Waterproof pressing structure and thin film switch circuit board applying same

文档序号:785000 发布日期:2021-04-09 浏览:39次 中文

阅读说明:本技术 防水按压结构及应用其的薄膜开关电路板 (Waterproof pressing structure and thin film switch circuit board applying same ) 是由 黄仁杰 于 2020-12-22 设计创作,主要内容包括:一种防水按压结构,包括一第一膜层、至少一第一接点、一第二膜层、至少一第二接点、一绝缘层以及一疏水性材料。第一接点位于第一膜层,第二接点位于第二膜层,绝缘层设置于第一膜层与第二膜层之间,其中第一膜层、第二膜层及绝缘层于一垂直方向上相互堆栈,且疏水性材料分别形成于第一接点与第二接点的二表面上,用以形成一低表面张力区于第一接点与第二接点之间。(A waterproof pressing structure comprises a first film layer, at least one first contact, a second film layer, at least one second contact, an insulating layer and a hydrophobic material. The first contact is located on the first film layer, the second contact is located on the second film layer, the insulating layer is arranged between the first film layer and the second film layer, wherein the first film layer, the second film layer and the insulating layer are stacked in a vertical direction, and the hydrophobic materials are respectively formed on two surfaces of the first contact and the second contact and used for forming a low surface tension area between the first contact and the second contact.)

1. A waterproof pressing structure characterized by comprising:

a first film layer;

at least one first contact point located on the first film layer;

a second film layer;

at least one second contact point located on the second film layer;

an insulating layer disposed between the first film layer and the second film layer, wherein the first film layer, the second film layer and the insulating layer are stacked in a vertical direction; and

a hydrophobic material formed on the two surfaces of the first contact and the second contact respectively for forming a low surface tension region between the first contact and the second contact.

2. The waterproof pressing structure of claim 1, wherein the first contact and the second contact are separated by a gap to form a pressing contact region, and the pressing contact region is defined by a region surrounded by the first film, the second film and the insulating layer.

3. The waterproof pressing structure of claim 1, further comprising a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the first film layer and the insulating layer, and the second adhesive layer is disposed between the second film layer and the insulating layer.

4. The waterproof pressing structure according to claim 3, wherein a plurality of openings are disposed around the waterproof pressing structure, and a vent hole is formed between the waterproof pressing structure and each of the openings of the first adhesive layer or the second adhesive layer.

5. The waterproof structure of claim 1, wherein the insulating layer has a hydrophilic coating formed on the periphery of the first contact and the second contact coated with the hydrophobic material to form a high surface tension region.

6. The waterproof press structure according to claim 5, wherein the adhesion of the high surface tension region to water molecules is greater than the adhesion of the low surface tension region to water molecules.

7. The waterproof structure according to claim 5, wherein the hydrophilic coating is selected from one of hydrophilic silane, polyvinyl alcohol and polyacrylic acid.

8. The structure of claim 1, wherein the hydrophobic material is selected from one of organofluorine compounds, organosilicon compounds, fluorosilicones, perfluoropolyethers, and hydrophobic silanes.

9. A waterproof pressing structure characterized by comprising:

a first film layer;

at least one first contact point located on the first film layer;

a second film layer;

at least one second contact point located on the second film layer;

an insulating layer disposed between the first film layer and the second film layer, wherein the first film layer, the second film layer and the insulating layer are stacked in a vertical direction; and

a hydrophobic material formed in the first contact and the second contact respectively for forming a low surface tension region between the first contact and the second contact.

10. The waterproof pressing structure of claim 9, wherein the first contact and the second contact are separated by a gap to form a pressing contact region, and the pressing contact region is defined by a region surrounded by the first film, the second film and the insulating layer.

11. The waterproof pressing structure of claim 9, further comprising a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the first film layer and the insulating layer, and the second adhesive layer is disposed between the second film layer and the insulating layer.

