阅读说明：本技术 惯性计测装置、电子设备及移动体 (Inertia measurement device, electronic apparatus, and moving object ) 是由 小泽谅平 于 2020-10-26 设计创作，主要内容包括：本发明涉及惯性计测装置、电子设备及移动体。惯性计测装置具有：基板；惯性传感器,配置在所述基板的第一面；盖,覆盖所述惯性传感器并与所述基板接合；以及端子,配置于所述基板并与安装对象物接合,在从所述基板的厚度方向的俯视观察下,所述惯性传感器与端子连接部不重叠,并且位于比所述端子连接部更靠向所述基板的中央侧的位置,所述端子连接部是所述端子与所述基板的连接部分。(The invention relates to an inertia measurement device, an electronic apparatus, and a moving object. The inertia measurement device includes: a substrate; an inertial sensor disposed on a first surface of the substrate; a cover covering the inertial sensor and joined to the substrate; and a terminal that is disposed on the substrate and is joined to an object to be mounted, wherein the inertial sensor does not overlap with a terminal connection portion that is a connection portion between the terminal and the substrate and is located closer to a center of the substrate than the terminal connection portion, in a plan view in a thickness direction of the substrate.)

1. An inertial measurement unit comprising:

a substrate;

an inertial sensor disposed on a first surface of the substrate;

a cover covering the inertial sensor and joined to the substrate; and

a terminal disposed on the substrate and bonded to an object to be mounted,

the inertial sensor is not overlapped with a terminal connection portion, which is a connection portion between the terminal and the substrate, and is located closer to a center side of the substrate than the terminal connection portion, in a plan view in a thickness direction of the substrate.

2. An inertial measurement unit according to claim 1, characterized in that,

the substrate has a groove disposed between the inertial sensor and the terminal connecting portion in the plan view.

3. An inertial measurement unit according to claim 2, characterized in that,

the groove is shaped like a frame surrounding the inertial sensor in the plan view.

4. An inertial measurement unit according to claim 2 or 3, characterized in that,

the slot is open at the first face.

5. An inertial measurement unit according to claim 2 or 3, characterized in that,

the terminal is disposed on a second surface opposite to the first surface,

the slot is open at the second face.

6. An inertial measurement unit according to claim 2 or 3, characterized in that,

the terminal is disposed on a second surface opposite to the first surface,

the groove has a first groove opening at the first face and a second groove opening at the second face.

7. An inertial measurement unit according to claim 1, characterized in that,

a cover joint portion, which is a joint portion of the substrate and the cover, is located between the terminal connecting portion and the inertial sensor in the plan view.

8. An inertial measurement unit according to claim 7, characterized in that,

the groove is located closer to the center of the substrate than the cover joint portion in the plan view.

9. An inertial measurement unit according to claim 1, characterized in that,

the substrate has a through hole that is disposed offset from between the inertial sensor and the terminal connecting portion in the plan view, and that penetrates the substrate in a thickness direction.

10. An inertial measurement unit according to claim 1, characterized in that,

the lid has a constant potential.

11. An inertial measurement unit according to claim 1, characterized in that,

the terminals are leads extending from the substrate.

12. An electronic device is characterized by comprising:

the inertial measurement unit according to any one of claims 1 to 11; and

and a control circuit for performing control based on an output signal of the inertia measurement device.

13. A moving body is characterized by comprising:

the inertial measurement unit according to any one of claims 1 to 11; and

and a signal processing circuit for performing signal processing based on an output signal of the inertia measurement device.

Technical Field

The invention relates to an inertia measurement device, an electronic apparatus, and a moving object.

Background

Patent document 1 describes a sensor device including: a substrate; an inertial sensor disposed on an upper surface of the substrate; a protective substrate covering the inertial sensor and bonded to an upper surface of the substrate; a wiring section disposed on a lower surface of the substrate and electrically connected to the inertial sensor via a through electrode penetrating the substrate; and an electrode portion serving as a terminal provided in the wiring portion.

Patent document 1: japanese patent laid-open publication No. 2016-138774

However, in the sensor device described in patent document 1, since the electrode portion overlaps the inertial sensor in a plan view, that is, since the inertial sensor is located directly above the electrode portion, stress is easily transmitted to the inertial sensor via the electrode portion. Therefore, there is a problem that the characteristics of the inertial sensor are easily deteriorated due to the stress.

Disclosure of Invention

An aspect of the present invention is an inertia measurement device including: a substrate; an inertial sensor disposed on a first surface of the substrate; a cover covering the inertial sensor and joined to the substrate; and a terminal that is disposed on the substrate and is joined to an object to be mounted, wherein the inertial sensor does not overlap with a terminal connection portion that is a connection portion between the terminal and the substrate and is located closer to a center of the substrate than the terminal connection portion, in a plan view in a thickness direction of the substrate.

In one aspect of the present invention, the substrate preferably has a groove disposed between the inertial sensor and the terminal connection portion in the plan view.

In one aspect of the present invention, the groove is preferably a frame shape surrounding the inertial sensor in the plan view.

Preferably, in one aspect of the present invention, the groove is open at the first surface.

In one aspect of the present invention, the terminal is preferably disposed on a second surface opposite to the first surface, and the groove is preferably open on the second surface.

