阅读说明：本技术 一种卫星承载与热管理一体化结构及制备方法 (Satellite bearing and thermal management integrated structure and preparation method ) 是由 许文军 刘龙权 陈俊铭 于 2021-07-06 设计创作，主要内容包括：本发明公开了一种卫星承载与热管理一体化结构及其制备方法,该结构包括：卫星保护层结构,所述卫星保护层结构包括外侧导热面和内侧导热面,且所述卫星保护层结构由金属层空心微点阵结构围合而成；其中,所述金属层空心微点阵结构由空心细管按微点阵结构排列而成,且所述空心细管内设有相变材料。本发明能使卫星的温度缓慢变化,使最高温和最低温差值缩小,从而能延长卫星的温度疲劳寿命；并且,通过金属层空心微点阵结构的高表面积,能增大相变材料的导热率,从而提高其传热性能,其散热效果好,散热效率高；同时,通过金属层空心微点阵结构特有的高比强度和高比刚度的性能,承载发射过程中和在轨运行时所受的力,并保持卫星的结构稳定。(The invention discloses a satellite bearing and heat management integrated structure and a preparation method thereof, wherein the structure comprises the following components: the satellite protective layer structure comprises an outer side heat conduction surface and an inner side heat conduction surface, and is formed by enclosing a metal layer hollow micro-lattice structure; the metal layer hollow micro-lattice structure is formed by arranging hollow thin tubes according to the micro-lattice structure, and phase-change materials are arranged in the hollow thin tubes. The invention can make the temperature of the satellite change slowly, and reduce the difference value between the highest temperature and the lowest temperature, thereby prolonging the temperature fatigue life of the satellite; moreover, the heat conductivity of the phase-change material can be increased through the high surface area of the metal layer hollow micro-lattice structure, so that the heat transfer performance of the phase-change material is improved, the heat dissipation effect is good, and the heat dissipation efficiency is high; meanwhile, the special high specific strength and high specific rigidity of the metal layer hollow micro-lattice structure can bear the force applied in the launching process and in the orbit operation, and the structural stability of the satellite can be kept.)

1. A satellite bears and thermal management integral structure which characterized in that includes:

the satellite protective layer structure (2) comprises an outer side heat conduction surface (1) and an inner side heat conduction surface (3), and the satellite protective layer structure (2) is formed by enclosing a metal layer hollow micro-lattice structure (4);

the metal layer hollow micro-lattice structure (4) is formed by arranging hollow tubules (42) according to a micro-lattice structure, and phase-change materials (41) are arranged in the hollow tubules (42).

2. The satellite bearing and thermal management integrated structure according to claim 1, wherein the hollow tubule (42) has a micron or submicron thickness, micron or millimeter diameter, and the hollow tubule (42) is made of metal, ceramic, carbon nanotube or graphene.

3. Satellite load-bearing and thermal management integrated structure according to claim 2, characterized in that said phase change material (41) is an inorganic or organic substance, said inorganic substance comprising crystalline hydrated salts, molten salts, gallium metals, metal alloys; the organic matter comprises paraffin, lactic acid, ester and polyhydric alcohol.

4. Satellite load bearing and thermal management integrated structure according to claim 1, characterized in that the satellite protection layer structure (2) is cylindrical, spherical or square in shape.

5. A method for manufacturing an integrated satellite load bearing and thermal management structure according to any one of claims 1 to 4, comprising the following steps:

s1, preparing a composite chemical plating solution;

s2, preparing a hollow micro-lattice material;

s3, carrying out copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice;

s4, sealing the hollow micro-lattice of the composite plating layer;

and S5, injecting a phase change material into the composite plating layer hollow micro lattice to form a metal layer hollow micro lattice structure.

6. The method for preparing a satellite bearing and heat management integrated structure according to claim 5, wherein in the step S1, preparing the composite electroless plating solution comprises:

s11, putting the graphene nanosheets with the diameters of 2 microns into the aqueous solution of the graphene container;

s12, sequentially adding sodium dodecyl sulfate, polyvinylpyrrolidone and deionized water in a mass ratio of 1:10: 10;

s13, dispersing the graphene nanosheets by an ultrasonic dispersion method to form a dispersed graphene solution;

and S14, mixing and stirring the alloy chemical plating solution and the dispersed graphene solution to obtain the uniform composite chemical plating solution.

