阅读说明：本技术 一种热释电传感器及其封装方法 (Pyroelectric sensor and packaging method thereof ) 是由 吕晶 汪晓波 于 2020-12-18 设计创作，主要内容包括：本发明公开了一种热释电传感器及其封装方法,所述释电传感器包括：管帽,所述管帽上设有滤光片；电路板,所述电路板包括芯片和陶瓷热敏元件；隔离板；管座；若干个管脚；其中所述电路板安装于所述管座正面,若干个管脚从所述管座背面电连接所述电路板,所述管帽盖于所述电路板正面并连接管座的边缘,所述隔离板设于所述基板正面,用于隔离所述芯片。所述热释电传感器及其封装方法结构简单,无复杂的陶瓷支架,在装配时无需复杂的设备进行安装,从而可以降低生产成本。(The invention discloses a pyroelectric sensor and a packaging method thereof, wherein the pyroelectric sensor comprises: the tube cap is provided with an optical filter; a circuit board comprising a chip and a ceramic thermal element; a separator plate; a tube holder; a plurality of pins; the circuit board is arranged on the front surface of the tube seat, the plurality of pins are electrically connected with the circuit board from the back surface of the tube seat, the tube cap covers the front surface of the circuit board and is connected with the edge of the tube seat, and the isolation plate is arranged on the front surface of the substrate and is used for isolating the chip. The pyroelectric sensor and the packaging method thereof have the advantages of simple structure, no complex ceramic support and no need of complex equipment for installation during assembly, thereby reducing the production cost.)

1. A pyroelectric sensor, characterized by comprising:

the tube cap is provided with an optical filter;

a circuit board comprising a chip and a ceramic thermal element;

a separator plate;

a tube holder;

a plurality of pins;

the circuit board is arranged on the front surface of the tube seat, the plurality of pins are electrically connected with the circuit board from the back surface of the tube seat, the tube cap covers the front surface of the circuit board and is connected with the edge of the tube seat, and the isolation plate is arranged on the front surface of the substrate and is used for isolating the chip.

2. The pyroelectric sensor according to claim 1, wherein the front edge of the base has an annular fixing edge, the annular fixing edge is matched with the bottom edge of the cap, and the bottom edge of the cap is connected with the annular fixing edge.

3. The pyroelectric sensor as claimed in claim 1, wherein the isolation plate has a square wall plate, the isolation plate protrudes from the front surface of the circuit board, and a square isolation cavity is formed in the square wall plate, and the isolation cavity is used for accommodating the chip.

4. The pyroelectric sensor of claim 1, wherein the isolation plate is comprised of spcc metal material and is welded over the stem to form an isolated cavity.

5. The pyroelectric sensor as claimed in claim 3, wherein the chip is attached to the back surface of the circuit board, the ceramic thermal element is attached to the front surface of the circuit board, the back surface of the circuit board is attached to the upper side of the square wall plate of the isolation plate, and the chip faces the isolation cavity.

6. The pyroelectric sensor according to claim 1, wherein the bottom of the circuit board has electrical terminals adapted to the pins, and each of the electrical terminals is electrically connected to the corresponding pin.

7. The pyroelectric sensor as claimed in claim 1, wherein the circuit board has a square structure, and the surface area of the chip is smaller than the bottom surface area of the circuit board.

8. The pyroelectric sensor as claimed in claim 1, wherein the ceramic heat sensitive element is an i-shaped structure and is attached to the circuit board by a conductive adhesive.

9. The pyroelectric sensor as claimed in claim 1, wherein the top of the cap has a square mounting opening, and the optical filter is fixed to the mounting opening by glue for transmitting heat from the heat source to the ceramic heat sensitive element through the optical filter.

10. A pyroelectric sensor packaging method is characterized by comprising the following steps:

obtaining an isolation plate and a tube seat, and fixing the isolation plate above the tube seat;

connecting the pin to the back of the tube seat by adopting a wire bonding method;

coating conductive adhesive on the back of the circuit board, adhering the chip to the back of the circuit board, and electrically connecting the chip and the pins with the circuit board through gold wires;

aligning a chip on the back surface of the circuit board with an isolation cavity formed by the isolation plate, and welding the circuit board to the isolation plate;

coating glue on the mounting opening above the pipe cap, and attaching the optical filter to the mounting opening;

and welding the tube cap on which the filter chip is adhered to the tube seat.

Technical Field

The invention relates to the field of sensors, in particular to a pyroelectric sensor and a packaging method thereof.

