阅读说明：本技术 接触针及插座 (Contact pin and socket ) 是由 上山雄生 于 2019-09-20 设计创作，主要内容包括：接触针包括：中空的第一针头,该第一针头包括设置在第一方向上的一端侧的第一接触部、和向与所述第一方向交叉的第二方向扩大的第一扩大部；第二针头,其所述一端侧插入所述第一针头,并且,该第二针头包括设置在所述第一方向上的另一端侧的第二接触部、和设置于从所述第一针头突出的突出部且向所述第二方向扩大的第二扩大部；以及弹簧,包围所述第一针头及所述第二针头,且安装在所述第一扩大部与所述第二扩大部之间,所述第一扩大部形成为向外侧鼓出的曲面形状。(The contact pin includes: a hollow first needle including a first contact portion provided at one end side in a first direction and a first enlarged portion enlarged in a second direction intersecting the first direction; a second needle inserted into the first needle at the one end side thereof and including a second contact portion provided at the other end side in the first direction and a second enlarged portion provided at a projection projecting from the first needle and enlarged in the second direction; and a spring surrounding the first and second needles and installed between the first and second enlarged portions, the first enlarged portion being formed in a curved shape bulging outward.)

1. A contact pin, comprising:

a hollow first needle including a first contact portion provided at one end side in a first direction and a first enlarged portion enlarged in a second direction intersecting the first direction;

a second needle inserted into the first needle at the one end side thereof and including a second contact portion provided at the other end side in the first direction and a second enlarged portion provided at a projection projecting from the first needle and enlarged in the second direction; and

a spring surrounding the first needle and the second needle and installed between the first enlarged portion and the second enlarged portion,

the first enlarged portion is formed in a curved shape bulging outward.

2. The contact pin of claim 1,

the second contact part is formed in a conical shape, and the top end of the second contact part is away from the axis of the second needle head.

3. A socket, comprising:

the contact pin of claim 1 or 2; and

a support body having a through hole into which the contact pin is inserted.

Technical Field

The invention relates to a contact pin and a socket.

Background

For example, as described in patent document 1, conventionally, a socket is used when an electrical component such as an IC (Integrated Circuit) package is inspected. The socket includes a plurality of contact pins for electrically connecting the electrical component to a board for inspection, which is a board on the inspection apparatus side.

These contact pins include: a first movable member that is in contact with a terminal of the electrical component; a second movable member that contacts a terminal of the inspection substrate; and a coil spring disposed between the first movable member and the second movable member and rebounding so as to separate the first movable member and the second movable member from each other.

An example of the structure of a conventional socket will be described with reference to fig. 5A and 5B. Fig. 5A and 5B are schematic cross-sectional views showing examples of the structures of a conventional contact pin and a conventional receptacle, respectively.

The contact pins 101 are inserted through holes 130 formed in the housing 103 of the socket.

The contact pin 101 includes a first pin 111, a second pin 112, and a coil spring 113.

The first needle 111 is a substantially cylindrical hollow member. The second needle 112 is a generally cylindrical member. The second needle 112 is inserted through the first needle 111 from below, and is movable forward or backward with respect to the first needle 111 along the axis L of the first needle 111 (or, substantially along the axis L).

The first needle 111 includes a cylindrical enlarged diameter portion 111a having a width along the axis L. In the portion not shown, the second needle 112 has an enlarged diameter portion at a portion protruding from the first needle 111. The coil spring 113 is provided between the enlarged diameter portion 111a of the first needle 111 and the enlarged diameter portion of the second needle 112.

In a portion not shown, the upper end of the first pin 111 is in electrical contact with a solder ball of the IC package. In the portion not shown, the lower end of the second pin 112 is electrically contacted to a terminal of the inspection board.

The housing 103 is provided with the through hole 130 having a circular cross section along a horizontal plane. The through hole 130 includes an upper small-diameter portion 130a, a lower small-diameter portion, not shown, and a large-diameter portion 130b formed between the small-diameter portions.

The diameter of the enlarged diameter portion 111a of the first needle 111 and the diameter of the enlarged diameter portion of the second needle 112 are formed larger than the inner diameters of the upper small diameter portion 130a and the lower small diameter portion of the through hole 130. Thereby, the contact pin 101 is held in the through hole 130.