7. The method of claim 6, wherein the step S2 of preparing the hollow micro lattice material comprises:

s21, designing a micro-lattice structure on a computer by using a computer aided design technology;

s22, manufacturing a micro-lattice matrix by using the chemical solubility of photosensitive resin and adopting a three-dimensional photocuring 3D printing method, and removing oil stains on the surface of the matrix;

s23, activating the surface of the microarray matrix by using a colloidal palladium solution at 40 ℃ for 10 minutes;

s25, placing the microarray matrix in NaOH solution with the concentration of 50g/L, exposing the microarray matrix for 10S at room temperature, and exposing palladium nanoparticles which can be used as a catalyst for chemical reduction reaction;

s26, immersing the microarray matrix in water for 3 minutes for preheating, wherein the temperature of the water is the same as that required by chemical plating;

s27, placing the preheated microarray substrate into the composite chemical plating solution for chemical plating for 90min, and washing with clean water after chemical plating;

s28, grinding part of external nodes of the cleaned microarray matrix, exposing the resin matrix, soaking the ground microarray matrix in a chemical solution consisting of 20g/L NaOH and 700ml/L ethanol, etching the internal resin matrix of the microarray matrix for 24 hours in a water bath environment at 60 ℃, and melting the resin in the etching solution;

and S29, washing the residual resin with clear water to obtain the hollow microarray material.

8. The method of claim 7, wherein the step S3 of copper electroplating the hollow microarray material to form a copper-coated composite hollow microarray comprises:

s31, immersing the hollow micro-lattice material in an electroplating copper solution at room temperature under the current of 3-5A for electroplating for 10 minutes;

s32, cleaning with clear water after electroplating, and then soaking for 1 minute by using an anti-oxidation liquid;

and S33, washing with clear water to obtain the hollow micro-lattice of the composite coating.

9. The method for preparing a satellite bearing and thermal management integrated structure according to claim 8, wherein in the step S4, the step of sealing the composite plated hollow micro-lattice comprises:

s41, mixing the glue of the two components of the AB glue together in a ratio of 1:1 before sealing by using the AB casting glue;

s42, sealing the gap of the hollow micro-lattice of the composite plating layer;

and S43, solidifying the AB casting adhesive for 6 hours at normal temperature.

10. The method of claim 9, wherein the step S5 of injecting a phase change material into the composite coated hollow microarray comprises:

s51, melting the phase-change material at least comprising paraffin and gallium in a water bath environment at 60 ℃, and placing the composite plating layer hollow microarray in the same temperature environment;

s52, sucking the melted phase-change material by using a needle tube;

and S52, injecting the phase-change material into the composite plating layer hollow micro-lattice with different sizes.

Technical Field

The invention relates to the technical field of satellite temperature management, in particular to a satellite bearing and heat management integrated structure and a preparation method thereof.

Background

Satellites face severe thermal protection problems, and satellites operating in outer space are subject to large periodic thermal radiation. In order to ensure the service life of the satellite and the normal operation of internal devices, a thermal protection method is required to be adopted to carry out thermal management on the satellite structure. With the increasing integration density and power of electronic components, the density of generated heat flow is also increasing, so that the heat dissipation and heat management of the electronic devices inside the satellite are very important.

Disclosure of Invention

Therefore, it is necessary to provide a satellite bearing and thermal management integrated structure and a use method thereof, which have good heat dissipation effect and high heat dissipation efficiency and can prevent performance failure caused by excessive temperature difference of the satellite, in order to solve the technical problems.

A satellite load-bearing and thermal management integrated structure, comprising:

the satellite protective layer structure comprises an outer side heat conduction surface and an inner side heat conduction surface, and is formed by enclosing a metal layer hollow micro-lattice structure;

the metal layer hollow micro-lattice structure is formed by arranging hollow thin tubes according to the micro-lattice structure, and phase-change materials are arranged in the hollow thin tubes.

In one embodiment, the hollow thin tube has a micron-sized or submicron-sized thickness and a micron-sized or millimeter-sized diameter, and is made of metal, ceramic, carbon nanotube or graphene.

In one embodiment, the phase change material is an inorganic substance or an organic substance, and the inorganic substance comprises a crystalline hydrated salt, a molten salt, gallium metal, a metal alloy; the organic matter comprises paraffin, lactic acid, ester and polyhydric alcohol.