12. The waterproof pressing structure according to claim 11, wherein a plurality of openings are disposed around the waterproof pressing structure, and a vent hole is formed between the waterproof pressing structure and each of the openings of the first adhesive layer or the second adhesive layer.

13. The waterproof structure of claim 9, wherein the insulating layer has a hydrophilic coating formed on the periphery of the first contact and the second contact comprising the hydrophobic material to form a high surface tension region.

14. The waterproof press structure of claim 13, wherein the adhesion of the high surface tension region to water molecules is greater than the adhesion of the low surface tension region to water molecules.

15. The waterproof structure according to claim 13, wherein the hydrophilic coating is selected from one of hydrophilic silane, polyvinyl alcohol, and polyacrylic acid.

16. The waterproof structure according to claim 9, wherein the hydrophobic material is selected from one of an organofluorine compound, an organosilicon compound, fluorosilicone, perfluoropolyether, and hydrophobic silane.

17. A membrane switch circuit board, comprising:

a first film layer;

a first circuit layer having at least one first contact located on the first film layer;

a second film layer;

a second circuit layer having at least one second contact point located on the second film layer;

an insulating layer disposed between the first film layer and the second film layer, wherein the first film layer, the second film layer and the insulating layer are stacked in a vertical direction; and

a hydrophobic material formed on the two surfaces of the first contact and the second contact or in the first contact and the second contact, respectively, for forming a low surface tension region between the first contact and the second contact.

18. The membrane switch circuit board of claim 17, wherein the insulating layer has a hydrophilic coating formed on the periphery of the first contact and the second contact coated with or including the hydrophobic material to form a high surface tension region.

19. The membrane switch circuit board of claim 18, wherein the hydrophilic coating is selected from one of hydrophilic silane, polyvinyl alcohol or polyacrylic acid.

20. The membrane switch circuit board of claim 17, wherein the hydrophobic material is selected from one of organofluorine compounds, organosilicon compounds, fluorosilicones, perfluoropolyethers and hydrophobic silanes.

Technical Field

The invention relates to a waterproof pressing structure and a thin film switch circuit board applying the same.

Background

The existing keyboard comprises a keycap, a scissor-foot structure, an elastic piece and a membrane switch circuit board. The elastic piece is arranged below the keycap and used for providing elastic restoring force for the keycap. The scissors foot structure is used for supporting the keycap, so that the keycap can press the elastic piece when pressed, the downward pressure is transmitted to the membrane switch circuit board, and a switch element of the membrane switch circuit board is triggered.

However, moisture is easy to enter the keyboard from the gap between the two keycaps, and therefore, the membrane switch circuit board is easy to malfunction or misconduct without a waterproof sheath or waterproof treatment, and needs to be further improved.

Disclosure of Invention

The invention provides a waterproof pressing structure and a thin film switch circuit board applying the same, which can be applied to a waterproof keyboard or a portable computer, so that water molecules are not easy to attach to a circuit, and the waterproof capability is improved.

According to an aspect of the present invention, a waterproof pressing structure is provided, which includes a first film, at least one first contact, a second film, at least one second contact, an insulating layer, and a hydrophobic material. The first contact is located on the first film layer, the second contact is located on the second film layer, the insulating layer is arranged between the first film layer and the second film layer, wherein the first film layer, the second film layer and the insulating layer are stacked in a vertical direction, and the hydrophobic materials are respectively formed on two surfaces of the first contact and the second contact and used for forming a low surface tension area between the first contact and the second contact.

According to an aspect of the present invention, a waterproof pressing structure is provided, which includes a first film, at least one first contact, a second film, at least one second contact, an insulating layer, and a hydrophobic material. The first contact is located on the first film layer, the second contact is located on the second film layer, the insulating layer is arranged between the first film layer and the second film layer, wherein the first film layer, the second film layer and the insulating layer are stacked in a vertical direction, and the hydrophobic materials are respectively formed in the first contact and the second contact and used for forming a low surface tension area between the first contact and the second contact.