Background

The pyroelectric sensor and the packaging method thereof are one of the most common monitoring products of an intrusion alarm system, and the pyroelectric sensor has the advantages of low power consumption, good concealment, relatively low cost, no requirement on illumination conditions and the like, and is widely applied to the fields of security systems, smart homes, enterprise safety and the like. The existing pyroelectric sensor and the packaging method thereof have complex structures, so that the assembly process efficiency of the pyroelectric sensor and the packaging method thereof is low, the process is complicated, and the yield is low.

Disclosure of Invention

One of the objects of the present invention is to provide a pyroelectric sensor and a method for packaging the same, wherein the pyroelectric sensor has a simple structure, does not have a complicated ceramic support, and does not require complicated equipment for installation during assembly, thereby reducing the production cost.

Another object of the present invention is to provide a pyroelectric sensor and a packaging method thereof, wherein the pyroelectric sensor has an isolation cavity, the isolation cavity is surrounded by a metal material, a chip of the sensor is placed in the isolation cavity, and the chip can be effectively prevented from being damaged by contacting with a mounting panel of the sensor through the isolation cavity, and can be prevented from being electromagnetically disturbed by surrounding electrical components.

Another object of the present invention is to provide a pyroelectric sensor and a packaging method thereof, wherein the packaging method can greatly improve the assembly efficiency by adopting a stacking assembly manner due to the structural arrangement of the pyroelectric resistor itself.

Another objective of the present invention is to provide a pyroelectric sensor and a packaging method thereof, in which a chip is mounted on a fixed circuit board by a conductive adhesive, and an optical filter is mounted above a cap by dispensing, so as to improve assembly efficiency.

To achieve at least one of the above-mentioned objects, the present invention further provides a pyroelectric sensor comprising:

the tube cap is provided with an optical filter;

a circuit board comprising a chip and a ceramic thermal element;

a separator plate;

a tube holder;

a plurality of pins;

the circuit board is arranged on the front surface of the tube seat, the plurality of pins are electrically connected with the circuit board from the back surface of the tube seat, the tube cap covers the front surface of the circuit board and is connected with the edge of the tube seat, and the isolation plate is arranged on the front surface of the substrate and is used for isolating the chip.

According to a preferred embodiment of the present invention, the front edge of the tube seat has an annular fixing edge, the annular fixing edge is matched with the bottom edge of the tube cap, and the bottom edge of the tube cap is connected with the annular fixing edge.

According to a preferred embodiment of the present invention, the isolation board has a square wall plate, the isolation board protrudes from the front surface of the circuit board, and a square isolation cavity is formed in the square wall plate, and the isolation cavity is used for accommodating the chip.

According to one of the preferred embodiments of the present invention, the isolation plate is composed of spcc metal material and is welded over the stem to form an isolation chamber.

According to a preferred embodiment of the present invention, the chip is attached to the back surface of the circuit board, the ceramic thermal sensitive element is attached to the front surface of the circuit board, the back surface of the circuit board is attached to the upper side of the square wall plate of the isolation plate, and the chip faces the isolation cavity.

According to a preferred embodiment of the present invention, the bottom of the circuit board has electrical connection terminals adapted to the pins, and the electrical connection terminals are electrically connected to the corresponding pins respectively.

According to one preferred embodiment of the present invention, the circuit board has a square structure, and the surface area of the chip is smaller than the bottom surface area of the circuit board.

According to a preferred embodiment of the present invention, the ceramic heat sensitive element is an i-shaped structure and is attached to the circuit board through a conductive adhesive.

According to a preferred embodiment of the present invention, the top of the cap has a square mounting opening, and the optical filter is fixed to the mounting opening by glue for transmitting the heat source to the ceramic heat sensitive element through the optical filter.

In order to achieve at least one of the above objects, the present invention further provides a pyroelectric sensor packaging method, comprising the steps of:

obtaining an isolation plate and a tube seat, and fixing the isolation plate above the tube seat;

connecting the pin to the back of the tube seat by adopting a wire bonding method;

coating conductive adhesive on the back of the circuit board, adhering the chip to the back of the circuit board, and electrically connecting the chip and the pins with the circuit board through gold wires;

aligning a chip on the back surface of the circuit board with an isolation cavity formed by the isolation plate, and welding the circuit board to the isolation plate;

coating glue on the mounting opening above the pipe cap, and attaching the optical filter to the mounting opening;

and welding the tube cap on which the filter chip is adhered to the tube seat.

