阅读说明：本技术 液体喷射装置、头主体以及头主体的安装方法 (Liquid ejecting apparatus, head body, and method of mounting head body ) 是由 小林优挥 于 2020-11-25 设计创作，主要内容包括：本发明提供一种在从框架的取出时能够降低头主体损坏的可能性的液体喷射装置。液体喷射装置具备：头主体(30),其从喷嘴(47)喷射液滴；框架(28),其使头主体被定位；接地部(38),其与头主体中的沿着从框架取出的取出方向的第一侧面(30a)接触,并使头主体与框架导通；第一销(32),其作为将头主体相对于框架而定位的销,在第一侧面的法线方向上,第一侧面和接地部的接触位置SP与第一销的位置P1重叠。(The invention provides a liquid ejecting apparatus capable of reducing the possibility of damage to a head main body when the head main body is taken out from a frame. The liquid ejecting apparatus includes: a head main body (30) that ejects liquid droplets from nozzles (47); a frame (28) that positions the head main body; a grounding part (38) which is contacted with a first side surface (30a) of the head body along the taking-out direction taken out from the frame and leads the head body and the frame to be conducted; and a first pin (32) which is a pin for positioning the head body relative to the frame, wherein the contact position SP of the first side surface and the grounding part is overlapped with the position P1 of the first pin in the normal direction of the first side surface.)

1. A liquid ejecting apparatus is provided with:

a head main body that ejects liquid droplets from nozzles;

a frame that positions the head main body;

a ground portion that makes the head main body and the frame conductive by making contact with a first side surface that is a surface of the head main body along a direction of removal from the frame;

a first pin as a pin for positioning the head main body with respect to the frame,

in a normal direction of the first side surface, a contact position of the first side surface and the grounding portion overlaps with a position of the first pin.

2. The liquid ejection device according to claim 1,

the pin is provided with a second pin,

in the normal direction, the position of the second pin overlaps with both the contact position and the position of the first pin.

3. The liquid ejection device according to claim 1 or 2,

the head body includes a nozzle plate on which the nozzle is formed, and a fixing plate that is in conduction with the nozzle plate and supports the nozzle plate, a part of the fixing plate is included in the first side surface, and the grounding portion is in contact with a part of the fixing plate included in the first side surface.

4. The liquid ejection device according to claim 3,

the portion of the fixed plate included in the first side surface includes a first region whose dimension in the removal direction is a first dimension and a second region whose dimension in the removal direction is a second dimension larger than the first dimension, and the ground contact portion is in contact with the second region.

5. A head main body is positioned on a frame, and is characterized by comprising:

a nozzle plate in which nozzles for ejecting liquid droplets are formed;

a first side surface that includes a conduction portion that conducts with the nozzle plate and that is along a direction in which the nozzle plate is taken out from the frame;

a first positioning hole through which a first pin for positioning the head main body with respect to the frame is inserted,

the conduction part overlaps with the first positioning hole in a normal direction of the first side surface.

6. A method of mounting a head main body, characterized in that the head main body is positioned with respect to a frame and mounted,

in the method of attaching the head body, a ground portion that conducts the head body and the frame is brought into contact with a first side surface of the head body along a direction of removal from the frame, and a first pin is inserted into a first positioning hole provided in the head body at a position overlapping a contact position of the first side surface and the ground portion in a normal direction of the first side surface, thereby positioning the head body on the frame.

Technical Field

The present invention relates to a liquid ejecting apparatus, a head main body, and a method of mounting the head main body.

Background

For example, in the liquid ejecting apparatus described in patent document 1, a head main body for ejecting liquid droplets from nozzles is fixed to a frame in alignment with the head main body. A first mounting plate having insertion holes for inserting fixing pins for position alignment and a second mounting plate having cutout portions for inserting adjusting pins for position alignment are provided at two positions on the outer peripheral portion of the head main body. The head main body is fixed to the frame by inserting a portion of the head main body located below the first mounting plate and the second mounting plate into a mounting hole formed in the frame, and aligning the head main body with a fixing pin and an adjusting pin while bringing the first mounting plate and the second mounting plate into contact with an edge portion of the mounting hole from above. In this way, the head body is fixed to the frame, and the tip of the grounding portion extending from the frame side is in contact with one side surface of the head body on the lower side of the first mounting plate and the second mounting plate from the side surface, whereby the grounding of the head body is achieved.

