiring a temperature parameter of the top shell;

s102, determining an electrifying current and a target electrifying direction according to the temperature parameter, and controlling the control circuit to be electrified according to the electrifying current and the target electrifying direction so as to enable the temperature of the top shell to reach a preset temperature;

wherein the target energization direction is forward energization or reverse energization.

The temperature control method provided by the embodiment of the application sets up in the casing and can switch over the refrigeration face and the face that heats the accuse temperature board, through to the temperature parameter judgement of top shell confirms circular telegram electric current and target circular telegram direction, according to circular telegram electric current with target circular telegram direction control circuit circular telegram to make the temperature of top shell reaches preset temperature, can reach the nimble regulation to electronic equipment heat dissipation or heating, improved user's use experience.

Specifically, the value range of the preset temperature is 8-30 ℃.

Specifically, when the temperature control device is used for a long time by a user, and the temperature of the temperature control device and the electronic device is too high due to the long-time use, the electronic device clamped in the accommodating groove 111 can be cooled by the refrigeration of the first surface. However, the long-time cooling may cause the temperature of the electronic device to be too low, thereby affecting the use of various functions of the electronic device. When the value range of the preset temperature is set to be larger than 8 ℃, the temperature of the electronic equipment can be effectively prevented from being too low, and the long-term normal use of the electronic equipment is ensured. In addition, when the control circuit reversely energizes the temperature control plate and heats the electronic device through the first surface, an upper limit value can be set for the second temperature sensor, that is, when the temperature of the electronic device meets the requirement, the control circuit can stop energizing the temperature control plate, and the upper limit value can be 30 ℃. When the first surface is used for heating the electronic equipment, the first surface can also be used for heating the electronic equipment in an extremely cold environment (20 ℃ below zero). Because electronic equipment is not allowed to charge under the extremely cold environment, the temperature control device that this application provided can make electronic equipment's temperature get back to and can allow the mode of charging, solves the problem that electronic equipment can't charge when lacking of electricity in extremely cold environment.

Optionally, the determining a target power-on direction according to the temperature parameter, and controlling the power-on of the control circuit according to the target power-on direction includes:

under the condition that the temperature parameter is larger than a first preset value, determining that the target electrifying direction is forward electrifying, controlling the second MOS switch and the third MOS switch to be switched on, and controlling the first MOS switch and the fourth MOS switch to be switched off;

and under the condition that the temperature parameter is smaller than a first preset value, determining that the target electrifying direction is reverse electrifying, controlling the first MOS switch and the fourth MOS switch to be switched on, and controlling the second MOS switch and the third MOS switch to be switched off.

Specifically, the first preset value may be set with reference to the preset temperature, for example, a value range of the first preset value is set to be 8-30 ℃. Under the condition that the temperature parameter is larger than a first preset value, determining that the target electrifying direction is forward electrifying, wherein the first surface is a refrigerating surface, the second surface is a heating surface, and the electronic equipment can be cooled through refrigeration of the first surface; and under the condition that the temperature parameter is smaller than a first preset value, determining that the target electrifying direction is reverse electrifying, wherein the second surface is a refrigerating surface, the first surface is a heating surface, and when the external environment temperature is lower, the electronic equipment can be heated through heating of the first surface, so that the normal operation of the electronic equipment is ensured.

Optionally, an embodiment of the present application further provides an electronic device, which includes a processor, a memory, and a program or an instruction stored in the memory and capable of running on the processor, where the program or the instruction is executed by the processor to implement each process of the above-mentioned embodiment of the temperature control method, and can achieve the same technical effect, and details are not repeated here to avoid repetition.

Optionally, an embodiment of the present application provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the program or the instruction implements each process of the foregoing embodiment of the temperature control method, and can achieve the same technical effect, and in order to avoid repetition, details are not repeated here.

The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.

Optionally, an embodiment of the present application provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to execute a program or an instruction to implement each process of the foregoing method embodiment, and the same technical effect can be achieved, and details are not repeated here to avoid repetition.

It should be understood that the chips mentioned in the embodiments of the present application may also be referred to as system-on-chip, system-on-chip or system-on-chip, etc.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.