阅读说明：本技术 一种减少工厂气氛下微距型连接器玻璃飞溅的模具及封接工艺 (Mold and sealing process for reducing splashing of glass of microspur connector in factory atmosphere ) 是由 赵煜 焦明 华斯嘉 牛建国 张攀 冯庆 刘卫红 杨文波 于 2020-12-29 设计创作，主要内容包括：本发明涉及电子玻璃技术领域,具体地说,是一种计微距型连接器玻璃-金属封接领域,特别涉及微距型连接器模具及封接工艺。该微距型连接器模具及封接工艺包括内石墨盒和外石墨盒,所述内石墨盒底面的内表面上设有第一卡槽,位于第一卡槽两侧各设有一个凹槽,所述外石墨盒底面的内表面上设有第二卡槽,将微距型连接器的壳体和芯柱放置于下模中,再将下模卡于第一卡槽内,将内石墨盒放入外石墨盒内,并且内石墨盒的下底面卡入第二卡槽内。本发明是一种减少工厂气氛下微距型连接器玻璃飞溅的模具,采用在石墨盒上增加液体储存凹槽,并增加微距型产品下模卡槽,避免在拿取过程中下模的滑移。(The invention relates to the technical field of electronic glass, in particular to the field of glass-metal sealing of a microspur connector, and particularly relates to a microspur connector mold and a sealing process. The microspur connector die and the sealing process comprise an inner graphite box and an outer graphite box, wherein a first clamping groove is formed in the inner surface of the bottom surface of the inner graphite box, two grooves are formed in two sides of the first clamping groove respectively, a second clamping groove is formed in the inner surface of the bottom surface of the outer graphite box, a shell and a core column of the microspur connector are placed in a lower die, the lower die is clamped in the first clamping groove, the inner graphite box is placed in the outer graphite box, and the lower bottom surface of the inner graphite box is clamped into the second clamping groove. The invention relates to a mold for reducing glass splashing of a microspur connector in a factory atmosphere.)

1. The utility model provides a reduce mould that microspur type connector glass splashes under mill's atmosphere for pass through the glass base with the casing and the stem of microspur type connector and seal-in, its characterized in that includes interior graphite box and outer stone ink horn, be equipped with first draw-in groove on the internal surface of interior graphite box bottom surface, be located first draw-in groove both sides and respectively be equipped with a recess, be equipped with the second draw-in groove on the internal surface of outer stone ink horn bottom surface, place the casing and the stem of microspur type connector in the lower mould, block the lower mould in first draw-in groove again, in putting into outer graphite box with interior graphite box to the lower bottom surface card of interior graphite box is gone into in the second draw-in groove.

2. The mold for reducing glass splash of a macro type connector in a factory atmosphere according to claim 1, wherein a stainless steel layer is provided on an inner surface of the groove.

3. A sealing process of a mold for reducing glass splashing of a microspur connector in a factory atmosphere is characterized by comprising the following steps:

(1) purifying the shell, the core column and the inner graphite box of the microspur connector at the high temperature of 960 ℃ in a high-temperature chain type atmosphere furnace protected by nitrogen;

(2) putting the core column and the shell of the purified microspur connector into a chain type pre-oxidation furnace, and pre-oxidizing at 870 ℃ for 20 min;

(3) respectively carrying out high-frequency ultrasonic cleaning on the core column and the shell of the preoxidized microspur connector twice for 30min by using water and ethanol, drying the core column and the shell with hot air to remove residual ethanol on the surfaces of the core column and the shell, and then drying the core column and the shell in an oven at 100 ℃;

(4) carrying out high-frequency ultrasonic cleaning on the glass blank for 30min by using absolute ethyl alcohol, repeatedly cleaning twice, drying by using hot air, and then putting into a drying oven at 100 ℃;

(5) after the treated core column, the shell and the glass blank are assembled, placing the microspur lower die into first clamping grooves of inner graphite boxes with 5g of deionized water at two ends of the groove respectively;

(6) and placing the inner graphite box into an outer graphite box with a corresponding second clamping groove, and sealing at 960 ℃ in a high-temperature chain type atmosphere protection furnace under the protection of nitrogen.

