阅读说明：本技术 一种半导体材料加工用成型系统 (Forming system is used in semiconductor material processing ) 是由 祝红伟 于 2021-01-05 设计创作，主要内容包括：本发明公开了一种半导体材料加工用成型系统,包括底板,底板的顶部固定连接有箱体,箱体顶部的中心位置设置有加热装置,并且连接板远离第一活动块的一侧固定连接有第二活动块,并且第一活动块和第二活动块的顶部均固定连接有防护箱,防护箱的内部设置有驱动机构,防护箱的顶部设置有成型装置,箱体顶部的左后方和右前方均设置有取料机构,本发明涉及半导体材料加工设备技术领域。该半导体材料加工用成型系统,单次可以成型两件工件,有利于提高工作效率,且导流机构能够加快活动框内水流的速度,从而降低活动框内不同位置之间冷却液的温度差,使工件冷却更均匀,取料时工件不易变形,有利于提高成品加工质量。(The invention discloses a forming system for processing a semiconductor material, which comprises a bottom plate, wherein the top of the bottom plate is fixedly connected with a box body, a heating device is arranged at the central position of the top of the box body, a second movable block is fixedly connected to one side, away from a first movable block, of a connecting plate, the tops of the first movable block and the second movable block are fixedly connected with a protective box, a driving mechanism is arranged in the protective box, a forming device is arranged at the top of the protective box, and material taking mechanisms are arranged on the left rear side and the right front side of the top of the box body. This forming system is used in semiconductor material processing, two work pieces of single can the shaping, are favorable to improving work efficiency, and water conservancy diversion mechanism can accelerate the speed of rivers in the movable frame to reduce the temperature difference of coolant liquid between the different positions in the movable frame, make the work piece cooling more even, work piece non-deformable when getting the material is favorable to improving finished product processingquality.)

1. The utility model provides a molding system is used in semiconductor material processing, includes bottom plate (1), the top fixedly connected with box (2) of bottom plate (1), its characterized in that: the heating device (3) is arranged at the center of the top of the box body (2), a first hydraulic cylinder (7) is fixedly connected to the left bottom of the box body (2), the output end of the first hydraulic cylinder (7) penetrates into the box body (2), a first movable block (8) is fixedly connected to the output end of the first hydraulic cylinder (7) positioned in the box body (2), a connecting plate (9) is fixedly connected to one side, away from the first hydraulic cylinder (7), of the first movable block (8), a second movable block (10) is fixedly connected to one side, away from the first movable block (8), of the connecting plate (9), the bottoms of the first movable block (8) and the second movable block (10) are both connected with the bottom of the inner wall of the box body (2) in a sliding mode through a first sliding rail, and a protection box (11) is fixedly connected to the tops of the first movable block (8) and the second movable block (10), a driving mechanism (4) is arranged inside the protective box (11), a forming device (5) is arranged at the top of the protective box (11), and material taking mechanisms (6) are arranged on the left rear part and the right front part of the top of the box body (2);

the forming device (5) comprises a movable frame (51) which is connected with the top of the protective box (11) through a second sliding rail in a sliding mode, forming dies (52) are connected to two sides of the top of the movable frame (51) in a sliding mode, two forming grooves (53) are formed in the top of the two forming dies (52) on the left and right sides, a groove (54) is formed in the bottom of each forming die (52) and located between the two forming grooves (53), a flow guide mechanism (55) is arranged inside the movable frame (51), one side, opposite to the forming dies (52), of each forming die (52) is fixedly connected through a first fixing plate (56), second fixing plates (57) are fixedly connected to two sides of the two forming dies (52) on the same side, and springs (58) are fixedly connected between the bottoms of the first fixing plates (56) and the second fixing plates (57) and the top of.

2. The molding system for processing a semiconductor material according to claim 1, wherein: the utility model discloses a water supply device, including activity frame (51), first miniature pump (12) of left side fixedly connected with of activity frame (51) to the right side fixedly connected with second miniature pump (13) of activity frame (51), the delivery port of first miniature pump (12) and the water inlet of second miniature pump (13) all communicate and have pipe (14) that run through to activity frame (51) inside, and the delivery port of the water inlet of first miniature pump (12) and second miniature pump (13) all communicates and has run through to the outside water supply hose (15) of box (2).

