阅读说明：本技术 电路装置以及电力变换装置 (Circuit device and power conversion device ) 是由 藤井健太 熊谷隆 福田智仁 平塚乔士 青木浩一 于 2019-07-11 设计创作，主要内容包括：电路装置(105)具备内芯(10)、第1电路基板(15)、第2电路基板(16)、散热构件(60)、第1传热构件(50)和第2传热构件(51)。第1电路基板(15)包括将内芯(10)的至少一部分包围的第1线圈图形(20)。第2电路基板(16)包括将内芯(10)的至少一部分包围的第2线圈图形(21)。第1传热构件(50)与第1电路基板(15)和散热构件(60)呈面接触。第2传热构件(51)与第1电路基板(15)和第2电路基板(16)呈面接触。(A circuit device (105) is provided with an inner core (10), a 1 st circuit board (15), a 2 nd circuit board (16), a heat dissipation member (60), a 1 st heat transfer member (50), and a 2 nd heat transfer member (51). The 1 st circuit board (15) includes a 1 st coil pattern (20) surrounding at least a portion of the core (10). The 2 nd circuit substrate (16) includes a 2 nd coil pattern (21) surrounding at least a portion of the core (10). The 1 st heat transfer member (50) is in surface contact with the 1 st circuit board (15) and the heat dissipation member (60). The 2 nd heat transfer member (51) is in surface contact with the 1 st circuit board (15) and the 2 nd circuit board (16).)

1. A circuit device, comprising:

an inner core;

a 1 st circuit board, the 1 st circuit board including a 1 st substrate and a 1 st coil pattern, the 1 st coil pattern surrounding at least a portion of the core;

a 2 nd circuit board, the 2 nd circuit board including a 2 nd substrate and a 2 nd coil pattern, the 2 nd coil pattern surrounding at least a portion of the core;

a heat dissipating member supporting the core, the 1 st circuit board, and the 2 nd circuit board;

a 1 st heat transfer member disposed between the 1 st circuit board and the heat dissipating member, the 1 st heat transfer member being in surface contact with the 1 st circuit board and the heat dissipating member; and

and a 2 nd heat transfer member, the 2 nd heat transfer member being disposed between the 1 st circuit board and the 2 nd circuit board and being in surface contact with the 1 st circuit board and the 2 nd circuit board.

2. The circuit arrangement of claim 1,

the 1 st circuit board includes a 3 rd coil pattern surrounding at least a portion of the core,

the 3 rd coil pattern is separated from the 1 st coil pattern in a thickness direction of the 1 st substrate, and is electrically connected to the 1 st coil pattern through a 1 st via electrode.

3. The circuit arrangement of claim 1 or 2,

the 2 nd circuit board includes a 4 th coil pattern surrounding at least a portion of the core,

the 4 th coil pattern is separated from the 2 nd coil pattern in a thickness direction of the 2 nd substrate, and is electrically connected to the 2 nd coil pattern through a 2 nd via electrode.

4. The circuit arrangement of any of claims 1 to 3,

the 1 st circuit board includes a heat transfer through-hole penetrating the 1 st circuit board,

the heat transfer through hole is in contact with the 1 st heat transfer member and the 2 nd heat transfer member.

5. The circuit arrangement of any of claims 1 to 4,

the circuit device further comprises a No. 3 heat transfer member,

the heat dissipating member includes a surface facing the 1 st circuit board and a protruding portion protruding from the surface toward the 2 nd circuit board,

the 3 rd heat transfer member is disposed between the 2 nd circuit board and the protrusion, and is in surface contact with the 2 nd circuit board and the protrusion.

6. The circuit arrangement of any of claims 1 to 4,

the heat dissipating member includes a surface facing the 1 st circuit board and a protruding portion protruding from the surface toward the 2 nd circuit board,

the 2 nd heat transfer member is disposed between the 2 nd circuit board and the projecting portion, and is in surface contact with the 2 nd circuit board and the projecting portion,

the 1 st substrate is provided with a through hole,

a part of the core and the protrusion are inserted into the through hole.

7. The circuit arrangement of claim 6,

the protrusion overlaps with a part of the 2 nd coil pattern in a plan view of the surface.

8. The circuit arrangement of any of claims 1 to 7,

the 1 st heat generation amount in the 1 st circuit board is larger than the 2 nd heat generation amount in the 2 nd circuit board.

9. The circuit arrangement of any of claims 1 to 8,

the above-mentioned 2 nd heat transfer member is constituted by a plurality of heat transfer partial layers,

the above-mentioned plurality of heat transfer partial layers are laminated on each other,

the plurality of heat transfer partial layers have electrical insulation properties.

10. The circuit arrangement of any of claims 1 to 8,

the above-mentioned 2 nd heat transfer member includes the 1 st heat transfer partial layer, the 2 nd heat transfer partial layer and the 3 rd heat transfer partial layer,

the 1 st heat transfer partial layer, the 2 nd heat transfer partial layer, and the 3 rd heat transfer partial layer are laminated on each other,

the 1 st heat transfer partial layer has electrical insulation and is in surface contact with the 1 st circuit substrate,

the 2 nd heat transfer partial layer has an electrical insulating property and is in surface contact with the 2 nd circuit board,

the 3 rd heat transfer partial layer is disposed between the 1 st heat transfer partial layer and the 2 nd heat transfer partial layer, and has a higher thermal conductivity than the 1 st heat transfer partial layer and the 2 nd heat transfer partial layer.

11. The circuit arrangement of any of claims 1 to 10,

the 2 nd thickness of the 2 nd circuit board is larger than the 1 st thickness of the 1 st circuit board.

12. A power conversion device, comprising:

the circuit arrangement of any one of claims 1 to 11; and

and an inverter circuit for controlling the current flowing in the 1 st coil pattern.

13. The power conversion apparatus according to claim 12,

electronic components constituting the inverter circuit are mounted on at least one of the 1 st circuit board and the 2 nd circuit board.

14. The power conversion apparatus according to claim 13,

a control circuit for controlling the electronic component is mounted on at least one of the 1 st circuit board and the 2 nd circuit board,

at least one of the 1 st circuit board and the 2 nd circuit board includes a conductive pattern that electrically connects the control circuit and the electronic component.

Technical Field

The present invention relates to a circuit device and a power conversion device.

Background

Japanese patent laying-open No. 2017-41998 (patent document 1) discloses a power conversion device provided with a transformer. The transformer includes an inner core, a primary coil pattern and a secondary coil pattern. The 1 st substrate on which the primary coil pattern is formed and the 2 nd substrate on which the secondary coil pattern is formed are laminated with each other.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2017-41998

Disclosure of Invention

Problems to be solved by the invention

In the transformer and the power converter disclosed in patent document 1, the 1 st substrate on which the primary coil pattern is formed and the 1 st substrate on which the secondary coil pattern is formed are laminated with a space therebetween. Therefore, when the transformer and the power conversion device are operated by flowing a current to the primary coil pattern and the secondary coil pattern, heat generated in the primary coil pattern and the secondary coil pattern is less likely to be dissipated to the outside of the transformer and the power conversion device. The temperature of the transformer and the temperature of the power converter increase, and the power loss in the transformer and the power converter increases. The present invention has been made in view of the above problems, and an object thereof is to provide a circuit device and a power conversion device that can suppress a temperature rise and a power loss during operation.

Means for solving the problems

A circuit device of the present invention includes an inner core, a 1 st circuit board, a 2 nd circuit board, a heat dissipation member, a 1 st heat transfer member, and a 2 nd heat transfer member. The 1 st circuit substrate includes a 1 st substrate and a 1 st coil pattern. The 1 st coil pattern surrounds at least a portion of the inner core. The 2 nd circuit substrate includes a 2 nd substrate and a 2 nd coil pattern. The 2 nd coil pattern surrounds at least a portion of the inner core. The heat dissipation member supports the core, the 1 st circuit substrate, and the 2 nd circuit substrate. The 1 st heat transfer member is disposed between the 1 st circuit board and the heat dissipating member, and is in surface contact with the 1 st circuit board and the heat dissipating member. The 2 nd heat transfer member is disposed between the 1 st circuit board and the 2 nd circuit board, and is in surface contact with the 1 st circuit board and the 2 nd circuit board.

The power conversion device of the present invention includes the circuit device of the present invention and an inverter circuit for controlling a current flowing through the 1 st coil pattern.

ADVANTAGEOUS EFFECTS OF INVENTION

When a current is caused to flow through the 1 st coil pattern and the 2 nd coil pattern to operate the circuit device and the power conversion device, heat is generated in the 1 st coil pattern and the 2 nd coil pattern. The heat generated in the 1 st coil pattern is transferred to the heat dissipation member with relatively low thermal resistance via the 1 st heat transfer member. The heat generated in the 2 nd coil pattern is transferred to the heat dissipation member with relatively low thermal resistance via the 2 nd heat transfer member, the 1 st circuit substrate, and the 1 st heat transfer member. Therefore, temperature rise and power loss of the circuit device and the power conversion device can be suppressed when the circuit device and the power conversion device operate.

Drawings

Fig. 1 is a circuit diagram of a power conversion device according to embodiment 1.

Fig. 2 is a schematic perspective view of the circuit device according to embodiment 1.

Fig. 3 is a schematic exploded perspective view of the circuit device according to embodiment 1.

Fig. 4 is a schematic plan view of the circuit device according to embodiment 1.

Fig. 5 is a schematic cross-sectional view of the circuit device according to embodiment 1 taken along line V-V shown in fig. 4.

Fig. 6 is a schematic plan view of the circuit device according to embodiment 2.

