阅读说明：本技术 一种具有托层的热释电传感器 (Pyroelectric sensor with support layer ) 是由 吕晶 汪晓波 于 2020-12-18 设计创作，主要内容包括：本发明公开了一种具有托层的热释电传感器,包括：管帽,所述管帽上设有滤光片；电路板,所述电路板包括芯片和陶瓷热敏元件；托层；管座；若干个管脚；其中所述电路板安装于所述管座正面,若干个管脚从所述管座背面电连接所述电路板,所述管帽盖于所述电路板正面并连接管座的边缘,所述托层设于所述基板正面,用于隔离所述芯片,所述热释电传感器内通过托层设置形成隔离腔,隔离腔周围具有隔热和绝缘的材料包围,传感器的芯片被放置在隔离腔内,通过隔离腔可有效地避免芯片接触传感器的安装面板而受损,同时隔离敏感元件,保持较好的热平衡,可避免热量的串扰。(The invention discloses a pyroelectric sensor with a support layer, which comprises: the tube cap is provided with an optical filter; a circuit board comprising a chip and a ceramic thermal element; supporting a layer; a tube holder; a plurality of pins; the circuit board is installed in the tube seat is positive, and a plurality of pin is followed the tube seat back electricity is connected the circuit board, the pipe cap lid in the circuit board is positive and connect the edge of tube seat, it locates to ask the layer the base plate is positive for keep apart the chip, set up through asking the layer in the pyroelectric sensor and form the isolation chamber, keep apart the material that has thermal-insulated and insulating around the chamber and surround, the chip of sensor is placed in keeping apart the intracavity, can avoid chip contact sensor's mounting panel and impaired effectively through keeping apart the chamber, keeps apart sensitive component simultaneously, keeps better thermal balance, can avoid thermal crosstalk.)

1. A pyroelectric sensor with a backing layer, comprising:

the tube cap is provided with an optical filter;

a circuit board comprising a chip and a ceramic thermal element;

supporting a layer;

a tube holder;

a plurality of pins;

the circuit board is arranged on the front surface of the tube seat, the plurality of pins are electrically connected with the circuit board from the back surface of the tube seat, the tube cap covers the front surface of the circuit board and is connected with the edge of the tube seat, and the supporting layer is arranged on the front surface of the substrate and is used for isolating the chip.

2. The pyroelectric sensor as claimed in claim 1, wherein the support layer has a circular through hole, the support layer protrudes from the front surface of the circuit board, and a circular isolation cavity is formed in the circular through hole and is used for accommodating the chip.

3. The pyroelectric sensor with support layer as claimed in claim 1, wherein the edge of the front surface of the tube seat is provided with an annular fixing edge, the annular fixing edge is matched with the bottom edge of the tube cap, and the bottom edge of the tube cap is connected with the annular fixing edge.

4. The pyroelectric sensor having a support layer as claimed in claim 1, wherein the support layer is composed of a resin material.

5. The pyroelectric sensor as claimed in claim 2, wherein the chip is attached to the back surface of the circuit board, the ceramic thermal element is attached to the front surface of the circuit board, the back surface of the circuit board is attached to the support layer, and the chip faces the isolation cavity.

6. The pyroelectric sensor with the support layer as claimed in claim 1, wherein the support layer is provided with a through hole matched with the mounting position of the pin for the pin to pass through.

7. The pyroelectric sensor with support layer as claimed in claim 6, wherein the circuit board has fixing holes adapted to the pins for passing the ends of the pins and connecting the circuit board, and the fixing holes are aligned with the through holes for fixing the circuit board to the support layer.

8. The pyroelectric sensor with supporting layer as claimed in claim 1, wherein the circuit board has gold wires, and the pin ends are connected with the gold wires on the circuit board.

9. The pyroelectric sensor with the support layer as claimed in claim 1, wherein the ceramic heat sensitive element is an i-shaped structure and is attached to the circuit board by a conductive adhesive.

10. The pyroelectric sensor with support layer as claimed in claim 1, wherein the top of the cap has a square mounting opening, and the optical filter is fixed to the mounting opening by glue for transmitting heat from the heat source to the ceramic heat sensitive element through the optical filter.

Technical Field

The invention relates to the field of sensors, in particular to a pyroelectric sensor with a support layer.