In one aspect of the present invention, the terminal is disposed on a second surface opposite to the first surface, and the groove preferably has a first groove opening on the first surface and a second groove opening on the second surface.

In one aspect of the present invention, a cover joint portion is preferably located between the terminal connecting portion and the inertial sensor in the plan view, and the cover joint portion is a joint portion between the substrate and the cover.

In one aspect of the present invention, the groove is preferably located closer to a center of the substrate than the cover joint portion in the plan view.

In one aspect of the present invention, the substrate may have a through hole that is disposed offset from a position between the inertial sensor and the terminal connection portion in the plan view, and that penetrates through the substrate in a thickness direction.

Preferably, in one mode of the present invention, the cover has a constant potential.

In one aspect of the present invention, the terminal is a lead extending from the substrate.

An aspect of the present invention is an electronic device including: the inertia measuring device described above; and a control circuit for performing control based on an output signal of the inertia measurement device.

One aspect of the present invention is a moving object, including: the inertia measuring device described above; and a signal processing circuit that performs signal processing based on an output signal of the inertia measurement device.

Drawings

Fig. 1 is a plan view showing an inertia measurement device according to a first embodiment.

Fig. 2 is a sectional view taken along line a-a of fig. 1.

Fig. 3 is a plan view showing a modification of the inertia measurement apparatus shown in fig. 1.

Fig. 4 is a cross-sectional view showing an inertia measuring apparatus according to a second embodiment.

Fig. 5 is a plan view showing an inertia measurement device according to a third embodiment.

Fig. 6 is a sectional view taken along line B-B of fig. 5.

Fig. 7 is a plan view showing an inertia measurement device according to a fourth embodiment.

Fig. 8 is a perspective view showing a smartphone according to a fifth embodiment.

Fig. 9 is a perspective view showing a movable body according to a sixth embodiment.

Description of the reference numerals

1 … inertial measurement unit; 2 … a substrate; 2a … first outer edge portion; 2b … second outer edge portion; 2c … third outer edge portion; 2d … fourth outer edge portion; 21 … upper surface; 22 … lower surface; 23. a 24 … terminal; 281. 282 … through holes; 29 … grooves; 29a … first part; 29b … second part; 29c … third part; 29d … fourth part; 291 … first groove; 292 … second groove; 3 … inertial sensor; 31 … package body; 34 … sensor element; 4 … inertial sensor; 41 … package body; 44 … sensor element; 5 … inertial sensors; 51 … package body; 54 … sensor element; 6 … inertial sensor; 61 … package body; 64. 65, 66 … sensor elements; 7 … circuit elements; 8 … cover; 80 … a lid engagement portion; 81 … recess; 9. 9a, 9b, 9c, 9d … lead wires; 90 … terminal connection; 1200 … smart phone; 1208 … display part; 1210 … control circuit; 1500 … automobile; 1502 … signal processing circuitry; 1510 … system; D. d1, D2 … depth; part F …; a G1 … gap; h … solder; t … thickness; q … mounting object; w … width.

Detailed Description

The inertia measurement device, the electronic apparatus, and the moving object according to one embodiment of the present invention will be described in detail below based on embodiments shown in the drawings.

First embodiment

Fig. 1 is a plan view showing an inertia measurement device according to a first embodiment. Fig. 2 is a sectional view taken along line a-a of fig. 1. Fig. 3 is a plan view showing a modification of the inertia measurement apparatus shown in fig. 1. For convenience of explanation, three axes orthogonal to each other are shown as an X axis, a Y axis, and a Z axis in each drawing. A direction parallel to the X axis is also referred to as an "X axis direction", a direction parallel to the Y axis is also referred to as a "Y axis direction", and a direction parallel to the Z axis is also referred to as a "Z axis direction". The positive side in the Z-axis direction is also referred to as "up", and the negative side in the Z-axis direction is also referred to as "down".

The inertia measurement device 1 includes: a substrate 2 having an upper surface 21 as a first surface and a lower surface 22 as a second surface in a front-back relationship with each other; four inertial sensors 3, 4, 5, 6 and a circuit element 7 arranged on an upper surface 21 of the substrate 2; a cover 8 covering them and engaged with the upper surface 21 of the substrate 2; and a plurality of leads 9 as terminals disposed on the lower surface 22 of the substrate 2 and extending from the substrate 2. As shown in fig. 2, the inertia measurement apparatus 1 is attached to an object Q via a plurality of leads 9, and in the attached state, the substrate 2 floats on the object Q. That is, a gap G1 is formed between the mounting object Q and the substrate 2. This makes it difficult to transmit stress from the mounting object Q to the substrate 2, and the characteristics of the inertia measurement apparatus 1 are stable.

The substrate 2 is substantially square in a plan view in the Z-axis direction. Such a substrate 2 supports the inertial sensors 3, 4, 5, and 6, the circuit element 7, and the plurality of leads 9, and electrically connects the inertial sensors 3, 4, 5, and 6, the circuit element 7, and the plurality of leads 9. The substrate 2 is a printed substrate, and for example, an epoxy substrate, a glass epoxy substrate, a ceramic substrate, or the like can be used. As shown in fig. 1 and 2, the wiring formed on the substrate 2 includes: a terminal 23 disposed on the lower surface 22 and electrically connected to the lead 9; a terminal 24 disposed on the upper surface 21 and electrically connected to the inertial sensors 3, 4, 5, 6 and the circuit element 7; and internal wiring, not shown, for electrically connecting these terminals 23, 24, and electrically connecting the inertial sensors 3, 4, 5, 6, the circuit element 7, and the plurality of leads 9 via the wiring.

