阅读说明：本技术 一种陶瓷基板材料及其制备方法和应用 (Ceramic substrate material and preparation method and application thereof ) 是由 卢儒 朱凉伟 刘广林 于 2020-12-14 设计创作，主要内容包括：本发明涉及一种陶瓷基板材料及其制备方法和应用,所述陶瓷基板材料按照重量百分比包括如下组分：陶瓷粉65-95％、MQ硅树脂-硅橡胶的嵌段共聚物3-30％和添加剂1-10％。所述陶瓷基板材料兼具高硬度和高韧性的特点,且既耐高温又耐低温,能用于制作大面积的电路板。(The invention relates to a ceramic substrate material and a preparation method and application thereof, wherein the ceramic substrate material comprises the following components in percentage by weight: 65-95% of ceramic powder, 3-30% of MQ silicon resin-silicon rubber block copolymer and 1-10% of additive. The ceramic substrate material has the characteristics of high hardness and high toughness, is high-temperature resistant and low-temperature resistant, and can be used for manufacturing large-area circuit boards.)

1. The ceramic substrate material is characterized by comprising the following components in percentage by weight: 65-95% of ceramic powder, 3-30% of MQ silicon resin-silicon rubber block copolymer and 1-10% of additive.

2. The ceramic substrate material of claim 1, wherein the weight percentage of the MQ silicone-silicone rubber block copolymer in the ceramic substrate material is 3-10%;

preferably, the number average molecular weight of the MQ silicone resin-silicone rubber block copolymer is 10000-50000 g/mol.

3. The ceramic substrate material according to claim 1 or 2, wherein the MQ silicone segment in the MQ silicone resin-silicone rubber block copolymer comprises a methyl MQ silicone resin segment and/or a phenyl MQ silicone resin segment;

preferably, the molar ratio of M units to Q units in the MQ silicone segment is 0.6-1.0;

preferably, the number average molecular weight of the MQ silicon resin chain segment is 2000-6000 g/mol;

preferably, the silicone rubber segment in the MQ silicone resin-silicone rubber block copolymer comprises a hydroxyl terminated polydimethylsiloxane;

preferably, the number average molecular weight of the silicone rubber segment is 5000-.

4. The ceramic substrate material according to any one of claims 1-3, wherein the additive comprises a high temperature resistant agent and/or a curing agent;

preferably, the high temperature resistant agent comprises a metal compound;

preferably, the metal compound comprises beryllium oxide and/or aluminum nitride;

preferably, the beryllium oxide is 1-5%, preferably 1-3% by weight of the ceramic substrate material;

preferably, the weight percentage of the aluminum nitride in the ceramic substrate material is 1-5%, preferably 1-3%;

preferably, the curing agent comprises dibenzoyl peroxide and/or 2, 4-dichlorobenzoyl peroxide;

preferably, the curing agent is present in the ceramic substrate material in an amount of 0.5 to 2% by weight.

5. A method of preparing a ceramic substrate material according to any one of claims 1-4, comprising the steps of:

(1) mixing ceramic powder and an additive for the first time to obtain a mixed powder material;

(2) adding the MQ silicon resin-silicon rubber block copolymer solution into the mixed powder material, mixing for the second time, drying, and pressing for molding;

(3) and (3) curing the sample obtained in the step (2) to obtain the ceramic substrate material.

6. The method according to claim 5, wherein the step (1) further comprises adding a solvent to perform a first mixing with the ceramic powder and the additive;

preferably, the solvent comprises water;

preferably, the addition amount of the solvent accounts for 5-20% of the weight of the ceramic powder;

preferably, the first mixing comprises first ball milling;

preferably, the time for the first ball milling mixing is 3-8 h;

preferably, the first mixing is followed by drying and screening;

preferably, the aperture of the screen is 200-400 meshes, preferably 300 meshes;

preferably, the step (1) specifically comprises: and carrying out primary ball milling and mixing on the ceramic powder, the additive and the solvent for 3-8h, drying, and screening to obtain a mixed powder material.