According to an aspect of the present invention, a thin film switch circuit board is provided, which includes a first film layer, a first circuit layer having at least a first contact, a second film layer, a second circuit layer having at least a second contact, an insulating layer, and a hydrophobic material. The first contact is located on the first film layer, the second contact is located on the second film layer, the insulating layer is arranged between the first film layer and the second film layer, wherein the first film layer, the second film layer and the insulating layer are stacked in a vertical direction, and the hydrophobic materials are respectively formed on two surfaces of the first contact and the second contact or formed in the first contact and the second contact so as to form a low surface tension area between the first contact and the second contact.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

FIG. 1 is a schematic diagram of a pressing unit of a membrane switch circuit board according to an embodiment of the invention;

FIG. 2 is a schematic cross-sectional view illustrating a waterproof pressing structure according to an embodiment of the invention;

FIG. 3 is a schematic cross-sectional view illustrating a waterproof pressing structure according to another embodiment of the invention;

fig. 4 is a schematic diagram illustrating a waterproof pressing structure according to another embodiment of the invention.

Reference numerals

100: thin film switch circuit board

110. 110', 110 ": waterproof pressing structure

102: push-button

103: opening part

104: first circuit layer

105: hydrophobic liquid

106: second circuit layer

111: first film layer

112: second film layer

113: insulating layer

114: a first adhesive layer

115: the second adhesive layer

116: low surface tension zone

117: adhesive layer

118: high surface tension zone

119: hydrophilic coating

120: vent hole

121: first contact

123: second contact

122. 124: hydrophobic materials

122 ', 124': hydrophobic materials

W: water molecule

Detailed Description

The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:

referring to fig. 1, fig. 2 and fig. 3, wherein fig. 1 is a schematic diagram illustrating a pressing unit of a membrane switch circuit board 100 according to an embodiment of the invention, fig. 2 is a cross-sectional view illustrating a waterproof pressing structure 110 of an embodiment of fig. 1, and fig. 3 is a cross-sectional view illustrating the waterproof pressing structure 110 of another embodiment of fig. 1.

In fig. 1, the membrane switch circuit board 100 can be applied to a keyboard structure or a portable computer for receiving a pressing signal of a user and transmitting the pressing signal to the processor for executing a corresponding instruction or a function. The keyboard structure includes a plurality of keys 102 (only one of which is shown in fig. 2). The keys 102 may be letter keys, numeric keys, symbol keys, function keys or keys with light signals, etc. The keyboard structure may be a wireless keyboard, a computer keyboard, a backlight keyboard, a touch keyboard, an ultra-thin flat keyboard or an optical axis keyboard, etc., which is not limited in the present invention.

In fig. 1, the membrane switch circuit board 100 has at least one waterproof pressing structure 110 and a plurality of openings 103, and the waterproof pressing structure 110 is correspondingly disposed below each key 102 (as shown in fig. 2 and 3) to form a waterproof switch. The openings 103 are disposed around the waterproof pressing structure 110, and are used for connecting the keys 102 with a bottom plate pivot portion (not shown) below through the openings 103. In order to prevent water molecules from entering the waterproof pressing structure 110 through the openings 103, in one embodiment, a waterproof treatment (for example, soaking the hydrophobic liquid 105, as shown by the dotted line) is performed around the openings 103, so that water molecules cannot adhere to the openings 103. Therefore, when water molecules enter the keyboard, the water molecules can only adhere to the film layer or the bottom plate with high adhesion to water, but cannot adhere to the periphery of the openings 103 which are subjected to hydrophobic treatment and have low adhesion to water, so that the waterproof and hydrophobic functions are achieved.

