阅读说明：本技术 控制局部加热和冷却的系统 (System for controlling localized heating and cooling ) 是由 D·M·萨拉 P·W·亚历山大 N·L·约翰逊 于 2020-09-30 设计创作，主要内容包括：本发明公开了控制局部加热和冷却的系统。一种热控制系统包括具有表面的部件。多个发热装置包括第一导电板、第二导电板和第三导电板、布置在第一导电板与第二导电板之间的第一半导体装置以及布置在第一导电板与第三导电板之间的第二半导体装置。第一半导体装置和第二半导体装置具有不同类型的掺杂。多个发热装置中的第一发热装置被布置成第一导电板邻近部件的表面定位。多个发热装置中的第二发热装置布置成第二导电板和第三导电板邻近部件的表面定位。多个发热装置中的第一发热装置和第二发热装置分别执行表面的加热和冷却。(The invention discloses a system for controlling local heating and cooling. A thermal control system includes a component having a surface. The plurality of heat generating devices includes first, second, and third conductive plates, a first semiconductor device disposed between the first and second conductive plates, and a second semiconductor device disposed between the first and third conductive plates. The first semiconductor device and the second semiconductor device have different types of doping. A first heat-generating device of the plurality of heat-generating devices is arranged with the first electrically conductive plate positioned adjacent to a surface of the component. A second heat generating device of the plurality of heat generating devices is arranged with the second and third electrically conductive plates positioned adjacent to a surface of the component. A first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively.)

1. A thermal control system, comprising:

a component having a surface; and

a plurality of heat generating devices comprising:

a first conductive plate;

a second conductive plate and a third conductive plate;

a first semiconductor device disposed between the first conductive plate and the second conductive plate; and

a second semiconductor device disposed between the first conductive plate and the third conductive plate,

wherein the first semiconductor device and the second semiconductor device have different types of doping,

wherein a first heat-generating device of the plurality of heat-generating devices is arranged with a first electrically conductive plate positioned adjacent to a surface of the component,

wherein a second heat generating device of the plurality of heat generating devices is arranged such that the second and third electrically conductive plates are positioned adjacent to a surface of the component, and

wherein a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively.

2. The thermal control system of claim 1, further comprising:

a plurality of temperature sensors disposed adjacent to the surface for sensing a plurality of temperatures of the component; and

a controller configured to selectively operate the plurality of heat generating devices based on the plurality of temperatures.

3. The thermal control system of claim 1, further comprising a controller including a heating and cooling profile that stores temperature differences for the plurality of heat-generating devices attached to the component based on locations of the plurality of heat-generating devices, wherein the controller controls power to the plurality of heat-generating devices based on the heating and cooling profile.

4. The thermal control system of claim 1, wherein one of a first one of the plurality of heat-generating devices and a second one of the plurality of heat-generating devices is selectively used to sense a plurality of temperatures.

5. The thermal control system of claim 4, further comprising a controller configured to operate the plurality of heat generating devices based on the plurality of temperatures.

6. The thermal control system of claim 1, wherein a subset of the plurality of heat generating devices are arranged in columns.

7. The thermal control system of claim 6, wherein each of the plurality of heat-generating devices arranged within the column are arranged parallel to one another.

8. The thermal control system of claim 1, wherein the plurality of heat generating devices are arranged in a circular arrangement within at least one of a seat and a seat cushion of a vehicle.

9. A thermal control system, comprising:

a plurality of heat-generating device holders, each of which is provided with a plurality of heat-generating device holders,

wherein each of the plurality of heat-generating device holders comprises:

n surfaces, where N is an integer greater than 1, and N grooves on each of the N surfaces, respectively;

a plurality of heat generating devices comprising:

a first conductive plate;

a second conductive plate and a third conductive plate;

a first semiconductor device disposed between the first conductive plate and the second conductive plate; and

a second semiconductor device disposed between the first conductive plate and the third conductive plate, wherein the first semiconductor device and the second semiconductor device have different types of doping,

wherein a first heat-generating device of the plurality of heat-generating devices is disposed in a first slot of the N slots, the first conductive plate facing outward,

wherein a second heat generating device of the plurality of heat generating devices is disposed in a second slot of the N slots with the second and third conductive plates facing outward, and

wherein a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively.