Among the inertial sensors 3, 4, 5, and 6, the inertial sensor 3 is an X-axis angular velocity sensor that detects an angular velocity around the X-axis, the inertial sensor 4 is a Y-axis angular velocity sensor that detects an angular velocity around the Y-axis, the inertial sensor 5 is a Z-axis angular velocity sensor that detects an angular velocity around the Z-axis, and the inertial sensor 6 is a triaxial acceleration sensor that independently detects an acceleration in the X-axis direction, an acceleration in the Y-axis direction, and an acceleration in the Z-axis direction, respectively. That is, the inertia measurement device 1 of the present embodiment is a six-axis compound sensor. However, the configuration of the inertia measurement apparatus 1 is not limited to this, and at least one of the inertia sensors 3, 4, 5, and 6 may be omitted, or other electronic components may be added.

Next, the inertial sensors 3, 4, and 5 will be described. The inertial sensors 3, 4, and 5 have the same configuration, and are disposed with their postures inclined by 90 ° with respect to each other so as to correspond to the respective detection axes.

As shown in fig. 1, the inertial sensor 3 includes a package 31 and a sensor element 34 housed in the package 31. Similarly, the inertial sensor 4 includes a package 41 and a sensor element 44 housed in the package 41, and the inertial sensor 5 includes a package 51 and a sensor element 54 housed in the package 51. The sensor elements 34, 44, and 54 are, for example, crystal oscillators having a driving arm and a detecting arm. When an angular velocity is applied in a state where the drive arm is driven to vibrate, the vibration is detected by exciting the vibration to the detection arm by Coriolis force (Coriolis force), and the angular velocity can be obtained based on the electric charge generated in the detection arm by the detected vibration. The inertial sensors 3, 4, and 5 are bonded to the upper surface 21 of the substrate 2 via solder, not shown, and are electrically connected to the terminals 24.

The configuration of the inertial sensors 3, 4, and 5 is not particularly limited as long as the functions thereof can be exhibited. For example, the sensor elements 34, 44, and 54 are not limited to crystal vibration elements, and may be, for example, silicon structures, and are configured to detect an angular velocity based on a change in capacitance. In the present embodiment, the inertial sensors 3, 4, and 5 have the same configuration, but are not limited to this configuration, and may have at least one configuration different from the other configurations. The inertial sensor 3 may be configured as follows: not only the angular velocity around the X axis but also angular velocities around other axes such as the Y axis and the Z axis can be detected. For example, the inertial sensor 4 may be omitted when the inertial sensor 3 is configured to be able to detect angular velocities about the X axis and the Y axis, and the inertial sensor 4 and the inertial sensor 5 may be omitted when the inertial sensor 3 is configured to be able to detect angular velocities about the X axis, the Y axis, and the Z axis.

The inertial sensor 6 includes a package 61 and three sensor elements 64, 65, and 66 housed in the package 61. The sensor element 64 is an element for detecting acceleration in the X-axis direction, the sensor element 65 is an element for detecting acceleration in the Y-axis direction, and the sensor element 66 is an element for detecting acceleration in the Z-axis direction. The sensor elements 64, 65, 66 are silicon structures having a fixed electrode and a movable electrode that forms an electrostatic capacitance with the fixed electrode and is displaced relative to the fixed electrode when receiving acceleration in the detection axis direction. In this case, the acceleration in the X-axis direction can be detected based on the change in the capacitance of the sensor element 64, the acceleration in the Y-axis direction can be detected based on the change in the capacitance of the sensor element 65, and the acceleration in the Z-axis direction can be detected based on the change in the capacitance of the sensor element 66. The inertial sensor 6 is bonded to the upper surface 21 of the substrate 2 via a solder not shown and is electrically connected to the terminal 24.

The configuration of the inertial sensor 6 is not particularly limited as long as the function thereof can be exhibited. For example, the sensor elements 64, 65, and 66 are not limited to a silicon structure, and may be crystal vibration elements, for example, and detect acceleration based on electric charges generated by vibration. The sensor elements 64, 65, and 66 may be housed separately in different packages.

The circuit element 7 includes: a drive/detection circuit that drives the inertial sensor 3 and detects an angular velocity about the X axis applied to the inertial sensor 3; a drive/detection circuit that drives the inertial sensor 4 and detects an angular velocity about the Y axis applied to the inertial sensor 4; a drive/detection circuit that drives the inertial sensor 5 and detects an angular velocity about the Z axis applied to the inertial sensor 5; and a drive/detection circuit that drives the inertial sensor 6 and detects accelerations applied to the inertial sensor 6 in the X-axis, Y-axis, and Z-axis directions. The circuit element 7 is bonded to the upper surface 21 of the substrate 2 via a solder not shown and is electrically connected to the terminal 24.