Fig. 7 is a schematic cross-sectional view of the circuit device according to embodiment 2, taken along a section line VII-VII shown in fig. 6.

Fig. 8 is a schematic plan view of the 1 st circuit board (the 1 st electronic component is omitted) included in the circuit device according to embodiment 3.

Fig. 9 is a schematic bottom view of the 1 st circuit board included in the circuit device according to embodiment 3.

Fig. 10 is a schematic plan view of a 2 nd circuit board (2 nd electronic component omitted) included in the circuit device according to embodiment 3.

Fig. 11 is a schematic bottom view of the 2 nd circuit board included in the circuit device according to embodiment 3.

Fig. 12 is a schematic cross-sectional view of a circuit device according to embodiment 4.

Fig. 13 is a schematic plan view of the 1 st circuit board included in the circuit device according to embodiment 4.

Fig. 14 is a schematic plan view of the 2 nd circuit board included in the circuit device according to embodiment 4.

Fig. 15 is a schematic cross-sectional view of a circuit device according to embodiment 5.

Fig. 16 is a schematic cross-sectional view of a circuit device according to embodiment 6.

Fig. 17 is a schematic plan view of the 1 st circuit board included in the circuit device according to embodiment 6.

Fig. 18 is a schematic plan view of the 2 nd circuit board included in the circuit device according to embodiment 6.

Fig. 19 is a schematic cross-sectional view of a circuit device according to embodiment 7.

Fig. 20 is a schematic plan view of the 1 st circuit board included in the circuit device according to embodiment 7.

Fig. 21 is a schematic plan view of a 2 nd circuit board included in the circuit device according to embodiment 7.

Fig. 22 is a schematic cross-sectional view of a circuit device according to embodiment 8.

Fig. 23 is a schematic plan view of a circuit device according to embodiment 9.

Fig. 24 is a schematic cross-sectional view of the circuit device according to embodiment 9 taken along line XXIV-XXIV shown in fig. 23.

Fig. 25 is a schematic plan view of a circuit device according to embodiment 10.

Fig. 26 is a schematic cross-sectional view of the circuit device according to embodiment 10, taken along a section line XXVI-XXVI shown in fig. 25.

Fig. 27 is a schematic plan view of the 1 st circuit board included in the circuit device according to embodiment 11.

Detailed Description

The following describes embodiments of the present invention. The same components are denoted by the same reference numerals, and descriptions thereof are omitted.

Embodiment 1.

An example of the circuit configuration of the power converter 1 according to the present embodiment will be described with reference to fig. 1. The power conversion device 1 of the present embodiment is, for example, a DC-DC converter. The power conversion device 1 includes an inverter circuit 2, a transformer circuit 3, a rectifier circuit 4, a smoothing circuit 5 including a coil device 100, and a control circuit 6. The power conversion device 1 inputs a dc voltage V to the input terminal 110_iConversion to DC voltage V_oA DC voltage V is output from an output terminal 111_o。

The inverter circuit 2 includes switching elements 7a, 7b, 7c, 7 d. The switching elements 7a, 7b, 7c, and 7d are, for example, Metal Oxide Semiconductor Field Effect Transistors (MOSFETs), Insulated Gate Bipolar Transistors (IGBTs), or the like. The switching elements 7a, 7b, 7c, and 7d are each formed of a semiconductor material such as silicon (Si), silicon carbide (SiC), or gallium nitride (GaN).

The transformer circuit 3 includes a transformer 101. The transformer 101 includes a primary side coil conductor 120, an inner core 10 (see fig. 2 to 5), and a secondary side coil conductor 121. For example, the primary coil conductor 120 is a high-voltage coil conductor, and the secondary coil conductor 121 is a low-voltage coil conductor. The primary coil conductor 120 is connected to the inverter circuit 2. The secondary side coil conductor 121 is connected to the rectifier circuit 4. The secondary side coil conductor 121 is magnetically coupled to the primary side coil conductor 120 via the core 10.

The rectifier circuit 4 includes diodes 8a, 8b, 8c, and 8 d. The diodes 8a, 8b, 8c, and 8d are each formed of a semiconductor material such as Si, SiC, or GaN. The smoothing circuit 5 includes a capacitor 9a and a coil device 100 as a smoothing coil.

The power conversion device 1 includes a capacitor 9b and a coil device 102 as a smoothing coil in a stage preceding the inverter circuit 2. The power conversion device 1 includes a coil device 103 as a resonant coil between the inverter circuit 2 and the transformer circuit 3.

The power conversion device 1 receives a dc voltage V of, for example, 100V to 600V_i. The power conversion device 1 outputs a dc voltage V of 12V to 16V, for example_o. Specifically, the dc voltage V input to the input terminal 110_iConverted into the 1 st ac voltage by the inverter circuit 2. The 1 st AC voltage is converted into a 2 nd AC voltage lower than the 1 st AC voltage by a transformer circuit 3. The 2 nd ac voltage is rectified by the rectifier circuit 4. The smoothing circuit 5 smoothes the voltage output from the rectifying circuit 4. The power conversion device 1 converts the dc voltage V output from the smoothing circuit 5 into the dc voltage V_oIs output from the output terminal 111.

At least one of the input terminal 110, the output terminal 111, the switching elements 7a, 7b, 7c, and 7d, the diodes 8a, 8b, 8c, and 8d, and the capacitors 9a and 9b is mounted on, for example, a circuit board (the 1 st circuit board 15 and the 2 nd circuit board 16 (see fig. 2 to 5)). The circuit board is mounted on the heat dissipation member 60 (see fig. 2 to 5). The heat radiation member 60 is, for example, a housing of the power conversion device 1. Other electronic components may be mounted on the circuit board. The electronic components including the input terminal 110, the output terminal 111, the switching elements 7a, 7b, 7c, and 7d, the diodes 8a, 8b, 8c, and 8d, and at least one of the capacitors 9a and 9b may be mounted on the housing of the power conversion device 1.

The circuit device 105 according to the present embodiment is described with reference to fig. 2 to 5. The power conversion apparatus 1 includes a circuit apparatus 105. The power conversion device 1 may include any one of the circuit devices 105b to 105i according to embodiments 2 to 11 in place of the circuit device 105 according to embodiment 1. The circuit device 105 is, for example, a transformer 101 included in the power conversion device 1. The circuit device 105 may be any one of the coil devices 100, 102, and 103. The circuit device 105 includes the core 10, the 1 st circuit board 15, the 2 nd circuit board 16, the heat dissipation member 60, the 1 st heat transfer member 50, and the 2 nd heat transfer member 51.

The inner core 10 includes a magnetic material. The inner core 10 is, for example, a ferrite inner core such as manganese-zinc (Mn-Zn) type ferrite or nickel-zinc (Ni-Zn) type ferrite, an amorphous inner core, or an iron powder inner core. The inner core 10 includes, for example, a 1 st inner core portion 10a and a 2 nd inner core portion 10 b. For example, the inner core 10 is an EI type inner core, the 1 st inner core portion 10a has an I shape, and the 2 nd inner core portion 10b has an E shape. The 2 nd core portion 10b has a 1 st leg portion 11a, a 2 nd leg portion 11b, and a 3 rd leg portion 11 c. The 2 nd leg 11b is located between the 1 st leg 11a and the 3 rd leg 11 c. The 1 st core portion 10a is disposed in the recess 60b of the heat dissipation member 60. The 2 nd core portion 10b is overlapped on the 1 st core portion 10 a. The shape of the inner core 10 is not particularly limited, and the inner core 10 may be an EE-type core, a U-type core, a UU-type core, an EER-type core, or an ER-type core.

The 1 st circuit substrate 15 includes a 1 st substrate 30 and a 1 st coil pattern 20. The 1 st circuit board 15 is, for example, a printed board. The 1 st substrate 30 includes a 1 st main surface 30a facing the surface 60a of the heat dissipation member 60 and a 2 nd main surface 30b opposite to the 1 st main surface 30 a. The 1 st substrate 30 is made of an electrically insulating material and is an insulating substrate. The 1 st substrate 30 is made of, for example, glass fiber reinforced epoxy resin, phenol resin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), or the like. The 1 st substrate 30 may be made of alumina (Al)₂O₃) And aluminum nitride (AlN). The 1 st substrate 30 may be provided with a 1 st through hole 30h extending from the 1 st main surface 30a to the 2 nd main surface 30 b. The 2 nd leg portion 11b of the core 10 is inserted into the 1 st through hole 30 h. The 2 nd leg portion 11b of the core 10 penetrates the 1 st circuit substrate 15 (1 st substrate 30).

The 1 st coil pattern 20 corresponds to the primary coil conductor 120 (see fig. 1). The 1 st coil pattern 20 is provided on the 1 st main surface 30a, the 2 nd main surface 30b, or in the 1 st substrate 30. The 1 st circuit board 15 is, for example, a single-sided wiring board in which the 1 st coil pattern 20 is provided on the 1 st main surface 30a or the 2 nd main surface 30 b. The 1 st coil pattern 20 is composed of a material having a lower electrical resistivity and a higher thermal conductivity than the 1 st substrate 30. The 1 st coil pattern 20 is formed of a conductive material such as copper (Cu), silver (Ag), gold (Au), tin (Sn), a copper (Cu) alloy, a nickel (Ni) alloy, a gold (Au) alloy, a silver (Ag) alloy, or a tin (Sn) alloy. The 1 st coil pattern 20 is a thin conductor layer having a thickness of 1 μm or more and 5000 μm or less, for example.