7. The preparation process according to claim 5 or 6, wherein in step (2), the solvent in the MQ silicone resin-silicone rubber block copolymer solution comprises toluene;

preferably, the mass concentration of the MQ silicone resin-silicone rubber block copolymer solution is 10-30%;

preferably, the second mixing comprises a second ball milling mixing;

preferably, the time for the second ball milling and mixing is 3-8 h;

preferably, the temperature of the press forming is 60-90 ℃.

8. The method according to any one of claims 5 to 7, wherein in step (3), the curing temperature is 120-200 ℃;

preferably, the curing time is 0.5 to 2 hours.

9. The method according to any one of claims 5 to 8, characterized by comprising the steps of:

(1) ball-milling and mixing the ceramic powder, the additive and the solvent for the first time for 3-8h, drying, and sieving with a 200-mesh and 400-mesh sieve to obtain a mixed powder material;

(2) adding the MQ silicon resin-silicon rubber block copolymer solution into the mixed powder material, performing secondary ball milling and mixing for 3-8h, drying, and performing compression molding at the temperature of 60-90 ℃;

(3) and (3) curing the sample obtained in the step (2) at the temperature of 120-200 ℃ for 0.5-2h to obtain the ceramic substrate material.

10. A filter comprising the ceramic substrate material of any one of claims 1-4.

Technical Field

The invention relates to the technical field of mobile communication, in particular to a ceramic substrate material and a preparation method and application thereof.

Background

The filter is a key device for selecting signal transmission frequency in mobile communication, and is a key material for ensuring that signals can be transmitted on a specific frequency band and eliminating mutual interference between the frequency bands. The ceramic substrate is a key material of the filter, and the heat dissipation performance, current carrying capacity, insulativity, thermal expansion coefficient and the like of the ceramic substrate are superior to those of a glass fiber PCB (printed Circuit Board). Ceramic substrates also have their significant disadvantages of being brittle, making them capable of making only small area circuit boards.

CN103951983A discloses a high-thermal-conductivity high-temperature-resistant polysiloxane ceramic composite material, a preparation method and application thereof, wherein the disclosed composite material comprises the following components: 100 parts by mass of vinyl polysiloxane, 20-100 parts by mass of vinyl methyl MQ silicon resin, 0-0.5 part by mass of inhibitor, 0.05-0.5 part by mass of noble metal organic compound catalyst, 3-30 parts by mass of borazine and/or borazine derivative, 0-5 parts by mass of methyl hydrogen-containing silicone oil and 50-150 parts by mass of high thermal conductivity ceramic powder. The high-thermal-conductivity high-temperature-resistant polysiloxane ceramic composite material disclosed by the invention has the advantages of high thermal conductivity coefficient, good elasticity, water resistance, moisture resistance, insulation and shock absorption; the high-temperature aging resistant performance is excellent, and the high-temperature aging resistant material has wide application prospects in the fields of aviation, aerospace, electronics, electricity, communication illumination and the like. However, the polysiloxane ceramic composite material disclosed by the method is complex to prepare, and is very limited to be applied to the field of mobile communication, especially filters.

CN107698270A discloses a method for in-situ synthesizing an amorphous SiOC nanowire reinforced ceramic core, which comprises ball-milling and mixing ceramic powder and silicone resin powder to obtain a required mixed powder, press-molding the powder to obtain a porous ceramic biscuit, then performing curing treatment in an atmospheric environment, sintering the cured sample in an atmosphere sintering furnace, and finally obtaining an amorphous SiOC nanowire reinforced ceramic core material under the protection of a circulating nitrogen atmosphere in the whole sintering process. The ceramic core material disclosed by the patent uses silicon resin as a binder and a precursor, and uses ceramic powder as a matrix, so that the ceramic core material has excellent room temperature and high temperature performances. The preparation process disclosed by the method is simple, strong in operability, short in production period and low in cost. However, the core ceramic material is focused on its reinforcing properties, and the brittleness of the ceramic powder product is ignored, so that the further development of the ceramic powder product is limited.