Drawings

FIG. 1 is a schematic view of a pyroelectric sensor showing an explosion in one direction;

FIG. 2 is a schematic diagram showing another direction of explosion of a pyroelectric sensor according to the present invention;

FIG. 3 is a flow chart of a pyroelectric sensor packaging method according to the present invention.

Wherein the content of the first and second substances,

pin-1, isolation board-2, tube seat-3, circuit board-4, ceramic heat sensitive element-5, fixing hole-6, tube cap-7, optical filter-8, chip-9 and fixing edge-10.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1-3, the present invention further provides a pyroelectric sensor and a packaging method thereof, wherein the pyroelectric sensor comprises a cap 7; a circuit board 4; a separator 2; a stem 3; the pyroelectric infrared sensor comprises a base pin 1 and other devices, wherein a light filter 8 is arranged on a pipe cap 7, a ceramic thermosensitive element and a chip 9 are arranged on a circuit board 4, the ceramic thermosensitive element is arranged above the circuit board 4, the chip 9 is arranged below the circuit board 4, a partition board 2 is arranged on the front surface of a pipe seat 3, and the circuit board 4 is fixedly arranged above the partition board 2, so that elements of the pyroelectric infrared sensor are mutually overlapped, and the assembly of the pyroelectric infrared sensor is convenient.

Specifically, the back surface of the circuit board 4 is provided with a mounting groove with a size matched with that of the chip 9, a conductive adhesive is coated in the mounting groove, the chip 9 is fixed in the mounting groove on the back surface of the circuit board 4 through the conductive adhesive, the isolation plate 2 is provided with a square frame structure, the isolation plate 2 is welded and fixed on the front surface of the tube seat 3, a square isolation cavity is arranged in the middle of the isolation plate 2, when the circuit board 4 is arranged above the isolation plate 2, the chip 9 on the back surface of the circuit board 4 is aligned with the isolation cavity, the circuit board is welded above the isolation plate 2, when the circuit board 4 is fixed above the isolation plate 2, the chip 9 is contained in the sealed isolation cavity, the isolation plate 2 is preferably made of metal or alloy material, preferably made of spcc metal and welded on the upper surface of the tube seat 3, and a sealed metal cavity capable of shielding electromagnetic signals is formed by the isolation plate 2 and the circuit board, therefore, the circuit board 4 has a better electromagnetic protection function on the chip 9, and can effectively avoid electromagnetic disturbance of the environment. And because the isolation plate 2 protrudes out of the front surface of the tube seat 3, when the isolation plate is installed, a certain distance is reserved between the upper surface and the lower surface of the isolation plate 2, and a certain gap is reserved between the chip 9 positioned on the back surface of the circuit board 4 and the tube seat 3, so that the chip 9 can keep a relatively independent position, and the contact friction failure damage of the chip 9 is avoided.

The ceramic heat sensitive element 5 is fixed above the circuit board 4 by means of dispensing, and the ceramic heat sensitive element 5 has an i-shaped structure. The socket 3 is provided with a plurality of pins 1, 3, 4 and 6 pins 1 can be arranged according to the number and size of chips 9, one end part of each pin 1 protrudes out of the front surface of the socket 3, the circuit board 4 is provided with a fixing hole 6 matched with the end part of each pin 1 protruding out of the front surface of the socket 3, the end part of each pin 1 protruding out of the front surface of the socket 3 penetrates through the fixing hole 6 to be used for rapidly fixing the circuit board 4 on the front surface of the socket 3, and it is worth mentioning that the end part of each pin 1 protruding out of the front surface of the socket 3 is higher than the isolation plate 2, so that the circuit board 4 is fixed above the isolation plate 2 to achieve a better positioning effect.

The mounting opening is arranged above the pipe cap 7 and is of a strip-shaped structure, and glue is coated on the mounting opening and used for attaching the optical filter 8 to the mounting opening. The tube seat 3 has an annular fixing edge 10, which is adapted to the annular edge of the bottom of the cap 7 and is used to fix the cap 7 to the fixing edge 10, wherein the fixing manner is preferably welding.

It will be understood by those skilled in the art that the embodiments of the present invention described above and illustrated in the drawings are given by way of example only and not by way of limitation, the objects of the invention having been fully and effectively achieved, the functional and structural principles of the present invention having been shown and described in the embodiments, and that various changes or modifications may be made in the embodiments of the present invention without departing from such principles.