Next, the lid 8 will be explained. As shown in fig. 1 and 2, the cover 8 has a recess 81 that is open on the lower surface, and is joined to the upper surface 21 of the substrate 2 via solder H in a state where the inertial sensors 3, 4, 5, and 6 and the circuit element 7 are accommodated in the recess 81. The cover 8 is conductive and is electrically connected to the terminal 24 via a solder H. When the inertia measurement apparatus 1 is driven, the cover 8 is connected to a constant potential via the terminal 24, and is grounded in the present embodiment. Thus, the cover 8 functions as a shield for shielding the interference, and the characteristics of the inertial sensors 3, 4, 5, and 6 and the circuit element 7 are stabilized. The material of the lid 8 is not particularly limited, and various metal materials can be used. In the present embodiment, the lid 8 is made of SUS (stainless steel), but may be made of aluminum, copper, or another metal material.

As shown in fig. 1, the cover 8 is substantially square slightly smaller than the substrate 2 in a plan view in the Z-axis direction, and the longitudinal center portion of each side, that is, the lower portions of the four side walls are joined to the upper surface 21 of the substrate 2 via solder H. That is, the entire periphery of the lower surface of the cover 8 is not bonded to the substrate 2 but has an unbonded portion. The portions not joined to the substrate 2, particularly the lower ends of the intersections of the adjacent side walls at the corners, are separated from the upper surface 21 of the substrate 2. That is, in each corner portion of the lower surface of the cover 8, a gap is formed between the cover 8 and the substrate 2. Thus, the inside of the lid 8 is not sealed and the inside and the outside are communicated, so that heat is hardly accumulated in the lid 8. Therefore, for example, heat generated when the inertia measurement device 1 is mounted on the mounting object Q due to solder reflow is less likely to remain in the inertia measurement device 1, and thermal damage to the inertia measurement device 1 can be reduced.

Next, the plurality of leads 9 will be explained. As shown in fig. 1, the plurality of leads 9 are joined to the outer edge portion of the lower surface 22 of the substrate 2 via solder, not shown, and electrically connected to the terminals 23. The plurality of leads 9 are arranged over the entire periphery of the outer edge portion of the substrate 2. That is, the plurality of leads 9 have: a plurality of leads 9a arranged at predetermined intervals along the longitudinal direction of the first outer edge 2a of the substrate 2; a plurality of leads 9b spaced apart from each other at predetermined intervals along the longitudinal direction of the second outer edge 2b of the substrate 2; a plurality of leads 9c arranged at predetermined intervals along the longitudinal direction of the third outer edge 2c of the substrate 2; and a plurality of leads 9d spaced apart from each other at predetermined intervals along the longitudinal direction of the fourth outer edge 2d of the substrate 2. However, the arrangement of the lead 9 is not particularly limited.

As shown in fig. 2, each of the plurality of leads 9 extends from the outer edge of the substrate 2 to the outside of the substrate 2, and is bent downward at the middle thereof, i.e., to the negative side in the Z-axis direction. By forming the lead 9 in such a shape, when the inertia measurement apparatus 1 is mounted on the mounting object Q via the lead 9, the substrate 2 is easily separated upward from the upper surface of the mounting object Q.

The basic configuration of the inertia measurement apparatus 1 is briefly described above. The arrangement of the respective portions will be described in detail below. As shown in fig. 1, the inertial sensors 3, 4, 5, and 6 and the circuit element 7 do not overlap with the terminal connection portion 90, which is a connection portion between the lead 9 and the substrate 2, and are located closer to the center of the substrate 2 than the terminal connection portion 90, when viewed from the top in the Z-axis direction. By adopting such a configuration, the inertial sensors 3, 4, 5, and 6 and the circuit element 7 can be separated from the terminal connection portion 90, and therefore, for example, the interference transmitted from the mounting object Q to the substrate 2 via the lead 9 is sufficiently attenuated before reaching the inertial sensors 3, 4, 5, and 6 and the circuit element 7, and the interference is difficult to be transmitted to the inertial sensors 3, 4, 5, and 6 and the circuit element 7. Therefore, the characteristics of the inertial sensors 3, 4, 5, and 6 and the circuit element 7 are stable, and excellent detection accuracy can be exhibited. Further, by disposing the inertial sensors 3, 4, 5, and 6 and the circuit element 7 on the center side, i.e., the inner side of the substrate 2 with respect to the terminal connection portion 90, the inertia measurement apparatus 1 can be downsized. The "disturbance" includes, for example, stress caused by vibration, heat, and a difference in linear expansion coefficient between the substrate 2 and the mounting object Q.

The distance separating the inertial sensors 3, 4, 5, and 6 and the circuit element 7 from the terminal connecting portion 90 is not particularly limited, but is preferably, for example, about 1 μm to 5 μm. Accordingly, the inertial sensors 3, 4, 5, and 6 and the circuit element 7 can be sufficiently separated from the terminal connection portion 90, and therefore, the noise reduction effect is significant. Therefore, the disturbance is more difficult to be transmitted to the inertial sensors 3, 4, 5, 6 and the circuit element 7, and the characteristics of the inertial sensors 3, 4, 5, 6 and the circuit element 7 can be made more stable. Further, the distance between the inertial sensors 3, 4, 5, and 6 and the circuit element 7 and the terminal connection portion 90 can be prevented from becoming excessively large, and the size of the inertial measurement unit 1 can be effectively prevented from becoming large.