When an inspection is performed using such a socket, the socket is first placed on an inspection board not shown. Next, from the state shown in fig. 5A, the solder ball of the IC package is pressed against the upper end of the first pin 111. Thereby, as shown in fig. 5B, the second needle 112 relatively enters further toward the first needle 111, and the coil spring 113 is compressed.

At this time, a preload, which is a force generated by the reaction force of the coil spring 113, is applied between the second needle 112 and the terminal of the inspection substrate. The preload contributes to stable contact between the second pin 112 and the terminal of the inspection substrate, and also contributes to reduction of contact resistance therebetween and stabilization.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2015-108608

Disclosure of Invention

Problems to be solved by the invention

However, in the contact pin 101 and the receptacle shown in fig. 5A and 5B, the enlarged diameter portion 111a of the first pin head 111 extends straight along the axis L, and therefore, there are the following problems.

(1) The diameter-enlarged portion 111a comes into surface contact with the inner wall surface of the housing 103 in which the through hole 130 is formed. Therefore, the frictional resistance when the enlarged diameter portion 111a moves in the through hole 130 is increased, and the contact pin 101 may not move smoothly in the through hole 130.

(2) The diameter-enlarged portion 111a restricts the first needle 111 from tilting in the through hole 130. Therefore, the first needle 111 and the second needle 112 are oriented with their axes in the vertical direction, and the contact pressure between the first needle 111 and the second needle 112 is liable to become unstable, and further the conductivity of the contact pin 101 is liable to become unstable.

The present invention has been made to solve the above problems, and an object of the present invention is to improve the mobility and conductivity of a contact pin.

Means for solving the problems

In order to solve the above conventional problems, a contact pin according to the present invention includes: a hollow first needle including a first contact portion provided at one end side in a first direction and a first enlarged portion enlarged in a second direction intersecting the first direction; a second needle inserted into the first needle at the one end side thereof and including a second contact portion provided at the other end side in the first direction and a second enlarged portion provided at a projection projecting from the first needle and enlarged in the second direction; and a spring surrounding the first and second needles and installed between the first and second enlarged portions, the first enlarged portion being formed in a curved shape bulging outward.

In order to solve the above conventional problems, the socket of the present invention includes the above contact pin; and a support body having through holes into which the contact pins are inserted.

Effects of the invention

According to the present invention, the mobility and conductivity of the contact pin can be improved.

Drawings

Fig. 1 is a diagram showing a structure of a contact pin, fig. 1A is a perspective view, and fig. 1B is a vertical cross section.

Fig. 2 is a sectional view showing the structure of the socket.

Fig. 3A and 3B are schematic cross-sectional views for explaining the operation and effect of the contact pin and the socket.

Fig. 4 is a diagram showing a configuration of a modification of the contact pin, fig. 4A is a perspective view, and fig. 4B is a longitudinal sectional view.

Fig. 5A and 5B are schematic cross-sectional views showing an example of the structure of a conventional contact pin and socket.

Detailed Description

Hereinafter, a contact pin and a receptacle according to an embodiment of the present invention will be described with reference to the drawings. The embodiments described below are merely examples, and various modifications and techniques that are not described in the embodiments below are not excluded. The configurations of the embodiments may be variously modified without departing from the spirit and scope thereof. Further, the configurations of the respective embodiments may be selected as needed or appropriately combined.

In the following embodiments, for convenience, the first needle of the contact needle is disposed on the upper side, and the second needle is disposed on the lower side. However, the arrangement of the contact pins and the sockets is not limited to this arrangement.

In all the drawings for explaining the embodiments, the same elements are given the same reference numerals in principle, and the explanation thereof may be omitted.

Hereinafter, a contact pin and a receptacle according to an embodiment of the present invention will be described in detail with reference to the drawings.

[1. Structure ]

[1-1. Structure of contact pin ]

The structure of a contact pin according to an embodiment of the present invention will be described with reference to fig. 1A and 1B. Fig. 1A and 1B are views showing the structure of a contact pin, fig. 1A being a perspective view, and fig. 1B being a longitudinal sectional view.

