阅读说明：本技术 一种低反射率的低辐射镀膜玻璃及其制备方法 (Low-emissivity coated glass with low reflectivity and preparation method thereof ) 是由 董炳荣 刘思睿 杨博文 陈佳佳 李小平 张碧辉 于 2021-03-11 设计创作，主要内容包括：本发明公开一种低反射率的低辐射镀膜玻璃及其制备方法,该低反射率的低辐射镀膜玻璃包括玻璃基层、功能层、保护膜层、吸收层、第二介质层和第三介质层,所述功能层位于所述玻璃基层的一侧；所述保护膜层位于所述功能层远离所述玻璃基层的一侧；所述吸收层位于所述玻璃基层与所述功能层之间,所述吸收层用于吸收太阳光,所述吸收层包括至少三层保护层；所述第二介质层和所述第三介质层分别位于两所述保护层之间。本发明技术方案降低了低辐射镀膜玻璃的反射率。(The invention discloses low-emissivity coated glass with low reflectivity and a preparation method thereof, wherein the low-emissivity coated glass with low reflectivity comprises a glass base layer, a functional layer, a protective film layer, an absorption layer, a second dielectric layer and a third dielectric layer, wherein the functional layer is positioned on one side of the glass base layer; the protective film layer is positioned on one side of the functional layer far away from the glass base layer; the absorption layer is positioned between the glass substrate and the functional layer, is used for absorbing sunlight and comprises at least three protective layers; the second dielectric layer and the third dielectric layer are respectively positioned between the two protective layers. The technical scheme of the invention reduces the reflectivity of the low-emissivity coated glass.)

1. A low-emissivity coated glass having a low reflectivity, comprising:

a glass substrate;

a functional layer on one side of the glass substrate;

the protective film layer is positioned on one side, far away from the glass base layer, of the functional layer;

the absorption layer is positioned between the glass base layer and the functional layer, is used for absorbing sunlight and comprises at least three protective layers;

the second dielectric layer and the third dielectric layer are respectively positioned between the two protective layers.

2. The low-emissivity, low-emissivity coated glass of claim 1, wherein the protective layer is one or both of a NiCr layer, a Cr layer, or a Cu layer.

3. The low-emissivity, low-emissivity coated glass of claim 2, wherein the absorbing layer comprises a first protective layer, a second protective layer, and a third protective layer disposed in that order from the glass substrate layer to the functional layer, the first protective layer comprising a NiCr layer.

4. The low-emissivity, low-emissivity coated glass of claim 3, further comprising a fourth protective layer, wherein the fourth protective layer is between the functional layer and the protective film layer, and wherein the fourth protective layer is one or both of a NiCr layer, a Cr layer, or a Cu layer.

5. The low-emissivity, low-emissivity coated glass of claim 4, wherein the low-emissivity, low-emissivity coated glass further comprises a first dielectric layer, the first dielectric layer being positioned between the glass base layer and the first protective layer; the second dielectric layer is located between the first protective layer and the second protective layer, and the third dielectric layer is located between the second protective layer and the third protective layer.

6. The low-emissivity, low-emissivity coated glass of claim 5, wherein the first dielectric layer and/or the protective film layer is a SiNx layer, wherein x in the SiNx layer is in the range of 0.50 to 1.33; the thickness of the first dielectric layer is 25 nm-35 nm, and the thickness of the protective film layer is 30 nm-48 nm.

7. The low-emissivity, low-emissivity coated glass of claim 6, wherein the second dielectric layer and/or the third dielectric layer is one or both of a ZnAlOx layer and a ZnSnOx layer; the thickness of the second dielectric layer is 36 nm-47 nm, and the thickness of the third dielectric layer is 38 nm-52 nm.

8. The low-emissivity, coated glass according to any one of claims 4 to 7, wherein the first protective layer has a thickness of 6nm to 14nm, the second protective layer has a thickness of 6nm to 14nm, the third protective layer has a thickness of 2nm to 5nm, and the fourth protective layer has a thickness of 2nm to 5 nm.

9. The low-emissivity, coated glass according to any one of claims 1 to 7, wherein the functional layer is an Ag layer having a thickness of from about 5nm to about 14 nm.

10. A method for producing a low-emissivity coated glass having a low reflectance according to any one of claims 1 to 9, comprising the steps of:

the method comprises the following steps of carrying out vacuum magnetron sputtering on the surface of a glass base layer by using a target in a vacuum environment, and sequentially sputtering to form an absorption layer, a second dielectric layer, a third dielectric layer, a functional layer and a protective film layer, wherein the absorption layer comprises at least three protective layers, and the second dielectric layer and the third dielectric layer are respectively positioned between the two protective layers.