Therefore, it is important to develop a ceramic substrate material having both high hardness and high toughness, which can be used for manufacturing a large-area circuit board.

Disclosure of Invention

Aiming at the defects of the prior art, the invention aims to provide a ceramic substrate material, a preparation method and application thereof.

In order to achieve the purpose, the invention adopts the following technical scheme:

in a first aspect, the present invention provides a ceramic substrate material, which comprises the following components by weight: 65-95% of ceramic powder, 3-30% of MQ silicon resin-silicon rubber block copolymer and 1-10% of additive.

The ceramic substrate material has the following advantages:

(1) the ceramic substrate material disclosed by the invention has the advantages that through the synergistic effect between the ceramic powder and the MQ silicon resin-silicon rubber block copolymer, the ceramic powder has very high hardness as a substrate material; the block silicone rubber in the MQ silicone resin-silicone rubber block copolymer has excellent toughness, and in addition, the silicone rubber has unique high temperature resistance and low temperature resistance, so that the application range of the ceramic substrate material is widened; the MQ silicon resin is polysiloxane with a three-dimensional core-shell structure, which is generated by carrying out cohydrolysis-polycondensation reaction on an organic silicon compound containing tetrafunctional siloxane chain links (Q) and an organic silicon compound containing monofunctional siloxane chain links (M), has hard and brittle texture and wider glass transition temperature range, can be used as a reinforcing material to make up for the strength lost by using silicon rubber, and simultaneously, the silicon rubber and the MQ silicon resin also have excellent aging resistance, so that the ceramic substrate material has excellent performances of high hardness, high toughness, high temperature resistance and low temperature resistance through the mutual matching of the ceramic powder and the block copolymer of the MQ silicon resin-silicon rubber, can be used for manufacturing large-area circuit boards, and has good use effect.

(2) The mass percentage of the MQ silicon resin-silicon rubber block copolymer in the ceramic substrate material is 3-30%, the ratio of the MQ silicon resin-silicon rubber block copolymer is too low to effectively compensate the inherent defects of the ceramic powder, and the ratio of the MQ silicon resin-silicon rubber block copolymer is too heavy, so that the heat-conducting property and the high-temperature property of the ceramic substrate are obviously weakened.

The ceramic powder is 65-95% by weight of the ceramic substrate material, such as 66%, 68%, 70%, 72%, 74%, 76%, 78%, 80%, 82%, 84%, 86%, 88%, 90%, 92%, 94%, etc.

The weight percentage of the MQ silicone-silicone rubber block copolymer is 3-30%, e.g., 4%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, etc.

The weight percentage of the additive is 1-10%, such as 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, etc.

Preferably, the weight percentage of the MQ silicone-silicone rubber block copolymer in the ceramic substrate material is 3-10%, e.g., 4%, 5%, 6%, 7%, 8%, 9%, etc.

The MQ silicon resin-silicon rubber block copolymer can furthest exert the toughness of the copolymer and the heat-conducting property of a ceramic substrate within the range of 3-30% by weight of the ceramic substrate material.

Preferably, the number average molecular weight of the MQ silicone resin-silicone rubber block copolymer is 10000-50000g/mol, such as 15000g/mol, 20000g/mol, 25000g/mol, 30000g/mol, 35000g/mol, 40000g/mol, 45000g/mol, and the like.

Preferably, the MQ silicone segment in the MQ silicone-silicone rubber block copolymer comprises a methyl MQ silicone segment and/or a phenyl MQ silicone segment.

Preferably, the molar ratio of M units to Q units (M/Q) in the MQ silicone segment is 0.6 to 1.0, e.g., 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, etc.

