阅读说明：本技术 一种电子元件生产用晶圆检测设备 (Wafer detection equipment is used in electronic component production ) 是由 吴禹凡 高洪庆 于 2020-12-03 设计创作，主要内容包括：本发明涉及检测设备的技术领域,特别是涉及一种电子元件生产用晶圆检测设备,其通过对晶圆进行检测,可有效节省人工检测时的时间,简化检测方式,节省人力和时间,提高工作效率,同时晶圆的检测精度提高,有效提高检测效果,提高实用性和可靠性；包括底座、放置台、顶板、侧支撑臂、中控箱和压盘,放置台安装在底座的顶端中部,顶板位于放置台的上方,顶板通过四组侧支撑臂固定在底座上,中控箱安装在顶板的前侧,顶板上设置有推动装置,推动装置的下侧伸出至顶板的下方。(The invention relates to the technical field of detection equipment, in particular to wafer detection equipment for electronic component production, which can effectively save time during manual detection, simplify a detection mode, save labor and time, improve the working efficiency, improve the detection precision of a wafer, effectively improve the detection effect and improve the practicability and reliability by detecting the wafer; including the base, place platform, roof, collateral branch brace, well accuse case and pressure disk, place the platform and install at the top middle part of base, the roof is located the top of placing the platform, and the roof is fixed on the base through four groups collateral branch braces, and well accuse case is installed in the front side of roof, is provided with thrust unit on the roof, and thrust unit's downside stretches out the below to the roof.)

1. The wafer detection equipment for electronic component production is characterized by comprising a base (1), a placing table (2), a top plate (3), side supporting arms (4), a central control box (5) and a pressure plate (6), wherein the placing table (2) is installed in the middle of the top end of the base (1), the top plate (3) is located above the placing table (2), the top plate (3) is fixed on the base (1) through four groups of side supporting arms (4), the central control box (5) is installed on the front side of the top plate (3), a pushing device is arranged on the top plate (3), the lower side of the pushing device extends to the lower side of the top plate (3), the pressure plate (6) is installed at the bottom of the pushing device, the position of the pressure plate (6) corresponds to the position of the placing table (2), a left through groove and a right through groove are transversely arranged on the lower side of the pressure plate (6), an opening device is arranged in the through groove, the upper side of the, an annular guide rail (7) is arranged on the conical surface, a rotating ring (8) is arranged on the annular guide rail (7) in a sliding manner, multiple sets of teeth are uniformly arranged on the top of the rotating ring (8) in an annular manner, a first motor (9) is arranged on the front side of the top of a pressure plate (6), a rotating shaft (10) is arranged at the front side output end of the first motor (9), a first gear (11) is arranged in the middle of the rotating shaft (10), the bottom of the first gear (11) is meshed with the teeth on the rotating ring (8), first mounting plates (12) are arranged on the left side and the right side of the rotating ring (8), first linear guide rails (13) are transversely arranged at the bottoms of the two sets of first mounting plates (12), sliding blocks (14) are arranged on the lower sides of the two sets of first linear guide rails (13) in a sliding manner, cambered plates (15) are arranged at the bottoms of the two sets of sliding blocks (14), the two sets of cambered, the left side and the right side of the opening device extend out of the outer side of the through groove and are in contact with the inner sides of the two groups of rollers (16), the outer ends of the two groups of first mounting plates (12) are provided with second mounting plates (17), the inner side walls of the two groups of second mounting plates (17) are provided with pressure detectors (18), the inner sides of the two groups of pressure detectors (18) are provided with springs (19), the inner sides of the two groups of springs (19) are connected with the outer sides of the two groups of sliding blocks (14) respectively, the lower sides of the inner side walls of the two groups of second mounting plates (17) are provided with laser range finders (20), the positions of the two groups of laser range finders (20) correspond to the positions of the outer side walls of the two groups of arched plates (15) respectively, and the central control box (5) is in signal connection with a pushing device, the opening device, the first.