Technical Field

The invention relates to the technical field of glass, in particular to low-emissivity coated glass with low reflectivity and a preparation method thereof.

Background

With the large-scale application of glass curtain walls in high-rise buildings, Low-emissivity coated glass (Low-E glass) meeting the requirements of energy conservation and environmental protection is highly appreciated. The low-radiation coated glass has good heat-insulating property and sun-shading property, can meet the requirement of indoor lighting, can prevent solar radiation from entering the room, and reduces the load of an indoor air conditioner. However, the reflectivity of Low-emissivity coated glass (Low-E glass) is generally high, so that the mirror reflection phenomenon of architectural glass is very serious, and light pollution becomes a new environmental pollution source following the pollution of waste gas, waste water, waste residue, noise and the like.

Disclosure of Invention

The invention mainly aims to provide low-emissivity coated glass with low reflectivity and a preparation method thereof, aiming at reducing the reflectivity of the low-emissivity coated glass.

In order to achieve the purpose, the low-emissivity coated glass with low reflectivity comprises a glass base layer, a functional layer, a protective film layer, an absorption layer, a second dielectric layer and a third dielectric layer, wherein the functional layer is positioned on one side of the glass base layer; the protective film layer is positioned on one side of the functional layer far away from the glass base layer; the absorption layer is positioned between the glass substrate and the functional layer, is used for absorbing sunlight and comprises at least three protective layers; the second dielectric layer and the third dielectric layer are respectively positioned between the two protective layers.

In one embodiment, the protective layer is one or two of a NiCr layer, a Cr layer or a Cu layer.

In an embodiment, the absorption layer includes a first protection layer, a second protection layer and a third protection layer sequentially arranged from the glass base layer to the functional layer, and the first protection layer is a NiCr layer.

In one embodiment, the low-emissivity coated glass with low reflectivity further comprises a fourth protective layer, the fourth protective layer is located between the functional layer and the protective film layer, and the fourth protective layer is one or two of a NiCr layer, a Cr layer or a Cu layer.

In one embodiment, the low-emissivity coated glass with low reflectivity further comprises a first dielectric layer, wherein the first dielectric layer is positioned between the glass base layer and the first protective layer; the second dielectric layer is positioned between the first protective layer and the second protective layer; the third dielectric layer is located between the second protective layer and the third protective layer.

In one embodiment, the first dielectric layer and/or the protective film layer is a SiNx layer, and x in the SiNx layer ranges from 0.50 to 1.33; the thickness of the first dielectric layer is 25 nm-35 nm, and the thickness of the protective film layer is 30 nm-48 nm.

In an embodiment, the second dielectric layer and/or the third dielectric layer is one or two of a ZnAlOx layer and a ZnSnOx layer; the thickness of the second dielectric layer is 36 nm-47 nm, and the thickness of the third dielectric layer is 38 nm-52 nm.

In one embodiment, the thickness of the first protective layer is 6nm to 14nm, the thickness of the second protective layer is 6nm to 14nm, the thickness of the third protective layer is 2nm to 5nm, and the thickness of the fourth protective layer is 2nm to 5 nm.

In one embodiment, the functional layer is an Ag layer, and the thickness of the Ag layer is 5nm to 14 nm.

The invention also provides a preparation method of the low-emissivity coated glass with low reflectivity, which is used for preparing the low-emissivity coated glass with low reflectivity, and the preparation method comprises the following steps: the method comprises the following steps of carrying out vacuum magnetron sputtering on the surface of a glass base layer by using a target in a vacuum environment, and sequentially sputtering to form an absorption layer, a second dielectric layer, a third dielectric layer, a functional layer and a protective film layer, wherein the absorption layer comprises at least three protective layers, and the second dielectric layer and the third dielectric layer are respectively positioned between the two protective layers.

According to the technical scheme, the absorption layer comprising at least three protective layers is arranged between the glass base layer and the functional layer, so that sunlight penetrating through the glass base layer is absorbed, the reflectivity of the low-radiation coated glass is effectively reduced, and light pollution caused by mirror reflection of the low-radiation coated glass is reduced. Meanwhile, the absorption layer also plays a role in protecting the functional layer, and the protection film layer is positioned on one side of the functional layer, which is far away from the absorption layer, so that the overall stability of the low-radiation coated glass is protected, the mechanical property of the product is improved, and the product is not easy to scratch. Compared with the method for reducing the reflectivity of the low-radiation coated glass by adopting the antireflection coated glass or the antireflection film, the low-radiation coated glass has low production cost, reduces the reflectivity of the low-radiation coated glass, and has wide market application space.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural view of an embodiment of a low-emissivity coated glass with low reflectivity according to the invention;