As shown in fig. 1 and 2, the substrate 2 has a groove 29, and the groove 29 is disposed between the inertial sensors 3, 4, 5, and 6, the circuit element 7, and the terminal connecting portion 90 in a plan view in the Z-axis direction. The groove 29 has the following functions: the interference transmitted from the mounting object Q to the substrate 2 via the lead 9 is attenuated before being transmitted to the inertial sensors 3, 4, 5, 6 and the circuit element 7. In this way, by disposing the grooves 29, the interference is more unlikely to be transmitted to the inertial sensors 3, 4, 5, and 6 and the circuit element 7, and the characteristics of the inertial sensors 3, 4, 5, and 6 and the circuit element 7 are more stable, and more excellent detection accuracy can be exhibited.

The groove 29 is formed of a bottomed recess opened in the upper surface 21. I.e. the groove 29 is not open at the lower surface 22. In this way, by opening the groove 29 on the upper surface 21, which is the same surface as the surface on which the inertial sensors 3, 4, 5, and 6 and the circuit element 7 are arranged, the effect of noise attenuation by the groove 29 becomes more remarkable. Further, by providing the groove 29 with a recessed portion having a bottom instead of a through hole, the internal wiring can be pulled and wound between the bottom surface of the groove 29 and the lower surface 22, and the degree of freedom of pulling and winding the internal wiring, particularly the wiring having one end connected to the terminal 24, can be increased. In addition, a decrease in the mechanical strength of the substrate 2 can be suppressed.

As shown in fig. 2, the depth D of the groove 29 is not particularly limited, but is preferably about 1/4 or more and 3/4 or less of the thickness T of the substrate 2. That is, T/4. ltoreq. D.ltoreq.3T/4 is preferable. This makes the groove 29 sufficiently deep, and the noise attenuation effect can be more reliably and effectively exhibited. Further, it is possible to suppress a decrease in mechanical strength of the substrate 2 and a decrease in the degree of freedom of pulling and winding of the internal wiring due to the excessively deep groove 29. The width W of the groove 29 is not particularly limited, but is preferably, for example, about 0.5 μm to 2 μm. This makes the width W of the groove 29 sufficiently wide, and the noise reduction effect can be more reliably and effectively exhibited. Further, the width W of the groove 29 can be prevented from being too wide, and the substrate 2 can be prevented from being enlarged.

As shown in fig. 1, the groove 29 is a frame-like, particularly continuous ring-like shape surrounding the inertial sensors 3, 4, 5, 6 and the circuit element 7 in a plan view in the Z-axis direction. By surrounding the inertial sensors 3, 4, 5, 6 and the circuit element 7 with such frame-shaped grooves 29, it is possible to more reliably and efficiently attenuate the disturbance transmitted to the substrate 2 via the leads 9 before being transmitted to the inertial sensors 3, 4, 5, 6 and the circuit element 7. In the present embodiment, the groove 29 has a single ring shape, but may have two or more ring shapes.

The configuration of the groove 29 is not particularly limited as long as it is disposed between at least one of the inertial sensors 3, 4, 5, 6 and the lead 9. For example, the groove 29 of the modification shown in fig. 3 includes: a first portion 29a located between the lead wire 9a and the inertial sensors 3, 4, 5, 6 and extending in the Y-axis direction; a second portion 29b located between the lead 9b and the inertial sensors 3, 4, 5, 6 and extending in the X-axis direction; a third portion 29c located between the lead wire 9c and the inertial sensors 3, 4, 5, 6 and extending in the Y-axis direction; and a fourth portion 29d extending in the X-axis direction between the lead wire 9d and the inertial sensors 3, 4, 5, and 6, the first to fourth portions 29a to 29d being formed separately from each other. For example, one, two, or three of the first to fourth portions 29a to 29d may be omitted from the modification shown in fig. 3.

As shown in fig. 1, a cover bonding portion 80, which is a portion where the substrate 2 and the cover 8 are bonded via the solder H, is located between the terminal connection portion 90 and the inertial sensors 3, 4, 5, 6 and the circuit element 7 in a plan view in the Z-axis direction. Thus, by disposing the cover bonding portion 80 between the terminal connection portion 90 and the inertial sensors 3, 4, 5, 6, and the circuit element 7, the interference transmitted to the substrate 2 via the lead 9 can be released to the cover 8 via the cover bonding portion 80 before being transmitted to the inertial sensors 3, 4, 5, 6, and the circuit element 7. Therefore, the disturbance is more difficult to be transmitted to the respective inertial sensors 3, 4, 5, 6 and the circuit element 7.

In addition, the groove 29 is located closer to the center of the substrate 2 than the cover joint portion 80 in a plan view in the Z-axis direction. Since the portion of the substrate 2 located more inward than the cover joining portion 80 is reinforced by the cover 8, a groove 29 is formed in this portion, and thus a decrease in mechanical strength of the substrate 2 can be suppressed to a small extent. However, the present invention is not limited to this, and the groove 29 may be located closer to the outer edge of the substrate 2 than the cover joint portion 80 in a plan view in the Z-axis direction.

