阅读说明：本技术 一种低漏热引线结构 (Low heat leakage lead structure ) 是由 边星 王金阵 伍继浩 于 2021-01-19 设计创作，主要内容包括：本发明适用于低温电磁学领域,公开了低漏热引线结构,包括变送器骨架、变送器输入导线和变送器输出导线,所述变送器输入导线在变送器骨架绕制若干匝数n1,变送器输出导线在变送器骨架绕制若干匝数n2,且n1大于n2,变送器输入导线具有第一引线端和第二引线端,第一引线端和第二引线端用于与室温区传感器连接,变送器输出导线具有第三引线端和第四引线端,第三引线端和第四引线端用于与低温区传感器连接；低漏热引线结构能够提高变送器输入导线的承载力,进而能够减少导线漏热,减小低温系统的冷量负荷。(The invention is suitable for the field of low-temperature electromagnetism, and discloses a low-heat-leakage lead structure which comprises a transmitter framework, a transmitter input lead and a transmitter output lead, wherein the transmitter input lead is wound on the transmitter framework by a plurality of turns n1, the transmitter output lead is wound on the transmitter framework by a plurality of turns n2, n1 is larger than n2, the transmitter input lead is provided with a first lead end and a second lead end, the first lead end and the second lead end are used for being connected with a room temperature zone sensor, the transmitter output lead is provided with a third lead end and a fourth lead end, and the third lead end and the fourth lead end are used for being connected with the low temperature zone sensor; the low heat leakage lead structure can improve the bearing capacity of the input lead of the transmitter, thereby reducing the heat leakage of the lead and reducing the cold load of a low-temperature system.)

1. The utility model provides a low heat lead structure that leaks, its characterized in that, includes changer skeleton, changer input wire and changer output wire, changer input wire is in a plurality of turns of changer skeleton coiling n1, changer output wire is in a plurality of turns of changer skeleton coiling n2, and n1 is greater than n2, changer input wire has first lead wire and second lead wire, first lead wire with the second lead wire is used for being connected with room temperature district sensor, changer output wire has third lead wire and fourth lead wire, the third lead wire with the fourth lead wire is used for being connected with low temperature district sensor.

2. The low heat leak lead configuration of claim 1 wherein said transmitter backbone, said transmitter input lead and said transmitter output lead are secured by a non-magnetic low temperature adhesive.

3. The low heat leak lead configuration of claim 1, wherein said transmitter frame is a frame made of a non-magnetic, non-metallic material.

4. The low heat leak lead structure of claim 3, wherein said transmitter frame is a frame made of glass fiber reinforced epoxy.

5. The low heat leak lead structure of claim 1, further comprising a magnetic shield casing, wherein the transmitter frame is mounted in the magnetic shield casing, the magnetic shield casing defines a first through hole, a second through hole, a third through hole, and a fourth through hole, the first lead end extends out of the magnetic shield casing from the first through hole, the second lead end extends out of the magnetic shield casing from the second through hole, the third lead end extends out of the magnetic shield casing from the third through hole, and the fourth lead end extends out of the magnetic shield casing from the fourth through hole.

6. The low leakage heat lead structure of claim 5, wherein said magnetically shielded enclosure is an enclosure fabricated from a superconducting material.

Technical Field

The invention relates to the field of low-temperature electromagnetism, in particular to a low-heat-leakage lead structure.

Background

The accounting of low-temperature heat leakage is always a problem which needs to be considered in a low-temperature experiment, and particularly, the cost for acquiring cold quantity gradually increases along with the reduction of temperature. Large heat leakage not only results in a greater rate of refrigerant consumption or refrigeration machines requiring greater refrigeration capacity, but also results in greater noise for the experiment. Theoretically, heat leakage is proportional to the cross-sectional area of the wire and the thermal conductivity of the wire, and a conventional method of reducing heat leakage is to select a wire with low thermal conductivity and reduce the diameter of the wire as much as possible. The phosphor bronze wire is a commonly used lead wire material at low temperature, the heat conductivity of the phosphor bronze wire is several times smaller than that of copper, and the phosphor bronze wire is widely applied at low temperature, but the material has higher resistance, and when the phosphor bronze wire is applied with higher current requirement, the resistance heat effect is larger, and copper wires or other thicker leads have to be adopted. However, the large current line is not always used, and heat leakage is always performed.