FIG. 2 is a schematic structural view of another embodiment of the low-emissivity coated glass with low reflectivity of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Glass substrate	430	Third protective layer
200	Functional layer	500	A fourth protective layer
				300	Protective film layer	610	A first dielectric layer
400	Absorbing layer	620	A second dielectric layer
				410	First protective layer	630	A third dielectric layer
420	Second protective layer

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Along with the rapid development of cities, the building density is rapidly increased, complaints caused by light pollution are more and more frequent, and people gradually realize the severity of the light pollution problem. Therefore, the requirement for the outdoor reflectivity of the glass is gradually improved, and the severe requirement that the outdoor reflectivity is less than or equal to 5 percent even appears on part of projects, which exceeds the performance requirement of common Low-E glass. Aiming at the project with strict requirement on reflectivity, the requirement on Low reflectivity is generally realized by adopting a scheme of combining antireflection coated glass or antireflection film with Low-E coated glass. However, antireflection coated glass is expensive, resulting in an increase in project cost.

The technical scheme of the invention uses a color model (Lab) as a color code to design the glass surface color and the film surface color of the low-emissivity coated glass. A color model (Lab) is a model built up based on human perception of color, with the numerical values in Lab describing all colors that a person with normal vision can see. The Lab color model consists of three elements, namely brightness (L), color value a and color value b. Where L denotes luminance (luminescence), a denotes a range from red to green, and b denotes a range from yellow to blue. L has a value ranging from 0 to 100, wherein L is 50% which corresponds to 50% black. The value ranges of a and b are from +127 to-128, wherein the color is red when a is +127 and green when a is-128. And b +127 is yellow, and b-128 is blue. All colors are composed of the three values which are changed alternately, and the color of the object is expressed by Lab numerical value. For example, when the Lab value of a color is L ═ 100, a ═ 30, and b ═ 0, the color indicates pink.

The invention provides low-emissivity coated glass with low reflectivity and a preparation method thereof.

Referring to fig. 1 to 2, in an embodiment of the present invention, a low-emissivity coated glass with low reflectivity includes a glass substrate 100, a functional layer 200, a protective film 300, an absorption layer 400, a second dielectric layer 620, and a third dielectric layer 630, where the functional layer 200 is located on one side of the glass substrate 100; the protective film layer 300 is located on the side of the functional layer 200 away from the glass substrate 100; the absorption layer 400 is located between the glass base layer 100 and the functional layer 200, and the absorption layer 400 is used for absorbing sunlight. Referring to fig. 1 to 2, the absorption layer 400 includes at least three protective layers, and the second dielectric layer 620 and the third dielectric layer 630 are respectively located between the two protective layers.

Specifically, referring to fig. 1 to 2, the glass substrate 100 may be ultra-white glass, and the thickness of the glass substrate 100 may be 4mm, 5mm, 6mm, 8mm, 10mm, or 12 mm. The thicker the glass substrate 100, the lower the reflectivity, and the thickness of the glass substrate 100 may be 5mm to 10mm, considering the reflectivity of the product and the convenience of transportation. It is understood that the glass substrate 100 may be a common glass.

Referring to fig. 1, the functional layer 200 is located on one side of the glass substrate 100, and the functional layer 200 has a low radiation performance, so that the radiance of the low-radiation coated glass with a low reflectivity is reduced, the infrared radiation of the sun can be reflected, the heat flow radiation from a high temperature field to a low temperature field can be effectively blocked, the heat energy in summer can be effectively prevented from entering the room and leaking out of the heat energy in winter, the bidirectional energy-saving effect is achieved, and the heat insulation performance of the low-radiation coated glass with a low reflectivity is improved. The functional layer 200 may be a single silver layer.

Referring to fig. 1, a glass substrate 100 and a protective film 300 are disposed on both sides of the functional layer 200 to protect the functional layer 200. The protective film 300 has good mechanical properties, can prevent the functional layer 200 from being scratched, corroded and the like, and improves the mechanical processing property and the scratch resistance of the low-emissivity coated glass. At the same time, oxidation of the functional layer 200 may be reduced.

Referring to fig. 1, the absorption layer 400 is located between the glass substrate 100 and the functional layer 200, and the absorption layer 400 includes at least three protective layers, which can absorb sunlight, reduce outdoor reflectivity, and protect the functional layer 200. The absorption layer 400 of the multi-layer structure effectively reduces the reflectivity of the low-emissivity coated glass by gradually absorbing sunlight transmitted through the glass substrate 100. The protective layer may be four layers, or five or six layers, so as to further absorb sunlight and reduce the reflectivity of the low-emissivity coated glass.