The 1 st coil pattern 20 surrounds at least a portion of the inner core 10. The 1 st coil pattern 20 surrounds, for example, at least one of the 1 st leg portion 11a, the 2 nd leg portion 11b, and the 3 rd leg portion 11 c. Specifically, the 1 st coil pattern 20 surrounds the 2 nd leg portion 11b of the core 10, for example, through a space between the 1 st leg portion 11a and the 2 nd leg portion 11b and a space between the 2 nd leg portion 11b and the 3 rd leg portion 11 c. The 1 st coil pattern 20 surrounding at least a portion of the inner core 10 means that the 1 st coil pattern 20 is wound more than a half turn around at least a portion of the inner core 10. In the present specification, the coil pattern having one turn (number of turns) means that the coil pattern penetrates once the entire space surrounded by the 1 st inner core portion 10a and the 2 nd inner core portion 10b around the 2 nd leg portion 11 b. A portion of the 1 st coil pattern 20 may also be located between the 1 st inner core portion 10a and the 2 nd inner core portion 10 b.

As shown in fig. 2 to 4, the 1 st electronic component 40 constituting the inverter circuit 2 (see fig. 1) is mounted on at least one of the 1 st circuit board 15 and the 2 nd circuit board 16. Specifically, the 1 st electronic component 40 may be mounted on the 2 nd main surface 30b of the 1 st circuit board 15. The 1 st electronic component 40 is, for example, switching elements 7a, 7b, 7c, and 7d (see fig. 1). The 1 st electronic component 40 is electrically connected to the 1 st coil pattern 20.

The 2 nd circuit substrate 16 includes a 2 nd substrate 31 and a 2 nd coil pattern 21. The 2 nd circuit board 16 is, for example, a printed board. The 2 nd substrate 31 includes a 3 rd main surface 31a facing the 1 st circuit substrate 15 and a 4 th main surface 31b opposite to the 3 rd main surface 31 a. The 2 nd substrate 31 is composed ofThe insulating substrate is made of an electrically insulating material. The 2 nd substrate 31 is made of, for example, glass fiber reinforced epoxy resin, phenol resin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), or the like. The 2 nd substrate 31 may be made of alumina (Al)₂O₃) And aluminum nitride (AlN). The 2 nd substrate 31 may be provided with a 2 nd through hole 31h extending from the 3 rd main surface 31a to the 4 th main surface 31 b. The 2 nd leg portion 11b of the core 10 is inserted into the 2 nd through hole 31 h. The 2 nd leg portion 11b of the core 10 penetrates the 2 nd circuit substrate 16 (the 2 nd substrate 31).

The 2 nd coil pattern 21 corresponds to the secondary side coil conductor 121 (see fig. 1). The 2 nd coil pattern 21 is provided on the 3 rd main surface 31a, the 4 th main surface 31b, or in the 2 nd substrate 31. The 2 nd circuit board 16 is, for example, a single-sided wiring board in which the 2 nd coil pattern 21 is provided on the 3 rd main surface 31a or the 4 th main surface 31 b. The 2 nd coil pattern 21 is provided on a substrate different from the 1 st coil pattern 20. Thus, the 2 nd coil pattern 21 can be easily designed independently of the 1 st coil pattern 20 in terms of shape, thickness, number of turns, and the like. The 2 nd coil pattern 21 is composed of a material having a lower electrical resistivity and a higher thermal conductivity than the 2 nd substrate 31. The 2 nd coil pattern 21 is formed of a conductive material such as copper (Cu), silver (Ag), gold (Au), tin (Sn), a copper (Cu) alloy, a nickel (Ni) alloy, a gold (Au) alloy, a silver (Ag) alloy, or a tin (Sn) alloy.

The 2 nd coil pattern 21 is a thin conductor layer having a thickness of 1 μm or more and 5000 μm or less, for example. The thickness of the 2 nd coil pattern 21 may be different from the thickness of the 1 st coil pattern 20. For example, when the power conversion device 1 is a step-down DC/DC converter, the 1 st current flowing through the 1 st coil pattern 20 corresponding to the primary side coil conductor 120 is smaller than the 2 nd current flowing through the 2 nd coil pattern 21 corresponding to the secondary side coil conductor 121. Therefore, the thickness of the 1 st coil pattern 20 may be made smaller than the thickness of the 2 nd coil pattern 21.

The 2 nd coil pattern 21 surrounds at least a portion of the inner core 10. The 2 nd coil pattern 21 surrounds at least one of the 1 st leg 11a, the 2 nd leg 11b, and the 3 rd leg 11c, for example. Specifically, the 2 nd coil pattern 21 surrounds the 2 nd leg portion 11b of the core 10, for example, through a space between the 1 st leg portion 11a and the 2 nd leg portion 11b and a space between the 2 nd leg portion 11b and the 3 rd leg portion 11 c. The 2 nd coil pattern 21 surrounds at least a portion of the inner core 10 means that the 2 nd coil pattern 21 is wound around at least a portion of the inner core 10 by more than a half turn. A part of the 2 nd coil pattern 21 may also be located between the 1 st inner core portion 10a and the 2 nd inner core portion 10 b.

With respect to at least a part of the core 10 (e.g., the 2 nd leg portion 11b of the core 10), the 2 nd coil pattern 21 is wound in a different direction from the 1 st coil pattern 20. The 2 nd coil pattern 21 is magnetically coupled to the 1 st coil pattern 20 via the core 10. The 2 nd circuit board 16 covers at least a part of the 1 st circuit board 15, and mechanically protects the 1 st circuit board 15.

As shown in fig. 2 to 4, the 2 nd electronic components 41 and 42 constituting the rectifier circuit 4 (see fig. 1) are mounted on at least one of the 1 st circuit board 15 and the 2 nd circuit board 16. Specifically, the 2 nd electronic components 41 and 42 may be mounted on the 4 th main surface 31b of the 2 nd circuit board 16. The 2 nd electronic components 41 and 42 are, for example, diodes 8a, 8b, 8c, and 8d (see fig. 1). The 2 nd electronic components 41 and 42 are electrically connected to the 2 nd coil pattern 21.

The heat dissipation member 60 supports the core 10, the 1 st circuit substrate 15, and the 2 nd circuit substrate 16. The heat discharging member 60 also supports the 1 st heat transfer member 50 and the 2 nd heat transfer member 51. The heat dissipation member 60 has a surface 60a facing the 1 st circuit substrate 15. The recess 60b is provided on the surface 60a of the heat discharging member 60. A part (1 st core part 10a) of the inner core 10 is housed in the recess 60 b. The heat discharging member 60 is in surface contact with the core 10 (1 st core portion 10 a). When the circuit device 105 is operated by flowing a current to the 1 st coil pattern 20 and the 2 nd coil pattern 21, energy loss due to magnetic force loss occurs in the core 10, and the core 10 generates heat. The heat generated in the core 10 is transferred to the heat discharging member 60 with low thermal resistance. The temperature rise of the core 10 and the power loss in the core 10 during the operation of the circuit device 105 can be suppressed.

The core 10, the 1 st circuit board 15, and the 2 nd circuit board 16 may be fixed to the heat dissipation member 60 by a fixing member 70 (see fig. 25) such as a screw, or a rivet. The core 10, the 1 st circuit board 15, and the 2 nd circuit board 16 may be fixed to the heat dissipation member 60 by being pressed against the heat dissipation member 60 by a spring (not shown).

The heat radiation member 60 constitutes, for example, a part of a housing of the power conversion device 1 that houses the core 10, the 1 st circuit board 15, and the 2 nd circuit board 16. Therefore, the circuit device 105 (the transformer 101) can be mounted on the power conversion device 1 simply by fixing the core 10, the 1 st circuit board 15, the 2 nd circuit board 16, the 1 st heat transfer member 50, and the 2 nd heat transfer member 51 to the heat dissipation member 60. Since it is not necessary to assemble the circuit device 105 in advance before mounting the circuit device 105 on the power conversion device 1, the manufacturing cost of the power conversion device 1 can be reduced. Further, since a housing of the circuit device 105 itself is not required, the power converter 1 including the circuit device 105 can be downsized. The heat dissipation member 60 has a thermal conductivity of 0.1W/(mK) or more. The heat dissipation member 60 may have a thermal conductivity of 1.0W/(m · K) or more, and may have a thermal conductivity of 10.0W/(m · K) or more. The heat discharging member 60 may also be electrically grounded.

The heat radiation member 60 is formed of a metal material such as copper (Cu), aluminum (Al), iron (Fe), an iron (Fe) alloy such as SUS304, a copper (Cu) alloy such as phosphor bronze, or an aluminum (Al) alloy such as ADC 12. The heat dissipation member 60 may also be formed of a resin material containing a thermally conductive filler. Examples of the resin material used for the heat dissipating member 60 include polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), and polyether ether ketone (PEEK). The heat dissipation member 60 is formed of, for example, a nonmagnetic material. The heat dissipating member 60 is manufactured by a method such as cutting, die casting, forging, or molding using a die.

The 1 st heat transfer member 50 is disposed between the 1 st circuit board 15 and the heat dissipating member 60, and is in surface contact with the 1 st circuit board 15 and the heat dissipating member 60. The 1 st circuit substrate 15, the 1 st heat transfer member 50, and the heat dissipation member 60 are stacked on one another. The 1 st heat transfer member 50 thermally connects the 1 st circuit substrate 15 to the heat dissipation member 60 with relatively low thermal resistance. The 1 st heat transfer member 50 is a 1 st heat transfer sheet. The 1 st heat transfer member 50 may have electrical insulation. The 1 st heat transfer member 50 having electrical insulation may be in surface contact with the 1 st coil pattern 20. The 1 st heat transfer member 50 may also be in contact with the core 10.