3. The molding system for processing a semiconductor material according to claim 1, wherein: the flow guide mechanism (55) comprises a micro motor (551) fixed on the back face of the movable frame (51) through a protective frame and a fixed frame (552) fixed on the front face of the movable frame (51), an output end of the micro motor (551) is fixedly connected with a driving rod (553), one end, far away from the micro motor (551), of the driving rod (553) penetrates through the movable frame (51) and the fixed frame (552) and extends to the inside of the fixed frame (552), and one end, located inside the fixed frame rotating rod, of the driving rod (553) is rotatably connected with the front face of the inner wall of the fixed frame (552) through a bearing.

4. The molding system for processing a semiconductor material as claimed in claim 3, wherein: the front surface of the inner wall of the fixed frame (552) is rotatably connected with a driven rod (554) through a bearing, the other end of the driven rod (554) penetrates into the movable frame (51) and is rotatably connected with the back surface of the inner wall of the movable frame (51) through a bearing, fan blades (555) are fixedly connected to the surfaces, located inside the movable frame (51), of the driving rod (553) and the driven rod (554), and the driving rod (553) and the driven rod (554) are located in grooves (54) at the bottoms of the two forming dies (52) respectively.

5. The molding system for processing a semiconductor material as claimed in claim 4, wherein: the surfaces of the driving rod (553) and the driven rod (554) which are positioned inside the fixed frame (552) are fixedly connected with belt pulleys (556), and the surfaces of the two belt pulleys (556) are in transmission connection through a belt (557).

6. The molding system for processing a semiconductor material according to claim 1, wherein: actuating mechanism (4) are including fixing first motor (41) in protective housing (11) inner wall bottom and fixing tooth dental lamina (42) in movable frame (51) bottom, the dwang (43) that are connected are rotated to one side of the output fixedly connected with of first motor (41) and protective housing (11) inner wall, the fixed surface of dwang (43) is connected with gear (44), the top of gear (44) meshes with the bottom of tooth dental lamina (42).

7. The molding system for processing a semiconductor material according to claim 1, wherein: the material taking mechanism (6) comprises a second motor (61) fixed on one side of the box body (2) through a protective frame, an output end of the second motor (61) is fixedly connected with a driving shaft (62) penetrating through the protective frame, the top end of the driving shaft (62) is fixedly connected with a rotating plate (63), and the right side of the top of the rotating plate (63) is fixedly connected with an L-shaped plate (64).

8. The molding system for processing a semiconductor material as claimed in claim 7, wherein: the equal fixedly connected with second pneumatic cylinder (65), two in both sides at L shaped plate (64) top the output of second pneumatic cylinder (65) all runs through to the below of L shaped plate (64), two the output fixedly connected with limiting plate (66) of second pneumatic cylinder (65) to the equal fixedly connected with sucking disc (67) in both sides of limiting plate (66) bottom.

9. The molding system for processing a semiconductor material according to claim 1, wherein: heating device (3) are including fixing melt bucket (31) at box (2) top through the supporting leg, protective frame fixed connection third motor (32) are passed through at the top of melt bucket (31) to the output fixedly connected with of third motor (32) runs through puddler (33) to melt bucket (31) inside, puddler (33) are located the fixed surface of melt bucket (31) inside and are connected with spiral leaf (34).

10. The molding system for processing a semiconductor material as claimed in claim 9, wherein: the right side fixedly connected with feeder hopper (35) at melting bucket (31) top to the both sides of melting bucket (31) bottom all communicate have run through to the inside unloading pipe (36) of box (2), the inside of melting bucket (31) bucket wall has run through heating coil (37) through helical channel.

Technical Field

The invention relates to the technical field of semiconductor material processing equipment, in particular to a molding system for processing a semiconductor material.

Background

The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. Many electronic products, such as computers, mobile phones, and digital recorders, utilize the change in the conductivity of semiconductors to process information, and semiconductor materials are a class of electronic materials that have semiconductor properties (conductivity between conductor and insulator, resistivity in the range of about 1m Ω · cm to 1G Ω · cm) and can be used to make semiconductor devices and integrated circuits, and during the processing of semiconductor materials, the raw materials are generally melted, then molded into semiconductors of fixed shape, and then cut into semiconductor materials.

