阅读说明：本技术 一种具有提高光伏组件功率效果的封装材料 (Packaging material with effect of improving power of photovoltaic module ) 是由 施瑕玉 林俊良 林金汉 林金锡 于 2020-12-30 设计创作，主要内容包括：本发明公开一种具有提高光伏组件功率效果的封装材料。包括至少一层胶膜,在胶膜中掺杂具有散射作用提高光多次利用的散射粒子和量子点,或者在胶膜中加入发泡剂和量子点,发泡剂在胶膜中形成具有散射作用提高光多次利用的孔洞结构；且散射粒子和量子点可以掺杂在同一层胶膜中,也可以掺杂在不同层胶膜中；孔洞与量子点可以在同一层胶膜中,也可以在不同层胶膜中；散射粒子与胶膜的质量比为(0.5-15)：100；量子点与胶膜的质量比为(0.1-5)：100；孔洞的直径为1-10μm。本发明在胶膜中掺杂散射粒子或发泡剂和量子点,藉由散射作用提高光的多次利用,提高太阳光到达电池片表面量的同时可提高量子点的利用率,在确保成本可控的情况下提高对太阳光的利用效率。(The invention discloses an encapsulating material with the effect of improving the power of a photovoltaic module. The coating comprises at least one layer of adhesive film, wherein scattering particles and quantum dots which have a scattering effect and can improve the light multi-time utilization are doped in the adhesive film, or a foaming agent and the quantum dots are added in the adhesive film, and the foaming agent forms a hole structure which has a scattering effect and can improve the light multi-time utilization in the adhesive film; the scattering particles and the quantum dots can be doped in the same adhesive film layer or different adhesive films; the holes and the quantum dots can be in the same adhesive film layer or different adhesive films; the mass ratio of the scattering particles to the adhesive film is (0.5-15): 100, respectively; the mass ratio of the quantum dots to the glue film is (0.1-5): 100, respectively; the diameter of the holes is 1-10 μm. According to the invention, scattering particles or foaming agent and quantum dots are doped in the adhesive film, so that the repeated utilization of light is improved by virtue of the scattering effect, the utilization rate of the quantum dots can be improved while the amount of sunlight reaching the surface of the cell sheet is improved, and the utilization efficiency of the sunlight is improved under the condition of ensuring controllable cost.)

1. The packaging material is characterized by comprising at least one layer of adhesive film, wherein scattering particles and quantum dots which have a scattering effect and can improve the multiple utilization of light are doped in the adhesive film, or a foaming agent and the quantum dots are added in the adhesive film, and the foaming agent is used for forming a hole structure which has the scattering effect and can improve the multiple utilization of light in the adhesive film; the scattering particles and the quantum dots can be doped in the same adhesive film layer or different adhesive films; the holes and the quantum dots can be in the same adhesive film layer or different adhesive films; the mass ratio of the scattering particles to the adhesive film is (0.5-15): 100, respectively; the mass ratio of the quantum dots to the adhesive film is (0.1-5): 100, respectively; the diameter of the hole is 1-10 μm.

2. The encapsulant as claimed in claim 1, wherein the adhesive film is an electrically insulating resin with a volume resistivity greater than 10¹⁵Omega cm, a hot melting point range of 40-180 ℃.

3. The encapsulant for increasing power of photovoltaic module as claimed in claim 2, wherein the electrically insulating resin is selected from one or more of polyolefin, ethylene-vinyl acetate copolymer, polyvinyl butyral, ionomer resin, polyurethane, silicone, epoxy resin, and ethylene propylene diene monomer.

4. The encapsulant for increasing power of photovoltaic module as claimed in claim 1, wherein the scattering particles are any one or more of boron nitride, titanium dioxide, barium sulfate, and silicon dioxide.

5. The encapsulant of claim 1, wherein the scattering particles and the quantum dots are doped into the adhesive film by blending.

6. The encapsulating material with the effect of improving the power of the photovoltaic module as claimed in claim 1, wherein the quantum dots are any one or more of silicon quantum dots, germanium quantum dots, cadmium sulfide quantum dots, cadmium selenide quantum dots, cadmium telluride quantum dots, zinc sulfide quantum dots, zinc selenide quantum dots and gallium arsenide quantum dots.

Technical Field

The invention relates to the technical field of photovoltaic materials, in particular to an encapsulating material with an effect of improving the power of a photovoltaic module.