The 1 st heat transfer member 50 may be made of a resin material such as silicone, urethane, epoxy, Acrylonitrile Butadiene Styrene (ABS), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), phenol, polyimide, or the like, a fiber material such as glass fiber or aramid fiber, or a ceramic material such as alumina or aluminum nitride. The 1 st heat transfer member 50 may also be a silicone rubber sheet or a urethane rubber sheet. The 1 st heat transfer member 50 may also be formed of silicone gel, silicone grease, or silicone adhesive.

The 1 st heat transfer member 50 has a higher thermal conductivity than the 1 st substrate 30 and the 2 nd substrate 31. The 1 st heat transfer member 50 has a thermal conductivity of 0.1W/(m.K) or more. The 1 st heat transfer member 50 may have a thermal conductivity of 1.0W/(m · K) or more, and may have a thermal conductivity of 10.0W/(m · K) or more. The 1 st heat transfer member 50 may also have elasticity. The 1 st heat transfer member 50 may be pressed and deformed by pressing the 1 st circuit board 15 against the heat dissipation member 60.

The 2 nd heat transfer member 51 is disposed between the 1 st circuit board 15 and the 2 nd circuit board 16, and is in surface contact with the 1 st circuit board 15 and the 2 nd circuit board 16. The 1 st circuit substrate 15, the 2 nd heat transfer member 51, and the 2 nd circuit substrate 16 are laminated on each other. The 2 nd heat transfer member 51 is a 2 nd heat transfer sheet. The 2 nd heat transfer member 51 thermally connects the 2 nd circuit substrate 16 to the 1 st circuit substrate 15 with relatively low thermal resistance. The 2 nd heat transfer member 51 may have electrical insulation. The 2 nd heat transfer member 51 having electrical insulation may be in surface contact with at least one of the 1 st coil pattern 20 and the 2 nd coil pattern 21. The 2 nd heat transfer member 51 may also be in contact with the core 10.

The 2 nd heat transfer member 51 may be made of a resin material such as silicone, urethane, epoxy, Acrylonitrile Butadiene Styrene (ABS), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), phenol, polyimide, or the like, a fiber material such as glass fiber or aramid fiber, or a ceramic material such as alumina or aluminum nitride. The 2 nd heat transfer member 51 may also be a silicone rubber sheet or a urethane rubber sheet. The 2 nd heat transfer member 51 may also be formed of silicone gel, silicone grease, or silicone adhesive. The 2 nd heat transfer member 51 may be formed of the same material as the 1 st heat transfer member 50 or may be formed of a material different from the 1 st heat transfer member 50.

The 2 nd heat transfer member 51 has a higher thermal conductivity than the 1 st substrate 30 and the 2 nd substrate 31. The 2 nd heat transfer member 51 may have either the same thermal conductivity as the 1 st heat transfer member 50 or a thermal conductivity different from that of the 1 st heat transfer member 50. The 2 nd heat transfer member 51 has a thermal conductivity of 0.1W/(m.K) or more. The 2 nd heat transfer member 51 may have a thermal conductivity of 1.0W/(m · K) or more, and may have a thermal conductivity of 10.0W/(m · K) or more. The 2 nd heat transfer member 51 may also have elasticity. The 2 nd heat transfer member 51 may be pressed and deformed by pressing the 2 nd circuit board 16 against the 1 st circuit board 15.

Effects of the circuit device 105 and the power conversion device 1 of the present embodiment will be described.

The circuit device 105 of the present embodiment includes the core 10, the 1 st circuit board 15, the 2 nd circuit board 16, the heat dissipation member 60, the 1 st heat transfer member 50, and the 2 nd heat transfer member 51. The 1 st circuit substrate 15 includes a 1 st substrate 30 and a 1 st coil pattern 20. The 1 st coil pattern 20 surrounds at least a portion of the inner core 10. The 2 nd circuit substrate 16 includes a 2 nd substrate 31 and a 2 nd coil pattern 21. The 2 nd coil pattern 21 surrounds at least a portion of the inner core 10. The heat dissipation member 60 supports the core 10, the 1 st circuit substrate 15, and the 2 nd circuit substrate 16. The 1 st heat transfer member 50 is disposed between the 1 st circuit board 15 and the heat dissipating member 60, and is in surface contact with the 1 st circuit board 15 and the heat dissipating member 60. The 2 nd heat transfer member 51 is disposed between the 1 st circuit board 15 and the 2 nd circuit board 16, and is in surface contact with the 1 st circuit board 15 and the 2 nd circuit board 16.

When the circuit device 105 is operated by flowing a current to the 1 st coil pattern 20 and the 2 nd coil pattern 21, heat is generated in the 1 st coil pattern 20 and the 2 nd coil pattern 21. The heat generated in the 1 st coil pattern 20 is transferred to the heat discharging member 60 with relatively low thermal resistance via the 1 st heat transfer member 50. The heat generated in the 2 nd coil pattern 21 is transferred to the heat dissipation member 60 with relatively low thermal resistance via the 2 nd heat transfer member 51, the 1 st circuit substrate 15, and the 1 st heat transfer member 50. Therefore, temperature rise and power loss of the circuit device 105 can be suppressed when the circuit device 105 operates.

Heat generated in the 1 st electronic component 40 during operation of the circuit device 105 is transferred to the heat dissipation member 60 at a relatively low thermal resistance via the 1 st circuit board 15 and the 1 st heat transfer member 50. Heat generated in the 2 nd electronic component 41 or 42 during operation of the circuit device 105 is transferred to the heat dissipating member 60 at a relatively low thermal resistance via the 2 nd circuit board 16, the 2 nd heat transfer member 51, the 1 st circuit board 15, and the 1 st heat transfer member 50. Therefore, temperature rise and power loss of the circuit device 105 can be suppressed when the circuit device 105 operates.

The power converter 1 of the present embodiment includes a circuit device 105 and an inverter circuit that controls a current flowing through the 1 st coil pattern 20. When the power conversion device 1 is operated by flowing a current to the 1 st coil pattern 20 and the 2 nd coil pattern 21, heat is generated in the 1 st coil pattern 20 and the 2 nd coil pattern 21. The heat generated in the 1 st coil pattern 20 is transferred to the heat discharging member 60 with relatively low thermal resistance via the 1 st heat transfer member 50. The heat generated in the 2 nd coil pattern 21 is transferred to the heat dissipation member 60 with relatively low thermal resistance via the 2 nd heat transfer member 51, the 1 st circuit substrate 15, and the 1 st heat transfer member 50. Therefore, temperature rise and power loss of the power conversion device 1 during operation of the power conversion device 1 can be suppressed.

Embodiment 2.

The circuit device 105b according to embodiment 2 is described with reference to fig. 6 and 7. The circuit device 105b of the present embodiment has the same configuration as the circuit device 105 of embodiment 1, but differs mainly in the following points.

In the circuit device 105b, the 1 st circuit substrate 15 includes the 3 rd coil pattern 22 surrounding at least a part of the core 10 (e.g., the 2 nd leg portion 11b of the core 10). The 3 rd coil pattern 22 is separated from the 1 st coil pattern 20 in the thickness direction of the 1 st substrate 30. The 3 rd coil pattern 22 is provided on the 1 st main surface 30a, the 2 nd main surface 30b, or in the 1 st substrate 30. The 1 st circuit board 15 is, for example, a double-sided wiring board in which the 1 st coil pattern 20 is provided on the 2 nd main surface 30b and the 3 rd coil pattern 22 is provided on the 1 st main surface 30 a. The 3 rd coil pattern 22 may have the same shape as the 1 st coil pattern 20 or a different shape from the 1 st coil pattern 20 in a plan view of the 2 nd main surface 30 b.

The 3 rd coil pattern 22 is electrically connected to the 1 st coil pattern 20 through the 1 st via electrode 27. The 1 st via electrode 27 extends in the thickness direction of the 1 st substrate 30. The 1 st via electrode 27 may extend from the 1 st main surface 30a to the 2 nd main surface 30 b. The 1 st via electrode 27 may be formed by filling a conductive material (e.g., a metal material) into a hole extending in the thickness direction of the 1 st substrate 30, or may be formed by depositing a conductive film (e.g., a metal film) on the surface of a hole extending in the thickness direction of the 1 st substrate 30.

In the circuit device 105b, the 2 nd circuit substrate 16 includes the 4 th coil pattern 23 surrounding at least a part of the inner core 10. The 4 th coil pattern 23 is separated from the 2 nd coil pattern 21 in the thickness direction of the 2 nd substrate 31. The 4 th coil pattern 23 is provided on the 3 rd main surface 31a, the 4 th main surface 31b, or in the 2 nd substrate 31. The 2 nd circuit board 16 is, for example, a double-sided wiring board in which the 2 nd coil pattern 21 is provided on the 4 th main surface 31b and the 4 th coil pattern 23 is provided on the 3 rd main surface 31 a. The 4 th coil pattern 23 may have the same shape as the 2 nd coil pattern 21 or a shape different from the 2 nd coil pattern 21 in a plan view of the 4 th main surface 31 b.

The 4 th coil pattern 23 is electrically connected to the 2 nd coil pattern 21 through the 2 nd via electrode 28. The 2 nd via electrode 28 extends in the thickness direction of the 2 nd substrate 31. The 2 nd via electrode 28 may extend from the 3 rd main surface 31a to the 4 th main surface 31 b. The 2 nd via electrode 28 may be formed by filling a conductive material (for example, a metal material) into a hole extending in the thickness direction of the 2 nd substrate 31, or may be formed by depositing a conductive film (for example, a metal film) on the surface of a hole extending in the thickness direction of the 2 nd substrate 31.