2. The wafer detection equipment for electronic component production as recited in claim 1, wherein the opening device comprises a second motor (21), a second gear (22), two sets of second linear guide rails (23), two sets of pushing slide bars (24) and two sets of arc push plates (25), the second motor (21) is installed on the top of the platen (6), the lower output end of the second motor (21) passes through the platen (6) and extends into the through slot, the second gear (22) is located in the middle of the through slot and is installed on the lower output end of the second motor (21), the two sets of second linear guide rails (23) are respectively installed on the front side and the rear side of the inner wall of the through slot, the two sets of pushing slide bars (24) are respectively installed on the two sets of second linear guide rails (23) in a sliding manner, the inner side walls of the two sets of pushing slide bars (24) are respectively provided with teeth, the front side and the rear side of the second gear (22) are respectively engaged with the sets of teeth on the inner side walls of the two sets, two sets of arc push pedal (25) are installed respectively and are promoted the left side of slide bar (24) and the right side of front side propelling movement slide bar (24) in the rear side, the outside of two sets of arc push pedal (25) stretches out to the outside of logical groove through the left side and the right side of logical groove respectively, the position of two sets of arc push pedal (25) staggers and alternate segregation with the position of two sets of promotion slide bars (24) respectively, two sets of arc push pedal (25) correspond with two sets of roller (16) positions respectively, second motor (21) and well accuse case (5) signal connection.

3. The wafer detection equipment for electronic component production as claimed in claim 2, wherein the pushing device comprises four sets of screw sleeves (26), four sets of lead screws (27), four sets of third gears (28), a third mounting plate (29), a third motor (30) and a fourth gear (31), the four sets of screw sleeves (26) are uniformly inserted on the top plate (3), the bottoms of the four sets of lead screws (27) are uniformly and rotatably mounted on the top of the platen (6), the bottoms of the four sets of lead screws (27) are separated from the second motor (21), the tops of the four sets of lead screws (27) respectively penetrate through the four sets of screw sleeves (26) and extend to the upper side of the top plate (3), the four sets of lead screws (27) are respectively in threaded connection with the four sets of screw sleeves (26), the four sets of third gears (28) are respectively mounted on the tops of the four sets of lead screws (27), the third mounting plate (29) is mounted on the tops of the four sets of third gears (28), the four groups of third gears (28) are rotatably connected with the third mounting plate (29), the third motor (30) is mounted at the top of the third mounting plate (29), the lower side output end of the third motor (30) penetrates through the third mounting plate (29) and extends out to the lower side of the third mounting plate (29), the fourth gear (31) is located between the four groups of third gears (28), the outer side of the fourth gear (31) is meshed with the inner sides of the four groups of third gears (28), the top of the fourth gear (31) is mounted at the lower side output end of the third motor (30), and the third motor (30) is in signal connection with the central control box (5).

4. The wafer detection equipment for electronic component production as claimed in claim 3, further comprising an arched reinforcing rod (32), a fourth mounting plate (33) and a turntable (34), wherein the arched reinforcing rod (32) is located on the upper side of the second motor (21), the left side and the right side of the bottom of the arched reinforcing rod (32) are respectively mounted on the two sets of first mounting plates (12), the fourth mounting plate (33) is mounted in the middle of the arched reinforcing rod (32), the top of the turntable (34) is mounted at the bottom of the arched reinforcing rod (32), and the bottom of the turntable (34) is rotatably mounted at the top of the second motor (21).

5. The wafer detection device for electronic component production as recited in claim 4, further comprising four sets of first guide rods (35) and four sets of sealing discs (36), wherein the tops of the four sets of first guide rods (35) are fixed on the top plate (3), the tops of the four sets of first guide rods (35) penetrate through the outer side of the third mounting plate (29) and extend above the third mounting plate (29), the four sets of first guide rods (35) are slidably connected with the third mounting plate (29), and the four sets of sealing discs (36) are respectively mounted on the tops of the four sets of first guide rods (35).

6. The wafer detection equipment for electronic component production as claimed in claim 5, further comprising a protective shield (37), wherein the protective shield (37) is located outside the first motor (9), the rotating shaft (10) and the first gear (11), and a bottom rear side of the protective shield (37) is mounted on the platen (6).

7. The wafer detection equipment for electronic component production as claimed in claim 6, further comprising a stabilizing plate (38), wherein the stabilizing plate (38) is located in the protective shield (37), the upper side of the stabilizing plate (38) is rotatably mounted on the front end of the rotating shaft (10), and the lower side of the stabilizing plate (38) is mounted on the platen (6).

8. The wafer detection device for electronic component production as claimed in claim 7, further comprising two sets of second guide rods (39), wherein the inner sides of the two sets of second guide rods (39) are respectively fixed at the lower sides of the outer side walls of the two sets of arcuate plates (15), and the outer sides of the two sets of second guide rods (39) both penetrate through the lower sides of the two sets of second mounting plates (17) and extend to the outer sides of the two sets of second mounting plates (17).