Background

With the exhaustion of non-renewable resources and the growing environmental problems, solar energy as a clean energy source is receiving wide attention and attention. Solar cell modules are actively developed in all countries of the world, and with the development of the photovoltaic market, high conversion efficiency and low cost are the main trends of the development of the solar cell modules. Conventional encapsulation materials suffer from significant light loss when sunlight passes through the glass and the encapsulation material, thereby reducing the conversion efficiency of the assembly. In order to reduce the loss of sunlight before reaching the cell and improve the conversion efficiency of the module, many manufacturers increase the refractive index of the packaging material or use wavelength conversion materials to improve the utilization rate of sunlight, but the ideal refractive index matching and incident light utilization effects are not achieved, and improvement is still needed.

Disclosure of Invention

The invention aims to provide an encapsulating material with the effect of improving the power of a photovoltaic module.

The invention is realized by the following technical scheme:

the packaging material is characterized by comprising at least one layer of adhesive film, wherein scattering particles and quantum dots which have a scattering effect and can improve the multiple utilization of light are doped in the adhesive film, or a foaming agent and the quantum dots are added in the adhesive film, and the foaming agent is used for forming a hole structure which has the scattering effect and can improve the multiple utilization of light in the adhesive film; the scattering particles and the quantum dots can be doped in the same adhesive film layer or different adhesive films; the holes and the quantum dots can be in the same adhesive film layer or different adhesive films; the mass ratio of the scattering particles to the adhesive film is (0.5-15): 100, respectively; the mass ratio of the quantum dots to the adhesive film is (0.1-5): 100, respectively; the diameter of the hole is 1-10 μm. Specifically, the scattering particles or the formed hole structure have the effects that incident light is reflected for multiple times in the adhesive film layer, the quantum dots are added into the adhesive film, and the two effects are superposed, so that the use efficiency of the quantum dots can be greatly improved.

Furthermore, the material of the adhesive film is electrically insulating resin, and the volume resistivity of the electrically insulating resin is more than 10¹⁵Omega cm, a hot melting point range of 40-180 ℃.

Further, the electrical insulating resin is selected from any one or a mixture of more of polyolefin, ethylene-vinyl acetate copolymer, polyvinyl butyral, ionomer resin, polyurethane, silica gel, epoxy resin and ethylene propylene diene monomer.

Further, the scattering particles are any one or a mixture of several of boron nitride, titanium dioxide, barium sulfate and silicon dioxide. The scattering particles can effectively reduce the loss of sunlight and improve the utilization rate of the photovoltaic module to the sunlight.

Furthermore, the scattering particles and the quantum dots are doped into the adhesive film by a blending method.

Furthermore, any one or more of the quantum dot silicon quantum dot, the germanium quantum dot, the cadmium sulfide quantum dot, the cadmium selenide quantum dot, the cadmium telluride quantum dot, the zinc sulfide quantum dot, the zinc selenide quantum dot and the gallium arsenide quantum dot. The quantum dots can absorb sunlight outside the response wavelength range of the cell piece and emit light within the response wavelength range of the cell piece, so that the utilization rate of the cell piece to the sunlight is improved.

The invention has the beneficial effects that:

the invention provides the packaging material with the effect of improving the power of the photovoltaic module aiming at the problem of improving the sunlight utilization rate of the photovoltaic packaging material on the road, and the invention provides the packaging material with the effect of improving the power of the photovoltaic module by doping scattering particles and quantum dots in an adhesive film or adding a foaming agent in the adhesive film to form a hole structure and quantum dots which have the scattering effect and improve the multiple utilization of light.

The doped scattering particles or the formed hole structure can effectively reduce the loss of sunlight and improve the utilization rate of the photovoltaic module to the sunlight; the doped quantum dots can absorb sunlight outside the response wavelength range of the cell piece and emit light within the response wavelength range of the cell piece, so that the utilization rate of the cell piece to the sunlight is improved. According to the invention, the scattering particles and the quantum dots are doped in the adhesive film, or the foaming agent is added in the adhesive film to form the hole structure and the quantum dots which have the scattering effect and can improve the repeated utilization of light, and the scattering particles or the holes and the quantum dots are combined for use, so that the absorptivity of the quantum dots to sunlight with the same incident quantity can be improved, the use value of the quantum dots is improved, the use amount of the quantum dots can be reduced, the cost is saved, and the doping difficulty is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural view of a packaging material in example 4 of the present invention;

FIG. 2 is a schematic structural view of a packaging material in example 5 of the present invention;

fig. 3 is a cross-sectional view of fig. 2.