The 1 st heat transfer member 50 having electrical insulation may be in surface contact with the 3 rd coil pattern 22 and the heat dissipation member 60. The 2 nd heat transfer member 51 having an electrical insulation property may be in surface contact with the 1 st coil pattern 20 and the 4 th coil pattern 23.

The circuit device 105b may include at least one of the 3 rd coil pattern 22 and the 4 th coil pattern 23. The 1 st circuit board 15 may include 3 or more layers of coil patterns. The 2 nd circuit board 16 may include 3 or more layers of coil patterns. For example, the 1 st circuit board 15 may further include a coil pattern (not shown) inside the 1 st substrate 30. The 2 nd circuit board 16 may further include a coil pattern (not shown) inside the 2 nd substrate 31.

The circuit device 105b of the present embodiment exhibits the following effects similar to those of the circuit device 105 of embodiment 1.

In the circuit device 105b of the present embodiment, the 1 st circuit board 15 includes the 3 rd coil pattern 22 surrounding at least a part of the core 10. The 3 rd coil pattern 22 is separated from the 1 st coil pattern 20 in the thickness direction of the 1 st substrate 30, and is electrically connected to the 1 st coil pattern 20 through the 1 st via electrode 27.

When the circuit device 105b is operated by flowing a current to the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 3 rd coil pattern 22, heat is generated in the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 3 rd coil pattern 22. The heat generated in the 1 st coil pattern 20 and the 3 rd coil pattern 22 is transferred to the heat discharging member 60 with relatively low thermal resistance via the 1 st heat transfer member 50. The heat generated in the 2 nd coil pattern 21 is transferred to the heat dissipation member 60 with relatively low thermal resistance via the 2 nd heat transfer member 51, the 1 st circuit substrate 15, and the 1 st heat transfer member 50. Since the heat generated in the 1 st coil pattern 20 is transferred to the 3 rd coil pattern 22, overheating of the 1 st coil pattern 20 can be suppressed. Therefore, temperature rise and power loss of the circuit device 105b can be suppressed when the circuit device 105b operates.

In the circuit device 105b of the present embodiment, the 2 nd circuit board 16 includes the 4 th coil pattern 23 surrounding at least a part of the core 10. The 4 th coil pattern 23 is separated from the 2 nd coil pattern 21 in the thickness direction of the 2 nd substrate 31, and is electrically connected to the 2 nd coil pattern 21 through the 2 nd via electrode 28.

When the circuit device 105b is operated by flowing a current to the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 4 th coil pattern 23, heat is generated in the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 4 th coil pattern 23. The heat generated in the 1 st coil pattern 20 is transferred to the heat discharging member 60 with relatively low thermal resistance via the 1 st heat transfer member 50. The heat generated in the 2 nd coil pattern 21 and the 4 th coil pattern 23 is transferred to the heat dissipation member 60 with relatively low thermal resistance via the 2 nd heat transfer member 51, the 1 st circuit board 15, and the 1 st heat transfer member 50. Since the heat generated in the 2 nd coil pattern 21 is transferred to the 4 th coil pattern 23, overheating of the 2 nd coil pattern 21 can be suppressed. Therefore, temperature rise and power loss of the circuit device 105b can be suppressed when the circuit device 105b operates.

Embodiment 3.

A circuit device according to embodiment 3 will be described with reference to fig. 8 to 11. The circuit device of the present embodiment has the same configuration as the circuit device 105b of embodiment 2, but differs mainly in the following points.

In the present embodiment, the 1 st heat generation amount in the 1 st circuit board 15 is larger than the 2 nd heat generation amount in the 2 nd circuit board 16. In the present specification, the 1 st heat generation amount in the 1 st circuit board 15 refers to the amount of heat generated in all the coil patterns (for example, the 1 st coil pattern 20 and the 3 rd coil pattern 22) formed in the 1 st circuit board 15. The 2 nd heat generation amount in the 2 nd circuit board 16 is heat generated in all the coil patterns (for example, the 2 nd coil pattern 21 and the 4 th coil pattern 23) formed in the 2 nd circuit board 16. The 1 st to 4 th coil patterns 20 to 23 are designed so that the 1 st heat generation amount in the 1 st circuit substrate 15 is larger than the 2 nd heat generation amount in the 2 nd circuit substrate 16. The 1 st circuit board 15 is disposed at a position closer to the heat radiation member 60 and generates a larger amount of heat than the 2 nd circuit board 16. Therefore, the temperature rise of the circuit device of the present embodiment can be reduced.

The turn ratio of the primary coil conductor 120 and the secondary coil conductor 121 is determined according to the specifications of the circuit device and the power conversion device. From the turn ratio, a ratio between a voltage applied to the primary side coil conductor 120 and a voltage applied to the secondary side coil conductor 121, and a ratio between a current flowing in the primary side coil conductor 120 and a current flowing in the secondary side coil conductor 121 are determined. The shape and the number of layers of the coil patterns formed on the 1 st circuit board 15 and the 2 nd circuit board 16 are determined based on the turn ratio. That is, the length of the coil pattern formed on the 1 st circuit board 15 and the 2 nd circuit board 16 is determined according to the turn ratio. At least one of the width, thickness, and resistivity of the coil patterns formed on the 1 st circuit board 15 and the 2 nd circuit board 16 is determined so that the 1 st heat generation amount in the 1 st circuit board 15 is larger than the 2 nd heat generation amount in the 2 nd circuit board 16.

Next, a case where the primary coil conductor 120 is formed on the 1 st circuit board 15 and the secondary coil conductor 121 is formed on the 2 nd circuit board 16 will be examined. As shown in fig. 8 and 9, the 1 st coil pattern 20 and the 3 rd coil pattern 22 are respectively wound 7/8 turns around the 2 nd leg portion 11b of the core 10. The 1 st coil pattern 20 and the 3 rd coil pattern 22 are electrically connected in series to each other by the 1 st via electrode 27. The 1 st coil pattern 20 and the 3 rd coil pattern 22 are wound around the 2 nd leg portion 11b of the inner core 10 as a whole by two turns. That is, the primary side coil conductor 120 is one series conductor of two turns.

As shown in fig. 10 and 11, the 2 nd coil pattern 21 and the 4 th coil pattern 23 are wound around the 2 nd leg portion 11b of the core 10 by one turn. The 2 nd coil pattern 21 and the 4 th coil pattern 23 are electrically connected in parallel to each other by the 2 nd via electrode 28 and the 3 rd via electrode 28 a. That is, the secondary side coil conductor 121 is two parallel conductors of one turn. The turn ratio between the primary side coil conductor 120 and the secondary side coil conductor 121 is 2: 1.

When the 1 st voltage (V) applied to the primary side coil conductor 120 is set to V₁The 1 st current (A) flowing through the primary-side coil conductor 120 is represented by I₁The 1 st resistance value (Ω) of the primary coil conductor 120 is R₁The heat generation amount W of the primary coil conductor 120₁(W) is given by formula (1).

W₁＝I₁×V₁＝I₁ ²×R₁ (1)

When the 2 nd voltage (V) applied to the secondary side coil conductor 121 is set to V₂The 2 nd current (A) flowing in the secondary side coil conductor 121 is I₂R represents the 2 nd resistance value (omega) of the secondary side coil conductor 121₂The amount of heat W generated by the secondary side coil conductor 121₂(W) is represented by the formula (2)And (6) discharging.

W₂＝I₂×V₂＝I₂ ²×R₂ (2)

The 1 st coil pattern 20 has b₁Width of (m), L₁Length of (m), t₁Thickness of (m) and ρ₁(Ω · m) resistivity. The 2 nd coil pattern 21 has b₂Width of (m), L₂Length of (m), t₂Thickness of (m) and ρ₂(Ω · m) resistivity. The 3 rd coil pattern 22 has b₃Width of (m), L₃Length of (m), t₃Thickness of (m) and ρ₃(Ω · m) resistivity. The 4 th coil pattern 23 has b₄Width of (m), L₄Length of (m), t₄Thickness of (m) and ρ₄(Ω · m) resistivity. 1 st resistance value R of primary coil conductor 120₁Is given by formula (3). Second resistance value R of secondary side coil conductor 121₂Is given by (4).

[ numerical formula 1]

[ numerical formula 2]

Since the turn ratio between the primary side coil conductor 120 and the secondary side coil conductor 121 is 2:1, V₁:V₂2:1, and I₁:I₂1: 2. Here, at ρ₁～ρ₄Are equal to each other, b₁～b₄Are equal to each other, L₁～L₄Are equal to each other, t₁And t₃Are equal to each other, t₂And t₄When the amounts of heat generation W of the primary coil conductors 120 are equal to each other₁Heat generation amount W with respect to the secondary side coil conductor 121₂The ratio of (A) to (B) is given by the formula (5). So that W₁/W₂In a manner of being larger than 1, the thickness t of the 1 st coil pattern 20 is determined₁And 2 nd lineThickness t of the loop pattern 21₂。

W₁/W₂＝t₂/2t₁ (5)

In addition, even at t₁And t₃Are different from each other and t₂And t₄In different cases, W may be set₁/W₂In a manner of being larger than 1, the thickness t of the 1 st coil pattern 20 is determined₁Thickness t of the 2 nd coil pattern 21₂Thickness t of the 3 rd coil pattern 22₃And thickness t of the 4 th coil pattern 23₄. Further, the amount W of heat generated by the secondary side coil conductor 121₂A heat generation amount W larger than that of the primary side coil conductor 120₁In the case of (1), the secondary side coil conductor 121 is formed on the 1 st circuit board 15, and the primary side coil conductor 120 is formed on the 2 nd circuit board 16.

