阅读说明：本技术 一种用于检测载物台水平及垂直度的装置及其使用方法 (Device for detecting level and verticality of objective table and using method thereof ) 是由 桂纯钦 于 2020-12-21 设计创作，主要内容包括：本发明提供一种用于检测载物台水平及垂直度的装置及其使用方法,水平放置第一平面板；固定于第一平面板一端且与第一平面板垂直的第二平面板；第一、第二平面板构成具有90度角的直角装置；第一平面板上表面设有用于检测水平度的水平仪；第二平面板的左上、右上、左下、右下四个位置分别设有压感距离侦测传感器；压感距离侦测传感器的凸出部分被挤压时,该被挤压的压感距离侦测传感器显示缩进的距离值。本发明的装置可以快速且精准的量测出半导体设备是否处于正常状态,可更精准的测试和调试承载台水平及垂直度,从而降低晶圆承载盒开关门时出现的异常风险,保障晶圆的安全。(The invention provides a device for detecting the level and the verticality of an objective table and a using method thereof, wherein a first flat panel is horizontally arranged; a second flat panel fixed at one end of the first flat panel and vertical to the first flat panel; the first and second flat panels form a right-angle device with a 90-degree angle; a level gauge for detecting levelness is arranged on the upper surface of the first flat panel; pressure-sensitive distance detecting sensors are respectively arranged at the upper left position, the upper right position, the lower left position and the lower right position of the second flat panel; when the protruding portion of the pressure-sensitive distance detection sensor is pressed, the pressed pressure-sensitive distance detection sensor displays a retracted distance value. The device can rapidly and accurately measure whether the semiconductor equipment is in a normal state or not, and can more accurately test and debug the horizontal and vertical degree of the bearing platform, thereby reducing abnormal risks when the wafer bearing box is opened and closed and ensuring the safety of the wafer.)

1. A device for detecting the level and perpendicularity of an object stage, characterized by comprising at least:

a first horizontally disposed rectangular flat plate; a rectangular second flat panel fixed at one end of the first flat panel and perpendicular to the first flat panel; the first and second flat panels form a right-angle device with a 90-degree angle;

a level gauge for detecting levelness is arranged on the upper surface of the first flat panel;

pressure-sensitive distance detecting sensors are respectively arranged at the upper left position, the upper right position, the lower left position and the lower right position of the second flat panel; the pressure-sensitive distance detection sensor is positioned on one side, back to the first flat panel, of the second flat panel, and protrudes outwards in the plane where the pressure-sensitive distance detection sensor is positioned; when the protruding portion of the pressure-sensitive distance detection sensor is pressed, the pressed pressure-sensitive distance detection sensor displays a retracted distance value.

2. The apparatus of claim 1, wherein the apparatus comprises: the level gauge on the first panel is located at the center of the first panel.

3. The apparatus of claim 1, wherein the apparatus comprises: the rectangle formed by connecting lines of the pressure-sensitive distance detection sensors at the four positions of the upper left, the upper right, the lower left and the lower right on the second flat panel is positioned at the center of the second flat panel.

4. The apparatus of claim 1, wherein the apparatus comprises: further comprising: the right-angle support is respectively positioned at the intersection position of the first and second flat panels, and two right-angle edges of the right-angle support are respectively attached to the first flat panel and the second flat panel.

5. The apparatus of claim 1, wherein the apparatus comprises: the apparatus is used in conjunction with a stage of a 12 inch wafer fabrication semiconductor device.

6. Use of the device for detecting the level and perpendicularity of an object table according to any one of claims 1 to 5, characterized in that the use method at least comprises the following steps:

providing a semiconductor equipment machine and an object stage matched with the semiconductor equipment machine; the side wall of the semiconductor equipment machine table is provided with a device for controlling the opening and closing of the door of the wafer bearing box, and the height of the upper surface of the object stage is flush with the lower end of the device for controlling the opening and closing of the door of the wafer bearing box;

secondly, placing the device for detecting the level and the verticality of the objective table on the objective table, and placing a first flat plate of the device on the upper surface of the objective table; attaching a second flat panel to a device for controlling the opening and closing of the door of the wafer bearing box on the side wall of the semiconductor equipment machine table;

thirdly, detecting the levelness of the objective table by using a level gauge on the first flat panel;

and fourthly, detecting the plane verticality of the device for controlling the opening and closing of the wafer bearing box door of the semiconductor equipment machine table by using the pressure-sensitive distance detection sensor on the second flat panel.