The contact pin 1 includes a first pin 11, a second pin 12, and a coil spring 13.

The first needle 11 is a substantially cylindrical hollow member. The second needle 12 is a generally cylindrical member. The second needle tip 12 is inserted into the first needle tip 11 from below, and is movable back and forth from below the first needle tip 11 along the axis L1 (or substantially along the axis L1) of the first needle tip 11. The first needle 11 and the second needle 12 are each formed of a conductive material.

The first needle 11 is provided with a bulging portion 11a that expands in the horizontal direction (the direction intersecting the vertical direction, which is the first direction) at the middle portion in the axial direction. The bulge portion 11a constitutes a first enlarged portion of the present invention. The bulging portion 11a is formed in a curved surface shape bulging outward (in a direction away from the axis L1). In the present embodiment, the bulging portion 11a has a shape in which the upper and lower portions of the hollow sphere are horizontally cut off.

Further, at an upper end (i.e., one end in the first direction) of the first needle 11, a contact portion 11b (first contact portion) that contacts a solder ball of an IC package described later is provided. In the present embodiment, the contact portion 11b is formed of a plurality of chips having sharp tips, and the contact portion 11b contacts the solder ball so as to pierce the solder ball.

In addition, the first needle 11 is provided with a cap 11c at an upper portion thereof, specifically, a portion between the bulging portion 11a and the contact portion 11b, which is slightly below the contact portion 11 b. The lid 11c prevents chips chipped off from the solder balls by the piercing contact of the contact portion 11b from entering downward. Thereby, the cutting chips are prevented from entering the gap between the first needle 11 and the second needle 12 to hinder the relative movement between the first needle 11 and the second needle 12. A substantially circular notch is formed in a part of the cylindrical surface of the first needle 11, and the cut piece surrounded by the notch is folded inward (toward the axis L side), thereby forming the cap 11 c.

The first needle 11 is manufactured by rolling a plate into a cylindrical shape so that one end and the other end extending in the vertical direction are butted with each other. Reference numeral 11d in fig. 1 denotes a butting portion between the one end and the other end. Fig. 1B is a cross-sectional view of the contact pin 1 taken along a vertical plane passing through the butting portion. Further, the bulging portion 11a is formed by press working the plate material, and the outer wall surface bulges outward together with the inner wall surface at the bulging portion 11 a.

As shown in fig. 1A and 1B, the second needle 12 includes a flange-like enlarged diameter portion 12a at a lower portion. The coil spring 13 is attached between the enlarged diameter portion 12a of the second needle 12 and the expanded portion 11a of the first needle 11.

A tapered contact portion 12b (second contact portion) that contacts a terminal of an inspection substrate described later is provided at a lower end of the second needle tip 12 below the enlarged diameter portion 12 a. The contact portion 12b has a shape obtained by obliquely cutting a cone having a sharp lower end. Thus, the tip 12c of the contact portion 12b, i.e., the contact point with the terminal of the inspection board, is located away from the axis L2 of the second needle 12.

[1-2. Structure of socket ]

The structure of the socket according to an embodiment of the present invention is described with reference to fig. 2. Fig. 2 is a sectional view showing the structure of the socket. In fig. 2, the different states of the socket are shown side by side for convenience.

The socket 100 shown in fig. 2 includes contact pins 1, a floating plate 2, and a housing 3.

On the bottom surface of the IC package 200 connected to the socket 100, solder balls 201 as a plurality of terminals are arranged in a matrix. A plurality of contact pins 1 are arranged in a matrix so as to correspond to the arrangement of the solder balls 201.

The floating plate 2 is disposed above the housing 3 in a manner to be contactable with or separable from the housing 3.

The floating plate 2 is provided with a plurality of through holes 20 penetrating the floating plate 2 in the vertical direction. The arrangement of the through holes 20 is identical to the arrangement of the solder balls 201 and the arrangement of the contact pins 1. The through-holes 20 have a circular cross section along a horizontal plane.

Similarly, the housing 3 constituting the support of the present invention is provided with a plurality of through holes 30 penetrating the housing 3 in the vertical direction, and the arrangement of the through holes 30 matches the arrangement of the solder balls 201 and the arrangement of the contact pins 1. The through-hole 30 has a circular cross section along a horizontal plane.