In the above-described conventional liquid ejecting apparatus, when the head body is taken out of the mounting hole of the frame, for example, at the time of replacement of the head body, the head body is extracted from the mounting hole while swinging in a small range in a direction intersecting with the taking-out direction from the mounting hole. That is, the portion of the head body that contacts the tip end of the grounding portion on the lower side of the first mounting plate and the second mounting plate swings in a small range so as to rotate about the position of the fixing pin or the adjusting pin on the upper side of the first mounting plate and the second mounting plate, and is pulled out upward from the mounting hole. Therefore, when the head body is pulled out upward from the mounting hole while swinging within a small range in this way, a sliding contact load along the direction of pulling out the head body from the mounting hole occurs at the contact position with the distal end of the grounding portion in the head body.

Patent document 1: japanese patent application laid-open No. 2010-36365

Disclosure of Invention

A liquid ejecting apparatus for solving the above problems includes: a head main body that ejects liquid droplets from nozzles; a frame that positions the head main body; a ground portion that is in contact with a first side surface of the head body along a direction of removal from the frame and that conducts the head body to the frame; and a first pin that positions the head body with respect to the frame, wherein a contact position between the first side surface and the grounding portion overlaps with a position of the first pin in a normal direction of the first side surface.

Drawings

Fig. 1 is a side sectional view schematically showing an internal structure of a liquid ejecting apparatus.

Fig. 2 is a plan view taken along arrow 2-2 in fig. 1.

Fig. 3 is a plan view showing a part of fig. 2 in an enlarged manner.

Fig. 4 is a perspective view of a sheet metal member constituting the ground portion.

Fig. 5 is a cross-sectional view of line 5-5 of fig. 3.

Fig. 6 is a cross-sectional view of arrow 6-6 in fig. 3.

Detailed Description

Hereinafter, an embodiment of a liquid ejecting apparatus will be described with reference to the drawings. In fig. 1, the liquid ejecting apparatus 11 is placed on a horizontal plane, and the vertical direction in fig. 1 is the vertical direction Z. In addition, when the liquid ejecting apparatus 11 is viewed from the front side, which is the left side surface in fig. 1, in two directions orthogonal to the vertical direction Z, a direction orthogonal to the paper surface in fig. 1 is referred to as a width direction X, and a left-right direction in fig. 1 is referred to as a depth direction Y. In the depth direction Y, the left side in fig. 1 is set as the front side or front surface side, and the right side in fig. 1 is set as the rear side or rear surface side.

As shown in fig. 1, the liquid ejecting apparatus 11 includes an apparatus main body 12 serving as a housing. Inside the apparatus main body 12 are provided: the recording medium transport apparatus includes a medium storage unit 13 capable of storing a medium P such as paper in a laminated state, a liquid ejecting unit 14 for ejecting droplets of ink or the like as an example of liquid onto the medium P, and a medium transport unit 15 for transporting the medium P from the medium storage unit 13 to the liquid ejecting unit 14. That is, the liquid ejecting apparatus 11 in the present embodiment is an ink jet printer that forms an image such as characters and graphics on a medium P by ejecting liquid droplets from a liquid ejecting unit 14 onto the medium P conveyed by a medium conveying unit 15 through a conveying path 16 of the liquid ejecting unit 14.

The medium conveying portion 15 includes a feed roller 17, and the feed roller 17 feeds the plurality of media P one by one to a downstream side where the liquid ejecting portion 14 is located by contacting and rotating an uppermost medium P among the plurality of media P laminated in the medium housing portion 13. A reverse roller 19 that rotates about a shaft 18 in the width direction X is provided at a position downstream of the feed roller 17 and above the feed roller 17 in the feeding direction of the medium P. The reverse roller 19 rotates counterclockwise in fig. 1 in a state where the medium P is wound around its circumferential surface, and thereby reverses the medium P fed out from the medium housing portion 13 to the reverse roller 19 by the feed roller 17 and conveys it to the downstream side.