7. The apparatus of claim 1, wherein the apparatus further comprises: the method for detecting the perpendicularity in the fourth step comprises the following steps of: the second plane is attached to the plane of the device for controlling the opening and closing of the door of the wafer bearing box, the retracting distance values of the four pressure-sensitive distance detection sensors are read, and if the four retracting distance values are the same, detection is finished; if the four read retracting distance values are not completely the same, adjusting the semiconductor equipment machine table and then reusing the device for detecting the level and the verticality of the semiconductor equipment object stage for detection until the four read retracting distance values are completely the same.

Technical Field

The invention relates to the technical field of semiconductors, in particular to a device for detecting the level and the verticality of an objective table and a using method thereof.

Background

In a 12 inch semiconductor device, the stage intersects the machine vertically. As shown in fig. 1, fig. 1 is a schematic diagram illustrating a positional relationship between a machine, a stage and a wafer cassette in the prior art. The wafer bearing box on the object stage is horizontally placed on the object stage, and the side surface of the wafer bearing box is parallel to the equipment. When objective table and board straightness skew 90 when hanging down, the deviation will appear in wafer bearing box and board depth of parallelism, the deviation can appear in the laminating of wafer bearing box opening/closing door device 01 on the board and wafer bearing box 02, there is the gap between the two, the deviation can appear when this opportunity platform end is opening or is closing the door plant of wafer bearing box, thereby can lead to the door plant to close the condition that the off-position is not gone out in the serious time, the wafer in the wafer bearing box can receive to expose and receive the pollution in ordinary environment this moment, even there is the roll-off to bear the risk that the box dropped and breaks into pieces.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a device for detecting the level and the verticality of an object stage and a method for using the same, which are used to solve the problem in the prior art that the wafer cassette is attached to a machine base of a semiconductor device in a deviation manner due to the levelness of the upper surface of the object stage and the poor verticality of the opening/closing device of the wafer cassette, and even the door plate of the wafer cassette is not closed to fall off.

To achieve the above and other related objects, the present invention provides an apparatus for detecting the level and perpendicularity of an object stage, comprising:

a first horizontally disposed rectangular flat plate; a rectangular second flat panel fixed at one end of the first flat panel and perpendicular to the first flat panel; the first and second flat panels form a right-angle device with a 90-degree angle;

a level gauge for detecting levelness is arranged on the upper surface of the first flat panel;

pressure-sensitive distance detecting sensors are respectively arranged at the upper left position, the upper right position, the lower left position and the lower right position of the second flat panel; the pressure-sensitive distance detection sensor is positioned on one side, back to the first flat panel, of the second flat panel, and protrudes outwards in the plane where the pressure-sensitive distance detection sensor is positioned; when the protruding portion of the pressure-sensitive distance detection sensor is pressed, the pressed pressure-sensitive distance detection sensor displays a retracted distance value.

Preferably, the level on the first panel is located at the center of the first panel.

Preferably, a rectangle formed by connecting lines of the pressure-sensitive distance detection sensors at four positions, namely, upper left, upper right, lower left and lower right, on the second flat panel is located at the center of the second flat panel.

Preferably, the method further comprises the following steps: the right-angle support is respectively positioned at the intersection position of the first and second flat panels, and two right-angle edges of the right-angle support are respectively attached to the first flat panel and the second flat panel.

Preferably, the apparatus is used in conjunction with a stage of a 12 inch wafer fabrication semiconductor device.

The invention also provides a using method of the device for detecting the level and the perpendicularity of the objective table, which at least comprises the following steps:

providing a semiconductor equipment machine and an object stage matched with the semiconductor equipment machine; the side wall of the semiconductor equipment machine table is provided with a device for controlling the opening and closing of the door of the wafer bearing box, and the height of the upper surface of the object stage is flush with the lower end of the device for controlling the opening and closing of the door of the wafer bearing box;

secondly, placing the device for detecting the level and the verticality of the objective table on the objective table, and placing a first flat plate of the device on the upper surface of the objective table; attaching a second flat panel to a device for controlling the opening and closing of the door of the wafer bearing box on the side wall of the semiconductor equipment machine table;

thirdly, detecting the levelness of the objective table by using a level gauge on the first flat panel;

and fourthly, detecting the plane verticality of the device for controlling the opening and closing of the wafer bearing box door of the semiconductor equipment machine table by using the pressure-sensitive distance detection sensor on the second flat panel.