The molar ratio of M units to Q units in the MQ silicon resin chain segment is 0.6-1.0, the ratio of M to Q is too high, the content of monofunctional siloxane chain links in the MQ silicon resin is high, the growth of the molecular chain of the MQ silicon resin is limited, the obtained MQ silicon resin is in a liquid state due to too low molecular weight, and an MQ silicon resin-silicon rubber copolymer formed by the MQ silicon resin with lower molecular weight has limited reinforcing effect and poor dispersibility when being mixed with ceramic powder, and can also influence the curing performance of a finally formed ceramic substrate material; the ratio of the M unit to the Q unit is too low, the content of the tetrafunctional siloxane chain link is high, the formed MQ silicon resin presents a body structure, the steric hindrance is too large, the MQ silicon resin is not favorable for carrying out good copolymerization with silicon rubber, and the performance of the obtained ceramic substrate material is limited.

Preferably, the number average molecular weight of the MQ silicone resin segment is 2000-6000g/mol, such as 2500g/mol, 3000g/mol, 3500g/mol, 4000g/mol, 4500g/mol, 5000g/mol, 5500g/mol, and the like.

Preferably, the silicone rubber segment in the MQ silicone resin-silicone rubber block copolymer comprises a hydroxyl terminated polydimethylsiloxane.

The preferable hydroxyl-terminated polydimethylsiloxane (107 silicone rubber) is selected as the silicone rubber chain segment, the 107 silicone rubber has excellent toughness, unique high-temperature and low-temperature resistance and aging resistance, and the application range of the ceramic substrate material is widened.

Preferably, the number average molecular weight of the silicone rubber segment is 5000-15000g/mol, such as 6000g/mol, 7000g/mol, 8000g/mol, 9000g/mol, 10000g/mol, 11000g/mol, 12000g/mol, 13000g/mol, 14000g/mol, and the like.

Preferably, the additive comprises a high temperature resistant agent and/or a curing agent.

Preferably, the high temperature resistant agent comprises a metal compound.

Preferably, the metal compound comprises beryllium oxide and/or aluminum nitride.

Preferably, the beryllium oxide is 1-5% by weight, such as 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, etc., preferably 1-3% in the ceramic substrate material.

Preferably, the aluminum nitride is present in the ceramic substrate material in an amount of 1-5% by weight, such as 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, etc., preferably 1-3%.

Preferably, the curing agent comprises dibenzoyl peroxide and/or 2, 4-dichlorobenzoyl peroxide.

Preferably, the curing agent is present in the ceramic substrate material in an amount of 0.5-2% by weight, such as 0.6%, 0.8%, 1.0%, 1.2%, 1.4%, 1.6%, 1.8%, etc.

In a second aspect, the present invention provides a method for preparing a ceramic substrate material according to the first aspect, the method comprising the steps of:

(1) mixing ceramic powder and an additive for the first time to obtain a mixed powder material;

(2) adding the MQ silicon resin-silicon rubber block copolymer solution into the mixed powder material, mixing for the second time, drying, and pressing for molding;

(3) and (3) curing the sample obtained in the step (2) to obtain the ceramic substrate material.

Preferably, the step (1) further comprises adding a solvent to perform first mixing with the ceramic powder and the additive.

Preferably, the solvent comprises water.

Preferably, the solvent is added in an amount of 5-20% by weight of the ceramic powder, such as 6%, 8%, 10%, 12%, 14%, 16%, 18%, etc.

Preferably, the first mixing comprises first ball milling.

Preferably, the time for the first ball milling mixing is 3 to 8 hours, such as 4 hours, 5 hours, 6 hours, 7 hours, and the like.

Preferably, the first mixing is followed by drying and sieving.

Preferably, the mesh has a pore size of 200-400 mesh, such as 220 mesh, 240 mesh, 260 mesh, 270 mesh, 280 mesh, 290 mesh, 300 mesh, 310 mesh, 320 mesh, 330 mesh, 340 mesh, 360 mesh, 380 mesh, etc., preferably 300 mesh.