Technical Field

The invention relates to the technical field of detection equipment, in particular to wafer detection equipment for electronic element production.

Background

As is well known, wafers are thin sheets cut from silicon columns, which are mainly used as basic materials for producing electronic components, in order to ensure the production quality of electronic components, generally, quality detection is performed on the roundness of the wafers, quality problems such as occurrence of ellipse in the shape of the wafers or occurrence of notches in the side walls of the wafers are prevented, the existing detection mode is that workers measure the diameters of the wafers at different angles through micrometer calipers, however, when the mode is adopted, the workers need to adjust the position and the angle of the caliper on the wafers for many times, simultaneously, the maximum measurement value is obtained at each angle, then the maximum values of the multiple measurements are compared, so that the detection work is completed, the detection mode is complicated, much labor and time are needed, the detection efficiency is low, meanwhile, the accuracy of manual detection is low, and the detection effect is poor.

Disclosure of Invention

In order to solve the technical problems, the invention provides the wafer detection equipment for the electronic component production, which can effectively save time during manual detection, simplify a detection mode, save labor and time, improve the working efficiency, improve the detection precision of the wafer, effectively improve the detection effect and improve the practicability and reliability by detecting the wafer.

The invention relates to a wafer detection device for electronic component production, which comprises a base, a placing table, a top plate, side supporting arms, a central control box and a pressure plate, wherein the placing table is arranged in the middle of the top end of the base, the top plate is positioned above the placing table, the top plate is fixed on the base through four groups of side supporting arms, the central control box is arranged on the front side of the top plate, a pushing device is arranged on the top plate, the lower side of the pushing device extends to the lower side of the top plate, the pressure plate is arranged at the bottom of the pushing device, the position of the pressure plate corresponds to the position of the placing table, a through groove which penetrates left and right is transversely arranged on the lower side of the pressure plate, an opening device is arranged in the through groove, the upper side of the pressure plate is provided with a conical surface, an annular guide rail is arranged on the conical surface, a rotating ring is slidably arranged on the annular guide, the middle part of the rotating shaft is provided with a first gear, the bottom of the first gear is meshed with teeth on the rotating ring, the left side and the right side of the rotating ring are respectively provided with a first mounting plate, the bottoms of the two groups of first mounting plates are respectively and transversely provided with a first linear guide rail, the lower sides of the two groups of first linear guide rails are respectively provided with a sliding block in a sliding manner, the bottoms of the two groups of sliding blocks are respectively provided with a cambered plate, the directions of the two groups of cambered plates are opposite, the inner sides of the two groups of cambered plates are respectively and rotatably provided with a roller, the left side and the right side of the opening device extend out of the through groove and are in contact with the inner sides of the two groups of rollers, the outer ends of the two groups of first mounting plates are respectively provided with a second mounting plate, the upper sides of the inner side walls of the two groups of second mounting plates are respectively provided with a pressure, the positions of the two groups of laser range finders respectively correspond to the positions of the outer side walls of the two groups of arched plates, and the central control box is respectively in signal connection with the pushing device, the opening device, the first motor, the pressure detector and the laser range finders; the wafer is placed on a placing table, the outer edge position of the wafer is located on the outer side of the placing table, a central control box controls an opening device to push two groups of rollers to move outwards, the two groups of rollers drive two groups of sliding blocks to slide outwards on two groups of first linear guide rails through two groups of cambered plates respectively, the two groups of rollers are separated and located on the outer side of the wafer on the placing table, so that the two groups of rollers are opened, the two groups of sliding blocks respectively generate extrusion deformation on two groups of springs at the moment, the central control box controls the pushing device to push a pressure plate to move downwards, the pressure plate drives a ring-shaped guide rail, a rotating ring, a first motor, a rotating shaft, a first gear, two groups of first mounting plates, two groups of first linear guide rails, two groups of sliding blocks, two groups of cambered plates, two groups of rollers, two groups of second mounting plates, two groups of pressure detectors, two groups of springs and two, prevent it from moving at will, two groups of rollers are located outside the wafer at this time, the central control box controls the opening device to recover slowly, two groups of first motors respectively push two groups of sliders to approach each other, two groups of sliders respectively drive two groups of bow-shaped plates and two groups of rollers to approach each other, the inner sides of the two groups of rollers are both contacted with the edge position of the outer side wall of the wafer, the two groups of rollers stop moving, the opening device continues to recover and restore to the initial state, the opening device is separated from the two groups of rollers at this time, two groups of pressure detectors respectively detect the elastic force values of two groups of springs and transmit the detection signals to the central control box, the relative position of the sliders is detected according to the elastic force values and the elastic coefficients of the springs, meanwhile, two groups of laser range finders can directly detect the distance between the inner sides of the two groups of laser range finders and the outer side, the first motor drives the rotating shaft and the first gear to rotate, the first gear is meshed with a plurality of sets of teeth on the rotating ring, the first gear pushes the rotating ring to rotate on the annular guide rail, the rotating ring drives two sets of rollers to rotate around the pressure plate through two sets of first mounting plates, meanwhile, the inner sides of the two sets of rollers roll on the edge of the outer side wall of the wafer, the two sets of rollers rotate on the two sets of cambered plates, the two sets of rollers rotate by taking the outer side wall of the wafer as a moving track, the two sets of springs continuously generate thrust on the two sets of sliding blocks, when the problems of protrusion, notch or irregular circumferential shape of the wafer and the like occur on the outer side wall of the wafer, the two sets of rollers move outwards or move inwards, the elastic deformation of the two sets of springs measures the change, the elastic pressure values of the two sets of springs change, and the central control box detects, thereby detect the circumference shape of wafer, realize carrying out the mesh that detects to the wafer, two sets of laser range finder can carry out the secondary to the removal orbit of two sets of rollers simultaneously and detect, thereby improve the detection precision and the degree of accuracy of wafer, after the wafer detects the completion, two sets of first mounting panels rotate to initial position, well accuse case control closes first motor, two sets of roller stall, well accuse case promotes two sets of rollers through opening device and keeps away from the wafer, well accuse case passes through thrust device and drives pressure disk and two sets of rollers rebound and resume to initial position, thereby accomplish detection work, through detecting the wafer, the time of artifical detection time measuring can be effectively saved, simplify the detection mode, use manpower sparingly and time, improve work efficiency, the detection precision of wafer improves simultaneously, effectively improve the detection effect, improve practicality and reliability.