Referring to fig. 1, since the absorption layer 400 includes at least three protective layers, the second dielectric layer 620 and the third dielectric layer 630 are respectively disposed between the two protective layers, that is, when the absorption layer 400 includes three protective layers, the second dielectric layer 620 is disposed between the two protective layers, the third dielectric layer 630 is disposed between one of the two protective layers and the other protective layer, and the third dielectric layer 630 can be far away from the glass substrate 100 relative to the second dielectric layer 620. The second dielectric layer 620 and the third dielectric layer 630 mainly serve to improve the adhesion of the functional layer 200 to the glass substrate 100, protect the functional layer 200, improve the light transmittance, adjust the color of the low-emissivity coated glass, and reduce the reflectivity when a dielectric material with a high refractive index is selected.

According to the technical scheme, the absorption layer 400 comprising at least three protective layers is arranged between the glass base layer 100 and the functional layer 200, so that sunlight penetrating through the glass base layer 100 is absorbed, the reflectivity of the low-radiation coated glass is effectively reduced, and light pollution caused by mirror reflection of the low-radiation coated glass is reduced. Meanwhile, the absorption layer 400 also plays a role in protecting the functional layer 200, and the protective film layer 300 is positioned on one side of the functional layer 200, which is far away from the absorption layer 400, so that the overall stability of the low-emissivity coated glass is protected, the mechanical performance of the product is improved, and the product is not easily scratched. Compared with the method for reducing the reflectivity of the low-radiation coated glass by adopting the antireflection coated glass or the antireflection film, the low-radiation coated glass disclosed by the invention is low in production cost, reduces the reflectivity of the low-radiation coated glass, meets the strict outdoor reflectivity requirement, and has a wide market application space.

The material of the protective layer is various, and in one embodiment, the protective layer is one or two of a NiCr layer, a Cr layer, or a Cu layer, so that sunlight transmitted through the glass substrate 100 is absorbed, and the reflectivity of the low-emissivity coated glass is effectively reduced. It is understood that the protective layer may also be a Zn layer, ZnNx layer, CrOx layer, Nb layer, or Ti layer.

Specifically, referring to fig. 1 to 2, in an embodiment, the absorption layer 400 includes a first protection layer 410, a second protection layer 420 and a third protection layer 430 sequentially disposed from the glass substrate 100 to the functional layer 200, and the first protection layer 410 is a NiCr layer.

One side of the first protection layer 410 is attached to the glass substrate 100, and the other side is provided with a second protection layer 420, wherein the first protection layer 410 is a NiCr layer, which absorbs part of sunlight penetrating through the glass substrate 100, thereby effectively reducing the outdoor reflectivity. The second protection layer 420 and the third protection layer 430 are one or two of a NiCr layer, a Cr layer, or a Cu layer, and the Cr layer and the Cu layer may be used to adjust the color of the low-emissivity coated glass, so that low-emissivity coated glass of different colors is obtained, and different low-emissivity coated glass may be selected according to indoor design, thereby satisfying the requirements of users.

Further, referring to fig. 1 to 2, in an embodiment, the low-emissivity coated glass with low reflectivity further includes a fourth protection layer 500, the fourth protection layer 500 is located between the functional layer 200 and the protection film layer 300, and the fourth protection layer 500 is one or two of a NiCr layer, a Cr layer, or a Cu layer.

Referring to fig. 2, the fourth protective layer 500 is located between the functional layer 200 and the protective film 300, and is used for absorbing sunlight, further reducing the outdoor reflectivity, and also playing a role in protecting the functional layer 200. The composite layer formed by the fourth protective layer 500 and the protective film 300 has strong absorption of sunlight, and can adjust the reflection performance of the low-emissivity coated glass.

In order to further reduce the reflectivity of the low-emissivity coated glass, referring to fig. 2, in an embodiment, the low-emissivity coated glass further includes a first dielectric layer 610, and the first dielectric layer 610 is located between the glass base layer 100 and the first protection layer 410; the second dielectric layer 620 is located between the first protective layer 410 and the second protective layer 420; the third dielectric layer 630 is located between the second passivation layer 420 and the third passivation layer 430.

Referring to fig. 2, the first dielectric layer 610 and the first protection layer 410, the second dielectric layer 620 and the second protection layer 420, and the third dielectric layer 630 and the third protection layer 430 form metal layers, respectively, which not only have strong absorption to sunlight and reduce the reflection performance of the low-emissivity coated glass, but also have the function of controlling the optical performance and color of the film system.

Further, referring to fig. 1 to 2, in an embodiment, the first dielectric layer 610 and/or the protective film 300 is a SiNx layer, where x in the SiNx is in a range from 0.50 to 1.33; the thickness of the first dielectric layer 610 is 25nm to 35nm, and the thickness of the protective film layer 300 is 30nm to 48 nm.