Preferably, the step (1) specifically comprises: and carrying out primary ball milling and mixing on the ceramic powder, the additive and the solvent for 3-8h, drying, and screening to obtain a mixed powder material.

Preferably, in step (2), the solvent in the MQ silicone resin-silicone rubber block copolymer solution comprises toluene.

Preferably, the mass concentration of the MQ silicone resin-silicone rubber block copolymer solution is 10-30%, such as 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, and the like.

Preferably, the second mixing comprises a second ball milling mixing.

Preferably, the time for the second ball milling mixing is 3 to 8 hours, such as 4 hours, 5 hours, 6 hours, 7 hours, and the like.

Preferably, the temperature of the press forming is 60-90 ℃, such as 65 ℃, 70 ℃, 75 ℃, 80 ℃, 85 ℃ and the like.

Preferably, in the step (3), the curing temperature is 120-.

Preferably, the curing time is 0.5-2h, such as 0.6h, 0.8h, 1.0h, 1.2h, 1.4h, 1.6h, 1.8h, and the like.

As a preferred technical scheme, the preparation method comprises the following steps:

(1) ball-milling and mixing the ceramic powder, the additive and the solvent for the first time for 3-8h, drying, and sieving with a 200-mesh and 400-mesh sieve to obtain a mixed powder material;

(2) adding the MQ silicon resin-silicon rubber block copolymer solution into the mixed powder material, performing secondary ball milling and mixing for 3-8h, drying, and performing compression molding at the temperature of 60-90 ℃;

(3) and (3) curing the sample obtained in the step (2) at the temperature of 120-200 ℃ for 0.5-2h to obtain the ceramic substrate material.

In a third aspect, the present invention provides a filter comprising the ceramic substrate material according to the first aspect.

Compared with the prior art, the invention has the following beneficial effects:

the ceramic substrate material disclosed by the invention has the excellent performances of high hardness, high toughness, high temperature resistance and low temperature resistance through the synergistic effect of the ceramic powder and the MQ silicon resin-silicon rubber block copolymer, can be used for manufacturing large-area circuit boards, and has a good use effect. The hardness of the ceramic substrate material is above 60HA, the heat conductivity coefficient is above 6.1W/m.k, the bending strength is as high as 260MPa, the bending strength after aging is above 253MPa, and the low-temperature bending strength is above 250MPa, and further, the ceramic substrate material obtained by MQ silicon resin-silicon rubber block copolymer modified ceramic powder with the silicon rubber chain segment of hydroxyl-terminated polydimethylsiloxane is preferable, and all the properties are obviously improved, for example, the bending strength of the ceramic substrate material is above 303 MPa.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.

Example 1

The embodiment provides a ceramic substrate material, which comprises the following components in percentage by weight: ceramic powder 83% (purchased from yunnan gang kuncai mineral products ltd., brand modified ceramic powder), MQ silicone resin-silicone rubber block copolymer 10% (number average molecular weight 30000g/mol, purchased from sandin scientific & technology ltd., brand SDA106), high temperature resistant agent (beryllium oxide 3% and aluminum nitride 3%) and curing agent (dibenzoyl peroxide 1%).

In the MQ silicon resin-silicon rubber block copolymer, M/Q in an MQ silicon resin chain segment is 0.7, and the number average molecular weight is 3000 g/mol; the silicone rubber segment was 107 silicone rubbers, and the number average molecular weight was 7000 g/mol.

The preparation method of the ceramic substrate material comprises the following steps:

(1) carrying out primary ball milling and mixing on ceramic powder, beryllium oxide, aluminum nitride, dibenzoyl peroxide and water for 5 hours, drying, and screening by using a 300-mesh screen to obtain a mixed powder material;

(2) adding the MQ silicon resin-silicon rubber block copolymer solution into the mixed powder material, performing secondary ball milling and mixing for 5 hours, drying, and performing compression molding at the temperature of 75 ℃;

(3) and (3) curing the sample obtained in the step (2) at the temperature of 150 ℃ for 1h to obtain the ceramic substrate material.