In the thermoelectric semiconductor material processing process, the material is often shaped by adopting a condensation forming mode, but the existing forming device, such as the patent with the publication number of CN112078067A, discloses a condensation forming device for semiconductor material processing, although the proposal utilizes the centrifugal force of the rotation of a semiconductor condensation forming disc to uniformly diffuse and tile the liquid semiconductor material, the condensation forming of the liquid semiconductor material is accelerated by a plurality of radiating rings, a micro fan absorbs gas impurities such as water vapor and the like, the product quality is high, the production efficiency is high, but the reference cases still have the following defects:

1) the quantity of semiconductor materials formed in a single time is small, the working efficiency is low, and in the cooling process, the cooling speed of the semiconductor materials at the water inlet is high due to the fact that the flowing direction of cooling water is unchanged, the cooling of the materials at the water outlet is low, the cooling is uneven, local cooling of a workpiece is prone to being not in place, the workpiece is prone to deforming when being taken, and the quality of a finished product is affected;

2) after a workpiece is formed, the workpiece needs to be taken out, then the blanking can be continued to perform the next forming operation, the equipment has long idle time, the time is wasted, and the working efficiency is further reduced.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a forming system for processing semiconductor materials, which solves the problems that the quantity of semiconductor materials formed in one time is small, the material taking process and the blanking process cannot be carried out simultaneously, the idle time is long, the working efficiency is low, workpieces are easy to cool unevenly, the deformation is easy to occur during material taking, and the quality of finished products is influenced.

(II) technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: a forming system for processing semiconductor materials comprises a bottom plate, wherein a box body is fixedly connected to the top of the bottom plate, a heating device is arranged at the central position of the top of the box body, a first hydraulic cylinder is fixedly connected to the left bottom of the box body, the output end of the first hydraulic cylinder penetrates into the box body, a first movable block is fixedly connected to the output end of the first hydraulic cylinder, which is positioned in the box body, a connecting plate is fixedly connected to one side of the first movable block, which is far away from the first hydraulic cylinder, and a second movable block is fixedly connected to one side of the connecting plate, which is far away from the first movable block, the bottoms of the first movable block and the second movable block are both in sliding connection with the bottom of the inner wall of the box body through a first sliding rail, protective boxes are both fixedly connected to the tops of the first movable block and the second movable block, a driving mechanism is arranged in the protective, the left rear part and the right front part of the top of the box body are provided with material taking mechanisms.

The forming device comprises a movable frame which is in sliding connection with the top of the protective box through a second sliding rail, forming dies are connected to the two sides of the top of the movable frame in a sliding mode, a left forming groove and a right forming groove are formed in the tops of the two forming dies, a groove is formed in the bottom of each forming die and located between the two forming grooves, a flow guide mechanism is arranged inside the movable frame, the two forming dies are fixedly connected to one opposite sides through first fixing plates, second fixing plates are connected to the two sides of the two forming dies in a fixed mode, and springs are fixedly connected between the bottoms of the first fixing plates and the second fixing plates and the top of the movable frame.

Preferably, the first miniature pump of left side fixedly connected with of movable frame to the miniature pump of right side fixedly connected with second of movable frame, the delivery port of first miniature pump and the water inlet of second miniature pump all communicate and run through to the inside pipe of movable frame, and the water inlet of first miniature pump and the delivery port of second miniature pump all communicate and have the delivery hose that runs through to the box outside.

Preferably, water conservancy diversion mechanism includes that the micro motor who fixes at the movable frame back through the protective frame and fix at the positive fixed frame of movable frame, micro motor's output fixedly connected with drive lever, micro motor's one end is kept away from to the drive lever runs through movable frame and fixed frame and extends to the inside of fixed frame, the drive lever is located the inside one end of fixed frame dwang and is passed through the positive rotation of bearing and fixed frame inner wall and be connected.