The first dielectric layer 610 is a SiNx layer, x in the SiNx layer is in a range of 0.50 to 1.33, sodium elements in the glass base layer 100 can be prevented from diffusing and transferring to other film layers, the structure of the functional layer 200 is prevented from being damaged, the adsorption force between the film layers and the glass base layer 100 is increased, and the glass base layer has strong corrosion resistance, mechanical scratch resistance and high-temperature oxidation resistance. The thickness of the first dielectric layer 610 is 25nm to 35nm, thereby controlling the performance of the low-emissivity coated glass.

Referring to fig. 1 to 2, the protective film 300 is located on the top layer, and has high hardness and stable physical and chemical properties due to the high hardness of SiNx, so that the film layer can be prevented from being scratched, corroded, and the like, the mechanical processing property and scratch resistance of the low-emissivity coated glass are improved, and the practicability of the product is improved. The thickness of the protective film 300 can be 30nm to 48nm, taking into account the production cost and the mechanical properties of the product.

Referring to fig. 2, in an embodiment, the second dielectric layer 620 and/or the third dielectric layer 630 are one or two of a ZnAlOx layer and a ZnSnOx layer; the thickness of the second dielectric layer 620 is 36nm to 47nm, and the thickness of the third dielectric layer 630 is 38nm to 52 nm.

Referring to fig. 2, the second dielectric layer 620 is located between the first protective layer 410 and the second protective layer 420, and the third dielectric layer 630 is located between the second protective layer 420 and the third protective layer 430, and is used for separating the functional layer 200 from the glass substrate 100 and protecting the functional layer 200. In addition, the method is also used for adjusting the film structure and the product color of the low-emissivity coated glass. In order to further reduce the low reflectivity of the product, the thickness of the second dielectric layer 620 is 36nm to 47nm, and the thickness of the third dielectric layer 630 is 38nm to 52 nm. The materials of the first dielectric layer 610, the second dielectric layer 620 and the third dielectric layer 630 are different, and can make up for the difference according to the quality of the materials, for example, when the first dielectric layer 610 is a SiNx layer, the SiNx has low transmittance, and when the second dielectric layer 620 and the third dielectric layer 630 are ZnSnOx layers, the transmittance is relatively high.

In consideration of the position difference of the different protection layers, in one embodiment, the thickness of the first protection layer 410 is 6nm to 14nm, the thickness of the second protection layer 420 is 6nm to 14nm, the thickness of the third protection layer 430 is 2nm to 5nm, and the thickness of the fourth protection layer 500 is 2nm to 5 nm.

The functional layer 200 is made of Ag, and referring to fig. 1 to 2, in an embodiment, the thickness of the Ag layer is 5nm to 14 nm. The functional layer 200 mainly utilizes the low radiation performance of silver to reduce the radiation rate of low-radiation coated glass, filters sunlight into a cold light source, improves the heat insulation performance of the coated glass, and brings good energy-saving performance to products.

In one embodiment, the low-emissivity coated glass comprises, from the glass substrate 100 to the outside, a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300, which have thicknesses of 32.70nm, 9.13nm, 38.30nm, 10.40nm, 40.30nm, 2.87nm, 10.03nm, 2.87nm and 36.20nm, respectively.

In another embodiment, the low-emissivity coated glass comprises, from the glass substrate 100 to the outside, a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300, which have thicknesses of 28.70nm, 10.97nm, 45.10nm, 8.52nm, 47.50nm, 4.02nm, 7.31nm, 4.02nm and 43.40nm, respectively.

The protective layer is made of metal materials, can absorb and block sunlight, and effectively reduces outdoor reflectivity. On the basis of the most classical Low-E film layer structure, a plurality of groups of dielectric layers and protective layers are arranged between the glass base layer 100 and the functional layer 200 to play double absorption and blocking roles, the reflectivity of the Low-radiation coated glass is lower than 4%, and the strict requirement that the reflectivity is not more than 5% is met. The low-emissivity coated glass can be applied to the fields of building doors and windows, building curtain walls or building internal devices.

The invention also provides a preparation method of the low-emissivity coated glass with low reflectivity, and the preparation method is used for preparing the low-emissivity coated glass with low reflectivity. The preparation method comprises the following steps: performing vacuum magnetron sputtering on the surface of the glass base layer 100 by using a target in a vacuum environment, and sequentially sputtering to form an absorption layer 400, a second dielectric layer 620, a third dielectric layer 630, a functional layer 200 and a protective film layer 300, wherein the absorption layer 400 comprises at least three protective layers, and the second dielectric layer 620 and the third dielectric layer 630 are respectively positioned between the two protective layers.