The invention relates to a wafer detection device for electronic component production, which comprises a second motor, a second gear, two groups of second linear guide rails, two groups of pushing slide bars and two groups of arc-shaped push plates, wherein the second motor is arranged at the top of a pressure plate, the lower output end of the second motor penetrates through the pressure plate and extends into a through groove, the second gear is positioned in the middle of the through groove and is arranged at the lower output end of the second motor, the two groups of second linear guide rails are respectively and transversely arranged at the front side and the rear side of the inner wall of the through groove, the two groups of pushing slide bars are respectively and slidably arranged on the two groups of second linear guide rails, the inner side walls of the two groups of pushing slide bars are respectively provided with a plurality of teeth, the front side and the rear side of the second gear are respectively engaged with the plurality of teeth on the inner side walls of the two groups of pushing slide bars, the two groups of arc-shaped push plates are respectively arranged at the left side and the, the positions of the two groups of arc-shaped push plates are respectively staggered with the positions of the two groups of pushing slide bars and are separated from each other, the two groups of arc-shaped push plates respectively correspond to the positions of the two groups of rollers, and a second motor is in signal connection with the central control box; the second motor is opened in well accuse case control, the second motor drives the second gear and rotates, the second gear respectively with the tooth meshing on two sets of promotion slide bars, the second gear drives rear side promotion slide bar and moves left and drive front side promotion slide bar and move right, the moving direction of two sets of promotion slide bars is opposite, two sets of promotion slide bars promote two sets of arc push pedals on it respectively and move to the outside, the outside of two sets of arc push pedals contacts with the inboard of two sets of rollers respectively and promotes two sets of rollers and move to the outside, two sets of rollers keep away from each other, reverse operation second motor, two sets of arc push pedals all move to the inboard and can take in logical inslot, because the position of two sets of arc push pedals staggers and alternate with the position of two sets of promotion slide bars respectively, two sets of arc push pedal moving forms can not produce the collision influence to.