Preferably, the front surface of the inner wall of the fixed frame is rotatably connected with a driven rod through a bearing, the other end of the driven rod penetrates through the inside of the movable frame and is rotatably connected with the back surface of the inner wall of the movable frame through a bearing, the surfaces of the driving rod and the driven rod, which are positioned in the inside of the movable frame, are fixedly connected with fan blades, and the driving rod and the driven rod are respectively positioned in grooves at the bottoms of the two forming dies.

Preferably, the driving rod and the driven rod are fixedly connected with belt pulleys on the surfaces inside the fixing frame, and the surfaces of the two belt pulleys are connected through belt transmission.

Preferably, actuating mechanism is including fixing the first motor in protective housing inner wall bottom and fixing the tooth dental lamina in activity frame bottom, the dwang of being connected is rotated with one side of protective housing inner wall to the output fixedly connected with of first motor, the fixed surface of dwang is connected with the gear, the top of gear meshes with the bottom of tooth dental lamina mutually.

Preferably, the material taking mechanism comprises a second motor fixed on one side of the box body through a protective frame, an output end of the second motor is fixedly connected with a driving shaft penetrating through the protective frame, the top end of the driving shaft is fixedly connected with a rotating plate, and the right side of the top of the rotating plate is fixedly connected with an L-shaped plate.

Preferably, the equal fixedly connected with second pneumatic cylinder in both sides at L shaped plate top, two the output of second pneumatic cylinder all runs through to the below of L shaped plate, two the output fixedly connected with limiting plate of second pneumatic cylinder to the equal fixedly connected with sucking disc in both sides of limiting plate bottom.

Preferably, heating device includes the melt bucket of fixing at the box top through the supporting leg, the top of melt bucket is through protection frame fixed connection third motor to the output fixedly connected with of third motor runs through to the inside puddler of melt bucket, the puddler is located the inside fixed surface of melt bucket and is connected with the spiral leaf.

Preferably, the right side fixedly connected with feeder hopper at melting storage bucket top to the both sides of melting storage bucket bottom all communicate to have the unloading pipe that runs through to the box inside, the inside of melting storage bucket wall has heating coil through the helical passage.

(III) advantageous effects

The invention provides a molding system for processing a semiconductor material. Compared with the prior art, the method has the following beneficial effects:

(1) this forming system is used in semiconductor material processing, two shaping grooves about all having seted up through the top of two moulded moulds, the inside of activity frame is provided with water conservancy diversion mechanism, water conservancy diversion mechanism includes the micro motor who fixes at the activity frame back through the protection frame, driving lever and driven lever are located the inside equal fixedly connected with flabellum in surface of activity frame, two shaping grooves have been seted up on the moulded mould, the single can two work pieces of shaping, be favorable to improving work efficiency, and water conservancy diversion mechanism can accelerate the speed of rivers in the activity frame, thereby reduce the temperature difference of coolant liquid between the different positions in the activity frame, it is more even to make the work piece cool off, work piece non-deformable when getting the material, be favorable to improving finished product processingquality.

(2) This molding system is used in semiconductor material processing, inside through the protective housing is provided with actuating mechanism, actuating mechanism is including fixing the first motor in protective housing inner wall bottom and fixing the tooth dental lamina in activity frame bottom, the fixed surface of dwang is connected with the gear, the top of gear meshes with the bottom of tooth dental lamina mutually, equal fixedly connected with spring between the bottom of first fixed plate and second fixed plate and the top of activity frame, actuating mechanism can drive the moulded die seesaw, thereby make the melting semiconductor raw materials that the unloading pipe fell lay at the shaping inslot, when the flabellum rotated simultaneously, can make the moulded die shake from top to bottom, thereby make the material of shaping inslot lay more evenly, the quality of product has further been improved, the practicality is better.

(3) This molding system is used in semiconductor material processing, through the first pneumatic cylinder of the left bottom fixedly connected with of box, the output of first pneumatic cylinder runs through to the inside of box, and first pneumatic cylinder is located the first movable block of the inside output fixedly connected with of box, one side fixedly connected with second movable block of first movable block is kept away from to the connecting plate, and the equal fixedly connected with guard box in top of first movable block and second movable block, first pneumatic cylinder work can drive two moulded die side-to-side motions, when a moulded die is located unloading shaping below the unloading pipe, can take out the work piece after the shaping in another moulded die through extracting mechanism, make the unloading and get the mutually noninterfere between the material twice process, thereby omit the time of equipment space etc., further improved machining efficiency.