Specifically, the absorption layer 400 includes a first protection layer 410, a second protection layer 420 and a third protection layer 430, the dielectric layers include a first dielectric layer 610, a second dielectric layer 620 and a third dielectric layer 630, and the first dielectric layer 610, the first protection layer 410, the second dielectric layer 620, the second protection layer 420, the third dielectric layer 630, the third protection layer 430, the functional layer 200, the fourth protection layer 500 and the protection film layer 300 may be sequentially formed on the surface of the glass substrate 100 by sputtering. During magnetron sputtering, the target material used by the cathode position is a silicon-aluminum target, a zinc-tin target, a silver target, a nickel-chromium target, a chromium target and a copper target.

In the preparation method, the first dielectric layer 610 and the protective film layer 300 can be formed into a SiNx layer by magnetron sputtering of a silicon-aluminum target, wherein the weight ratio of silicon to aluminum of the silicon-aluminum target is 9: 1. The second dielectric layer 620 and the third dielectric layer 630 can be formed by forming a ZnAlOx layer by magnetron sputtering of a zinc-aluminum target, wherein the weight ratio of zinc to aluminum of the silicon-aluminum target is 98: 2; the ZnSnOx layer can also be formed by magnetron sputtering of a zinc-tin target, wherein the weight ratio of zinc to tin of the zinc-tin target is 5: 5. The first, second, third and fourth protective layers 410, 420, 430 and 500 may be formed of a NiCr layer by magnetron sputtering of a nickel-chromium target with a weight ratio of nickel to chromium of 8: 2; the second protective layer 420, the third protective layer 430 and the fourth protective layer 500 may also be formed by magnetron sputtering of a chromium target with a chromium purity of 99.95%; alternatively, the second, third, and fourth protective layers 420, 430, and 500 are formed of Cu by magnetron sputtering from a copper target having a copper purity of 99.99%. The functional layer 200 is formed by magnetron sputtering of a silver target with a silver purity of 99.99%.

The silver target, the nickel-chromium target, the chromium target and the copper target are planar targets, and the silicon-aluminum target, the zinc-aluminum target and the zinc-tin target are rotary targets.

During magnetron sputtering, the use power is controlled to ensure stable sputtering and not to damage the target material. The silicon-aluminum target powerNot more than 70Kw, the ratio of high-purity argon to high-purity nitrogen in the sputtering process gas is 1: 1, and the sputtering pressure is 2 x 10^-3mbar to 5 x 10^-3mbar. The power of the zinc-aluminum target is not more than 60Kw, the proportion of high-purity argon and high-purity oxygen in the sputtering process gas is 0.78: 1, sputtering gas pressure of 2 x 10^-3mbar to 5 x 10^-3mbar. The power of the zinc-tin target is not more than 60Kw, the proportion of high-purity argon and high-purity nitrogen in the sputtering process gas is 0.78: 1, sputtering gas pressure of 2 x 10^-3mbar to 5 x 10^-3mbar. The power of the chromium target is not more than 20Kw, the sputtering process gas is high-purity argon, and the sputtering pressure is 2 x 10^-3mbar to 5 x 10^-3mbar. The power of the chromium target is not more than 20Kw, the sputtering process gas is high-purity argon, and the sputtering pressure is 2 x 10^-3mbar to 5 x 10^-3mbar. The power of the copper target is not more than 20Kw, the sputtering process gas is high-purity argon, and the sputtering pressure is 2 x 10^-3mbar to 5 x 10^-3mbar. The power of the silver target is not more than 20Kw, the sputtering process gas is high-purity argon, and the sputtering pressure is 2 x 10^-3mbar to 5 x 10^-3mbar。

Embodiments of the present invention will be described in detail below with reference to specific examples, but those skilled in the art will appreciate that the following examples are only illustrative of the present invention and should not be construed as limiting the scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

Example 1

A low-emissivity coated glass with low reflectivity comprises a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300 from a glass substrate 100 to the outside in sequence. The first dielectric layer 610 is a SiNx layer with a thickness of 32.70 nm; the first protection layer 410 is a NiCr layer with a thickness of 9.13 nm; the second dielectric layer 620 is a ZnSnOx layer with a thickness of 38.30 nm; the second protection layer 420 is a NiCr layer with a thickness of 10.40 nm; the third dielectric layer 630 is a ZnSnOx layer with a thickness of 40.30 nm; the third protection layer 430 is a NiCr layer with a thickness of 2.87 nm; the functional layer 200 is an Ag layer with the thickness of 10.03 nm; the fourth protection layer 500 is a NiCr layer with a thickness of 2.87 nm; the protective film 300 is a SiNx layer with a thickness of 36.20 nm.