Technical Field

The invention relates to the technical field of electronic glass, in particular to the field of glass-metal sealing of a microspur connector, and particularly relates to a microspur connector mold and a sealing process.

Background

The glass insulator is widely applied to the sealing field of aerospace, petroleum, radio frequency connectors and the like, but in the high-temperature sealing process, the glass insulator is often accompanied with the generation of glass splash due to the overflow of bubbles inside the glass insulator. For the treatment of the splashed glass beads, a manual scraping mode is generally adopted, which easily causes the scratching of the shell and the core column to cause poor product appearance. Researchers have found that the atmosphere has a significant effect on glass splatter during the sealing process. In a reducing atmosphere (N)₂+2％H₂) The frequency of the lower glass splash is much less than the oxidizing atmosphere. The glass sealing factory adopts a high-temperature chain furnace protected by nitrogen to seal products, and because the sealing process is carried out in a closed graphite box, oxygen and water vapor in a closed space can generate incomplete reaction with graphite to generate CO and H₂But has weak reducibility. However, the limited reducing atmosphere can ensure that no glass splash occurs only when the oxide layers of the shell and the core column are thin enough. This is difficult to achieve for factory mass production. Changing the protective atmosphere to N₂And H₂The mixed gas will increase the production cost and has a certain risk.

Disclosure of Invention

The invention relates to a mold for reducing glass splashing of a microspur connector in a factory atmosphere.

The invention improves the reducing atmosphere around the sealing device by optimizing the graphite box mould and the sealing process on the premise of not changing factory facilities, thereby achieving the purpose of reducing glass splashing. And the method does not cause adverse effects on sealing strength, resistance and air tightness.

The utility model provides a reduce mould that microspur type connector glass splashes under mill's atmosphere for pass through the glass base with the casing and the stem of microspur type connector and seal-in, including interior graphite box and outer stone ink horn, be equipped with first draw-in groove on the internal surface of interior graphite box bottom surface, be located first draw-in groove both sides and respectively be equipped with a recess, be equipped with the second draw-in groove on the internal surface of outer stone ink horn bottom surface, place the casing and the stem of microspur type connector in the lower mould, block the lower mould in first draw-in groove again, in putting into outer graphite box with interior graphite box to the lower bottom surface card of interior graphite box is gone into in the second draw-in groove.

Further, a stainless steel layer is arranged on the inner surface of the groove.

A sealing process of a mold for reducing glass splashing of a microspur connector in a factory atmosphere comprises the following steps:

(1) purifying the shell, the core column and the inner graphite box of the microspur connector at the high temperature of 960 ℃ in a high-temperature chain type atmosphere furnace protected by nitrogen;

(2) putting the core column and the shell of the purified microspur connector into a chain type pre-oxidation furnace, and pre-oxidizing at 870 ℃ for 20 min;

(3) respectively carrying out high-frequency ultrasonic cleaning on the core column and the shell of the preoxidized microspur connector twice for 30min by using water and ethanol, drying the core column and the shell with hot air to remove residual ethanol on the surfaces of the core column and the shell, and then drying the core column and the shell in an oven at 100 ℃;

(4) carrying out high-frequency ultrasonic cleaning on the glass blank for 30min by using absolute ethyl alcohol, repeatedly cleaning twice, drying by using hot air, and then putting into a drying oven at 100 ℃;

(5) after the treated core column, the shell and the glass blank are assembled, placing the microspur lower die into first clamping grooves of inner graphite boxes with 5g of deionized water at two ends of the groove respectively;

(6) and placing the inner graphite box into an outer graphite box with a corresponding second clamping groove, and sealing at 960 ℃ in a high-temperature chain type atmosphere protection furnace under the protection of nitrogen.