The invention relates to a wafer detection device for electronic component production, wherein a pushing device comprises four groups of screw sleeves, four groups of screw rods, four groups of third gears, a third mounting plate, a third motor and a fourth gear, the four groups of screw sleeves are uniformly inserted on a top plate, the bottoms of the four groups of screw rods are uniformly and rotatably mounted at the top of a pressure plate, the bottoms of the four groups of screw rods are separated from a second motor, the tops of the four groups of screw rods respectively penetrate through the four groups of screw sleeves and extend to the upper side of the top plate, the four groups of screw rods are respectively and spirally connected with the four groups of screw sleeves, the four groups of third gears are respectively mounted at the tops of the four groups of screw rods, the third mounting plate is mounted at the top of the four groups of third gears, the four groups of third gears are respectively and rotatably connected with the third mounting plate, the third motor is mounted at the top of the third mounting plate, the lower side output end of, the outer side of the fourth gear is meshed with the inner sides of the four groups of third gears, the top of the fourth gear is arranged on the lower side output end of a third motor, and the third motor is in signal connection with the central control box; the central control box controls the opening of a third motor, the third motor drives a fourth gear to rotate, the fourth gear is meshed with four groups of third gears, the fourth gear drives four groups of third gears to synchronously rotate, the four groups of third gears drive four groups of lead screws to synchronously rotate, the four groups of lead screws are respectively in threaded connection with four groups of screw sleeves, the four groups of lead screws synchronously move up and down on the four groups of screw sleeves respectively, the four groups of lead screws drive a pressure plate to synchronously move up and down so as to drive two groups of rollers on the pressure plate to synchronously move, and the four groups of lead screws drive the four groups of third gears, a third mounting plate, a third motor and the fourth gear to synchronously move up and down when moving up and.

The wafer detection equipment for electronic component production further comprises an arched reinforcing rod, a fourth mounting plate and a rotary table, wherein the arched reinforcing rod is located on the upper side of the second motor, the left side and the right side of the bottom of the arched reinforcing rod are respectively mounted on the two groups of first mounting plates, the fourth mounting plate is mounted in the middle of the arched reinforcing rod, the top of the rotary table is mounted at the bottom of the arched reinforcing rod, and the bottom of the rotary table is rotatably mounted at the top of the second motor; when two sets of first mounting panels rotated, two sets of first mounting panels drove bow-shaped stiffener, fourth mounting panel and carousel and rotate, and the carousel rotates on the second motor, through setting up bow-shaped stiffener, fourth mounting panel and carousel, can conveniently support and connect two sets of first mounting panels, takes place the bending and collapses when preventing it from rotating, improves the fastness of two sets of first mounting panels.

The invention discloses a wafer detection device for electronic element production, which further comprises four groups of first guide rods and four groups of sealing discs, wherein the tops of the four groups of first guide rods are fixed on a top plate, the tops of the four groups of first guide rods penetrate through the outer side of a third mounting plate and extend to the upper side of the third mounting plate, the four groups of first guide rods are in sliding connection with the third mounting plate, and the four groups of sealing discs are respectively mounted at the tops of the four groups of first guide rods; when the third mounting panel reciprocated, the third mounting panel slided on four first guide bars of group, and four first guide bars of group can support the third mounting panel, and four group seal dishes can carry out the shutoff to the top of four first guide bars of group, take place to break away from with four first guide bars of group when preventing the third mounting panel rebound, improve the practicality.

The wafer detection equipment for electronic element production further comprises a protective shield, wherein the protective shield is positioned on the outer sides of the first motor, the rotating shaft and the first gear, and the rear side of the bottom of the protective shield is arranged on the pressure plate; through setting up the protection and keeping off the cover, can conveniently shelter from the protection to first motor, pivot and first gear, conveniently shelter from the meshing position of the tooth on first gear and the rotating ring simultaneously, improve the practicality.

The wafer detection equipment for electronic component production further comprises a stabilizing plate, wherein the stabilizing plate is positioned in the protective shield, the upper side of the stabilizing plate is rotatably arranged at the front end of the rotating shaft, and the lower side of the stabilizing plate is arranged on the pressure plate; through setting up the stabilizer plate, can conveniently support countershaft and first gear to make first gear remain throughout with the engaged state of the tooth on the swivel becket, prevent that it from taking place the disjointing phenomenon.

The wafer detection equipment for electronic component production further comprises two groups of second guide rods, wherein the inner sides of the two groups of second guide rods are respectively fixed on the lower sides of the outer side walls of the two groups of arched plates, and the outer sides of the two groups of second guide rods penetrate through the lower sides of the two groups of second mounting plates and extend out of the two groups of second mounting plates; two sets of bows can drive two sets of second guide bars and slide respectively on two sets of second mounting panels, through setting up two sets of second guide bars, can conveniently connect and lead the downside of two sets of second mounting panels and the downside of two sets of bows, improve equipment's fastness and stability, improve practicality and reliability.