In fig. 1, the membrane switch circuit board 100 further has a first circuit layer 104 and a second circuit layer 106, wherein the first circuit layer 104 and the second circuit layer 106 are respectively located on two film layers, the first circuit layer 104 is electrically connected to the first contact 121 of the waterproof pressing structure 110, the second circuit layer 106 is electrically connected to the second contact 123 of the waterproof pressing structure 110, and the first circuit layer 104 and the second circuit layer 106 are made of, for example, copper wires, silver wires or other conductive materials. The user can press the waterproof pressing structure 110 to generate a pressing signal and conduct the first circuit layer 104 and the second circuit layer 106, so as to transmit the pressing signal to the processor, so that the processor can execute a corresponding instruction or a function. Please refer to fig. 2 and fig. 3 for the detailed structure and a-a sectional view of the waterproof pressing structures 110 and 110'.

Referring to fig. 2, the waterproof pressing structure 110 includes a first film 111, at least one first contact 121, a second film 112, at least one second contact 123, an insulating layer 113, and at least one hydrophobic material 122, 124. The first contact 121 is located on the first film 111, the second contact 123 is located on the second film 112, and the insulating layer 113 is disposed between the first film 111 and the second film 112, wherein the first film 111, the second film 112, and the insulating layer 113 are stacked in a vertical direction, and the hydrophobic materials 122 and 124 are respectively formed on two surfaces of the first contact 121 and the second contact 123 to form a low surface tension region 116 between the first contact 121 and the second contact 123.

In addition, the waterproof pressing structure 110 may include a first adhesive layer 114 and a second adhesive layer 115, where the first adhesive layer 114 is, for example, a waterproof adhesive, and is disposed between the first film 111 and the insulating layer 113; the second adhesive layer 115 is, for example, a waterproof adhesive, and is disposed between the second film layer 112 and the insulating layer 113. The first contact 121 and the second contact 123 form a pressing contact region defined by a region surrounded by the first film 111, the second film 112 and the insulating layer 113, so that the first contact 121 and the second contact 123 are normally kept at a predetermined gap (normally not contacting, contacting when pressing).

In one embodiment, the Hydrophobic material 122, 124 is selected from organic fluorine compounds (organofluorine compounds), organic silicon compounds (organosilicone compounds), fluorosilicones (Fluorosilicone), perfluoropolyethers (perfluoropolyethers), or Hydrophobic Silanes (hydrophosphonic Silanes), wherein the Hydrophobic Silanes may include methyl, linear alkyl, branched alkyl, fluoroalkyl, aryl, or diradical groups.

The hydrophobic materials 122 and 124 are formed on the two surfaces of the first contact 121 and the second contact 123, respectively, for example, by coating or spray printing, so that water molecules are not easily attached to the first contact 121 and the second contact 123. Referring to fig. 2, specifically, when water molecules W inadvertently enter the waterproof pressing structure 110, the water molecules W can only adhere to the inner walls of the first film 111 or the second film 112 with high adhesion to water, but are not easily adhered to the two surfaces of the first contact 121 and the second contact 123 coated with the hydrophobic materials 122 and 124 and with low adhesion to water, so as to achieve the waterproof and hydrophobic functions. Meanwhile, when water molecules W inadvertently enter the waterproof pressing structure 110, due to the hydrophobic materials 122 and 124, the pressing contact area (with a predetermined gap) between the first contact 121 and the second contact 123 is not prone to retain the water molecules W, so that a low surface tension area 116 (i.e., a low adhesion area) can be formed between the first contact 121 and the second contact 123, and the first contact 121 and the second contact 123 are not in a short circuit state due to the retained water molecules W, so that the waterproof pressing structure 110 is not in a misconduction state.

Referring to fig. 3, in another embodiment, the waterproof pressing structure 110 ' includes a first film 111, at least one first contact 121, a second film 112, at least one second contact 123, an insulating layer 113, and at least one hydrophobic material 122 ', 124 '. The first contact 121 is located on the first film 111, the second contact 123 is located on the second film 112, and the insulating layer 113 is disposed between the first film 111 and the second film 112, wherein the first film 111, the second film 112, and the insulating layer 113 are stacked in a vertical direction, and the hydrophobic materials 122 'and 124' are respectively formed in the first contact 121 and the second contact 123 to form a low surface tension region 116 between the first contact 121 and the second contact 123.