The 1 st circuit board 15 may include 3 or more layers of coil patterns. The 2 nd circuit board 16 may include 3 or more layers of coil patterns. For example, the 1 st circuit board 15 may further include a coil pattern (not shown) inside the 1 st substrate 30. The 2 nd circuit board 16 may further include a coil pattern (not shown) inside the 2 nd substrate 31.

Embodiment 4.

A circuit device 105c according to embodiment 4 will be described with reference to fig. 12 to 14. The circuit device 105c according to the present embodiment has the same configuration as the circuit device 105 according to embodiment 1, but differs mainly in the following points.

In the circuit device 105c, the 1 st circuit substrate 15 includes a heat transfer through-hole 29 penetrating the 1 st substrate 30. The heat transfer through holes 29 are in contact with the 1 st heat transfer member 50 and the 2 nd heat transfer member 51. The heat transfer through hole 29 extends in the thickness direction of the 1 st substrate 30 from the 3 rd main surface 31a to the 4 th main surface 31 b. The heat transfer through hole 29 may be formed by filling a hole extending from the 3 rd main surface 31a to the 4 th main surface 31b with a heat conductive material (for example, a metal material), or may be formed by depositing a heat conductive film (for example, a metal film) on the surface of a hole extending from the 3 rd main surface 31a to the 4 th main surface 31 b. The heat transfer through holes 29 have a higher thermal conductivity than the 1 st substrate 30.

The 1 st circuit board 15 may further include a 3 rd coil pattern 22 provided on the 1 st main surface 30 a. The 1 st circuit substrate 15 may further include a 1 st conductive pattern 26a provided on the 1 st main surface 30 a. The 1 st conductive pattern 26a is formed of the same material as the 3 rd coil pattern 22. The 1 st conductive pattern 26a may be electrically insulated from the coil patterns (e.g., the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 3 rd coil pattern 22).

The 1 st circuit substrate 15 may further include a 2 nd conductive pattern 26b provided on the 2 nd main surface 30 b. The 2 nd conductive pattern 26b is formed of the same material as the 1 st coil pattern 20. The 2 nd conductive pattern 26b may also be electrically insulated from the coil patterns (e.g., the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 3 rd coil pattern 22). The heat transfer through hole 29 may also be in contact with the 1 st conductive pattern 26a and the 2 nd conductive pattern 26 b. The heat transfer via 29 may also function as a 3 rd via electrode electrically connecting the 2 nd conductive pattern 26b and the 1 st conductive pattern 26 a.

The circuit device 105c of the present embodiment exhibits the following effects similar to those of the circuit device 105 of embodiment 1.

In the circuit device 105c of the present embodiment, the 1 st circuit board 15 includes the heat transfer through hole 29 penetrating the 1 st substrate 30. The heat transfer through holes 29 are in contact with the 1 st heat transfer member 50 and the 2 nd heat transfer member 51. When the circuit device 105c is operated by flowing a current to the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 3 rd coil pattern 22, heat is generated in the 1 st coil pattern 20, the 2 nd coil pattern 21, and the 3 rd coil pattern 22. The heat generated in the 1 st coil pattern 20 and the 3 rd coil pattern 22 is transferred to the heat discharging member 60 with relatively low thermal resistance via the 1 st heat transfer member 50. The heat generated in the 2 nd coil pattern 21 is transferred to the heat discharging member 60 with lower thermal resistance via the 2 nd heat transfer member 51, the heat transfer through-hole 29, and the 1 st heat transfer member 50. Therefore, the temperature rise and power loss of the circuit device 105c can be suppressed when the circuit device 105c operates.

Embodiment 5.

A circuit device 105d according to embodiment 5 is described with reference to fig. 15. The circuit device 105d of the present embodiment has the same configuration as the circuit device 105 of embodiment 1, but differs mainly in the following points.

The heat radiation member 60 includes a 1 st protruding portion 62 protruding from the surface 60a toward the 2 nd circuit substrate 16. The 1 st protruding part 62 may also be a member separate from the portion of the heat dissipation member 60 other than the 1 st protruding part 62. The 1 st protruding part 62 may be formed of a material different from the heat dissipation member 60.

The circuit device 105d further includes the 3 rd heat transfer member 52. The 3 rd heat transfer member 52 is disposed between the 2 nd circuit board 16 and the 1 st projecting portion 62, and is in surface contact with the 2 nd circuit board 16 and the 1 st projecting portion 62. The 2 nd circuit substrate 16, the 3 rd heat transfer member 52, and the 1 st protrusion 62 are laminated on each other. The 3 rd heat transfer member 52 thermally connects the 2 nd circuit substrate 16 with the 1 st protrusion 62. The 3 rd heat transfer member 52 is a 3 rd heat transfer sheet. The 3 rd heat transfer member 52 may have electrical insulation.

The 3 rd heat transfer member 52 may be made of a rubber material such as silicone or urethane, a resin material such as Acrylonitrile Butadiene Styrene (ABS), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), epoxy, phenol, or polyimide, or a ceramic material such as alumina or aluminum nitride. The 3 rd heat transfer member 52 may also be formed of silicone gel, silicone grease, or silicone adhesive.

The 3 rd heat transfer member 52 has a thermal conductivity of 0.1W/(m · K) or more. The 1 st heat transfer member 50 may have a thermal conductivity of 1.0W/(m · K) or more, and may have a thermal conductivity of 10.0W/(m · K) or more. The 3 rd heat transfer member 52 may also have elasticity. The 3 rd heat transfer member 52 may be pressed and deformed by pressing the 2 nd circuit substrate 16 against the heat dissipation member 60.

The circuit device 105d of the present embodiment exhibits the following effects in addition to the effects of the circuit device 105 of embodiment 1.

The circuit device 105d of the present embodiment further includes the 3 rd heat transfer member 52. The heat dissipation member 60 includes a surface 60a facing the 1 st circuit substrate 15 and a 1 st protruding portion 62 protruding from the surface 60a toward the 2 nd circuit substrate 16. The 3 rd heat transfer member 52 is disposed between the 2 nd circuit board 16 and the 1 st projecting portion 62, and is in surface contact with the 2 nd circuit board 16 and the 1 st projecting portion 62.

When a current is caused to flow in the 1 st coil pattern 20 and the 2 nd coil pattern 21 to operate the circuit device 105d, heat generated in the 2 nd coil pattern 21 is transmitted to the heat dissipation member 60 at a lower thermal resistance through the 1 st heat dissipation path including the 2 nd heat transfer member 51, the 1 st circuit board 15, and the 1 st heat transfer member 50, and the 2 nd heat dissipation path including the 3 rd heat transfer member 52. Therefore, temperature rise and power loss of the circuit device 105d can be suppressed when the circuit device 105d operates.

The 2 nd circuit substrate 16 is supported by the 1 st protruding portion 62 via the 3 rd heat transfer member 52. Thus, the 2 nd circuit board 16 can be suppressed from being deformed and mechanically damaged by vibration or impact applied to the circuit device 105 d.

Embodiment 6.

A circuit device 105e according to embodiment 6 is described with reference to fig. 16 to 18. The circuit device 105e according to the present embodiment has the same configuration as the circuit device 105 according to embodiment 1, but differs mainly in the following points.

The heat radiation member 60 includes a 1 st protruding portion 62 protruding from the surface 60a toward the 2 nd circuit substrate 16. The 1 st protruding part 62 may also be a member separate from the portion of the heat dissipation member 60 other than the 1 st protruding part 62. The 1 st projection 62 may also be composed of a different material from that of the heat dissipation member 60.

A part of the core 10 (for example, the 2 nd leg portion 11b of the core 10) and the 1 st protruding portion 62 are inserted in the 1 st through hole 30 h. A part of the core 10 (for example, the 2 nd leg portion 11b of the core 10) is inserted in the 2 nd through hole 31h, and the 1 st protrusion 62 is not inserted in the 2 nd through hole 31 h. The 1 st protruding portion 62 penetrates the 1 st circuit board 15 (1 st board 30) but does not penetrate the 2 nd circuit board 16 (1 st board 30).

The 2 nd heat transfer member 51 is disposed between the 2 nd circuit board 16 and the 1 st projecting portion 62, and is in surface contact with the 2 nd circuit board 16 and the 1 st projecting portion 62. The 2 nd circuit substrate 16, the 2 nd heat transfer member 51, and the 1 st protrusion 62 are laminated on each other. The 2 nd heat transfer member 51 thermally connects the 2 nd circuit substrate 16 and the 1 st protrusion 62. The 1 st protruding portion 62 may overlap a part of the 2 nd coil pattern 21 in a plan view of the surface 60a of the heat dissipation member 60.

The circuit device 105e according to the present embodiment exhibits the following effects in addition to the effects of the circuit device 105 according to embodiment 1.

In the circuit device 105e of the present embodiment, the heat dissipation member 60 includes a surface 60a facing the 1 st circuit substrate 15 and a 1 st protruding portion 62 protruding from the surface 60a toward the 2 nd circuit substrate 16. The 2 nd heat transfer member 51 is disposed between the 2 nd circuit board 16 and the 1 st projecting portion 62, and is in surface contact with the 2 nd circuit board 16 and the 1 st projecting portion 62. The 1 st substrate 30 is provided with a 1 st through hole 30 h. A part of the core 10 (the 2 nd leg portion 11b of the core 10) and the 1 st protruding portion 62 are inserted in the 1 st through hole 30 h.