In the figure: 1 scattering particle layer, 2 quantum dot layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

The packaging material comprises a layer of adhesive film, wherein electrical insulating resin is selected as a base material of the adhesive film; then adding a foaming agent and quantum dots into the adhesive film, wherein the foaming agent is used for forming a hole structure which has a scattering effect and improves the light multi-time utilization in the adhesive film; foaming by a foaming agent to form a packaging material with a certain hole, and curing and forming, wherein the curing mode is UV curing; the mass ratio of the quantum dots to the adhesive film is 2: 100, respectively; the holes in the resulting encapsulation material were 5 microns in diameter and approximately 500 microns thick. Preferably, the electrically insulating resin is a polyolefin material. The quantum dots are silicon quantum dots.

Example 2

The packaging material comprises two layers of co-extrusion adhesive films, wherein electrical insulating resin is selected as a base material of the adhesive films; then adding a foaming agent and quantum dots into the adhesive film, wherein the foaming agent is used for forming a hole structure which has a scattering effect and improves the repeated utilization of light in the adhesive film, and the holes and the quantum dots belong to adhesive films of different layers; foaming by a foaming agent to form a packaging material with a certain hole, and curing and forming, wherein the curing mode is UV curing; the mass ratio of the quantum dots to the adhesive film is 0.1: 100, respectively; the diameter of the hole in the packaging material prepared by co-extrusion is 10 microns, and the thickness is about 500 microns. Preferably, the electrically insulating resin is an ethylene-vinyl acetate copolymer. The quantum dots are cadmium sulfide quantum dots.

Example 3

The packaging material comprises three layers of co-extrusion adhesive films, wherein electrical insulating resin is selected as a base material of the adhesive films; then adding a foaming agent and quantum dots into the adhesive film, wherein the foaming agent is used for forming a hole structure which has a scattering effect and improves the repeated utilization of light in the adhesive film, the holes are formed in two adhesive film layers, and the quantum dots are also dispersed in the two adhesive film layers; foaming by a foaming agent to form a packaging material with a certain hole, and curing and forming, wherein the curing mode is UV curing; the mass ratio of the quantum dots to the adhesive film is 5: 100, respectively; the diameter of the hole in the packaging material prepared by co-extrusion is 1 micron, and the thickness is about 500 microns. Preferably, the electrically insulating resin is polyvinyl butyral. The quantum dots are zinc sulfide quantum dots.

Example 4

As shown in fig. 1, an encapsulating material with an effect of improving power of a photovoltaic module includes a layer of adhesive film, and an electrically insulating resin is selected as a base material of the adhesive film; then, scattering particles and quantum dots which have a scattering effect and can improve the multiple utilization of light are doped in the adhesive film, and the mass ratio of the scattering particles to the adhesive film is 5: 100, respectively; the mass ratio of the quantum dots to the adhesive film is 0.1: 100, respectively; the thickness of the resulting encapsulant was about 500 microns. Preferably, the electrically insulating resin is an ionomer resin. The scattering particles are Boron Nitride (BN). The quantum dots are cadmium telluride quantum dots.

Example 5

As shown in fig. 2, the packaging material with the effect of improving the power of the photovoltaic module comprises two co-extruded adhesive films, and an electrical insulating resin is selected as a base material of the adhesive films; then, the adhesive film is doped with scattering particles and quantum dots which have a scattering effect and can improve the multiple utilization of light, and the scattering particles and the quantum dots are respectively doped in the adhesive films of different layers (the adhesive film layer doped with the scattering particles is a scattering particle layer 1, and the adhesive film layer doped with the quantum dots is a quantum dot layer 2); and the mass ratio of the scattering particles to the adhesive film is 0.5: 100, respectively; the mass ratio of the quantum dots to the adhesive film is 1: 100, respectively; the thickness of the packaging material obtained by co-extrusion is about 500 microns. Preferably, the electrically insulating resin is polyurethane. The scattering particles are titanium dioxide (TiO)₂). The quantum dots are cadmium selenide quantum dots.

Example 6

The packaging material comprises three layers of co-extrusion adhesive films, wherein electrical insulating resin is selected as a base material of the adhesive films; then, doping scattering particles and quantum dots which have a scattering effect and can improve the multiple utilization of light into the adhesive films, wherein the scattering particles are doped into two adhesive films, and the quantum dots are also doped into two adhesive films; and the mass ratio of the scattering particles to the adhesive film is 15: 100, respectively; the mass ratio of the quantum dots to the adhesive film is 5: 100, respectively; the thickness of the packaging material obtained by co-extrusion is about 500 microns. Preferably, theThe electrically insulating resin is ethylene propylene diene monomer. The scattering particles are barium sulfate (BaSO)₄). The quantum dots are gallium arsenide quantum dots.