Background

The pyroelectric sensor is one of the most common monitoring products of an intrusion alarm system, and has the advantages of low power consumption, good concealment, relatively low cost, no requirement on illumination conditions and the like, so that the pyroelectric sensor is widely applied to the fields of security systems, smart homes, enterprise safety and the like. The existing pyroelectric sensor is complex in structure, so that the assembly process efficiency of the pyroelectric sensor is low, and in addition, a chip inside the pyroelectric sensor is disturbed by electromagnetism in the environment, so that the performance of the chip is influenced.

Disclosure of Invention

One of the objects of the present invention is to provide a pyroelectric sensor with a support layer, which has a simple structure, does not have a complicated ceramic support, and does not require complicated equipment for installation during assembly, thereby reducing the production cost.

Another object of the present invention is to provide a pyroelectric sensor with a support layer, wherein an isolation cavity is formed in the pyroelectric sensor through the support layer, the isolation cavity is surrounded by a thermal insulation and insulation material, a chip of the sensor is placed in the isolation cavity, the chip can be effectively prevented from being damaged by contacting with a mounting panel of the sensor through the isolation cavity, and meanwhile, a sensitive element is isolated, so that a better thermal balance is maintained, and thermal crosstalk can be avoided.

Another object of the present invention is to provide a pyroelectric sensor with a support layer, wherein due to the structural arrangement of the pyroelectric resistor itself, the assembly efficiency can be greatly improved by the packaging method using a stacking assembly method.

Another object of the present invention is to provide a pyroelectric sensor with a support layer, wherein the chip in the packaging method is attached to a fixed circuit board by a conductive adhesive, and an optical filter is attached above a cap by dispensing, so as to improve the assembly efficiency.

To achieve at least one of the above objects, the present invention further provides a pyroelectric sensor having a support layer, comprising:

the tube cap is provided with an optical filter;

a circuit board comprising a chip and a ceramic thermal element;

supporting a layer;

a tube holder;

a plurality of pins;

the circuit board is arranged on the front surface of the tube seat, the plurality of pins are electrically connected with the circuit board from the back surface of the tube seat, the tube cap covers the front surface of the circuit board and is connected with the edge of the tube seat, and the supporting layer is arranged on the front surface of the substrate and is used for isolating the chip.

According to another preferred embodiment of the present invention, the supporting layer has a circular through hole, the supporting layer protrudes from the front surface of the circuit board, and a circular isolation cavity is formed in the circular through hole, and the isolation cavity is used for accommodating the chip.

According to another preferred embodiment of the present invention, the edge of the front surface of the tube base is provided with an annular fixing edge, the annular fixing edge is matched with the bottom edge of the tube cap, and the bottom edge of the tube cap is connected with the annular fixing edge.

According to a preferred embodiment of the present invention, the support layer is made of a resin material.

According to another preferred embodiment of the present invention, the chip is attached to the back surface of the circuit board, the ceramic thermosensitive element is attached to the front surface of the circuit board, the back surface of the circuit board is attached to the supporting layer, and the chip faces the isolation cavity.

According to another preferred embodiment of the present invention, the supporting layer has a through hole adapted to the mounting position of the pin, for the pin to pass through the through hole.

According to another preferred embodiment of the present invention, the circuit board has a fixing hole adapted to the pin for allowing the end of the pin to pass through and conductively connect to the circuit board, and the fixing hole is aligned with the through hole for fixing the circuit board to the supporting layer.

According to another preferred embodiment of the present invention, the circuit board has gold wires, and the ends of the pins are connected to the gold wires on the circuit board.

According to another preferred embodiment of the present invention, the ceramic heat sensitive element is an i-shaped structure and is attached to the circuit board through a conductive adhesive.

According to another preferred embodiment of the present invention, the top of the cap has a square mounting opening, and the optical filter is fixed to the mounting opening by glue for transmitting the heat source to the ceramic heat sensitive element through the optical filter.

Drawings

FIG. 1 is a schematic view of a pyroelectric sensor with a backing layer in one direction for illustrating the explosion of the present invention;

fig. 2 shows a schematic diagram of an explosion in another direction of a pyroelectric sensor with a support layer according to the present invention.