Two driven rollers 20, 21 are rotatably provided around the reversing roller 19, and the two driven rollers 20, 21 are driven to rotate with the medium P interposed therebetween, between the reversing roller 19 and the driven rollers 20, 21. A guide member 22 is provided obliquely below the driven roller 21 located on the downstream side in the conveyance direction of the medium P, among the two driven rollers 20 and 21, and the guide member 22 guides the medium P such that the medium P fed to the downstream side from the circumferential surface of the reverse roller 19 is conveyed toward the liquid ejecting portion 14 in front. That is, when the medium P is directed from the reverse roller 19 to the liquid ejecting portion 14 through the guide member 22 on the transport path 16, the medium P is transported in the transport direction Y1 which is a direction from the rear side to the front side in the depth direction Y.

The medium conveying unit 15 includes a conveying roller pair 23 and a discharge roller pair 24 on the downstream side of the guide member 22 in the conveying direction Y1. In the transport direction Y1 of the medium P, the transport roller pair 23 is provided on the upstream side of the liquid ejecting portion 14, and the discharge roller pair 24 is provided on the downstream side of the liquid ejecting portion 14. The transport roller pair 23 and the discharge roller pair 24 are configured by drive rollers 23a and 24a and driven rollers 23b and 24b, respectively, and transport the medium P in a horizontal direction along the depth direction Y. The medium P on which an image is formed by the droplets ejected from the liquid ejecting portion 14 is conveyed from the liquid ejecting portion 14 to a more downstream side in accordance with the rotation of the ejection roller pair 24, and is discharged to the outside through a discharge port 25 formed to be opened in a side wall of the apparatus main body 12.

The liquid ejecting section 14 includes a medium supporting section 26, and the medium supporting section 26 supports the medium P, which is nipped by the transport roller pair 23 and the discharge roller pair 24 from the lower surface side and is transported to the downstream side. The medium support portion 26 is a support base having a rectangular shape in plan view with the width direction of the medium P, which is also the width direction X of the apparatus main body 12, as the longitudinal direction, and the length in the longitudinal direction is longer than the width dimension of the medium P. Further, a pair of upper and lower guide rails 27 are provided so as to extend in the width direction X at a position above the medium support portion 26 in the vertical direction Z. Further, a movable body 29 that supports a frame 28 in a cantilever shape is supported on the guide rail 27 so as to reciprocate in the width direction X that is the scanning direction of the medium P.

As shown in fig. 1 and 2, a plurality of head main bodies 30 capable of ejecting liquid droplets are mounted on the frame 28. The frame 28 has a plurality of mounting holes 31 formed therein so as to be aligned in the width direction X. The mounting hole 31 is configured to allow insertion of a portion of the head main body 30 below the middle in the vertical direction Z. The mounting hole 31 is a substantially rectangular through-hole whose longitudinal direction is along the depth direction Y. In the present embodiment, as an example, eight mounting holes 31 are arranged in the width direction X. As shown in fig. 2, four head main bodies 30 are attached to four adjacent mounting holes 31, i.e., the second to fifth mounting holes 31 from the right among the eight mounting holes 31.

As shown in fig. 2 and 3, the frame 28 is provided with a pair of pins 32 and 33 in the depth direction Y on an extension line of, for example, one long side 31a on the right side in fig. 2, out of two long sides along the longitudinal direction of the mounting hole 31. The pins 32 and 33 protrude upward in the vertical direction Z. Of the two pins 32, 33 paired in the depth direction Y, the upper pin 32 is the first pin 32 in fig. 2, and the lower pin 33 is the second pin 33. The first pin 32 and the second pin 33 are located on the extension line of the one long side 31a at the edge of the mounting hole 31, and are used as a reference for positioning when the head main body 30 is mounted on the frame 28. That is, the positions of the head main body 30 in the width direction X and the depth direction Y are determined by the first pin 32 and the second pin 33. The frame 28 is provided with screw fixing portions 34 at one side and the other side in the depth direction Y of the edge portion of the mounting hole 31, respectively, so that the head main body 30, which is partially inserted into the mounting hole 31 from above, can be fixed to the frame 28.