In one embodiment, the satellite protective layer structure is cylindrical, spherical, or square in shape.

A preparation method of a satellite bearing and heat management integrated structure comprises the following steps:

s1, preparing a composite chemical plating solution;

s2, preparing a hollow micro-lattice material;

s3, carrying out copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice;

s4, sealing the hollow micro-lattice of the composite plating layer;

and S5, injecting a phase change material into the composite plating layer hollow micro lattice to form a metal layer hollow micro lattice structure.

In one embodiment, the step S1, preparing the composite electroless plating solution includes:

s11, putting the graphene nanosheets with the diameters of 2 microns into the aqueous solution of the graphene container;

s12, sequentially adding sodium dodecyl sulfate, polyvinylpyrrolidone and deionized water in a mass ratio of 1:10: 10;

s13, dispersing the graphene nanosheets by an ultrasonic dispersion method to form a dispersed graphene solution;

and S14, mixing and stirring the alloy chemical plating solution and the dispersed graphene solution to obtain the uniform composite chemical plating solution.

In one embodiment, the step S2, the preparing the hollow microarray material includes:

s21, designing a micro-lattice structure on a computer by using a computer aided design technology;

s22, manufacturing a micro-lattice matrix by using the chemical solubility of photosensitive resin and adopting a three-dimensional photocuring 3D printing method, and removing oil stains on the surface of the matrix;

s23, activating the surface of the microarray matrix by using a colloidal palladium solution at 40 ℃ for 10 minutes;

s25, placing the microarray matrix in NaOH solution with the concentration of 50g/L, exposing the microarray matrix for 10S at room temperature, and exposing palladium nanoparticles which can be used as a catalyst for chemical reduction reaction;

s26, immersing the microarray matrix in water for 3 minutes for preheating, wherein the temperature of the water is the same as that required by chemical plating;

s27, placing the preheated microarray substrate into the composite chemical plating solution for chemical plating for 90min, and washing with clean water after chemical plating;

s28, grinding part of external nodes of the cleaned microarray matrix, exposing the resin matrix, soaking the ground microarray matrix in a chemical solution consisting of 20g/L NaOH and 700ml/L ethanol, etching the internal resin matrix of the microarray matrix for 24 hours in a water bath environment at 60 ℃, and melting the resin in the etching solution;

and S29, washing the residual resin with clear water to obtain the hollow microarray material.

In one embodiment, in step S3, the step of performing copper electroplating on the hollow microarray material to form a copper-added composite coated hollow microarray includes:

s31, immersing the hollow micro-lattice material in an electroplating copper solution at room temperature under the current of 3-5A for electroplating for 10 minutes;

s32, cleaning with clear water after electroplating, and then soaking for 1 minute by using an anti-oxidation liquid;

and S33, washing with clear water to obtain the hollow micro-lattice of the composite coating.

In one embodiment, in step S4, the sealing the composite plating hollow microarray comprises:

s41, mixing the glue of the two components of the AB glue together in a ratio of 1:1 before sealing by using the AB casting glue;

s42, sealing the gap of the hollow micro-lattice of the composite plating layer;

and S43, solidifying the AB casting adhesive for 6 hours at normal temperature.

In one embodiment, the step S5, injecting the phase change material into the composite plating hollow microarray includes:

s51, melting the phase-change material at least comprising paraffin and gallium in a water bath environment at 60 ℃, and placing the composite plating layer hollow microarray in the same temperature environment;

s52, sucking the melted phase-change material by using a needle tube;

and S52, injecting the phase-change material into the composite plating layer hollow micro-lattice with different sizes.

According to the satellite bearing and heat management integrated structure and the preparation method thereof, the heat protection system is formed by the heat absorption and heat release functions of the phase-change material in the metal layer hollow micro-lattice structure, so that the temperature of the satellite is slowly changed, the difference value between the highest temperature and the lowest temperature is reduced, and the temperature fatigue life of the satellite can be prolonged; moreover, the heat conductivity of the phase-change material can be increased through the high surface area of the metal layer hollow micro-lattice structure, so that the heat transfer performance of the phase-change material is improved, the heat dissipation effect is good, and the heat dissipation efficiency is high; meanwhile, the special high specific strength and high specific rigidity of the metal layer hollow micro-lattice structure can bear the force applied in the launching process and in the orbit operation, and the structural stability of the satellite can be kept.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a satellite bearing and thermal management integrated structure according to a first embodiment of the present invention;