The beneficial effects brought by the invention are as follows:

the invention has the beneficial effects that the stainless steel groove of the inner graphite box is increased, and the adsorption of graphite to water and the influence of graphite powder in the graphite box on the process stability are reduced. The first clamping groove of the lower die of the micro-distance connector is added, so that the position deviation caused by the slippage of the micro-distance connector is reduced. The atmosphere composition in the inner stone ink box can be adjusted by adding deionized water with different masses, and the fine adjustment of the reducing atmosphere is realized. And the deionized water is pollution-free, is in a steam form at high temperature, is in a nested structure of two layers of graphite boxes, and cannot influence products fed into the furnace in the same batch.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings.

Figure 1 is a top view of the inner graphite box.

Figure 2 is a cross-sectional view of the inner graphite box.

Fig. 3 is a bottom view of the lower mold in which the macro-type product is loaded.

Fig. 4 is a bottom view of the outer stone ink cartridge.

FIG. 5 is a cross-sectional view of an outer stone ink cartridge.

Detailed Description

The invention is further illustrated in the following figures with reference to the accompanying drawings and examples:

in the invention, as shown in fig. 1-5, a mold for reducing glass splash of a microspur connector in a factory atmosphere is used for sealing a shell and a core column of the microspur connector through a glass blank, and comprises an inner stone ink box 1 and an outer stone ink box 2, wherein a first clamping groove 3 is arranged on the inner surface of the bottom surface of the inner stone ink box 1, two grooves 4 are respectively arranged at two sides of the first clamping groove 3, a second clamping groove 5 is arranged on the inner surface of the bottom surface of the outer stone ink box 2, the shell and the core column of the microspur connector are placed in a lower mold 2, the lower mold 2 is clamped in the first clamping groove 3, the inner stone ink box 1 is placed in the outer graphite box 2, and the lower bottom surface of the inner stone ink box 1 is clamped in the second clamping groove 5.

Further, a stainless steel layer 6 is arranged on the inner surface of the groove 4.

A sealing process of a mold for reducing glass splashing of a microspur connector in a factory atmosphere comprises the following steps:

(1) purifying the shell, the core column and the inner graphite box of the microspur connector at high temperature of 960 ℃ in a high-temperature chain type atmosphere furnace protected by nitrogen to remove surface adhesive substances;

(2) placing the core column and the shell of the purified microspur connector into a chain type pre-oxidation furnace, pre-oxidizing at 870 ℃ for 20min to generate an oxide layer with uniform thickness, and facilitating the subsequent sealing process;

(3) respectively carrying out high-frequency ultrasonic cleaning on the core column and the shell of the preoxidized microspur connector twice for 30min by using water and ethanol, drying the core column and the shell with hot air to remove residual ethanol on the surfaces of the core column and the shell, and then drying the core column and the shell in an oven at 100 ℃; removing foreign matter from the surface material.

(4) Cleaning the glass blank with absolute ethyl alcohol by high-frequency ultrasonic waves for 30min, repeatedly cleaning twice, drying the glass blank with hot air, and then putting the glass blank into a drying oven at 100 ℃ for drying, removing water vapor and ethanol adsorbed by the glass blank, and reducing the content of overflowed gas in the sealing process;

(5) after the treated core column, the shell and the glass blank are assembled, the microspur lower die is placed into the first clamping groove of the inner graphite box with 5g of deionized water at two ends of the groove respectively, and the aim is to change the atmosphere composition in the closed space, so that water is changed into a steam form at high temperature and generates steamReacting to increase the reducing atmosphere in the environment. The reducibility can be adjusted by adjusting the water quality, and the assembled lower die of the microspur connector according to the figure 3 is placed into the first clamping groove in the middle;

(6) and placing the inner graphite box into an outer graphite box with a corresponding second clamping groove, and sealing the inner graphite box at 960 ℃ in a high-temperature chain type atmosphere protection furnace under the protection of nitrogen, so that the phenomenon that the inner graphite box moves to cause deionized water contained in the inner graphite box to be scattered out of the groove to cause unstable process is avoided.

In the present invention, the principle and the implementation of the present invention are explained by applying the specific embodiments, and the above description of the embodiments is only used to help understanding the method and the core idea of the present invention; for those skilled in the art, the invention can be modified in the specific embodiments and applications according to the spirit of the present invention, and therefore the content of the present description should not be construed as limiting the invention.