(4) This molding system is used in semiconductor material processing, left back and right front through the box top all are provided with feeding agencies, feeding agencies includes the second motor of fixing in box one side through the protective frame, the top fixedly connected with rotor plate of drive shaft, the right side fixedly connected with L shaped plate at rotor plate top, the output fixedly connected with limiting plate of two second pneumatic cylinders, the equal fixedly connected with sucking disc in both sides of limiting plate bottom, feeding agencies simple structure can accomplish automatically and get material work, and the practicality is better.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a cross-sectional view of the present invention;

FIG. 3 is a perspective view of the protective housing and forming apparatus of the present invention;

FIG. 4 is a cross-sectional view of the molding apparatus of the present invention;

FIG. 5 is a cross-sectional view of a heating device of the present invention;

FIG. 6 is a perspective view of a forming die of the present invention;

FIG. 7 is a top view of the deflector mechanism of the present invention;

FIG. 8 is a cross-sectional view of the drive mechanism of the present invention;

fig. 9 is a cross-sectional view of a take off mechanism of the present invention.

In the figure, 1 a bottom plate, 2 a box body, 3 a heating device, 31 a melting barrel, 32 a third motor, 33 a stirring rod, 34 helical blades, 35 a feed hopper, 36 a discharge pipe, 37 a heating coil, 4 a driving mechanism, 41 a first motor, 42 a toothed plate, 43 a rotating rod, 44 a gear, 5 a forming device, 51 a movable frame, 52 a forming die, 53 a forming groove, 54 a groove, 55 a flow guide mechanism, 551 a micro motor, 552 a fixed frame, 553 a driving rod, 554 a driven rod, 555 a belt pulley, 556 a belt pulley, 56 a first fixed plate, 57 a second fixed plate, 58 a spring, 6 a material taking mechanism, 61 a second motor, 62 a driving shaft, 63 a rotating plate, 64L-shaped plates, 65 a second hydraulic cylinder, 66 a limiting plate, 67a suction cup, 7a first hydraulic cylinder, 8 a first movable block, 9 a connecting plate, 10 a second movable block, 11 a protective box, 12 a first micro water pump, 13 a second micro water pump, 14 a guide pipe, 15 water delivery hose.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-9, an embodiment of the present invention provides a technical solution: a forming system for processing semiconductor materials comprises a bottom plate 1, a box body 2 is fixedly connected to the top of the bottom plate 1, a control panel is fixedly connected to the front upper left corner of the box body 2, material taking ports are formed in the positions of the left rear corner and the right front corner of the top of the box body 2, a heating device 3 is arranged at the center of the top of the box body 2, a first hydraulic cylinder 7 is fixedly connected to the left bottom of the box body 2, the first hydraulic cylinder 7 forms a hydraulic circulating system with an external hydraulic component through a pipeline, the expansion and contraction of the first hydraulic cylinder 7 are achieved, the output end of the first hydraulic cylinder 7 penetrates into the box body 2, a first movable block 8 is fixedly connected to the output end of the first hydraulic cylinder 7 positioned in the box body 2, a connecting plate 9 is fixedly connected to one side, away from the first hydraulic cylinder 7, of the first movable block 8 is fixedly connected to, the bottom sliding connection of first slide rail and 2 inner walls of box is all passed through to the bottom of first movable block 8 and second movable block 10 to the equal fixedly connected with guard box 11 in top of first movable block 8 and second movable block 10, the inside of guard box 11 is provided with actuating mechanism 4, and the top of guard box 11 is provided with forming device 5, and the left back and the right front at 2 tops of box all are provided with gets material mechanism 6.