Example 2

The embodiment provides a ceramic substrate material, which comprises the following components in percentage by weight: 73% of ceramic powder (purchased from hong kong kuncai mineral products limited, trade mark modified ceramic powder), 15% of MQ silicone resin-silicone rubber block copolymer (number average molecular weight 10000g/mol, purchased from sandong science and technology limited, trade mark SDA106), high temperature resistant agent (beryllium oxide 5% and aluminum nitride 5%) and curing agent (2, 4-dichlorobenzoyl peroxide 2%).

In the MQ silicon resin-silicon rubber block copolymer, M/Q in an MQ silicon resin chain segment is 1, and the number average molecular weight is 2000 g/mol; the silicone rubber chain segment is 107 silicone rubber, and the number average molecular weight is 10000 g/mol.

The preparation method of the ceramic substrate material comprises the following steps:

(1) carrying out primary ball milling and mixing on ceramic powder, beryllium oxide, aluminum nitride, 2, 4-dichlorobenzoyl peroxide and water for 3 hours, drying, and sieving by using a 200-mesh sieve to obtain a mixed powder material;

(2) adding the MQ silicon resin-silicon rubber block copolymer solution into the mixed powder material, performing secondary ball milling and mixing for 8 hours, drying, and performing compression molding at the temperature of 60 ℃;

(3) and (3) curing the sample obtained in the step (2) at the temperature of 120 ℃ for 2h to obtain the ceramic substrate material.

Example 3

The embodiment provides a ceramic substrate material, which comprises the following components in percentage by weight: ceramic powder 94.5% (purchased from yunnang rich color mineral products limited, trade mark modified ceramic powder), MQ silicone-silicone rubber block copolymer 3% (number average molecular weight 50000g/mol, purchased from sandin limited, trade mark SDA 108), high temperature resistant agent (beryllium oxide 1% and aluminum nitride 1%) and curing agent (dibenzoyl peroxide 0.25% and 2, 4-dichlorobenzoyl peroxide 0.25%).

In the MQ silicon resin-silicon rubber block copolymer, M/Q in an MQ silicon resin chain segment is 0.6, and the number average molecular weight is 6000 g/mol; the silicone rubber chain segment is 107 silicone rubber, and the number average molecular weight is 5000 g/mol.

The preparation method of the ceramic substrate material comprises the following steps:

(1) carrying out primary ball milling and mixing on ceramic powder, beryllium oxide, aluminum nitride, dibenzoyl peroxide, 2, 4-dichlorobenzoyl peroxide and water for 8 hours, drying, and sieving by using a 400-mesh sieve to obtain a mixed powder material;

(2) adding the MQ silicon resin-silicon rubber block copolymer solution into the mixed powder material, performing secondary ball milling and mixing for 3 hours, drying, and performing compression molding at the temperature of 90 ℃;

(3) and (3) curing the sample obtained in the step (2) at the temperature of 200 ℃ for 0.5h to obtain the ceramic substrate material.

Example 4

This example differs from example 1 in that the weight percent of MQ silicone-silicone rubber block copolymer is 5%, and the preparation method of this example is the same as example 1.

Example 5

This example differs from example 1 in that M/Q in the MQ silicone resin segment is 0.4 and the number average molecular weight is 6000g/mol, and this example is the same as the preparation method of example 1.

Example 6

This example differs from example 1 in that M/Q in the MQ silicone resin segment is 1.2 and the number average molecular weight is 2000g/mol, and this example is the same as the preparation method of example 1.

Example 7

This example differs from example 1 in that M/Q in the MQ silicone resin segment is 0.6 and the number average molecular weight is 6000g/mol, and this example is the same as the preparation method of example 1.

Example 8

This example differs from example 1 in that M/Q in the MQ silicone resin segment is 1.0 and the number average molecular weight is 3000g/mol, and this example is the same as the preparation method of example 1.