Compared with the prior art, the invention has the beneficial effects that: the wafer is placed on a placing table, the outer edge position of the wafer is located on the outer side of the placing table, a central control box controls an opening device to push two groups of rollers to move outwards, the two groups of rollers drive two groups of sliding blocks to slide outwards on two groups of first linear guide rails through two groups of cambered plates respectively, the two groups of rollers are separated and located on the outer side of the wafer on the placing table, so that the two groups of rollers are opened, the two groups of sliding blocks respectively generate extrusion deformation on two groups of springs at the moment, the central control box controls the pushing device to push a pressure plate to move downwards, the pressure plate drives a ring-shaped guide rail, a rotating ring, a first motor, a rotating shaft, a first gear, two groups of first mounting plates, two groups of first linear guide rails, two groups of sliding blocks, two groups of cambered plates, two groups of rollers, two groups of second mounting plates, two groups of pressure detectors, two groups of springs and two, prevent it from moving at will, two groups of rollers are located outside the wafer at this time, the central control box controls the opening device to recover slowly, two groups of first motors respectively push two groups of sliders to approach each other, two groups of sliders respectively drive two groups of bow-shaped plates and two groups of rollers to approach each other, the inner sides of the two groups of rollers are both contacted with the edge position of the outer side wall of the wafer, the two groups of rollers stop moving, the opening device continues to recover and restore to the initial state, the opening device is separated from the two groups of rollers at this time, two groups of pressure detectors respectively detect the elastic force values of two groups of springs and transmit the detection signals to the central control box, the relative position of the sliders is detected according to the elastic force values and the elastic coefficients of the springs, meanwhile, two groups of laser range finders can directly detect the distance between the inner sides of the two groups of laser range finders and the outer side, the first motor drives the rotating shaft and the first gear to rotate, the first gear is meshed with a plurality of sets of teeth on the rotating ring, the first gear pushes the rotating ring to rotate on the annular guide rail, the rotating ring drives two sets of rollers to rotate around the pressure plate through two sets of first mounting plates, meanwhile, the inner sides of the two sets of rollers roll on the edge of the outer side wall of the wafer, the two sets of rollers rotate on the two sets of cambered plates, the two sets of rollers rotate by taking the outer side wall of the wafer as a moving track, the two sets of springs continuously generate thrust on the two sets of sliding blocks, when the problems of protrusion, notch or irregular circumferential shape of the wafer and the like occur on the outer side wall of the wafer, the two sets of rollers move outwards or move inwards, the elastic deformation of the two sets of springs measures the change, the elastic pressure values of the two sets of springs change, and the central control box detects, thereby detect the circumference shape of wafer, realize carrying out the mesh that detects to the wafer, two sets of laser range finder can carry out the secondary to the removal orbit of two sets of rollers simultaneously and detect, thereby improve the detection precision and the degree of accuracy of wafer, after the wafer detects the completion, two sets of first mounting panels rotate to initial position, well accuse case control closes first motor, two sets of roller stall, well accuse case promotes two sets of rollers through opening device and keeps away from the wafer, well accuse case passes through thrust device and drives pressure disk and two sets of rollers rebound and resume to initial position, thereby accomplish detection work, through detecting the wafer, the time of artifical detection time measuring can be effectively saved, simplify the detection mode, use manpower sparingly and time, improve work efficiency, the detection precision of wafer improves simultaneously, effectively improve the detection effect, improve practicality and reliability.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a schematic view of the structure of the present invention viewed obliquely from the bottom right;

FIG. 3 is a schematic cross-sectional oblique view of the pressure plate of FIG. 1;

FIG. 4 is an enlarged view of a portion A of FIG. 2;

FIG. 5 is an enlarged view of a portion B of FIG. 3;