The low-temperature lead wire experiences temperature change from room temperature to low temperature, because the conductivity of the conventional conductor generally decreases along with the decrease of the temperature, the heating power of the room-temperature part of the same wire is higher, the temperature is highest, and the current carrying capacity is limited to the room-temperature part. For this reason, it is necessary to design a reasonable structure to reduce heat leakage while ensuring that the current demand is satisfied.

Disclosure of Invention

The invention aims to provide a low-heat-leakage lead structure, which can improve the bearing capacity of a lead, namely, the same lead can transmit larger signals, and the same signals only need thinner leads, so that the heat leakage of the lead is reduced.

In order to achieve the purpose, the invention provides the following scheme:

the utility model provides a low heat lead structure that leaks, includes changer skeleton, changer input wire and changer output wire, changer input wire is in a plurality of turns of changer skeleton coiling n1, changer output wire is in a plurality of turns of changer skeleton coiling n2, and n1 is greater than n2, changer input wire has first lead wire and second lead wire, first lead wire with the second lead wire is used for being connected with room temperature district sensor, changer output wire has third lead wire and fourth lead wire, the third lead wire with the fourth lead wire is used for being connected with low temperature district sensor.

Preferably, the transmitter framework, the transmitter input lead and the transmitter output lead are fixed through nonmagnetic low-temperature glue. Preferably, the transmitter framework is a framework made of nonmagnetic non-metallic materials.

Preferably, the transmitter framework is a framework prepared by adopting glass fiber reinforced epoxy resin.

Preferably, low heat leak lead structure still includes magnetic screen casing, the changer skeleton is installed in the magnetic screen casing, first perforation, second perforation, third perforation and fourth perforation have been seted up to the magnetic screen casing, first lead terminal is followed first perforation stretches out the magnetic screen casing, the second lead terminal is followed the second perforation stretches out the magnetic screen casing, the third lead terminal is followed the third perforation stretches out the magnetic screen casing, the fourth lead terminal is followed the fourth perforation stretches out the magnetic screen casing. The magnetic shielding shell has no other opening except the four holes and has a closed structure.

Preferably, the magnetic shielding shell is a shell made of a superconducting material.

The low-heat-leakage lead structure provided by the invention is provided with the transmitter framework, the transmitter input lead wound by the transmitter framework with a plurality of turns n1 and the transmitter output lead wound by the transmitter framework with a plurality of turns n2, and is connected with the room temperature region sensor through the transmitter input lead and is connected with the low temperature region sensor through the transmitter output lead, so that the bearing capacity of the transmitter input lead can be improved, the heat leakage of the lead can be further reduced, and the cold load of a low temperature system can be reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a low heat leakage lead structure according to an embodiment of the present invention.

The reference numbers illustrate:

10. a magnetic shield case;

20. a transmitter framework;

30. a transmitter input lead; 31. a first lead terminal; 32. a second lead terminal;

40. a transmitter output lead; 41. a third lead terminal; 42. a fourth lead terminal.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Because the heat leakage is directly proportional to the cross sectional area of wire and the heat conductivity of wire, problem in order to reduce the wire heat leakage can be realized through more than one mode, in this application, then realize through the bearing capacity that improves the wire, that is to say, this application utilizes the wire of same size can transmit bigger signal, and the heat leakage that its produced does not increase, or when transmitting certain signal, the sectional area of the wire that this application used is littleer, under the unchangeable condition of other conditions, the wire sectional area diminishes, the heat leakage that its produced also diminishes, consequently, the lead wire structure of this application can reduce the heat leakage.

It should be noted that heat conduction (heat leakage) can only occur in the region with the temperature gradient, that is, only the region from the low temperature end of the wire to the room temperature end leaks heat, and the constant temperature portion is not.