When a current is caused to flow to the 1 st coil pattern 20 and the 2 nd coil pattern 21 to operate the circuit device 105e, heat generated in the 2 nd coil pattern 21 passes through the 1 st heat radiation path including the 2 nd heat transfer member 51, the 1 st circuit board 15, and the 1 st heat transfer member 50, and the 2 nd heat radiation path including the 2 nd heat transfer member 51 and the 1 st protrusion 62, and is transmitted to the heat radiation member 60 at a lower thermal resistance. Therefore, temperature rise and power loss of the circuit device 105e can be suppressed when the circuit device 105e operates.

The 2 nd circuit substrate 16 is supported by the 1 st protruding portion 62 via the 2 nd heat transfer member 51. Thus, the 2 nd circuit board 16 can be suppressed from being deformed and mechanically damaged by vibration or impact applied to the circuit device 105 e.

A part of the core 10 (the 2 nd leg portion 11b of the core 10) and the 1 st protruding portion 62 are inserted in the 1 st through hole 30 h. Thus, the 1 st circuit substrate 15 and the core 10 can be aligned with respect to the heat dissipation member 60. The 1 st circuit substrate 15 and the core 10 can be prevented from being displaced relative to the heat dissipation member 60 in a direction along the surface 60a of the heat dissipation member 60 due to vibration or impact applied to the circuit device 105 e.

In the circuit device 105e of the present embodiment, the 1 st protruding portion 62 may overlap a part of the 2 nd coil pattern 21 in a plan view of the surface 60a of the heat dissipating member 60. Therefore, when the circuit device 105e is operated by flowing a current to the 1 st coil pattern 20 and the 2 nd coil pattern 21, the heat generated in the 2 nd coil pattern 21 is transmitted to the heat radiation member 60 at a lower thermal resistance through the 2 nd heat radiation path including the 2 nd heat transfer member 51 and the 1 st protrusion 62. Temperature rise and power loss of the circuit device 105e can be suppressed when the circuit device 105e operates.

Embodiment 7.

A circuit device 105f according to embodiment 7 is described with reference to fig. 19 to 21. The circuit device 105f according to the present embodiment has the same configuration as the circuit device 105e according to embodiment 6, but differs mainly in the following points.

The heat dissipation member 60 further includes a 2 nd projecting portion 63 projecting from the surface 60a toward the 2 nd circuit substrate 16. The 2 nd protrusion 63 may be a member separate from the portion of the heat dissipation member 60 other than the 1 st protrusion 62 and the 2 nd protrusion 63. The 2 nd protrusion 63 may be formed of a material different from the portion of the heat discharging member 60.

A part of the core 10 (for example, the 2 nd leg 11b of the core 10) and the 2 nd protrusion 63 are inserted into the 1 st through hole 30 h. A part of the core 10 (for example, the 2 nd leg portion 11b of the core 10) is inserted in the 2 nd through hole 31h, and the 2 nd protrusion 63 is not inserted in the 2 nd through hole 31 h. The 2 nd projection 63 penetrates the 1 st circuit board 15 (the 1 st board 30), but does not penetrate the 2 nd circuit board 16 (the 2 nd board 31). A portion of the core 10 (e.g., the 2 nd leg 11b of the core 10) is disposed between the 1 st and 2 nd tabs 62, 63.

The 2 nd heat transfer member 51 is disposed between the 2 nd circuit board 16 and the 2 nd projecting portion 63, and is in surface contact with the 2 nd circuit board 16 and the 2 nd projecting portion 63. The 2 nd circuit substrate 16, the 2 nd heat transfer member 51, and the 2 nd protrusion 63 are laminated on each other. The 2 nd heat transfer member 51 thermally connects the 2 nd circuit substrate 16 and the 2 nd protrusion 63.

The circuit device 105f according to the present embodiment exhibits the following effects in addition to the effects of the circuit device 105e according to embodiment 6.

In the circuit device 105f of the present embodiment, the heat radiation member 60 further includes the 2 nd projecting portion 63 projecting from the surface 60a toward the 2 nd circuit board 16. The 2 nd heat transfer member 51 is disposed between the 2 nd circuit board 16 and the 2 nd projecting portion 63, and is in surface contact with the 2 nd circuit board 16 and the 2 nd projecting portion 63. The 1 st substrate 30 is provided with a 1 st through hole 30 h. A part of the core 10 (the 2 nd leg portion 11b of the core 10), the 1 st protruding portion 62, and the 2 nd protruding portion 63 are inserted in the 1 st through hole 30 h.

When a current is caused to flow through the 1 st coil pattern 20 and the 2 nd coil pattern 21 to operate the circuit device 105f, heat generated in the 2 nd coil pattern 21 passes through the 1 st heat dissipation path including the 2 nd heat transfer member 51, the 1 st circuit board 15, and the 1 st heat transfer member 50, the 2 nd heat dissipation path including the 2 nd heat transfer member 51 and the 1 st protrusion 62, and the 3 rd heat dissipation path including the 2 nd heat transfer member 51 and the 2 nd protrusion 63, and is transferred to the heat dissipation member 60 at a lower thermal resistance. Therefore, the temperature rise and power loss of the circuit device 105f can be suppressed when the circuit device 105f operates.

The 2 nd circuit board 16 is supported by the 1 st projecting portion 62 and the 2 nd projecting portion 63 via the 2 nd heat transfer member 51. Thus, the 2 nd circuit board 16 can be suppressed from being deformed and mechanically damaged by vibration or impact applied to the circuit device 105 f.

A part of the core 10 (the 2 nd leg portion 11b of the core 10), the 1 st protruding portion 62, and the 2 nd protruding portion 63 are inserted in the 1 st through hole 30 h. Thus, the 1 st circuit substrate 15 and the core 10 can be aligned with respect to the heat dissipation member 60. The 1 st circuit substrate 15 and the core 10 can be prevented from being displaced relative to the heat dissipation member 60 in a direction along the surface 60a of the heat dissipation member 60 due to vibration or impact applied to the circuit device 105 f.

Embodiment 8.

The circuit device 105g according to embodiment 8 is described with reference to fig. 22. The circuit device 105g of the present embodiment has the same configuration as the circuit device 105 of embodiment 1, but differs mainly in the following points.

In the circuit device 105g, the 2 nd heat transfer member 51 is constituted by a plurality of heat transfer partial layers (for example, the 1 st heat transfer partial layer 57 and the 2 nd heat transfer partial layer 58). A plurality of heat transfer partial layers are laminated to each other. For example, the 2 nd heat transfer member 51 is formed by laminating the 1 st heat transfer partial layer 57 and the 2 nd heat transfer partial layer 58. The 1 st heat transfer partial layer 57 is in surface contact with the 1 st circuit substrate 15. The 2 nd heat transfer partial layer 58 is in surface contact with the 2 nd circuit substrate 16. The plurality of heat transfer partial layers (for example, the 1 st heat transfer partial layer 57 and the 2 nd heat transfer partial layer 58) have electrical insulation properties. The plurality of heat transfer partial layers may have the same thickness as each other or different thicknesses from each other. The plurality of heat transfer partial layers may be made of the same material as each other or may be made of different materials from each other.

The 2 nd coil pattern 21 is provided on the 3 rd main surface 31 a. The 2 nd heat transfer member 51 having an electrical insulation property is in surface contact with the 1 st coil pattern 20 and the 2 nd coil pattern 21.

The circuit device 105g according to the present embodiment exhibits the following effects in addition to the effects of the circuit device 105 according to embodiment 1. In the circuit device 105g of the present embodiment, the 2 nd heat transfer member 51 is composed of a plurality of heat transfer partial layers. A plurality of heat transfer partial layers are laminated to each other. The plurality of heat transfer partial layers have electrical insulation properties, respectively. Therefore, even if a part of the plurality of heat transfer partial layers includes voids and dielectric breakdown occurs in the part of the plurality of heat transfer partial layers when the circuit device 105g operates, the remaining layers of the plurality of heat transfer partial layers can ensure electrical insulation between the 1 st coil pattern 20 and the 2 nd coil pattern 21. When the circuit device 105g operates, it is possible to suppress the occurrence of discharge (for example, partial discharge or corona discharge) between the 1 st coil pattern 20 and the 2 nd coil pattern 21 due to the air gap. The 2 nd coil pattern 21 can be more reliably electrically insulated from the 1 st coil pattern 20.

Embodiment 9.

The circuit device 105h according to embodiment 9 is described with reference to fig. 23 and 24. The circuit device 105h according to the present embodiment has the same configuration as the circuit device 105g according to embodiment 8, and exhibits the same effects as the circuit device 105g according to embodiment 8, but differs mainly in the following points.

In the circuit device 105h of the present embodiment, the 2 nd heat transfer member 51 includes the 1 st heat transfer partial layer 57, the 2 nd heat transfer partial layer 58, and the 3 rd heat transfer partial layer 59. The 1 st heat transfer partial layer 57, the 2 nd heat transfer partial layer 58, and the 3 rd heat transfer partial layer 59 are laminated on one another. The 1 st heat transfer partial layer 57 is electrically insulating and in surface contact with the 1 st circuit board 15. The 2 nd heat transfer partial layer 58 is electrically insulating and in surface contact with the 2 nd circuit board 16. The 3 rd heat transfer partial layer 59 is disposed between the 1 st heat transfer partial layer 57 and the 2 nd heat transfer partial layer 58. The 3 rd heat transfer partial layer 59 has a higher thermal conductivity than the 1 st heat transfer partial layer 57 and the 2 nd heat transfer partial layer 58. The 3 rd heat transfer partial layer 59 has a thermal conductivity of, for example, 10.0W/(m · K) or more.