With this structure, each contact pin 1 is inserted through the through hole 20 and the through hole 30 arranged in the vertical direction in accordance with the arrangement of the solder ball 201.

The through hole 30 is constituted by an upper small diameter portion 30a, a lower small diameter portion 30a, and a large diameter portion 30b formed between the small diameter portions 30a, 30. The inner diameter of the small diameter portion 30a is formed smaller than the maximum outer diameter of the bulge portion 11a of the first needle 11, the maximum outer diameter of the enlarged diameter portion 12a of the second needle 12, and the maximum outer diameter of the coil spring 13. In addition, the diameter of the large diameter portion 30b is formed slightly larger than the maximum outer diameter of the bulge portion 11a of the first needle tip 11, the maximum outer diameter of the enlarged diameter portion 12a of the second needle tip 12, and the maximum outer diameter of the coil spring 13.

The maximum outer diameter of the portion of the first needle 11 above the bulging portion 11a including the contact portion 11b is smaller than the inner diameter of the upper small-diameter portion 30a and the inner diameter of the through hole 20 of the floating plate 2. Further, the maximum outer diameter of the contact portion 12b of the second needle tip 12 below the enlarged diameter portion 12a is smaller than the inner diameter of the small diameter portion 30a below. Therefore, the portion of the first needle tip 11 above the bulging portion 11a including the contact portion 11b can protrude upward beyond the upper small-diameter portion 30a and the through hole 20 of the floating plate 2. Likewise, the contact portion 12b of the second needle 12 can protrude further downward than the lower small-diameter portion 30 a.

Thereby, the contact pin 1 does not escape from the through hole 30, and the coil spring 13 is retractable within the through hole 30, and the second needle tip 12 can advance or retreat with respect to the first needle tip 11.

In fig. 2, different states of the socket 100 are shown for each contact pin 1, and hereinafter, the states will be described in order from the left side of fig. 2.

The left-hand first contact pin 1 is in a natural state in which no external force acts, i.e., the coil spring 13 is extended, and the contact pin 1 is extended. In this state, the enlarged diameter portion 12a of the second needle 12 is supported from below by the step between the small diameter portion 30a and the large diameter portion 30b below the through hole 30, and the contact portion 12b protrudes from the bottom surface of the housing 3.

In the second contact pin 1 lifted up to the left, the entire contact pin 1 is lifted up by the inspection substrate 300. Specifically, the contact pin 1 is pushed upward until the upper portion of the bulging portion 11a abuts on the step between the small diameter portion 30a and the large diameter portion 30b on the upper side of the through hole 30.

The third contact pin 1 lifted to the left (second contact pin lifted to the right) is further lifted up by the inspection board 300. Specifically, the inspection board 300 is raised until its upper surface comes into contact with the bottom surface of the housing 3. In this state, the second needle 12 is further inserted into the first needle 11, and the coil spring 13 is compressed. In this state, although the IC package 200 is placed above the floating plate 2, the solder ball 201 does not contact the contact portion 11b of the contact pin 1.

The fourth contact pin 1 from the left (first from the right) is in a state when the IC package 200 is inspected. That is, the first pin 11 is pressed downward by the solder ball 201, and the coil spring 13 is further compressed. At this time, a reaction force generated by the coil spring 13 acts between the second needle 12 and the terminal 301 of the inspection board 300 as a preload between the second needle 12 and the terminal 301 of the inspection board 300.

[2. action, Effect ]

The operation and effect of the socket and the contact pin according to one embodiment of the present invention will be described with reference to fig. 1A to 3B. Fig. 3A and 3B are schematic cross-sectional views for explaining the operation and effect of the socket and the contact pin. Fig. 3A shows a state where the solder ball 201 (see fig. 2) is not pressed downward, that is, a state where the IC package 200 is not inspected. Fig. 3B shows a state where the solder ball 201 is pressed downward, that is, a state where the IC package 200 is inspected.