In fig. 3, the hydrophobic materials 122 ', 124' are similar or identical in function and material to the hydrophobic materials 122, 124 shown in fig. 2, for example, so that water molecules W are not easily attached to the two surfaces of the hydrophobic first contact 121 and the hydrophobic second contact 123 having low adhesion to water, and the first contact 121 and the second contact 123 are not short-circuited by the residual water molecules W, so that the waterproof pressing structure 110 is not misconducted.

Referring to fig. 4, a schematic diagram of a waterproof pressing structure 110 ″ according to another embodiment of the invention is shown, in which a plurality of openings 103 are disposed around the waterproof pressing structure 110 ″ and an insulating layer 113 of the waterproof pressing structure 110 ″ has a hydrophilic coating 119 formed on the peripheries of a first contact 121 and a second contact 123 coated with or containing a hydrophobic material to form a high surface tension region 118 on the periphery of a low surface tension region 116. Low surface tension zone 116 has a higher hydrophobicity relative to high surface tension zone 118.

In addition, an adhesive layer 117 may be formed on the insulating layer 113, and functions as the first adhesive layer 114 and the second adhesive layer 115 described in fig. 2 and 3. The adhesive layer 117 forms a vent 120 between the waterproof pressing structure 110 "and the opening 103, so that air can be discharged to the opening 103 when the waterproof pressing structure 110" is pressed.

In one embodiment, the Hydrophilic coating 119 is selected from Hydrophilic Silanes (hydrophic Silanes), Polyvinyl alcohol (Polyvinyl alcohol), or Polyacrylic acid (Polyacrylic acid), wherein the Hydrophilic Silanes may include polar groups or hydroxyl groups. The hydrophilic coating is formed on the surface of the insulating layer 113 by, for example, coating or inkjet printing, and allows water molecules to easily adhere to the insulating layer 113. When water molecules W enter the waterproof pressing structure 110 carelessly, the water molecules W are more easily moved (as shown by arrows) from the low surface tension region 116 to the high surface tension region 118 due to the hydrophilic coating 119, so that the water molecules W are more easily led out to the opening 103 through the vent 120, thereby achieving the waterproof, hydrophobic and water-guiding functions.

The high surface tension zone 118 is, for example, a zone having a surface tension greater than 30 dynes/cm, such as 30 to 40 dynes/cm or higher, while the low surface tension zone 116 is, for example, a zone having a surface tension less than 25 dynes/cm, such as 25 to 18 dynes/cm or lower. The adhesion force of the high surface tension region 118 to water molecules is greater than that of the low surface tension region 116 to water molecules, and in this embodiment, the low surface tension region 116 and the high surface tension region 118 are formed by the cooperation of the hydrophobic material and the hydrophilic coating 119, respectively, so as to accelerate the water molecules W to be guided out to the opening 103. In another embodiment, only the low surface tension region 116 may be provided to guide the water molecules W to the opening 103 through the vent 120.

The hydrophilic coating 119 may be formed on the inner walls of the first and second films 111 and 112 of fig. 2 and 3, in addition to the surface of the insulating layer 113 of fig. 4, so that water molecules W are easily attached to the first and second films 111 and 112. Due to the hydrophilic coating 119, water molecules W more easily move from the low surface tension region 116 to the high surface tension region 118 to be guided to the opening 103 in fig. 1.

That is, the insulating layer 113 of the waterproof pressing structure 110 of fig. 2 has, for example, a hydrophilic coating 119 formed on the periphery of the first contact 121 and the second contact 123 coated with or containing a hydrophobic material, so as to form a high surface tension region 118 on the periphery of the low surface tension region 116.

The waterproof pressing structure and the membrane switch circuit board using the same in the embodiment of the invention can be applied to a waterproof keyboard or a portable computer, so that water molecules are not easy to attach to a circuit, and the waterproof capability is improved.

The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

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