Preferably, the method for detecting the perpendicularity in the fourth step comprises: the second plane is attached to the plane of the device for controlling the opening and closing of the door of the wafer bearing box, the retracting distance values of the four pressure-sensitive distance detection sensors are read, and if the four retracting distance values are the same, detection is finished; if the four indentation distance values read are not completely the same, adjusting the semiconductor equipment machine table and then reusing the device for detecting the levelness and the verticality of the semiconductor equipment object stage for detection until the four indentation distance values read are completely the same.

As described above, the apparatus for detecting the level and perpendicularity of the objective table and the method for using the same according to the present invention have the following advantages: the device can help engineers quickly and accurately measure whether the semiconductor equipment is in a normal state or not. Can help more accurate test of engineer and debugging plummer level and straightness that hangs down to reduce the unusual risk that appears when wafer bears box switch door, ensure the safety of wafer.

Drawings

FIG. 1 is a schematic diagram illustrating a relationship between a machine, a stage, and a wafer cassette in the prior art;

FIG. 2 is a side view of the apparatus for detecting stage level and verticality of the present invention;

FIG. 3 is a front view of the apparatus for detecting the level and perpendicularity of the stage according to the present invention;

FIG. 4 is a schematic three-dimensional structure of the apparatus for detecting the level and perpendicularity of the objective table according to the present invention;

fig. 5 is a schematic structural view showing that the device for detecting the level and the perpendicularity of the objective table according to the present invention is placed on the objective table.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

Please refer to fig. 1 to 5. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.

The invention provides a device for detecting the level and verticality of an objective table, which at least comprises:

a first horizontally disposed rectangular flat plate; a rectangular second flat panel fixed at one end of the first flat panel and perpendicular to the first flat panel; the first and second flat panels form a right-angle device with a 90-degree angle;

a level gauge for detecting levelness is arranged on the upper surface of the first flat panel;

pressure-sensitive distance detecting sensors are respectively arranged at the upper left position, the upper right position, the lower left position and the lower right position of the second flat panel; the pressure-sensitive distance detection sensor is positioned on one side, back to the first flat panel, of the second flat panel, and protrudes outwards in the plane where the pressure-sensitive distance detection sensor is positioned; when the protruding portion of the pressure-sensitive distance detection sensor is pressed, the pressed pressure-sensitive distance detection sensor displays a retracted distance value.

Fig. 2 is a side view of the apparatus for detecting the level and perpendicularity of the stage according to the present invention, as shown in fig. 2; wherein the first flat plate 031 is a rectangular structure placed horizontally; the second flat panel 033 is fixed to one end of the first flat panel 031 and perpendicular to the first flat panel 031, and the second flat panel 033 is also of a rectangular structure; the first flat panel 031 and the second flat panel 033 intersect to form a right-angle device with a 90-degree angle.

A level 032 for detecting levelness is arranged on the upper surface of the first flat plate 031; when the first flat plate 031 is attached to the upper surface of the object stage, the level 032 disposed on the first flat plate 031 may be used to detect the levelness of the object stage.

Pressure-sensitive distance detecting sensors are respectively arranged at the upper left position, the upper right position, the lower left position and the lower right position of the second flat panel; referring to fig. 3, fig. 3 is a front view of the apparatus for detecting the level and verticality of an object stage according to the present invention; wherein, four positions of the second flat panel 033, namely, the upper left, the upper right, the lower left and the lower right, are respectively provided with a pressure-sensitive distance detecting sensor 035; for example, the pressure-sensitive distance detecting sensor 035 at the upper left position of the second flat panel is a first sensor; the pressure-sensitive distance detecting sensor 035 at a position right above the second flat panel is a second sensor; the pressure-sensitive distance detecting sensor 035 at a lower left position of the second flat panel is a third sensor; the pressure-sensitive distance detecting sensor 035 is a fourth sensor located at a lower right position of the second flat panel.

As shown in fig. 4, fig. 4 is a schematic three-dimensional structure diagram of the apparatus for detecting the horizontal and vertical degree of the object stage according to the present invention, wherein the pressure-sensitive distance detecting sensor 035 is located on a side of the second flat panel 033 opposite to the first flat panel 031, and in fig. 4, the pressure-sensitive distance detecting sensor 035 protrudes outward in the plane thereof; when the protruding portion of the pressure-sensitive distance detection sensor 035 is pressed (as the pressure-sensitive distance detection sensor 035 presses rightward in fig. 2), that is, the pressure-sensitive distance detection sensor 035 presses in the direction of the apparatus. The compressed pressure-sensitive distance detection sensor displays the retracted distance value.