A gap is provided between the inner peripheral surface of the large diameter portion 30b of the through hole 30 and the coil spring 13. Therefore, during the period from the state shown in fig. 3A to the state shown in fig. 3B in which the first needle 11A and the coil spring 13 are pushed down by the solder ball 201, the coil spring 13 is displaced in the gap and moves down in a meandering manner.

The bulging portion 11a of the first needle 11 has a curved shape and a shape gradually expanding in diameter from above the coil spring 13. Therefore, the adhesion between the coil spring 13 and the bulging portion 11a is improved. Since the bulging portion 11a has a curved shape, the area of contact with the wall surface of the housing 3 in which the through hole 30 is formed is smaller than that of the straight expanded diameter portion 111a shown in fig. 5A and 5B.

As a result, the first needle 11 is easily inclined with respect to the vertical direction along with the meandering of the coil spring 13, and further, the first needle 11 is easily inclined with respect to the second needle 12. The result is an increased weight of the internal contacts. That is, the second needle 12 strongly contacts the inner wall surface of the first needle 11. Therefore, the resistance value between the first needle 11 and the second needle 12 is stabilized, and the conductivity of the contact pin 1 is stabilized.

Further, the first needle 11 has improved followability to the meandering of the coil spring 13, and the contact area between the bulging portion 11a and the wall surface of the housing 3 is smaller than in the related art, so that the first needle 11 moves more smoothly in the through hole 30 than in the related art.

Therefore, the mobility and conductivity of the contact pin 1 can be improved.

Further, as shown in fig. 1B, since the tip end 12c of the contact portion 12B of the second needle 12 is located away from the axis line L2, when a load is applied while being sandwiched between the solder ball 201 of the IC package 200 and the terminal 301 of the inspection board 300, it is likely to be inclined with respect to the vertical direction. At this time, the first needle 11 and the second needle 12 are inclined in opposite directions for balance, and the contact pin 1 is formed in an く shape or a く shape. Therefore, the second needle tip 12 is more strongly brought into contact with the inner wall surface of the first needle tip 11, and the mobility and conductivity of the contact pin 1 can be further improved. In fig. 2, the first needle tip 11 and the second needle tip 11 are illustrated in an attitude in which the axes L1 and L2 are perpendicular to each other for convenience.

[3. modification ]

(1) The structure of a modification of the contact pin will be described with reference to fig. 4A and 4B. Fig. 4A and 4B are views showing a configuration of a modification of the contact pin, where fig. 4A is a perspective view and fig. 4B is a vertical sectional view.

The first tip 11A of the contact pin 1A shown in fig. 4A and 4B is manufactured by machining. Specifically, since the hollow portion 11e of the first needle 11A is formed by cutting, the inner diameter is constant even at the bulging portion 11A. In the contact pin 1 shown in fig. 1A and 1B, the cover 11c is omitted. The other structures are the same as those of the contact pin 1, and therefore, the description thereof is omitted.

(2) In the above embodiment, the bulging portion 11a has a shape in which the upper and lower portions of the sphere are horizontally cut off, respectively, but the shape of the bulging portion 11a is not limited thereto. For example, the bulging portion 11a may be formed in a shape in which upper and lower portions of a vertically long ellipsoid or a horizontally long ellipsoid are cut off.

(3) In the above embodiment, the contact pin and the socket of the present invention are applied to the inspection of the IC package, but the socket of the present invention is not limited thereto, and can be applied to various uses of other electrical components.

The application claims priority based on the special application 2018-180711 proposed in 26.9.2018. The entire contents described in the specification and drawings of this patent application are incorporated in the specification of this application.

Industrial applicability

The present invention can be suitably used as a contact pin and a socket.

Description of the reference numerals

1. 1A contact pin

2 floating plate

3 outer cover (support)

11. 11A first needle

11a bulge (first enlargement)

11b contact part (first contact part)

11c cover part

11d butt joint part

11e hollow part

12 second needle

12a diameter expanding part

12b contact part (second contact part)

12c top end

13 helical spring (spring)

20 through hole

30 through hole

30a small diameter portion

30b large diameter portion

100 socket

200 IC package

201 tin ball

300 substrate for inspection

301 terminal

Axis of the first needle of L1

Shaft of L2 second needle