The inertia measuring apparatus 1 is explained above. As described above, the inertia measurement device 1 includes: a substrate 2; inertial sensors 3, 4, 5, 6 disposed on an upper surface 21 which is a first surface of the substrate 2; a cover 8 that covers the inertial sensors 3, 4, 5, 6 and is joined to the substrate 2; and a lead 9 as a terminal disposed on the substrate 2 and bonded to the mounting object Q, wherein the inertial sensors 3, 4, 5, and 6 are located on the center side of the substrate 2 with respect to the terminal connection portion 90 as a connection portion between the lead 9 and the substrate 2 without overlapping the terminal connection portion 90 when viewed in a plan view in the Z-axis direction which is the thickness direction of the substrate 2. With this configuration, the interference transmitted from the mounting object Q to the substrate 2 via the lead 9 is sufficiently attenuated before reaching the inertial sensors 3, 4, 5, and 6, and the interference is less likely to be transmitted to the inertial sensors 3, 4, 5, and 6. Therefore, the characteristics of the inertial sensors 3, 4, 5, and 6 are stable, and excellent detection accuracy can be exhibited. Further, by disposing the respective inertial sensors 3, 4, 5, and 6 at positions further toward the center side, i.e., the inner side of the substrate 2 than the terminal connecting portion 90, the inertia measuring apparatus 1 can be downsized.

As described above, the substrate 2 has the groove 29, and the groove 29 is disposed between the inertial sensors 3, 4, 5, and 6 and the terminal connecting portion 90 in a plan view in the Z-axis direction. The groove 29 has the following functions: the interference transmitted to the substrate 2 via the lead wires 9 is attenuated before being transmitted to the respective inertial sensors 3, 4, 5, 6. Therefore, the disturbance is more difficult to be transmitted to the inertial sensors 3, 4, 5, and 6, and the characteristics of the inertial sensors 3, 4, 5, and 6 are more stable.

As described above, the groove 29 is a frame shape surrounding the inertial sensors 3, 4, 5, and 6 in a plan view in the Z-axis direction. By surrounding the inertial sensors 3, 4, 5, and 6 with the frame-shaped groove 29, the interference transmitted to the substrate 2 via the lead 9 can be more reliably and effectively attenuated before being transmitted to the inertial sensors 3, 4, 5, and 6.

Further, as described above, the groove 29 is open at the upper surface 21. In this way, by opening the groove 29 on the upper surface 21, which is the same surface as the surface on which the inertial sensors 3, 4, 5, and 6 are arranged, the noise attenuation effect of the groove 29 can be more remarkably exhibited.

As described above, the cover bonding portion 80, which is a bonding portion between the substrate 2 and the cover 8, is located between the terminal connection portion 90 and the inertial sensors 3, 4, 5, and 6 in a plan view in the Z-axis direction. Thus, the interference transmitted to the substrate 2 via the lead 9 can be released to the cover 8 via the cover bonding portion 80 before being transmitted to the respective inertial sensors 3, 4, 5, 6. Therefore, the disturbance is more difficult to be transmitted to each of the inertial sensors 3, 4, 5, 6.

As described above, the groove 29 is located closer to the center of the substrate 2 than the cover joint portion 80 in a plan view in the Z-axis direction. Since the portion of the substrate 2 located more inward than the cover joining portion 80 is reinforced by the cover 8, a groove 29 is formed in this portion, and thus a decrease in mechanical strength of the substrate 2 can be suppressed to a small extent.

Further, as described above, the cover 8 has a constant potential. In particular, in the present embodiment, the lid 8 is grounded. Thus, the cover 8 functions as a shield for shielding the interference, and the characteristics of the inertial sensors 3, 4, 5, and 6 are stabilized.

Further, as described above, the terminal is the lead 9 extending from the substrate 2. This makes it easy to support the substrate 2 while floating on the mounting object Q.

Second embodiment

Fig. 4 is a cross-sectional view showing an inertia measuring apparatus according to a second embodiment.

This embodiment is the same as the first embodiment described above except for the configuration of the groove 29. In the following description, the present embodiment will be mainly described with respect to differences from the first embodiment described above, and descriptions of the same items will be omitted. In fig. 4, the same components as those of the above-described embodiment are denoted by the same reference numerals.

In the inertia measurement apparatus 1 shown in fig. 4, the groove 29 is formed by a bottomed recess that opens at the lower surface 22. That is, the opening of the groove 29 is located on the opposite side to the first embodiment. By opening the groove 29 in the lower surface 22, which is the same surface as the surface to which the lead 9 is bonded, as described above, it is possible to effectively attenuate the disturbance transmitted from the object Q to be mounted via the lead 9 by the groove 29. The dimensions and arrangement pattern of the grooves 29, such as the depth D and the width W, may be the same as those described in the first embodiment.

As described above, in the inertia measurement apparatus 1 according to the present embodiment, the lead 9 as a terminal is disposed on the lower surface 22, the lower surface 22 is a second surface opposite to the upper surface 21 as the first surface of the substrate 2, and the groove 29 is open on the lower surface 22. This enables the groove 29 to effectively attenuate the disturbance transmitted through the lead 9.

According to the second embodiment, the same effects as those of the first embodiment can be obtained.

Third embodiment

Fig. 5 is a plan view showing an inertia measurement device according to a third embodiment. Fig. 6 is a sectional view taken along line B-B of fig. 5.