Further, the level gauge on the first flat plate of the present embodiment is located at the center of the first flat plate.

In the present invention, the rectangle formed by the connection lines of the pressure-sensitive distance detecting sensors at the four positions of the second flat panel, i.e. the upper left, the upper right, the lower left and the lower right, is located at the center of the second flat panel. That is, in the front view of fig. 3, four sides of the second flat panel are an upper side, a lower side, a left side, and a right side, respectively; the distance between the first sensor and the upper edge, the distance between the second sensor and the upper edge, the distance between the third sensor and the lower edge and the distance between the fourth sensor and the lower edge are respectively the same; the distance between the first sensor and the left side, the distance between the second sensor and the right side, the distance between the third sensor and the left side, and the distance between the fourth sensor and the right side are respectively the same.

Further, the apparatus for detecting the level and the verticality of the objective table of the present embodiment further includes: the right-angle support is respectively positioned at the intersection position of the first and second flat panels, and two right-angle edges of the right-angle support are respectively attached to the first flat panel and the second flat panel. As shown in fig. 4, the apparatus of the present invention is further provided with two right-angle brackets 034, which are respectively located at two intersection positions of the first and second flat panels, and form a structure as shown in fig. 4: and two right-angle sides of the right-angle support are respectively attached to the first flat panel and the second flat panel.

Further, the apparatus of the present embodiment is used in conjunction with a stage of a semiconductor device manufactured from a 12-inch wafer.

The invention also provides a using method of the device for detecting the level and the perpendicularity of the objective table, which at least comprises the following steps:

providing a semiconductor equipment machine and an object stage matched with the semiconductor equipment machine; the side wall of the semiconductor equipment machine table is provided with a device for controlling the opening and closing of the door of the wafer bearing box, and the height of the upper surface of the object stage is flush with the lower end of the device for controlling the opening and closing of the door of the wafer bearing box; as shown in fig. 5, fig. 5 is a schematic structural view illustrating the apparatus for detecting the horizontal and vertical degree of the object stage according to the present invention is disposed on the object stage. The semiconductor equipment machine in the step one is attached to an object stage matched with the semiconductor equipment machine; the side wall of the semiconductor equipment machine table is provided with a device 01 for controlling the opening and closing of the wafer bearing box, and the height of the upper surface of the object stage is flush with the lower end of the device for controlling the opening and closing of the wafer bearing box

Secondly, placing the device 03 for detecting the level and the perpendicularity of the objective table on the objective table, and placing a first flat plate of the device on the upper surface of the objective table; attaching a second flat panel to a device for controlling the opening and closing of the door of the wafer bearing box on the side wall of the semiconductor equipment machine table;

thirdly, detecting the levelness of the objective table by using a level gauge on the first flat panel;

and fourthly, detecting the plane verticality of the device 01 for controlling the opening and closing of the wafer bearing box door of the semiconductor equipment machine table by using the pressure-sensitive distance detection sensor on the second flat panel.

Further, the method for detecting the perpendicularity in the fourth step of the present embodiment includes: the second plane is attached to the plane of the device for controlling the opening and closing of the door of the wafer bearing box, the retracting distance values of the four pressure-sensitive distance detection sensors are read, and if the four retracting distance values are the same, detection is finished; if the four read retracting distance values are not completely the same, adjusting the semiconductor equipment machine table and then reusing the device for detecting the level and the verticality of the semiconductor equipment object stage for detection until the four read retracting distance values are completely the same.

And when the device is placed on the first plane of the machine table object stage, the device is closed to the machine table direction, and when the pressure-sensitive distance detection sensor is contacted with the vertical plane of the machine table, the pressure-sensitive distance detection sensor is continuously pushed to the machine table direction, and at the moment, the pressure-sensitive distance detection sensor can be extruded, so that the device retracts towards the direction of the device. The indentation distance is displayed on the pressure-sensitive distance detecting sensor. If the retraction distances of the four positions are consistent, the four positions are proved to be on the same plane. If the two are not consistent, the quadrilateral contact between the machine platform and the wafer bearing box on the object stage is proved to have uneven conditions, and is not a vertical plane.

In summary, the apparatus of the present invention can help engineers quickly and accurately measure whether the semiconductor device is in a normal state. Can help more accurate test of engineer and debugging plummer level and straightness that hangs down to reduce the unusual risk that appears when wafer bears box switch door, ensure the safety of wafer. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.