FIG. 6 is an enlarged view of the third mounting plate of FIG. 2;

in the drawings, the reference numbers: 1. a base; 2. a placing table; 3. a top plate; 4. a side support arm; 5. a central control box; 6. a platen; 7. an annular guide rail; 8. a rotating ring; 9. a first motor; 10. a rotating shaft; 11. a first gear; 12. a first mounting plate; 13. a first linear guide rail; 14. a slider; 15. an arcuate plate; 16. a roller; 17. a second mounting plate; 18. a pressure detector; 19. a spring; 20. a laser range finder; 21. a second motor; 22. a second gear; 23. a second linear guide; 24. pushing the sliding rod; 25. an arc-shaped push plate; 26. a threaded sleeve; 27. a lead screw; 28. a third gear; 29. a third mounting plate; 30. a third motor; 31. a fourth gear; 32. an arcuate stiffener; 33. a fourth mounting plate; 34. a turntable; 35. a first guide bar; 36. sealing the disc; 37. a protective shield; 38. a stabilizing plate; 39. a second guide bar.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

As shown in fig. 1 to 6, in the wafer inspection apparatus for electronic component production according to the present invention, during operation, a wafer is placed on a placing table 2, the outer edge position of the wafer is located outside the placing table 2, an opening device is controlled by a central control box 5 to push two sets of rollers 16 to move outwards, the two sets of rollers 16 respectively drive two sets of sliders 14 to slide outwards on two sets of first linear guide rails 13 through two sets of arcuate plates 15, the two sets of rollers 16 are separated and located outside the wafer on the placing table 2, so as to open the two sets of rollers 16, at this time, the two sets of sliders 14 respectively generate extrusion deformation on two sets of springs 19, the central control box 5 controls the pushing device to push a platen 6 to move downwards, the platen 6 drives a ring guide rail 7, a rotating ring 8, a first motor 9, a rotating shaft 10, a first gear 11, two sets of first mounting plates 12, two sets of first linear guide rails 13, Two groups of bow-shaped plates 15, two groups of rollers 16, two groups of second mounting plates 17, two groups of pressure detectors 18, two groups of springs 19 and two groups of laser range finders 20 synchronously move downwards, the bottom of the pressure plate 6 is in contact with the top of the wafer on the placing table 2 and slightly extrudes the wafer to prevent the wafer from moving randomly, at the moment, the two groups of rollers 16 are positioned on the outer side of the wafer, the central control box 5 controls the opening device to slowly recover, the two groups of first motors 9 respectively push the two groups of sliders 14 to approach each other, the two groups of sliders 14 respectively drive the two groups of bow-shaped plates 15 and the two groups of rollers 16 to approach each other, the inner sides of the two groups of rollers 16 are both in contact with the edge position of the outer side wall of the wafer, the two groups of rollers 16 stop moving, the opening device is continuously recovered and recovered to the initial state, at the moment, the opening device is separated from the two, the relative position of the sliding block 14 is detected according to the elastic force value and the elastic coefficient of the spring 19, meanwhile, the two groups of laser range finders 20 can directly detect the distance between the inner sides of the two groups of laser range finders 20 and the outer side walls of the two groups of arc-shaped plates 15 and transmit the detection to the central control box 5, the first motor 9 is started, the first motor 9 drives the rotating shaft 10 and the first gear 11 to rotate, the first gear 11 is meshed with multiple sets of teeth on the rotating ring 8, the first gear 11 pushes the rotating ring 8 to rotate on the annular guide rail 7, the rotating ring 8 drives the two groups of rollers 16 to rotate around the pressure plate 6 through the two groups of first mounting plates 12, meanwhile, the inner sides of the two groups of rollers 16 roll on the outer side wall edge of the wafer, the two groups of rollers 16 rotate on the two groups of arc-shaped plates 15, the two groups of rollers 16 rotate by taking the outer side, when the outer side wall of the wafer has the problems of protrusion, notch or irregular circumferential shape of the wafer, the two groups of rollers 16 move outwards or inwards, the elastic deformation of the two groups of springs 19 changes, the two groups of springs 19 change the elastic pressure values of the two groups of pressure detectors 18, the central control box 5 detects the moving tracks of the two groups of rollers 16 in real time through the elastic force values of the two groups of springs 19 so as to detect the circumferential shape of the wafer and achieve the purpose of detecting the wafer, meanwhile, the two groups of laser range finders 20 can perform secondary detection on the moving tracks of the two groups of rollers 16 so as to improve the detection precision and accuracy of the wafer, after the wafer detection is completed, the two groups of first mounting plates 12 rotate to the initial position, the central control box 5 controls to close the first motor 9, the two groups of rollers 16 stop rotating, and the central control box 5 pushes the two groups of rollers 16 to be far away, well accuse case 5 drives pressure disk 6 and two sets of roller 16 rebound and resumes to initial position through thrust unit to accomplish detection achievement, through detecting the wafer, can effectively save the time of artifical detection time, simplify the detection mode, use manpower sparingly and time, improve work efficiency, the detection precision of wafer improves simultaneously, effectively improves detection effect, improves practicality and reliability.