Wherein the content of the first and second substances,

pin-1, support layer-2, tube seat-3, circuit board-4, ceramic heat sensitive element-5, fixing hole-6, tube cap-7, optical filter-8, chip-9 and fixing edge-10.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1-2, the present invention further provides a pyroelectric sensor with a support layer, wherein the pyroelectric sensor comprises a cap 7; a circuit board 4; a supporting layer 2; a stem 3; the pyroelectric infrared sensor comprises a base pin 1 and other devices, wherein a light filter 8 is arranged on a pipe cap 7, a ceramic thermosensitive element and a chip 9 are arranged on a circuit board 4, the ceramic thermosensitive element is arranged above the circuit board 4, the chip 9 is arranged below the circuit board 4, a supporting layer 2 is arranged on the front surface of a pipe seat 3, and the circuit board 4 is fixedly arranged above the supporting layer 2, so that all elements of the pyroelectric infrared sensor are mutually overlapped, and the assembly of the pyroelectric infrared sensor is facilitated.

Specifically, the circuit board 4 back have with the mounting groove of the 9 looks adaptation sizes of chip, the coating has the conducting resin in the mounting groove, chip 9 passes through the conducting resin is fixed in the mounting groove at the 4 backs of circuit board, it has square frame structure to hold in the palm layer 2, it has square isolation chamber to hold in the palm the middle of layer 2, works as circuit board 4 install in when holding in the palm layer 2 top, the chip 9 at the 4 backs of circuit board is aimed at keep in the isolation chamber can hold in the palm the last frame position coating colloid of layer 2, circuit board 4 accessible the colloid is fixed in hold in the palm layer 2 top, 1 welding of the outstanding pin of circuit board 4 and tube socket 3, thereby it is fixed hold in the palm layer 2 and circuit board 4. When the circuit board 4 is fixed above the supporting layer 2, the chip 9 is accommodated in a sealed isolation cavity, the supporting layer 2 is preferably made of resin materials, and because the supporting layer 2 protrudes out of the front surface of the tube seat 3, when the circuit board is installed, a certain distance is reserved between the upper surface and the lower surface of the supporting layer 2, and a certain gap is reserved between the chip 9 positioned on the back surface of the circuit board 4 and the tube seat 3, so that the chip 9 can be kept in a relatively independent position, and the contact friction failure damage of the chip 9 is avoided.

The ceramic heat sensitive element 5 is fixed above the circuit board 4 by means of dispensing, and the ceramic heat sensitive element 5 has an i-shaped structure. The tube seat 3 is provided with a plurality of pins 1, 3, 4 and 6 pins 1 can be specifically arranged according to the number and size of chips 9, one end part of each pin 1 protrudes out of the front surface of the tube seat 3, the circuit board 4 is provided with a fixing hole 6 matched with the end part of each pin 1 protruding out of the front surface of the tube seat 3, the end part of each pin 1 protruding out of the front surface of the tube seat 3 penetrates through the fixing hole 6 and is used for rapidly fixing the circuit board 4 to the front surface of the tube seat 3, and the end part of each pin 1 protruding out of the front surface of the tube seat 3 is higher than the support layer 2, so that the circuit board 4 is fixed above the support layer 2 to achieve a better positioning effect.

The support layer 3 is preferably of a square structure, through holes corresponding to the fixing holes 6 are formed in four corners of the support layer 3, and the upper end of each pin 1 can be connected with the fixing holes 6 of the circuit board 4 through the through holes, so that the support layer 3 has a good positioning effect and is convenient to produce and process.

The mounting opening is arranged above the pipe cap 7 and is of a strip-shaped structure, and glue is coated on the mounting opening and used for attaching the optical filter 8 to the mounting opening. The tube seat 3 is provided with an annular fixing edge 10, the annular fixing size is matched with the annular edge at the bottom of the tube cap 7, and the tube cap 7 is fixed on the fixing edge 10 in a fixing mode including but not limited to dispensing and welding.

It will be understood by those skilled in the art that the embodiments of the present invention described above and illustrated in the drawings are given by way of example only and not by way of limitation, the objects of the invention having been fully and effectively achieved, the functional and structural principles of the present invention having been shown and described in the embodiments, and that various changes or modifications may be made in the embodiments of the present invention without departing from such principles.