Fig. 3 shows an enlarged view of a portion a surrounded by a dotted line in fig. 2 to form an ellipse. As shown in fig. 3, a conductive mount 35 is provided at a position near the first pin 32 on the edge of the mounting hole 31 of the frame 28 and at a portion along the edge of the one long side 31 a. A screw hole 36 is formed in the center portion in the depth direction Y of the mounting seat 35, and positioning pins 37 for positioning a grounding portion 38, which will be described later, are provided on both sides in the depth direction Y across the screw hole 36. The positioning pin 37 protrudes upward in the vertical direction Z. The mount 35 is grounded via a not-shown grounding wire provided in the apparatus main body 12, and when the head main body 30 is mounted in the corresponding mounting hole 31, the head main body 30 is grounded via a grounding portion 38 mounted on the mount 35.

As shown in fig. 4, the grounding portion 38 is a sheet metal member formed of a conductive metal material such as aluminum, and includes a long plate-shaped mounting plate portion 39 placed on the mounting seat 35, and a contact piece portion 40 extending obliquely from a part of a side edge along the longitudinal direction of the mounting plate portion 39. A screw insertion hole 41 corresponding to the screw hole 36 of the mounting seat 35 is formed in the center portion of the mounting plate portion 39 in the longitudinal direction. Further, on both sides in the longitudinal direction of the mounting plate portion 39 across the screw insertion hole 41, a long hole 42 corresponding to one positioning pin 37 of the mounting seat 35 and a round hole 43 corresponding to the other positioning pin 37 are formed.

As shown in fig. 5, when the grounding portion 38 is mounted on the mounting seat 35, one positioning pin 37 of the mounting seat 35 is inserted into the elongated hole 42 of the mounting plate portion 39, and the other positioning pin 37 of the mounting seat 35 is aligned and inserted into the circular hole 43 of the mounting plate portion 39. Then, the grounding portion 38 contacts the tip of the contact piece portion 40 as an elastic piece with the side surface of the head main body 30 in a state where the screw insertion hole 41 of the mounting plate portion 39 is aligned with the screw hole 36 of the mounting seat 35 and the mounting plate portion 39 is in surface contact with the mounting seat 35. At this time, the contact piece portion 40 of the grounding portion 38 comes into contact with the first side surface 30a, which is a side surface along the one long side 31a of the mounting hole 31 at the side corresponding to the mount 35, of the side surface of the head main body 30, a portion of which is inserted into the mounting hole 31 of the frame 28 from above, while being elastically deformed. The grounding portion 38 is fixed to the mounting seat 35 of the frame 28 by a fixing screw 44 inserted into the screw hole 36 through the screw insertion hole 41.

As shown in fig. 5 and 6, the head body 30 is provided with a mounting flange 45 that can be engaged with an edge of the mounting hole 31 of the frame 28 from above at a halfway position in the vertical direction Z on the head body 30. That is, the mounting flange 45 has a portion that covers the positions of the first pin 32 and the second pin 33 of the frame 28 from above when the head main body 30 is inserted into the mounting hole 31 at a portion below the halfway in the vertical direction Z, and a positioning hole 46 through which the first pin 32 and the second pin 33 are inserted is formed in this portion. Incidentally, the positioning hole 46 through which the first pin 32 is inserted is set as a first positioning hole 46A.

Here, as shown in fig. 6, the first side surface 30a of the head main body 30, which is a side surface that contacts the tip end of the contact piece portion 40 of the grounding portion 38, is along the vertical direction Z that is the insertion and extraction direction with respect to the mounting hole 31 in a state where a part of the head main body 30 is inserted into the mounting hole 31 of the frame 28. That is, the first side surface 30a of the head main body 30 is along the vertical direction Z which is also the direction in which the head main body 30 is taken out from the frame 28. The contact position SP between the first side surface 30a and the land portion 38 and the position P1 of the first pin 32 overlap each other in the width direction X, which is the normal direction of the first side surface 30 a. As can be understood from fig. 2, the position of the second pin 33 also overlaps in position with both the contact position SP and the position P1 of the first pin 32 in the width direction X, which is the normal direction of the first side surface 30 a.