FIG. 2 is a schematic structural view of a metal layer hollow micro-lattice structure according to the present invention;

FIG. 3 is a schematic view of a partial structure of the hollow metal-layer microarray structure of the present invention;

fig. 4 is a schematic structural diagram of a satellite bearing and thermal management integrated structure according to a second embodiment of the present invention;

fig. 5 is a schematic structural diagram of a satellite bearing and thermal management integrated structure according to a third embodiment of the present invention;

fig. 6 is a schematic structural diagram of a satellite bearing and thermal management integrated structure according to a fourth embodiment of the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, an embodiment of the invention provides an integrated satellite bearing and thermal management structure, which includes a satellite protection layer structure 2.

The satellite protection layer structure 2 comprises an outer side heat conduction surface 1 and an inner side heat conduction surface 3, and the satellite protection layer structure 2 is enclosed by a metal layer hollow micro-lattice structure 4; the metal layer hollow micro-lattice structure 4 is formed by arranging hollow tubules 42 according to a micro-lattice structure, and phase-change materials 41 are arranged in the hollow tubules 42. The phase change material 41 has heat management functions of heat absorption, heat storage, heat release, and the like.

When the satellite protective layer structure 2 is subjected to external heat radiation, the outer heat conduction surface 1 conducts heat into the phase change material 41 through the hollow tubule 42 to absorb and store the heat. Thus, the main heat transfer forms are: the heat conduction of the tube wall of the hollow tubule 42, the heat radiation between the tube walls of the hollow tubule 42, the heat conduction of the phase change material 41, and the possible natural convection heat transfer phenomenon of the liquid phase change material 41. And because the satellite only often faces the heat radiation in one direction when in orbit operation, the heat accumulation is easily caused. Through the high heat conductivity of the metal layer hollow micro-lattice structure 4, heat is conducted from a high-temperature area to a low-temperature area, and the temperature gradient of the whole satellite is reduced.

In some cases, when the satellite protection layer structure 2 needs to dissipate heat to the outside due to high internal heat generation, the heat is absorbed by the inner side heat conduction surface 3, transferred to the phase change material 41 through the hollow tubules 42 to be absorbed and stored, and dissipated to the space through various heat transfer modes of the metal layer hollow micro-lattice structure 4. The main heat transfer forms are as follows: the heat conduction of the tube wall of the hollow thin tube 42, the heat radiation between the tube walls of the hollow thin tube 42, the heat radiation of the metal layer hollow micro-lattice structure 4 and the external environment, the heat conduction of the phase-change material 41 and the possible natural convection heat exchange phenomenon of the liquid phase-change material 41.

In summary, according to the satellite bearing and thermal management integrated structure and the preparation method thereof, the heat protection system is formed by the heat absorption and heat release functions of the phase-change material in the metal layer hollow micro-lattice structure, so that the temperature of the satellite changes slowly, the difference between the highest temperature and the lowest temperature is reduced, and the temperature fatigue life of the satellite can be prolonged; moreover, the heat conductivity of the phase-change material can be increased through the high surface area of the metal layer hollow micro-lattice structure, so that the heat transfer performance of the phase-change material is improved, the heat dissipation effect is good, and the heat dissipation efficiency is high; meanwhile, the special high specific strength and high specific rigidity of the metal layer hollow micro-lattice structure can bear the force applied in the launching process and in the orbit operation, and the structural stability of the satellite can be kept.

In an embodiment of the present invention, the hollow thin tube has a micron-sized or submicron-sized thickness and a micron-sized or millimeter-sized diameter, and the hollow thin tube is made of metal, ceramic, carbon nanotube, graphene, or the like.

Optionally, the phase change material 41 is an inorganic substance or an organic substance, and the inorganic substance includes a crystalline hydrated salt, a molten salt, gallium metal, a metal alloy, and the like; the organic matter includes paraffin, lactic acid, ester, polyol, etc.

Referring to fig. 4-6, in the second to fourth embodiments of the present invention, the satellite protection layer structure 2 may be cylindrical, spherical or square.

