阅读说明：本技术 一种调顶深度测试装置及方法 (Top-adjusting depth testing device and method ) 是由 高南京 周志勇 石旨博 于 2020-12-16 设计创作，主要内容包括：本发明提供一种调顶深度测试装置及方法,该装置包括：光电探测单元,用于将光信号转换成电信号,并对电信号进行滤波整形输出方波电压信号；采样计算单元,通过ADC接口采样后,将采样得到的高低电平信号转换为对应的电平值,MCU根据公式计算调顶深度值；结果显示模块,用于将采样计算单元的调顶深度计算结果在显示屏上进行显示输出。通过该方案可以简化光模块调顶深度测试过程,并保障测算结果的准确性和可靠性。(The invention provides a device and a method for testing the set-top depth, wherein the device comprises: the photoelectric detection unit is used for converting the optical signal into an electric signal and filtering and shaping the electric signal to output a square wave voltage signal; the sampling calculation unit converts the sampled high and low level signals into corresponding level values after sampling through the ADC interface, and the MCU calculates the set-top depth value according to a formula; and the result display module is used for displaying and outputting the vertex-adjusting depth calculation result of the sampling calculation unit on a display screen. By the scheme, the testing process of the optical module top-adjusting depth can be simplified, and the accuracy and reliability of the measuring and calculating result can be guaranteed.)

1. A set-top depth testing device is characterized by at least comprising:

the photoelectric detection unit is used for converting the optical signal into an electric signal and filtering and shaping the electric signal to output a square wave voltage signal;

the sampling calculation unit converts the sampled high and low level signals into corresponding level values after sampling through the ADC interface, and the MCU calculates the set-top depth value D according to a formula (1):

D＝(V1-V0)/(V1+V0)；

in the formula, V1 denotes a high level signal level value, and V0 denotes a low level signal level value;

and the result display module is used for displaying and outputting the vertex-adjusting depth calculation result of the sampling calculation unit on a display screen.

2. The device of claim 1, wherein the tuning depth testing device further comprises a power supply unit for converting an alternating current power supply into electric energy required by the photoelectric detection unit, the sampling calculation unit and the result display unit.

3. The apparatus of claim 1, wherein the photo detection unit comprises a photo detection chip, a TIA conversion sampling circuit, a filter shaping circuit, and a square wave signal output.

4. A method for testing the set top depth is characterized by comprising the following steps:

collecting optical signals of an optical module, converting the optical signals into electric signals, and filtering and shaping the electric signals to output square wave voltage signals;

after sampling through an ADC (analog to digital converter) interface, converting high and low level signals obtained by sampling into corresponding level values, and calculating a set-top depth value D according to a formula (1):

D＝(V1-V0)/(V1+V0)；

in the formula, V1 denotes a high level signal level value, and V0 denotes a low level signal level value;

and displaying and outputting the top-adjusting depth calculation result of the sampling calculation unit on a display screen.

Technical Field

The invention relates to the field of optical communication, in particular to a device and a method for testing the top-adjusting depth.

Background

From the next half year of 2019, china movement starts to promote the use of MWDM optical modules with a top-adjusting function in the 5G fronthaul field and releases a series of application enterprises and industry standards, wherein for amplitude modulation modules, the specification of the top-adjusting depth is defined to be 3% -5%. At present, the test mode to the accent top degree of depth is comparatively loaded down with trivial details always, and the universal use has 2 kinds of modes: one is to test through a light probe and an oscilloscope, and then to perform manual calculation; and the other slave module receives an RSS I pin, flies, tests high and low levels by using an oscilloscope and then performs manual calculation. However, the vertex-adjusting depth test procedures in the two modes are relatively complicated.

Disclosure of Invention

In view of this, the embodiment of the invention provides a device and a method for testing a set-top depth, so as to solve the problem that the existing set-top depth testing methods are complicated.

In a first aspect of the embodiments of the present invention, there is provided a set-top depth testing apparatus, including:

the photoelectric detection unit is used for converting the optical signal into an electric signal and filtering and shaping the electric signal to output a square wave voltage signal;

the sampling calculation unit converts the sampled high and low level signals into corresponding level values after sampling through the ADC interface, and the MCU calculates the set-top depth value D according to a formula (1):

D＝(V1-V0)/(V1+V0)；

in the formula, V1 denotes a high level signal level value, and V0 denotes a low level signal level value;

and the result display module is used for displaying and outputting the vertex-adjusting depth calculation result of the sampling calculation unit on a display screen.

In a second aspect of the embodiments of the present invention, there is provided a method for testing a set-top depth, including:

collecting optical signals of an optical module, converting the optical signals into electric signals, and filtering and shaping the electric signals to output square wave voltage signals;

after sampling through an ADC (analog to digital converter) interface, converting high and low level signals obtained by sampling into corresponding level values, and calculating a set-top depth value D according to a formula (1):

D＝(V1-V0)/(V1+V0)；

in the formula, V1 denotes a high level signal level value, and V0 denotes a low level signal level value;

and displaying and outputting the top-adjusting depth calculation result of the sampling calculation unit on a display screen.