The 3 rd heat transfer partial layer 59 may have electrical conductivity or electrical insulation. The 3 rd heat transfer partial layer 59 is formed of a metal material such as copper (Cu), silver (Ag), gold (Au), tin (Sn), iron (Fe), a copper (Cu) alloy, a nickel (Ni) alloy, a gold (Au) alloy, a silver (Ag) alloy, a tin (Sn) alloy, or an iron (Fe) alloy. The 3 rd heat transfer partial layer 59 may be formed of a non-metallic material such as graphite or ceramic. The 3 rd heat transfer partial layer 59 is electrically insulated from the 1 st coil pattern 20 by the 1 st heat transfer partial layer 57. The 3 rd heat transfer partial layer 59 is electrically insulated from the 2 nd coil pattern 21 by the 2 nd heat transfer partial layer 58. The 3 rd heat transfer partial layer 59 is not magnetically coupled to the 1 st coil pattern 20 and the 2 nd coil pattern 21. Therefore, the 3 rd heat transfer partial layer 59 does not generate heat when the circuit device 105h operates.

The effect of the circuit device 105h according to the present embodiment will be described. The circuit device 105h of the present embodiment exhibits the following effects in addition to the effects of the circuit device 105g of embodiment 8.

In the circuit device 105h of the present embodiment, the 2 nd heat transfer member 51 includes the 1 st heat transfer partial layer 57, the 2 nd heat transfer partial layer 58, and the 3 rd heat transfer partial layer 59. The 1 st heat transfer partial layer 57, the 2 nd heat transfer partial layer 58, and the 3 rd heat transfer partial layer 59 are laminated on one another. The 1 st heat transfer partial layer 57 is electrically insulating and in surface contact with the 1 st circuit board 15. The 2 nd heat transfer partial layer 58 is electrically insulating and in surface contact with the 2 nd circuit board 16. The 3 rd heat transfer partial layer 59 is disposed between the 1 st heat transfer partial layer 57 and the 2 nd heat transfer partial layer 58, and has a higher thermal conductivity than the 1 st heat transfer partial layer 57 and the 2 nd heat transfer partial layer 58. Thus, the 3 rd heat transfer partial layer 59 diffuses the heat generated in the 1 st coil pattern 20 and the 2 nd coil pattern 21 in the direction in which the 3 rd heat transfer partial layer 59 extends (the direction along the surface 60a of the heat dissipation member 60). When the circuit device 105h is operated, the circuit device 105h can be prevented from being locally overheated. Temperature rise and power loss of the circuit device 105h can be suppressed when the circuit device 105h operates.

Embodiment 10.

A circuit device 105i according to embodiment 10 will be described with reference to fig. 25 and 26. The circuit device 105i of the present embodiment has the same configuration as the circuit device 105 of embodiment 1, but differs mainly in the following points.

In the circuit device 105i, the 2 nd thickness d of the 2 nd circuit board 16₂Greater than the 1 st thickness d of the 1 st circuit substrate 15₁. When the 1 st coil pattern 20 is formed on the 1 st main surface 30a or the 2 nd main surface 30b in the 1 st circuit board 15, the 1 st thickness d of the 1 st circuit board 15₁Is defined as the sum of the thickness of the 1 st substrate 30 and the thickness of the 1 st coil pattern 20. In the case that the 1 st coil pattern 20 is formed on the 1 st substrate 30 in the 1 st circuit substrate 15, the 1 st thickness d of the 1 st circuit substrate 15₁Is defined as the thickness of the 1 st substrate 30.

When the 2 nd coil pattern 21 is formed on the 3 rd main surface 31a or the 4 th main surface 31b in the 2 nd circuit board 16, the 2 nd thickness d of the 2 nd circuit board 16₂Is defined as the sum of the thickness of the 2 nd substrate 31 and the thickness of the 2 nd coil pattern 21. When the 2 nd coil pattern 21 is formed on the 2 nd substrate 31 in the 2 nd circuit substrate 16, the 2 nd thickness d of the 2 nd circuit substrate 16₂Is defined as the thickness of the 2 nd substrate 31. The 1 st circuit board 15 and the 2 nd circuit board 16 are fixed to the heat dissipation member 60 using a fixing member 70 such as a screw, or a rivet.

The circuit device 105i of the present embodiment exhibits the following effects in addition to the effects of the circuit device 105 of embodiment 1. In the circuit device 105i of the embodiment, the 2 nd thickness d of the 2 nd circuit board 16₂Greater than the 1 st thickness d of the 1 st circuit substrate 15₁. Therefore, the 2 nd circuit board 16 has a rigidity higher than that of the 1 st circuit board 15. The circuit device 105i can be prevented from being mechanically damaged due to vibration or impact applied to the circuit device 105 i.

Embodiment 11.

A circuit device and a power conversion device according to embodiment 11 will be described with reference to fig. 27. The circuit device and the power conversion device of the present embodiment have the same configurations as the circuit device 105 and the power conversion device 1 of embodiment 1, but mainly differ in the following respects.

In the circuit device and the power converter of the present embodiment, the control circuit 6 that controls the 1 st electronic components 40 and 43 constituting the inverter circuit 2 (see fig. 1) is disposed on at least one of the 1 st circuit board 15 and the 2 nd circuit board 16. For example, the control circuit 6 is disposed on the 1 st circuit board 15 (specifically, the 2 nd main surface 30 b).

At least one of the 1 st circuit substrate 15 and the 2 nd circuit substrate 16 includes a 3 rd conductive pattern 25. The 3 rd conductive pattern 25 electrically connects the control circuit 6 to the 1 st electronic component 40, 43, and for example, the 1 st circuit board 15 includes the 3 rd conductive pattern 25 provided on the 1 st substrate 30 (specifically, the 2 nd main surface 30 b). The current flowing in the 3 rd conductive pattern 25 is smaller than the current flowing in the 1 st coil pattern 20 and the 2 nd coil pattern 21. Thus, the thickness of the 3 rd conductive pattern 25 may also be less than the thickness of the 1 st coil pattern 20. The thickness of the 3 rd conductive pattern 25 may also be less than the thickness of the 2 nd coil pattern 21.

The circuit device and the power converter according to the present embodiment exhibit the following effects in addition to the effects of embodiment 1. In the circuit device and the power conversion device 1 of the present embodiment, the control circuit 6 that controls the 1 st electronic component 40, 43 is mounted on at least one of the 1 st circuit board 15 and the 2 nd circuit board 16. At least one of the 1 st circuit substrate 15 and the 2 nd circuit substrate 16 includes a 3 rd conductive pattern 25. The 3 rd conductive pattern 25 electrically connects the control circuit 6 to the 1 st electronic components 40, 43.

Thus, cables and connectors for electrically connecting the control circuit 6 and the 1 st electronic components 40 and 43 are omitted, and the circuit device and the power conversion device can be downsized. Further, since the length of the 3 rd conductive pattern 25 connecting the control circuit 6 and the 1 st electronic components 40 and 43 can be shortened, the influence of electromagnetic interference on the 1 st electronic components 40 and 43 can be reduced.

The embodiments 1 to 11 disclosed herein are considered to be illustrative in all respects and not restrictive. At least 2 of embodiments 1 to 11 disclosed herein may be combined as long as there is no contradiction. For example, the power conversion device 1 includes any one of the circuit devices 105, 105b, 105c, 105d, 105e, 105f, 105g, 105h, and 105i according to embodiments 1 to 11. The scope of the present invention is defined by the claims rather than the above description, and is intended to include all modifications equivalent in meaning and scope to the claims.

Description of reference numerals

1a power conversion device; 2 an inverter circuit; 3 a transformer circuit; 4 a rectifying circuit; 5 a smoothing circuit; 6a control circuit; 7a, 7b, 7c, 7d switching elements; 8a, 8b, 8c, 8d diodes; 9a, 9b capacitors; 10 an inner core; 10a 1 st inner core portion; 10b a 2 nd inner core portion; 11a, 1 st leg; 11b, 2 nd leg; 11c, leg 3; 15 the 1 st circuit board; 16 nd circuit substrate 2; 20 the 1 st coil pattern; 21 nd coil pattern 2; 22 a 3 rd coil pattern; 23 th coil pattern; 25 a 3 rd conductive pattern; 26a the 1 st conductive pattern; 26b a 2 nd conductive pattern; 27 a 1 st via electrode; 28a 2 nd via electrode; 28a 3 rd via electrode; 29 heat transfer through holes; 30, a 1 st substrate; 30a 1 st major surface; 30b a 2 nd main surface; 30h the 1 st through hole; 31a 2 nd substrate; 31a 3 rd main surface; 31b a 4 th main surface; 31h No. 2 through hole; 40. 43 the 1 st electronic component; 41. 42 a 2 nd electronic component; 50 the 1 st heat transfer member; 51 a 2 nd heat transfer member; 52 a 3 rd heat transfer member; 57 a 1 st heat transfer partial layer; 58 a 2 nd heat transfer partial layer; 59 a 3 rd heat transfer partial layer; 60a heat dissipating member; 60a surface; 60b a recess; 62, 1 st projection; 63 a 2 nd projection; 70 a fixing member; 100. 102, 103 coil arrangements; 101 a transformer; 105. 105b, 105c, 105d, 105e, 105f, 105g, 105h, 105i circuit means; 110 input terminals; 111 an output terminal; 120 a primary side coil conductor; 121 secondary side coil conductors.