Further, the head main body 30 has: a nozzle plate 48 having nozzles 47 for ejecting liquid droplets formed on a lower surface thereof: and a fixing plate 49 for supporting the nozzle plate 48 from below in a state of conduction with the nozzle plate 48. The fixing plate 49 and the nozzle plate 48 are fixed together. The fixing plate 49 has: a first region 50 having a first dimension L1 along a vertical direction Z in which the head body 30 is also taken out from the frame 28, and a second region 51 having a second dimension L2 larger than the first dimension L1. That is, in the fixing plate 49, the first region 50 and the second region 51 along the vertical direction Z are included in the first side surface 30a of the head main body 30 along the vertical direction Z which is also the direction of taking out from the frame 28.

As shown in fig. 5, the contact piece portion 40 of the grounding portion 38 attached to the attachment seat 35 of the frame 28 contacts the first region 50 of the fixing plate 49 included in the first side surface 30a of the head main body 30 and the second region 51 of the second region 51 having the larger dimension L2 in the vertical direction Z. In this case, the fixing plate 49 is formed of a conductive metal material or the like, and functions as a conductive portion that is electrically connected to the nozzle plate 48.

Next, the operation of the above embodiment will be explained.

When the head body 30 is removed from the frame 28, for example, when the head body 30 is replaced, the screw fixing portion 34 that fixes the head body 30 to the frame 28 is first loosened. Then, the head main body 30 is pulled upward in the vertical direction Z in a direction in which the first pin 32 and the second pin 33 of the frame 28 are pulled out from the pair of positioning holes 46 including the first positioning hole 46A in the mounting flange 45. At this time, the head main body 30 is rotated with a small swing around the first pin 32 and the second pin 33 as shown in fig. 6 due to a pulling force of an operator who grasps the upper portion of the head main body 30.

Here, as is assumed to be indicated by a two-dot chain line in fig. 6, when the tip of the land portion 38 makes contact with the side surface of the head main body 30 at a position not overlapping with the position P1 of the first pin 32 in the normal direction of the side surface, the rotation of the rotation locus N around the position P1 of the first pin 32 is generated with respect to the contact position of the tip of the land portion 38 with the side surface of the head main body 30. In the rotation of the rotation locus N, a large force including a component in the vertical direction Z is applied to a contact position on the side surface of the head main body 30, which is in contact with the tip end of the grounding portion 38. Therefore, when the head main body 30 is pulled up in the vertical direction Z along with the rotation of the rotation locus N, a large sliding contact load along the vertical direction Z occurs at the contact position of the side surface of the head main body 30 with the tip end of the grounding portion 38.

In contrast, in the case of the present embodiment, as shown by the solid line in fig. 6, the tip of the contact piece portion 40 of the land portion 38 contacts the first side surface 30a of the head main body 30 at a position overlapping with the position P1 of the first pin 32 in the normal direction of the first side surface 30 a. Therefore, the rotation locus M centered on the position P1 of the first pin 32 is generated at the contact position SP at which the tip of the contact piece portion 40 of the land portion 38 contacts the first side surface 30a of the head main body 30. Here, in the case of the rotation locus M, a force including a component in the vertical direction Z is hardly generated. Therefore, when the head body is pulled upward in the vertical direction Z while swinging in a small range along with the rotation of the rotation locus M, a sliding contact load in the vertical direction Z is less likely to occur at the contact position SP on the first side surface 30a of the head body 30, which is in contact with the tip end of the contact piece portion 40 of the land portion 38.

In the present embodiment, the distal end of the contact piece portion 40 of the land portion 38 contacts the first side surface 30a of the head main body 30 at a position overlapping both the position P1 of the first pin 32 and the position of the second pin 33 in the normal direction of the first side surface 30 a. Therefore, the rotation generated when the head main body 30 is taken out from the frame 28 is likely to be the rotation of the rotation locus M in which the axis along the depth direction Y passing through the position P1 of the first pin 32 and the position of the second pin 33 is a rotation axis.

Further, in the head main body 30, the tip ends of the contact piece portions 40 of the land portions 38 are in contact with a second region 51 which is a planar region in the vertical direction Z of a fixing plate 49 that fixes the nozzle plate 48 to the head main body 30. Therefore, even in the second region 51 of the fixing plate 49, a sliding contact load in the vertical direction Z is less likely to occur when the head main body 30 is removed. Therefore, the possibility that the fixing plate 49 is peeled off from the lower portion of the head main body 30 is also reduced. On the other hand, when the head body 30 is attached to the frame 28, the tip of the contact piece portion 40 of the grounding portion 38 is easily brought into contact with the second region 51 of the second dimension L2 of the fixed plate 49, which has a relatively large dimension in the vertical direction Z.