This embodiment is the same as the first embodiment described above except for the configuration of the groove 29. In the following description, the present embodiment will be mainly described with respect to differences from the first and second embodiments described above, and descriptions of the same items will be omitted. In fig. 5 and 6, the same components as those of the above-described embodiment are denoted by the same reference numerals.

In the inertia measurement apparatus 1 shown in fig. 5 and 6, the groove 29 includes a first groove 291 including a bottomed recess opened in the upper surface 21 and a second groove 292 including a bottomed recess opened in the lower surface 22. In addition, the first groove 291 and the second groove 292 are frame-shaped so as to surround the inertial sensors 3, 4, 5, and 6 and the circuit element 7, respectively, when viewed from a plan view in the Z-axis direction. In addition, the first groove 291 and the second groove 292 do not overlap with each other in a plan view in the Z-axis direction, and the first groove 291 is located inside the second groove 292 in this embodiment. That is, the double structure has a frame-shaped first groove 291 and a frame-shaped second groove 292 surrounding the first groove 291 in a plan view in the Z-axis direction.

As described above, by forming the first groove 291 which opens on the upper surface 21 which is the same surface as the surface on which the inertial sensors 3, 4, 5, and 6 and the circuit element 7 are arranged and the second groove 292 which opens on the lower surface 22 which is the same surface as the surface on which the lead 9 is bonded, it is possible to effectively attenuate the disturbance transmitted from the mounting object Q via the lead 9 by the groove 29. The arrangement of the first groove 291 and the second groove 292 is not limited to this, and the first groove 291 may be located outside the second groove 292. At least one of the first and second grooves 291 and 292 may have the pattern shown in fig. 3.

In particular, in the present embodiment, as shown in fig. 6, the total of the depth D1 of the first groove 291 and the depth D2 of the second groove 292 is larger than the thickness T of the substrate 2, that is, satisfies the relationship of D1+ D2> T, and has a portion F where the first groove 291 and the second groove 292 overlap each other in a side view. This configuration enables the groove 29 to effectively attenuate the disturbance. However, the present invention is not limited thereto, and at least a part of D1+ D2. ltoreq.T may be used.

As described above, in the inertia measurement device 1 according to the present embodiment, the lead 9 as a terminal is disposed on the lower surface 22, the lower surface 22 is a second surface opposite to the upper surface 21 as a first surface, and the groove 29 includes the first groove 291 opening on the upper surface 21 and the second groove 292 opening on the lower surface 22. As described above, by forming the first groove 291 which opens on the upper surface 21 which is the same surface as the surface on which the inertial sensors 3, 4, 5, and 6 are arranged and the second groove 292 which opens on the lower surface 22 which is the same surface as the surface on which the lead 9 is bonded, it is possible to effectively attenuate the disturbance transmitted from the mounting object Q via the lead 9 by the groove 29.

According to the third embodiment, the same effects as those of the first embodiment can be obtained. Further, unlike the above, the first groove 291 and the second groove 292 may partially or entirely overlap each other in a plan view in the Z-axis direction. In this case, the first groove 291 and the second groove 292 do not communicate.

Fourth embodiment

Fig. 7 is a plan view showing an inertia measurement device according to a fourth embodiment.

This embodiment is the same as the first embodiment except for the configuration of the substrate 2 and the lead 9. In the following description, the present embodiment will be mainly described with respect to differences from the above-described embodiments, and descriptions of the same items will be omitted. In fig. 7, the same components as those of the above-described embodiment are denoted by the same reference numerals.

In the inertia measurement apparatus 1 shown in fig. 7, the plurality of leads 9 include a plurality of leads 9a arranged along the first outer edge portion 2a of the substrate 2 and a plurality of leads 9c arranged along the third outer edge portion 2c of the substrate 2. That is, the plurality of leads 9b arranged along the second outer edge portion 2b of the substrate 2 and the plurality of leads 9d arranged along the fourth outer edge portion 2d of the substrate 2 are omitted from the configuration of the first embodiment described above.

Further, the groove 29 has: a first portion 29a located between each lead 9a and each inertial sensor 3, 4, 5, 6, and circuit element 7 and extending in the Y-axis direction; and a third portion 29c located between each lead 9c and each inertial sensor 3, 4, 5, 6, circuit element 7 and extending in the Y-axis direction. That is, the second portion 29b and the fourth portion 29d are omitted from the modification shown in fig. 3 described above.

Further, the substrate 2 has: a through hole 281 located between the second outer edge portion 2b of the substrate 2 and each of the inertial sensors 3, 4, 5, 6 and the circuit element 7 and extending in the X-axis direction; and a through hole 282 located between the fourth outer edge portion 2d of the substrate 2 and each of the inertial sensors 3, 4, 5, 6 and the circuit element 7, and extending in the X-axis direction. The through holes 281 and 282 penetrate through the substrate 2 in the thickness direction thereof and are open on the upper surface 21 and the lower surface 22. The through holes 281 and 282 have the following functions as in the case of the groove 29: the disturbance transmitted from the mounting object Q via the lead 9 is attenuated before reaching the respective inertial sensors 3, 4, 5, 6 and the circuit element 7. The interference attenuation effect of the through holes 281 and 282 is more excellent than that of the groove 29 formed by a bottomed recess. Therefore, the disturbance transmitted from the mounting object Q via the lead wires 9 can be more effectively attenuated before reaching the respective inertial sensors 3, 4, 5, and 6 and the circuit element 7.