10. A thermal control system, comprising:

a vehicle component selected from the group consisting of a seat, a seat cushion, and a steering wheel, wherein the vehicle component comprises a surface;

a plurality of heat generating devices comprising:

a first conductive plate;

a second conductive plate and a third conductive plate;

a first semiconductor device disposed between the first conductive plate and the second conductive plate; and

a second semiconductor device disposed between the first conductive plate and the third conductive plate,

wherein the first semiconductor device and the second semiconductor device have different types of doping,

wherein a first heat-generating device of the plurality of heat-generating devices is arranged with the first electrically conductive plate positioned adjacent to a surface of the component,

wherein a second heat-generating device of the plurality of heat-generating devices is arranged with a second electrically conductive plate and a third electrically conductive plate positioned adjacent to the surface of the component, and

wherein a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively; and

a controller comprising a heating and cooling profile that defines a temperature differential of the plurality of heat-generating devices attached to the component based on positions of the plurality of heat-generating devices, wherein the controller controls power to the plurality of heat-generating devices based on the heating and cooling profile.

Technical Field

The present disclosure relates to a thermal management system that includes a thermal device to provide localized heating and/or cooling of a seat cushion, seat, steering wheel, and/or other components.

Background

The information provided in this section is intended to generally introduce the background of the disclosure. Work of the presently named inventors, to the extent it is described in this section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

Vehicles typically include a heating, ventilation, and air conditioning (HVAC) system to manage the thermal comfort of the vehicle occupants. Thermal devices are also used in the seat cushion and/or seat to provide additional occupant comfort. For example, some vehicle seats include a heating device (e.g., a resistive heater) and/or a cooling device (e.g., a fan).

Disclosure of Invention

A thermal control system includes a component having a surface. The plurality of heat generating devices includes first, second, and third conductive plates, a first semiconductor device disposed between the first and second conductive plates, and a second semiconductor device disposed between the first and third conductive plates. The first semiconductor device and the second semiconductor device have different types of doping. A first heat-generating device of the plurality of heat-generating devices is disposed with the first electrically conductive plate adjacent to a surface of the component. A second heat generating device of the plurality of heat generating devices is arranged with the second and third electrically conductive plates positioned adjacent to the surface of the component. A first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively.

In other features, a plurality of temperature sensors are disposed adjacent to the surface to sense a plurality of temperatures of the component. The controller is configured to selectively operate the plurality of heat generating devices based on the plurality of temperatures.

In other features, the controller stores a heating and cooling profile that defines a temperature differential for the plurality of heat-generating devices based on the locations of the plurality of heat-generating devices. The controller controls power to the plurality of heat generating devices based on the heating and cooling profiles.

In other features, the first one of the plurality of heat-generating devices is configured to sense a plurality of temperatures when the first one of the plurality of heat-generating devices is not heating. When the second heat generating device of the plurality of heat generating devices is not cooled, the second heat generating device of the plurality of heat generating devices is used for sensing a plurality of temperatures, respectively.

In other features, the controller is configured to operate the plurality of heat generating devices based on a plurality of temperatures. A subset of the plurality of heat generating devices are arranged in columns. Each of the plurality of heat generating devices arranged in the column is arranged in parallel with each other.

In other features, the plurality of heat generating devices are arranged in a circular arrangement within at least one of a seat and a seat cushion of the vehicle.

In other features, a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices are disposed between the first foam substrate and the second foam substrate. The first foam substrate defines a plurality of thermally conductive channels. A heat sink is disposed along a surface of the second foam substrate.

A thermal control system includes a plurality of heat-generating device holders. Each of the plurality of heat-generating device holders includes N surfaces, where N is an integer greater than 1, and N grooves are respectively on each of the N surfaces. The plurality of heat generating devices includes first, second, and third conductive plates, a first semiconductor device disposed between the first and second conductive plates, and a second semiconductor device disposed between the first and third conductive plates. The first semiconductor device and the second semiconductor device have different types of doping. A first heat-generating device of the plurality of heat-generating devices is disposed in a first slot of the N slots with the first conductive plate facing outward. A second heat generating device of the plurality of heat generating devices is disposed in a second slot of the N slots, the second conductive plate and the third conductive plate facing outward. A first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively.