Next, the effects of the above embodiment will be explained.

(1) For example, when the head body 30 is removed from the frame 28, for example, when the head body 30 is replaced, the head body 30 may be rotated in a small range of swing about the first pin 32. In this case, when the contact position SP of the first side surface 30a with the grounding part 38 and the position P1 of the first pin 32 are located at different positions in the normal direction of the first side surface 30a in the head main body 30, a sliding contact load along the direction of removal from the frame 28 is likely to occur at the contact position with the grounding part 38 on the first side surface 30a of the head main body 30. In this regard, in the present embodiment, the contact position SP between the first side surface 30a of the head main body 30 and the grounding portion 38 overlaps the position P1 of the first pin 32 in the normal direction of the first side surface 30 a. Therefore, a sliding contact load along the direction of removal from the frame 28 is less likely to occur at the contact position with the grounding portion 38 on the first side surface 30a of the head main body 30, and the possibility of damage to the head main body 30 can be reduced.

(2) When the head main body 30 is taken out from the frame 28, the head main body 30 is rotated along the rotational locus M which swings in a small range with the axis passing through the position P1 of the first pin 32 and the position of the second pin 33 as the rotational axis. Therefore, a sliding contact load along the direction of removal from the frame 28 can be made less likely to occur at the contact position with the grounding portion 38 on the first side surface 30a of the head main body 30.

(3) When the head main body 30 is taken out from the frame 28, since a sliding contact load along the taking-out direction from the frame 28 is less likely to occur at a contact position between a part of the fixing plate 49 included in the first side surface 30a of the head main body 30 and the grounding portion 38, the possibility that the fixing plate 49 is peeled off from the head main body 30 can be reduced.

(4) When the head main body 30 is positioned on the frame 28, the grounding portion 38 can be easily brought into contact with the second region 51 which is a portion of the fixing plate 49 included in the first side surface 30 a.

(5) When the head main body 30 is taken out from the frame 28 in which the first pins 32 are inserted into the first positioning holes 46A and positioned, a sliding contact load along the taking-out direction from the frame 28 is less likely to occur in the fixing plate 49 functioning as a conduction portion that conducts electricity with the nozzle plate 48, and therefore the possibility of damage to the head main body 30 can be reduced.

(6) The head main body 30 can be easily positioned and mounted on the frame 28, and when the head main body 30 mounted in this way is taken out from the frame 28, the sliding contact load with the grounding portion 38 can be suppressed to be easily taken out.

This embodiment can be modified and implemented as follows. The present embodiment and the following modifications can be combined and implemented within a range not technically contradictory to each other.

In the fixing plate 49, the portion included in the first side surface 30a of the head main body 30 may be either the first region 50 having the first dimension L1 or the second region 51 having the second dimension L2 in the direction of removing the head main body 30 from the frame 28. Alternatively, the regions may have other sizes than these sizes.

The tip of the contact piece 40 of the land portion 38 may be in contact with the first region 50 of the fixed plate 49 instead of the second region 51.

The head main body 30 may not include the fixing plate 49.

The tip of the contact piece 40 of the land portion 38 may be configured to contact the first side surface 30a of the head main body 30 other than the fixed plate 49 without contacting the second region 51 or the first region 50 of the fixed plate 49.

The second pin 33 may be provided at a position that does not overlap with both the contact position SP between the first side surface 30a and the land portion 38 and the position P1 of the first pin 32 in the normal direction of the first side surface 30a of the head main body 30.

The technical idea and the operational effects thereof grasped from the above-described embodiment and modified examples are described below.

(A) A liquid ejecting apparatus includes: a head main body that ejects liquid droplets from nozzles; a frame on which the head main body is positioned; a grounding section that is in contact with a first side surface of the head body along a direction of removal from the frame, and that conducts the head body to the frame; a first pin as a pin for positioning the head main body with respect to the frame; in a normal direction of the first side surface, a contact position of the first side surface and the grounding portion overlaps with a position of the first pin.