Comparative example 1

The packaging material comprises a layer of adhesive film, wherein electrical insulating resin is selected as a base material of the adhesive film; then adding a foaming agent into the adhesive film, wherein the foaming agent is used for forming a hole structure which has a scattering effect and improves the light multiple utilization in the adhesive film; foaming by a foaming agent to form a packaging material with a certain hole, and curing and forming, wherein the curing mode is UV curing; the holes in the resulting encapsulation material were 5 microns in diameter and approximately 500 microns thick. Preferably, the electrically insulating resin is a polyolefin material.

Comparative example 1 is different from example 1 in that comparative example 1 has no doped quantum dots, and the rest is the same as example 1.

Comparative example 2

The packaging material comprises a layer of adhesive film, wherein electrical insulating resin is selected as a base material of the adhesive film; then doping quantum dots in the adhesive film; and the mass ratio of the quantum dots to the adhesive film is 2: 100, respectively; the thickness of the resulting encapsulation material was about 500 microns. Preferably, the electrically insulating resin is a polyolefin material. The quantum dots are silicon quantum dots.

Comparative example 2 is different from example 1 in that no foaming agent is added to form a cell structure in comparative example 2, and the rest is the same as example 1.

Comparative example 3

The packaging material comprises a layer of adhesive film, wherein electrical insulating resin is selected as a base material of the adhesive film; then, scattering particles which have a scattering effect and improve the multiple utilization of light are doped in the adhesive film, and the mass ratio of the scattering particles to the adhesive film is 5: 100, respectively; the thickness of the resulting encapsulant was about 500 microns. Preferably, the electrically insulating resin is an ionomer resin. The scattering particles are Boron Nitride (BN).

Comparative example 3 is different from example 4 in that comparative example 3 has no doped quantum dots, and the rest is the same as example 4.

Comparative example 4

The packaging material comprises a layer of adhesive film, wherein electrical insulating resin is selected as a base material of the adhesive film; then, doping quantum dots in the glue film, wherein the mass ratio of the quantum dots to the glue film is 0.1: 100, respectively; the thickness of the resulting encapsulant was about 500 microns. Preferably, the electrically insulating resin is an ionomer resin. The quantum dots are cadmium telluride quantum dots.

Comparative example 4 is different from example 4 in that comparative example 4 is not doped with scattering particles, and the rest is the same as example 4.

Test example 1

The photovoltaic modules of 60 cells were fabricated using the above-described encapsulant materials of examples 1-6 and comparative examples 1-4, respectively, with the other materials kept in agreement (front glass: ultra white embossed glass, back glass: common clear float glass, cell: single crystal PERC cell 5.5W), and the module power was measured and the data are shown in tables 1 and 2 below:

table 1 shows the results of power tests on photovoltaic modules fabricated from the encapsulating materials of examples 1 to 6

Table 2 shows the results of power tests on photovoltaic modules fabricated from the encapsulating materials of comparative examples 1 to 4

Component numbering	Comparative example 1	Comparative example 2	Comparative example 3	Comparative example 4
					1	324.50	325.03	324.86	324.75
2	324.50	324.69	324.55	324.63
					3	324.05	324.15	324.11	324.22
4	324.23	324.23	324.21	324.26
					5	324.37	324.87	324.45	324.28
Mean value of	324.33	324.594	324.436	324.428

As can be seen from the test data in tables 1 and 2, the power of the photovoltaic modules made of the encapsulating materials prepared in examples 1 to 6 is significantly higher than that of the photovoltaic modules made of the encapsulating materials prepared in comparative examples 1 to 4, which indicates that the encapsulating materials obtained by adding the foaming agent and the quantum dots in the adhesive film or adding the scattering particles and the quantum dots in the adhesive film in the examples of the present invention have higher power than the encapsulating materials obtained by adding only the foaming agent or the scattering particles or doping only the quantum dots in the comparative examples.

According to the invention, the hole structure or the doped scattering particles formed by the foaming agent have the functions of reflecting incident light in the adhesive film layer for multiple times and doping quantum dots in the adhesive film layer, and the use efficiency of the quantum dots can be greatly improved by superposing the two effects. The hole structure formed by the foaming agent added in the invention is different from the use direction of the buffering effect generated after the foaming of the common foaming agent.

The above-mentioned preferred embodiments of the present invention are provided for illustration only and not for the purpose of limiting the invention. Obvious variations or modifications of the present invention are within the scope of the present invention.