In the embodiment of the invention, the optical signal acquired by the optical module is converted into the electrical signal, the electrical signal is sampled and calculated to obtain the top-adjusting depth, and the top-adjusting depth is displayed, so that the automatic calculation and output of the top-adjusting depth are realized, the test process is greatly simplified, the measuring and calculating efficiency is improved, and the accuracy and the reliability of the calculation result can be ensured.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a vertex-adjusting depth testing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic flow chart of a method for testing a set-top depth according to an embodiment of the present invention.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons skilled in the art without any inventive work shall fall within the protection scope of the present invention, and the principle and features of the present invention shall be described below with reference to the accompanying drawings.

The terms "comprises" and "comprising," when used in this specification and claims, and in the accompanying drawings and figures, are intended to cover non-exclusive inclusions, such that a process, method or system, or apparatus that comprises a list of steps or elements is not limited to the listed steps or elements. In addition, "first" and "second" are used to distinguish different objects, and are not used to describe a specific order.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a vertex-adjusting depth testing apparatus according to an embodiment of the present invention, including:

the photoelectric detection unit 110 is configured to convert an optical signal into an electrical signal, and filter and shape the electrical signal to output a square wave voltage signal;

the light band detection unit is used for collecting light signals in the light module, converting the light signals into electric signals, filtering and shaping the electric signals, and outputting square wave voltage signals to the sampling calculation unit.

The photodetection unit 110 includes a photodetection chip, a TIA conversion sampling circuit, a filter shaping circuit, and a square wave signal output. The TIA conversion sampling circuit is a photoelectric conversion circuit in a TIA product and is used for converting a photoelectric sampling signal; the filter shaping circuit is used for carrying out filter shaping on the signal. After the optical signal is converted and filtered and shaped, the accuracy of the signal sampling signal can be improved, and noise interference is reduced. And outputting the square wave signal finally obtained by the photoelectric detection unit to a sampling calculation unit for carrying out the top-adjusting depth calculation.

The sampling calculation unit 120 converts the sampled high and low level signals into corresponding level values after sampling through the ADC interface, and the MCU calculates the set-top depth value D according to the formula (1):

D＝(V1-V0)/(V1+V0)；

in the formula, V1 denotes a high level signal level value, and V0 denotes a low level signal level value;

the square wave voltage signal is informed to an ADC (analog to digital converter) through the MCU for sampling by a sampling interface, then high-level and low-level digital signals are acquired and converted into a '1' signal level value V1 and a '0' signal level value V0, and then the set-top depth value is calculated according to a formula (1).

And the result display module 130 is configured to display and output the vertex-adjusting depth calculation result of the sampling calculation unit on a display screen.

And finally inputting the vertex-adjusting depth data obtained by calculation of the sampling calculation unit into a result display unit, and displaying and outputting the data in percentage through an LED display screen.

Furthermore, the device for testing the ceiling-adjusting depth further comprises a power supply unit which is used for converting an alternating current power supply into electric energy required by the photoelectric detection unit, the sampling calculation unit and the result display unit. Converting a 220V alternating current power supply into power supplies required by a PD detection unit, an MCU sampling calculation unit and a result display unit, and respectively providing stable electric energy for each functional unit;

it can be understood that, at present, no quick and effective method exists for the vertex-adjusting depth of the test module, the test mode is more complicated, and the result is not accurate enough. The device provided by the embodiment realizes a device for quickly and accurately testing the top-adjusting depth of the optical module with the top-adjusting function, and the device can be used for sampling and calculating the electrical signal and displaying the top-adjusting depth by converting the optical signal into the electrical signal, thereby greatly simplifying the testing process and ensuring the accuracy and reliability of the calculation result.

Fig. 2 is a schematic flow chart of a method for testing a set-top depth according to an embodiment of the present invention, where the method includes:

s201, collecting optical signals of an optical module, converting the optical signals into electric signals, and filtering and shaping the electric signals to output square wave voltage signals;

specifically, the optical signal is collected by the photoelectric detector, the signal is converted by the sampling conversion circuit, and then the signal is filtered and shaped by the filter shaping circuit, and finally the square wave voltage signal is output.

S202, after sampling through an ADC (analog to digital converter) interface, converting the sampled high-low level signals into corresponding level values, and calculating a set-top depth value D according to a formula (1):

D＝(V1-V0)/(V1+V0)；

in the formula, V1 denotes a high level signal level value, and V0 denotes a low level signal level value;

and S203, displaying and outputting the vertex-adjusting depth calculation result of the sampling calculation unit on a display screen.

Based on the method provided by the embodiment, the testing process of the topping depth of the topping light module with the topping light can be simplified, the testing efficiency is improved, and the accuracy of the result is guaranteed.

It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.