Example 9

This example differs from example 1 in that the molecular weight in the 107 silicone rubber segment is 3000g/mol, and the preparation method of this example is the same as that of example 1.

Example 10

This example differs from example 1 in that the molecular weight in the 107 silicone rubber segment is 17000g/mol, and the preparation method of this example is the same as that of example 1.

Example 11

This example is different from example 1 in that the silicone rubber segment is methyl vinyl silicone rubber and the number average molecular weight is 10000g/mol, and the preparation method of this example is the same as that of example 1.

Comparative example 1

This comparative example differs from example 1 in that the weight percent of MQ silicone resin-silicone rubber block copolymer is 2%, and the comparative example was prepared in the same manner as example 1.

Comparative example 2

This comparative example differs from example 1 in that the weight percent of MQ silicone resin-silicone rubber block copolymer was 32%, and the comparative example was prepared in the same manner as example 1.

Comparative example 3

This comparative example differs from example 1 in that the MQ silicone resin-silicone rubber block copolymer is replaced with MQ silicone resin of equal mass, and the preparation method of this example is the same as example 1.

Comparative example 4

This comparative example differs from example 1 in that the MQ silicone resin-silicone rubber block copolymer is replaced with silicone rubber of equivalent mass, and the method of preparation of this example is the same as example 1.

Performance testing

Examples 1-11 and comparative examples 1-4 were tested as follows:

(1) hardness: GB/T531-1992 Shore A hardness test method of vulcanized rubber is adopted.

(2) Coefficient of thermal conductivity: ASTM D5470 Standard test method for Heat transfer Performance of Chinese version of thermally conductive and electrically insulating Material is adopted.

(2) Toughness: the bending strength is detected to represent the toughness by adopting a GB/T6569-2006 fine ceramic bending strength test method. High bending strength and good toughness.

(3) Bending strength after aging: the ceramic substrate was placed in an environment at 300 ℃ for 30 days, and the bending strength was measured.

(4) Low temperature resistant bending strength: the ceramic substrate was placed at-40 ℃ to measure the bending strength.

The test results are summarized in table 1.

TABLE 1

Analysis table 1 shows that the ceramic substrate material HAs the hardness of more than 60HA, the thermal conductivity of more than 6.1W/m.k, the bending strength of 260MPa, the bending strength of 253MPa after aging and the low-temperature bending strength of more than 250 MPa.

As can be seen by analyzing examples 1-4 and comparative examples 1-2, comparative examples 1-2 performed less than examples 1-4, and example 2 performed less than examples 1 and 3-4, demonstrating that the weight percent of MQ silicone resin-silicone rubber block copolymer in the ceramic substrate material in the range of 3-30% gave better performance of the ceramic substrate material, while example 1 performed the best, further demonstrating that the MQ silicone resin-silicone rubber block copolymer in the range of 3-10% gave better performance of the ceramic substrate material.

As can be seen from the analysis of comparative examples 1-4 and example 1, comparative examples 1-4 are inferior to example 1 in performance, demonstrating that the ceramic substrate material obtained using MQ silicone-silicone rubber block copolymer has better performance, and the effect is deteriorated without adding copolymer or without adding amount within the range of the present invention.

As can be seen by analyzing examples 5-8 with example 1, examples 5-6 are inferior to examples 7-8 and example 1, demonstrating the better performance of ceramic substrate materials obtained by selecting MQ silicone resins with M/Q in the range of 0.6-1.0.

As can be seen from the analysis of examples 9-10 and examples 1-3, examples 9-10 are inferior to examples 1-3, and the number average molecular weight of the silicone rubber is in the range of 5000-.

Analysis of example 11 with example 1 revealed that example 11 is significantly inferior to example 1, and that the use of 107 silicone rubber was more favorable for forming ceramic substrate materials with better properties than the other examples.

The present invention is illustrated in detail by the examples described above, but the present invention is not limited to the details described above, i.e., it is not intended that the present invention be implemented by relying on the details described above. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.