Forming device 5 includes the movable frame 51 through the top sliding connection of second slide rail and protective housing 11, the equal sliding connection in both sides at movable frame 51 top has moulded die 52, and two shaping grooves 53 about two moulding die 52's top has all been seted up, the bottom of moulded die 52 just is located and has seted up recess 54 between two shaping grooves 53, the inside of movable frame 51 is provided with water conservancy diversion mechanism 55, through first fixed plate 56 fixed connection between the relative one side of two moulded die 52, and the equal fixedly connected with second fixed plate 57 in both sides of two moulded die 52, equal fixedly connected with spring 58 between the bottom of first fixed plate 56 and second fixed plate 57 and the top of movable frame 51, forming device 5 can make the shaping of fused raw materials in shaping groove 53.

In the embodiment of the invention, the left side of the movable frame 51 is fixedly connected with the first micro water pump 12, the right side of the movable frame 51 is fixedly connected with the second micro water pump 13, the water outlet of the first micro water pump 12 and the water inlet of the second micro water pump 13 are both communicated with the guide pipe 14 penetrating into the movable frame 51, the water inlet of the first micro water pump 12 and the water outlet of the second micro water pump 13 are both communicated with the water supply hose 15 penetrating to the outside of the box body 2, and the micro water pumps pump extracts external cooling liquid to form a cooling liquid circulating system, so that the forming die 52 is cooled, and the cooling forming speed of the semiconductor material is further accelerated.

In the embodiment of the invention, the diversion mechanism 55 comprises a micro motor 551 fixed on the back of the movable frame 51 through a protective frame and a fixed frame 552 fixed on the front of the movable frame 51, the output end of the micro motor 551 is fixedly connected with a driving rod 553, one end of the driving rod 553 far away from the micro motor 551 penetrates through the movable frame 51 and the fixed frame 552 and extends to the inside of the fixed frame 552, one end of the driving rod 553 positioned inside the rotating rod of the fixed frame is rotatably connected with the front of the inner wall of the fixed frame 552 through a bearing, the front of the inner wall of the fixed frame 552 is rotatably connected with a driven rod 554 through a bearing, the other end of the driven rod 554 penetrates through the inside of the movable frame 51 and is rotatably connected with the back of the inner wall of the movable frame 51 through a bearing, the surfaces of the driving rod 553 and the driven rod 554 positioned inside the movable frame 51 are fixedly connected, the equal fixedly connected with belt pulley 556 in the inside surface of fixed frame 552 of drive rod 553 and driven rod 554 position, and connect through the transmission of belt 557 between the surface of two belt pulleys 556, guiding mechanism 55 can make the coolant temperature in the activity frame 51 more even, accelerate the flow velocity of cooling liquid in the activity frame 51 simultaneously, it is more even to make moulded die 52 be heated, be favorable to improving the production quality of product, in addition, guiding mechanism 55 can mutually support with spring 58 and make moulded die 52 shake from top to bottom, thereby make the material in the shaping groove 53 lay more evenly, further improve the processingquality of product.

In the embodiment of the invention, the driving mechanism 4 comprises a first motor 41 fixed at the bottom of the inner wall of the protective box 11 and a tooth plate 42 fixed at the bottom of the movable frame 51, the first motor 41, a second motor 61 and a third motor 32 are all electrically connected with a control panel and an external power supply through leads, the output end of the first motor 41 is fixedly connected with a rotating rod 43 which is rotatably connected with one side of the inner wall of the protective box 11, the surface of the rotating rod 43 is fixedly connected with a gear 44, the top of the gear 44 is meshed with the bottom of the tooth plate 42, and the driving mechanism 4 is matched with the first hydraulic cylinder 7, so that the device can achieve the purpose of simultaneously carrying out the blanking and material taking processes, the processes are not interfered with each other, and the processing efficiency is improved.

In the embodiment of the invention, the material taking mechanism 6 comprises a second motor 61 fixed on one side of the box body 2 through a protective frame, the output end of the second motor 61 is fixedly connected with a driving shaft 62 penetrating to the upper part of the protective frame, the top end of the driving shaft 62 is fixedly connected with a rotating plate 63, an L-shaped plate 64 is fixedly connected to the right side of the top of the rotating plate 63, second hydraulic cylinders 65 are fixedly connected to both sides of the top of the L-shaped plate 64, the second hydraulic cylinders 65 form a hydraulic circulation system with external hydraulic components through pipelines to realize the extension and contraction of the second hydraulic cylinders 65, the output ends of the two second hydraulic cylinders 65 penetrate through the lower portion of the L-shaped plate 64, limiting plates 66 are fixedly connected to the output ends of the two second hydraulic cylinders 65, and the equal fixedly connected with sucking disc 67 in both sides of limiting plate 66 bottom, on extracting mechanism 6 can take out the work piece after the shaping and place outside conveying mechanism, carry to follow-up processing equipment.