Referring to fig. 1, the low heat leakage lead structure of the embodiment of the present invention is entirely in a low temperature environment, and includes a transmitter frame 20, a transmitter input lead 30 and a transmitter output lead 40, wherein the transmitter input lead 30 is wound on the transmitter frame 20 with a plurality of turns n1, the transmitter output lead 40 is wound on the transmitter frame 20 with a plurality of turns n2, and n1 is greater than n 2; the transmitter input lead 30 has a first lead terminal 31 and a second lead terminal 32, the first lead terminal 31 and the second lead terminal 32 are used for connecting with the room temperature zone sensor, the transmitter output lead 40 has a third lead terminal 41 and a fourth lead terminal 42, and the third lead terminal 41 and the fourth lead terminal 42 are used for connecting with the low temperature zone sensor.

In the embodiment of the invention, when the load needs I₀Without this low leakage hot lead configuration, the transmitter input lead 30 needs to be able to withstand I₀The current of (a); when provided with the low leakage hot lead configuration of the present application, the current through transmitter output wire 40 is I₀Then the current through transmitter input lead 30 isI₁，I₁＝n2*I₀/n1＜I₀That is, compared to the original structure, the low heat leakage lead structure of the present application can use a lead having a smaller cross-sectional area as the transmitter input lead 30, so that heat leakage generated from the transmitter input lead 30 can be reduced.

It should be noted that the thickness of transmitter output lead 40 is dependent on the current requirements of the load; the thickness of transmitter input lead 30 is determined by the load, the number of turns n 1: n2 parameter determination.

The low-heat-leakage lead structure provided by the embodiment of the invention is provided with the transmitter framework 20, the transmitter input lead 30 wound with a plurality of turns n1 by the transmitter framework 20 and the transmitter output lead 40 wound with a plurality of turns n2 by the transmitter framework 20, and is connected with a room temperature region sensor through the transmitter input lead 30 and is connected with a low temperature region sensor through the transmitter output lead 40, so that the bearing capacity of the transmitter input lead 30 can be improved, the heat leakage of the lead can be further reduced, and the cold load of a low temperature system can be reduced.

Preferably, the low leakage hot lead structure further includes a magnetic shielding case 10, the transmitter frame 20 is mounted in the magnetic shielding case 10, the transmitter input lead 30 has a first lead terminal 31 and a second lead terminal 32, the first lead terminal 31 and the second lead terminal 32 respectively penetrate through the magnetic shielding case 10 and are used for being connected with the room temperature zone sensor, the transmitter output lead 40 has a third lead terminal 41 and a fourth lead terminal 42, and the third lead terminal 41 and the fourth lead terminal 42 respectively penetrate through the magnetic shielding case 10 and are used for being connected with the low temperature zone sensor.

The low-heat-leakage lead structure of the embodiment of the invention adopts the magnetic shielding shell 10, the transmitter framework 20 is arranged in the magnetic shielding shell 10, only the lead ends of the transmitter input lead 30 and the transmitter output lead 40 are allowed to pass through the magnetic shielding shell 10, and other parts have no openings, so that the introduction of external noise can be avoided.

Specifically, the magnetic shield shell 10 is provided with a first through hole, a second through hole, a third through hole and a fourth through hole, the first lead end 31 extends out of the magnetic shield shell 10 from the first through hole, the second lead end 32 extends out of the magnetic shield shell 10 from the second through hole, the third lead end 41 extends out of the magnetic shield shell 10 from the third through hole, the fourth lead end 42 extends out of the magnetic shield shell 10 from the fourth through hole, each lead end is led out of the magnetic shield shell 10 from the independent through hole, and the lead ends are independent of each other and do not affect each other.

Preferably, in order to ensure the stability of the positions of the transmitter frame 20, the transmitter input lead 30 and the transmitter output lead 40, the transmitter frame 20, the transmitter input lead 30 and the transmitter output lead 40 are fixed by non-magnetic low-temperature glue.

Preferably, transmitter cage 20 is a cage made from a non-magnetic, non-metallic material, such as a fiberglass reinforced epoxy.

Preferably, the magnetic shield case 10 is a case made of a superconducting thin film material, and is excellent in shielding performance.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.