An embodiment of the invention provides a preparation method of a satellite bearing and heat management integrated structure, which comprises the following steps:

s1, preparing a composite chemical plating solution;

s2, preparing a hollow micro-lattice material;

s3, carrying out copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice;

s4, sealing the hollow micro-lattice of the composite plating layer;

and S5, injecting a phase change material into the composite plating layer hollow micro lattice to form a metal layer hollow micro lattice structure.

Specifically, in step S1 of the present invention, the preparing the composite electroless plating solution includes:

s11, putting the graphene nanosheets with the diameters of 2 microns into the aqueous solution of the graphene container;

s12, sequentially adding sodium dodecyl sulfate, polyvinylpyrrolidone and deionized water in a mass ratio of 1:10: 10;

s13, dispersing the graphene nanosheets by an ultrasonic dispersion method to form a dispersed graphene solution;

and S14, mixing and stirring the alloy chemical plating solution and the dispersed graphene solution to obtain the uniform composite chemical plating solution.

In an embodiment of the present invention, in step S2, the preparing the hollow microarray material includes:

s21, designing a micro-lattice structure on a computer by using a computer aided design technology; in this embodiment, the microarray structure includes, but is not limited to, octahedral unit cell, pyramidal unit cell structure, and the like.

S22, manufacturing a micro-lattice matrix by using the chemical solubility of photosensitive resin and adopting a three-dimensional photocuring 3D printing method, and removing oil stains on the surface of the matrix; in this embodiment, the detergent solution and the ultrasonic wave may be used together to remove the oil stain possibly existing on the surface of the microarray substrate.

S23, activating the surface of the microarray matrix by using a colloidal palladium solution at 40 ℃ for 10 minutes;

s25, placing the microarray matrix in NaOH solution with the concentration of 50g/L, exposing the microarray matrix for 10S at room temperature, and exposing palladium nanoparticles which can be used as a catalyst for chemical reduction reaction;

s26, immersing the microarray matrix in water for 3 minutes for preheating, wherein the temperature of the water (such as 90 ℃) is the same as the temperature required by chemical plating;

s27, placing the preheated microarray substrate into the composite chemical plating solution for chemical plating for 90min, and washing with clean water after chemical plating;

s28, grinding part of external nodes of the cleaned microarray matrix, exposing the resin matrix, soaking the ground microarray matrix in a chemical solution consisting of 20g/L NaOH and 700ml/L ethanol, etching the internal resin matrix of the microarray matrix for 24 hours in a water bath environment at 60 ℃, and melting the resin in the etching solution;

and S29, washing the residual resin with clear water to obtain the hollow microarray material.

In an embodiment of the present invention, in step S3, the step of performing copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice includes:

s31, immersing the hollow micro-lattice material in an electroplating copper solution at room temperature under the current of 3-5A for electroplating for 10 minutes; therefore, the heat-conducting property of the hollow micro-lattice material can be improved. Specifically, the anode is connected with the phosphor copper plate by a conductive metal wire, the cathode is connected with the metal hollow lattice by a metal wire, the distance between the electroplated sample and the anode plate is about 3-5 cm, and the electroplating material is stirred and turned over during electroplating, so that the electroplated layer is uniformly plated on the hollow micro lattice material.

S32, cleaning with clear water after electroplating, and then soaking for 1 minute by using an anti-oxidation liquid;

and S33, washing with clear water to obtain the hollow micro-lattice of the composite coating. In some embodiments, the hollow microarray material may also be subjected to a secondary electroless plating operation.

In an embodiment of the present invention, in step S4, the sealing the hollow composite coating micro-lattice includes:

s41, mixing the glue of the two components of the AB glue together in a ratio of 1:1 before sealing by using the AB casting glue;

s42, sealing the gap of the hollow micro-lattice of the composite plating layer;

and S43, solidifying the AB casting adhesive for 6 hours at normal temperature.

In an embodiment of the present invention, in step S5, injecting a phase change material into the composite plating layer hollow microarray includes:

s51, melting the phase-change material at least comprising paraffin and gallium in a water bath environment at 60 ℃, and placing the composite plating layer hollow microarray in the same temperature environment;

s52, sucking the melted phase-change material by using a needle tube;

and S52, injecting the phase-change material into the composite plating layer hollow micro-lattice with different sizes.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-described examples merely represent several embodiments of the present application and are not to be construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.