In the embodiment of the invention, the heating device 3 comprises a melt barrel 31 fixed on the top of the box body 2 through a support leg, the top of the melt barrel 31 is fixedly connected with a third motor 32 through a protective frame, the output end of the third motor 32 is fixedly connected with a stirring rod 33 penetrating into the melt barrel 31, the surface of the stirring rod 33 positioned in the melt barrel 31 is fixedly connected with a spiral blade 34, the right side of the top of the melt barrel 31 is fixedly connected with a feed hopper 35, two sides of the bottom of the melt barrel 31 are both communicated with a blanking pipe 36 penetrating into the box body 2, an electromagnetic valve is arranged on the blanking pipe 36, a heating coil 37 penetrates through a spiral channel in the barrel wall of the melt barrel 31, and the heating device 3 can heat and melt the semiconductor material.

During the use, place the semiconductor raw materials in the melting bucket through the feeder hopper, start this molding system through control panel, heating coil work heats the raw materials in the melting bucket, and third motor work drives the spiral leaf through the puddler and rotates simultaneously, stirs the material, makes the material receive the heat to melt while rolling, and the raw materials melts into the fluidform after a period, and the solenoid valve on the unloading pipe is opened, makes the material directly fall into the shaping inslot on the moulded die of bottom through the unloading pipe.

First motor work, drive gear revolve through the dwang, drive forming device rearward movement through gear and tooth dental lamina mutually supporting then, the material that makes the intraductal drop of unloading is laid at the shaping inslot, first miniature water pump work draws outside coolant liquid simultaneously and gets into in the movable frame through sending water hose and pipe, the movable frame is taken out through pipe and sending water hose with the coolant liquid in the movable frame to the miniature water pump of second, make coolant liquid advance on the right side and go out on the left in the movable frame, form the flow state, cool off the moulded die, and then cool off the semiconductor material to the shaping inslot, make the semiconductor material shaping.

In the forming process, micro motor work, make the drive lever rotate, then drive the driven lever rotation through two belt pulleys and belt inter-working, thereby make the flabellum on drive lever and driven lever surface rotate, accelerate the velocity of flow of cooling liquid in the movable frame, make the moulded die be heated more evenly, and the flabellum rotates the in-process, can withstand the inner wall of moulded die bottom recess, make the moulded die take place the motion, further drive first fixed plate and second fixed plate and take place the motion, the spring takes place deformation this moment, make the moulded die shake from top to bottom under the combined action of water conservancy diversion mechanism and spring, thereby make the material of shaping inslot lay more evenly.

After the material reaches a certain amount in the forming groove, the electromagnetic valve on the discharging pipe is closed, two forming dies are located at the position of the left rear part in the box body at the moment, the first hydraulic cylinder extends, the first movable block is pushed to move rightwards, the second movable block is further pushed to move rightwards through the connecting plate, the protection box is further driven to move rightwards, the forming dies are driven to move rightwards, the left forming dies are made to move to a discharging station under the discharging pipe, the first hydraulic cylinder stops working, the forming dies are located at the position of the right rear part in the box body at the moment, then the discharging process is repeated, the first motor rotates in the reverse direction, the forming dies are driven to move forwards, the forming dies are made to move to.

The second hydraulic cylinder extends, drives the sucking disc downstream through the limiting plate, makes the sucking disc adsorb two semiconductor material's in the right side forming die top, then the second hydraulic cylinder shrink takes out the work piece from the shaping inslot, then the work of second motor drives the rotor plate through the drive shaft and rotates, further drives L shaped plate and rotates to box one side to shift the work piece to the box outside, place and carry to follow-up processing apparatus on outside conveying mechanism.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.