In this embodiment, the glass substrate 100 of the low-emissivity coated glass is 6mm white glass. The preparation method of the low-emissivity coated glass comprises the following steps: performing vacuum magnetron sputtering on the surface of the glass substrate 100 by using a target in a vacuum environment, and sequentially sputtering to form a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective film 300.

In this example, the glass surface color L of the low-emissivity coated glass is 23.63, a is-1.05, b is-4.75, and the outdoor reflectivity after synthesizing the hollow glass is 4.89%.

Example 2

A low-emissivity coated glass with low reflectivity comprises a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300 from a glass substrate 100 to the outside in sequence. The first dielectric layer 610 is a SiNx layer with a thickness of 28.70 nm; the first protection layer 410 is a NiCr layer with a thickness of 10.97 nm; the second dielectric layer 620 is a ZnAlOx layer with the thickness of 45.10 nm; the second protection layer 420 is a NiCr layer and a Cu layer, and the thicknesses of the NiCr layer and the Cu layer are 4.52nm and 4.00nm respectively; the third dielectric layer 630 is a ZnAlOx layer with the thickness of 47.50 nm; the third protection layer 430 is a NiCr layer with a thickness of 4.02 nm; the functional layer 200 is an Ag layer with the thickness of 7.31 nm; the fourth protection layer 500 is a NiCr layer with a thickness of 4.02 nm; the protective film 300 is a SiNx layer with a thickness of 43.40 nm.

In this embodiment, the glass substrate 100 of the low-emissivity coated glass is 6mm white glass. The preparation method of the low-emissivity coated glass comprises the following steps: performing vacuum magnetron sputtering on the surface of the glass substrate 100 by using a target in a vacuum environment, and sequentially sputtering to form a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective film 300.

In this example, the glass surface color L of the low-emissivity coated glass is 23.97, a is-2.17, b is-4.88, and the outdoor reflectivity after synthesizing the hollow glass is 4.91%.

Example 3

A low-emissivity coated glass with low reflectivity comprises a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300 from a glass substrate 100 to the outside in sequence. The first dielectric layer 610 is a SiNx layer, and the thickness is 33.30 nm; the first protection layer 410 is a NiCr layer with a thickness of 12.77 nm; the second dielectric layer 620 is a ZnAlOx layer with the thickness of 38.80 nm; the second protective layer 420 is a Cr layer and a Cu layer, and the thicknesses are 3.47nm and 3.40nm, respectively; the third dielectric layer 630 is a ZnAlOx layer with the thickness of 51.13 nm; the third protective layer 430 is a Cr layer with a thickness of 3.70 nm; the functional layer 200 is an Ag layer with the thickness of 8.94 nm; the fourth protective layer 500 is a Cr layer with a thickness of 2.79 nm; the protective film 300 is a SiNx layer with a thickness of 32.01 nm.

In this embodiment, the glass substrate 100 of the low-emissivity coated glass is 6mm white glass. The preparation method of the low-emissivity coated glass comprises the following steps: performing vacuum magnetron sputtering on the surface of the glass substrate 100 by using a target in a vacuum environment, and sequentially sputtering to form a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective film 300.

In this example, the glass surface color L of the low-emissivity coated glass is 22.79, a is-1.09, b is-5.35, and the outdoor reflectivity after synthesizing the hollow glass is 4.91%.

Example 4

A low-emissivity coated glass with low reflectivity comprises a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300 from a glass substrate 100 to the outside in sequence. The first dielectric layer 610 is a SiNx layer with a thickness of 29.70 nm; the first protection layer 410 is a NiCr layer with a thickness of 6.97 nm; the second dielectric layer 620 is a ZnSnOx layer and a ZnAlOx layer, and the thicknesses of the ZnSnOx layer and the ZnAlOx layer are respectively 24.10nm and 22.00 nm; the second protection layer 420 is a NiCr layer, and the thickness of the second protection layer is 9.55 nm; the third dielectric layer 630 is a ZnAlOx layer with the thickness of 42.45 nm; the third protection layer 430 is a NiCr layer with a thickness of 4.90 nm; the functional layer 200 is an Ag layer with the thickness of 5.79 nm; the fourth protection layer 500 is a NiCr layer with a thickness of 3.01 nm; the protective film 300 is a SiNx layer and has a thickness of 47.30 nm.

In this embodiment, the glass substrate 100 of the low-emissivity coated glass is 6mm white glass. The preparation method of the low-emissivity coated glass comprises the following steps: performing vacuum magnetron sputtering on the surface of the glass substrate 100 by using a target in a vacuum environment, and sequentially sputtering to form a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective film 300.

In this example, the glass surface color L of the low-emissivity coated glass is 23.51, a is-1.23, b is-3.19, and the outdoor reflectivity after synthesizing the hollow glass is 4.66%.