The main functions realized by the invention are as follows: by detecting the wafer, the time of manual detection can be effectively saved, the detection mode is simplified, the labor and the time are saved, the working efficiency is improved, and meanwhile, the detection precision of the wafer is improved, and the detection effect is effectively improved; the working mode of the opening device is that the central control box 5 controls the opening of the second motor 21, the second motor 21 drives the second gear 22 to rotate, the second gear 22 is respectively engaged with teeth on the two groups of pushing slide bars 24, the second gear 22 drives the rear side pushing slide bar 24 to move leftwards and drives the front side pushing slide bar 24 to move rightwards, the moving directions of the two groups of pushing slide bars 24 are opposite, the two groups of pushing slide bars 24 respectively push the two groups of arc push plates 25 on the two groups of pushing slide bars to move outwards, the outer sides of the two groups of arc push plates 25 are respectively contacted with the inner sides of the two groups of rollers 16 and push the two groups of rollers 16 to move outwards, the two groups of rollers 16 are far away from each other, the second motor 21 is reversely operated, the, because the positions of the two groups of arc-shaped push plates 25 are respectively staggered and separated from the positions of the two groups of pushing slide bars 24, the moving modes of the two groups of arc-shaped push plates 25 do not generate collision influence on the two groups of pushing slide bars 24; the working mode of the pushing device is that the central control box 5 controls to open the third motor 30, the third motor 30 drives the fourth gear 31 to rotate, the fourth gear 31 is meshed with the four groups of third gears 28, the fourth gear 31 drives the four groups of third gears 28 to synchronously rotate, the four groups of third gears 28 drive the four groups of lead screws 27 to synchronously rotate, the four groups of lead screws 27 are respectively in threaded connection with the four groups of screw sleeves 26, the four groups of lead screws 27 respectively move up and down on the four groups of screw sleeves 26 synchronously, the four groups of lead screws 27 drive the pressure plate 6 to synchronously move up and down, so as to drive the two groups of rollers 16 on the pressure plate 6 to synchronously move up and down, and the four groups of lead screws 27 drive the four groups of third gears 28, the third mounting plate 29, the third motor 30 and; when the two groups of first mounting plates 12 rotate, the two groups of first mounting plates 12 drive the arched reinforcing rods 32, the fourth mounting plates 33 and the rotary table 34 to rotate, the rotary table 34 rotates on the second motor 21, and the arched reinforcing rods 32, the fourth mounting plates 33 and the rotary table 34 are arranged, so that the two groups of first mounting plates 12 can be conveniently supported and connected, the bending and the collapse of the two groups of first mounting plates 12 during rotation are prevented, and the firmness of the two groups of first mounting plates 12 is improved; when the third mounting plate 29 moves up and down, the third mounting plate 29 slides on the four groups of first guide rods 35, the four groups of first guide rods 35 can support the third mounting plate 29, and the four groups of sealing discs 36 can seal the tops of the four groups of first guide rods 35 to prevent the third mounting plate 29 from being separated from the four groups of first guide rods 35 when moving up; by arranging the protective shield 37, the first motor 9, the rotating shaft 10 and the first gear 11 can be shielded and protected conveniently, and meanwhile, the meshing position of the first gear 11 and the teeth on the rotating ring 8 can be shielded conveniently; the stabilizing plate 38 is arranged, so that the rotating shaft 10 and the first gear 11 can be conveniently supported, the first gear 11 is always kept in a meshing state with teeth on the rotating ring 8, and the phenomenon of dislocation is prevented; two sets of bows 15 can drive two sets of second guide bars 39 and slide on two sets of second mounting panels 17 respectively, through setting up two sets of second guide bars 39, can conveniently connect and lead the downside of two sets of second mounting panels 17 and the downside of two sets of bows 15, improve equipment's fastness and stability, improve practicality and reliability.

According to the wafer detection equipment for electronic element production, the installation mode, the connection mode or the arrangement mode are all common mechanical modes, and the installation mode, the connection mode or the arrangement mode can be implemented as long as the beneficial effects of the equipment can be achieved; the center control box 5, the pressure detector 18 and the laser range finder 20 are commercially available.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.