In particular, in the present embodiment, the groove 29 is formed in the region between each of the inertial sensors 3, 4, 5, and 6 and the circuit element 7 and the terminal connection portion 90, and the through-holes 281 and 282 are formed in the regions offset from the inertial sensors 3, 4, 5, and 6 and the region between the circuit element 7 and the terminal connection portion 90. In other words, the groove 29 is formed in the region between the first outer edge portion 2a and the third outer edge portion 2c of the substrate 2 on which the terminal connecting portion 90 is provided and each of the inertial sensors 3, 4, 5, 6, and the circuit element 7, and the through-holes 281 and 282 are formed in the region between the second outer edge portion 2b and the fourth outer edge portion 2d of the substrate 2 on which the terminal connecting portion 90 is not provided and each of the inertial sensors 3, 4, 5, 6, and the circuit element 7. This makes it possible to exhibit the above-described excellent noise reduction effect while maintaining a high degree of freedom in drawing and winding the wiring in the substrate 2, particularly the wiring of the connection terminal 24, the inertial sensors 3, 4, 5, and 6, and the circuit element 7.

In the present embodiment, the through holes 281 and 282 are formed separately from the groove 29, but the present invention is not limited to this, and for example, the ends of the through holes 281 and 282 on the positive side in the X axis direction may be connected to the first portion 29a, and the ends may be connected to the third portion 29c on the negative side in the X axis direction. That is, the groove 29 and the through holes 281 and 282 may be connected in a frame shape.

As described above, in the inertia measurement apparatus 1 of the present embodiment, the substrate 2 has the through holes 281 and 282 that are disposed offset between the inertia sensors 3, 4, 5, and 6 and the terminal connecting portion 90 and penetrate the substrate 2 in the thickness direction in a plan view in the Z-axis direction. This makes it possible to exhibit an excellent noise reduction effect while maintaining a high degree of freedom in drawing and winding the wiring in the substrate 2.

According to the fourth embodiment, the same effects as those of the first embodiment can be obtained.

Fifth embodiment

Fig. 8 is a perspective view showing a smartphone according to a fifth embodiment.

A smartphone 1200 as an electronic device shown in fig. 8 incorporates the inertia measurement device 1 and a control circuit 1210 that performs control based on a detection signal output from the inertia measurement device 1. The detection data detected by the inertia measurement device 1 is transmitted to the control circuit 1210, and the control circuit 1210 recognizes the posture or behavior of the smartphone 1200 based on the received detection data, and can change the image displayed on the display unit 1208, generate a warning sound or an effect sound, or drive the vibration motor to vibrate the main body.

The smartphone 1200 as such an electronic device includes the inertia measurement apparatus 1 and a control circuit 1210 that performs control based on a detection signal output from the inertia measurement apparatus 1. Therefore, the effects of the inertia measurement device 1 described above can be enjoyed, and high reliability can be exhibited.

In addition, the electronic device can be applied to the smartphone 1200 described above, and can be applied to, for example: personal computers, digital still cameras, tablet terminals, watches including smart watches, inkjet ejection devices, wearable terminals such as inkjet printers, HMD (head mounted display), smart glasses, televisions, video recorders, video tape recorders, car navigation devices, pagers, electronic notebooks, electronic dictionaries, electronic translators, electronic calculators, electronic game devices, training devices, word processors, workstations, video phones, crime prevention television monitors, electronic binoculars, POS terminals, electronic thermometers, sphygmomanometers, blood glucose meters, electrocardiograph devices, ultrasonic diagnostic devices, medical devices such as electronic endoscopes, fish finder, various measurement devices, measurement instruments mounted on vehicles, aircrafts, ships, base stations for portable terminals, flight simulators, and the like.

Sixth embodiment

Fig. 9 is a perspective view showing a movable body according to a sixth embodiment.

An automobile 1500 as a moving body shown in fig. 9 incorporates at least one system 1510 of an engine system, a brake system, and a keyless entry system, an inertia measurement device 1, and a signal processing circuit 1502, and is capable of detecting the posture of a vehicle body by the inertia measurement device 1. A detection signal of the inertia measurement apparatus 1 is supplied to the signal processing circuit 1502, and the signal processing circuit 1502 can control the system 1510 based on the signal.

Thus, the automobile 1500 as a moving body includes the inertia measurement device 1 and the signal processing circuit 1502 that performs control based on the detection signal output from the inertia measurement device 1. Therefore, the automobile 1500 can enjoy the effects of the inertia measurement device 1 described above and can exhibit high reliability.

The moving object including the inertia measurement device 1 may be, for example, a robot, an unmanned aerial vehicle, an electric wheelchair, a motorcycle, an aircraft, a helicopter, a ship, an electric train, a monorail, a cargo container for cargo transportation, a rocket, a spacecraft, or the like, in addition to the automobile 1500.

The inertia measuring apparatus, the electronic apparatus, and the moving object of the present invention have been described above based on the illustrated embodiments, but the present invention is not limited thereto, and the configurations of the respective portions may be replaced with arbitrary configurations having the same function. In addition, other arbitrary components may be added to the present invention.