For example, when the head body is removed from the frame at the time of replacement of the head body or the like, rotation may occur in the head body in association with a small-range swing around the first pin. In this case, when the contact position between the first side surface and the grounding portion in the normal direction of the first side surface of the head main body is different from the position of the first pin, a sliding contact load along the extraction direction from the frame is likely to occur at the contact position with the grounding portion on the first side surface of the head main body. In this regard, according to the above configuration, since the contact position between the first side surface of the head body and the grounding portion overlaps with the position of the first pin in the normal direction of the first side surface, a sliding contact load along the extraction direction from the frame is less likely to occur at the contact position with the grounding portion on the first side surface of the head body, and thus the possibility of damage to the head body 30 can be reduced.

(B) The liquid ejecting apparatus may include, as the pin, a second pin whose position overlaps with both the contact position and the position of the first pin in the normal direction.

According to this configuration, when the head body is taken out from the frame, the head body is rotated along a rotational locus that swings to a small extent with a shaft passing through the positions of the first pin and the second pin as a rotational axis. Therefore, it is possible to make it difficult for a sliding contact load to occur along the removal direction from the frame at the contact position with the grounding portion on the first side surface of the head main body.

(C) In the liquid ejecting apparatus, the head body may include a nozzle plate in which the nozzles are formed, and a fixing plate that supports the nozzle plate in a state in which the nozzle plate is electrically connected to the fixing plate, a portion of the fixing plate may be included in the first side surface, and the land portion may be in contact with a portion of the fixing plate included in the first side surface.

According to this configuration, when the head body is taken out from the frame, a sliding contact load along the taking-out direction from the frame is less likely to occur at the contact position between the grounding part and a part of the fixing plate included in the first side surface of the head body, and therefore the possibility that the fixing plate is peeled off from the head body can be reduced.

(D) In the liquid ejecting apparatus, a portion of the fixed plate included in the first side surface may include a first region having a first dimension in the extracting direction and a second region having a second dimension larger than the first dimension, and the ground contact portion may be in contact with the second region.

According to this configuration, when the head main body is positioned on the frame, the grounding portion can be easily brought into contact with the portion of the fixed plate included in the first side surface.

(E) A head main body positioned on a frame, the head main body comprising: a nozzle plate in which nozzles for ejecting liquid droplets are formed; a first side surface including a conduction portion that conducts with the nozzle plate and along a taking-out direction taken out from the frame; and a first positioning hole into which a first pin for positioning the head main body with respect to the frame is inserted, wherein the conduction part overlaps with the first positioning hole in a normal direction of the first side surface.

According to this configuration, when the head main body is taken out from the frame in which the first pin is inserted into the first positioning hole and positioned, a sliding contact load along the taking-out direction from the frame is less likely to occur in the conductive portion, and therefore the possibility of damage to the head main body can be reduced.

(F) A method of mounting a head body, wherein the head body is positioned with respect to a frame and mounted, wherein a ground portion that conducts between the head body and the frame is brought into contact with a first side surface of the head body along a direction of removal from the frame, and a first pin is inserted into a first positioning hole provided in the head body at a position overlapping a contact position between the first side surface and the ground portion in a normal direction of the first side surface, thereby positioning the head body on the frame.

According to this configuration, the head body can be easily positioned and attached with respect to the frame, and when the head body attached in this manner is taken out from the frame, the sliding contact load with the grounding portion can be suppressed and the head body can be easily taken out.

Description of the symbols

11 … liquid ejection means; 28 … frame; 30 … head body; 30a … first side; 32 … first pin; 33 … second pin; 34 … screw fixing part; a 35 … mount; 37 … locating pins; 38 … ground; 39 … mounting plate portion; 40 … contact the tab portion; 41 … screw insertion hole; 42 … elongated holes; 43 … circular holes; 44 … set screws; 45 … mounting flanges; 46 … locating holes; 46a … first locating hole; a 47 … nozzle; 48 … a nozzle plate; 49 … fixing plate; 50 … a first region; 51 … second region; l1 … first size; l2 … second size; position P1 …; SP … contact position.