Example 5

A low-emissivity coated glass with low reflectivity comprises a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300 from a glass substrate 100 to the outside in sequence. The first dielectric layer 610 is a SiNx layer with a thickness of 26.20 nm; the first protection layer 410 is a NiCr layer with a thickness of 9.23 nm; the second dielectric layer 620 is a ZnSnOx layer and a ZnAlOx layer, and the thicknesses of the ZnSnOx layer and the ZnAlOx layer are respectively 27.70nm and 10.00 nm; the second protection layer 420 is a NiCr layer, and the thickness of the second protection layer is 13.59 nm; the third dielectric layer 630 is a ZnSnOx layer and a ZnAlOx layer, and the thicknesses of the ZnSnOx layer and the ZnAlOx layer are 32.33nm and 15.20nm respectively; the third protection layer 430 is a NiCr layer with a thickness of 4.30 nm; the functional layer 200 is an Ag layer with the thickness of 9.12 nm; the fourth protection layer 500 is a NiCr layer with a thickness of 4.57 nm; the protective film 300 is a SiNx layer and has a thickness of 38.66 nm.

In this embodiment, the glass substrate 100 of the low-emissivity coated glass is 6mm white glass. The preparation method of the low-emissivity coated glass comprises the following steps: performing vacuum magnetron sputtering on the surface of the glass substrate 100 by using a target in a vacuum environment, and sequentially sputtering to form a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective film 300.

In this example, the glass surface color L of the low-emissivity coated glass is 23.82, a is-3.27, b is-5.54, and the outdoor reflectivity after synthesizing the hollow glass is 4.74%.

Example 6

A low-emissivity coated glass with low reflectivity comprises a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective layer 300 from a glass substrate 100 to the outside in sequence. The first dielectric layer 610 is a SiNx layer and is 31.07nm thick; the first protection layer 410 is a NiCr layer with a thickness of 8.89 nm; the second dielectric layer 620 is a ZnSnOx layer and a ZnAlOx layer, and the thickness is 42.90 nm; the second protection layer 420 is a NiCr layer and a Cu layer, and the thickness is 11.79 nm; the third dielectric layer 630 is a ZnSnOx layer and a ZnAlOx layer, and the thickness is 45.34 nm; the third protection layer 430 is a NiCr layer with a thickness of 2.01 nm; the functional layer 200 is an Ag layer with the thickness of 13.99 nm; the fourth protection layer 500 is a NiCr layer with a thickness of 3.94 nm; the protective film 300 is a SiNx layer with a thickness of 40.77 nm.

In this embodiment, the glass substrate 100 of the low-emissivity coated glass is 6mm white glass. The preparation method of the low-emissivity coated glass comprises the following steps: performing vacuum magnetron sputtering on the surface of the glass substrate 100 by using a target in a vacuum environment, and sequentially sputtering to form a first dielectric layer 610, a first protective layer 410, a second dielectric layer 620, a second protective layer 420, a third dielectric layer 630, a third protective layer 430, a functional layer 200, a fourth protective layer 500 and a protective film 300.

In this example, the glass surface color L of the low-emissivity coated glass is 22.85, a is-1.25, b is-2.98, and the outdoor reflectivity after synthesizing the hollow glass is 4.58%.

In order to investigate the performance of the low-emissivity coated glass of the present invention, the low-emissivity coated glass prepared in the above examples 1 to 6 was tested, and the test results are shown in tables 1 and 2 below.

TABLE 1 film layer Structure and thickness in examples

TABLE 2 color values of single pieces of low-E coated glass and reflectivity of synthetic hollow glass in each example

According to tables 1 and 2, the low emissivity coated glass produced in examples 1 to 6 of the present invention has a transmittance T of 35% to 43%, a transmission color a of-0.5 to-2.0, and b of 1.5 to-3.5; the glass surface has a reflection color L value of 22 to 24, a value of-1.0 to-4.0, and b value of-2.5 to-6.5. The low-emissivity coated glass has stable color, small color difference between the front surface and the side surface, and excellent color consistency when being observed from multiple angles.

After the low-emissivity coated glass is synthesized into hollow glass, the outdoor reflectivity is lower than 5%, the low-emissivity coated glass has good low reflectivity, and meets the strict requirement of the project on the outdoor reflectivity of curtain wall glass. When the glass is observed outdoors, the light pollution caused by mirror reflection is effectively reduced because the reflectivity is low, the brightness is low, and the color of the glass is close to black. In addition, the low-emissivity coated glass is prepared by adopting a magnetron sputtering deposition mode, has low production cost and is beneficial to market popularization of products.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.