In other features, the plurality of heat-generating device holders define a plurality of cavities, respectively. The cord passes through the plurality of cavities of the plurality of heat generating device holders. The cord and the plurality of heat generating device holders are attached to the vehicle component. The vehicle component is selected from the group consisting of a seat and a steering wheel of a vehicle. The first and second heat-generating devices of the plurality of heat-generating devices are alternately arranged around the circumference of at least one of the plurality of heat-generating device holders. The plurality of heat-generating device holders have a polygonal cross-section.

A thermal control system includes a vehicle component selected from the group consisting of a seat, a seat cushion, and a steering wheel. The vehicle component includes a surface. The plurality of heat generating devices includes first, second, and third conductive plates, a first semiconductor device disposed between the first and second conductive plates, and a second semiconductor device disposed between the first and third conductive plates. The first semiconductor device and the second semiconductor device have different types of doping. A first heat-generating device of the plurality of heat-generating devices is arranged with the first electrically conductive plate positioned adjacent to a surface of the component. A second heat generating device of the plurality of heat generating devices is arranged with the second and third electrically conductive plates positioned adjacent to the surface of the component. A first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively. The controller stores heating and cooling profiles that define temperature differences for a plurality of heat-generating devices attached to the component based on positions of the plurality of heat-generating devices. The controller controls power to the plurality of heat generating devices based on the heating and cooling profiles.

The invention may include the following scheme:

1. a thermal control system, comprising:

a component having a surface; and

a plurality of heat generating devices comprising:

a first conductive plate;

a second conductive plate and a third conductive plate;

a first semiconductor device disposed between the first conductive plate and the second conductive plate; and

a second semiconductor device disposed between the first conductive plate and the third conductive plate,

wherein the first semiconductor device and the second semiconductor device have different types of doping,

wherein a first heat-generating device of the plurality of heat-generating devices is arranged with a first electrically conductive plate positioned adjacent to a surface of the component,

wherein a second heat generating device of the plurality of heat generating devices is arranged such that the second and third electrically conductive plates are positioned adjacent to a surface of the component, and

wherein a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively.

2. The thermal control system of claim 1, further comprising:

a plurality of temperature sensors disposed adjacent to the surface for sensing a plurality of temperatures of the component; and

a controller configured to selectively operate the plurality of heat generating devices based on the plurality of temperatures.

3. The thermal control system of claim 1, further comprising a controller including a heating and cooling profile that stores temperature differences for the plurality of heat-generating devices attached to the component based on locations of the plurality of heat-generating devices, wherein the controller controls power to the plurality of heat-generating devices based on the heating and cooling profile.

4. The thermal control system of claim 1, wherein one of a first heat-generating device of the plurality of heat-generating devices and a second heat-generating device of the plurality of heat-generating devices is selectively used to sense a plurality of temperatures.

5. The thermal control system of claim 4, further comprising a controller configured to operate the plurality of heat generating devices based on the plurality of temperatures.

6. The thermal control system of claim 1, wherein a subset of the plurality of heat generating devices are arranged in a column.

7. The thermal control system of claim 6, wherein each of the plurality of heat-generating devices arranged within the column are arranged parallel to one another.

8. The thermal control system of claim 1 wherein the plurality of heat generating devices are arranged in a circular arrangement within at least one of a seat and a seat cushion of a vehicle.

9. The thermal control system of claim 1, wherein a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices are disposed between a first foam substrate and a second foam substrate.

10. The thermal management system of claim 9, wherein the first foam substrate defines a plurality of thermally conductive channels.

11. The thermal management system of claim 9, further comprising a heat sink disposed along a surface of the second foam substrate.

12. A thermal control system, comprising:

a plurality of heat-generating device holders, each of which is provided with a plurality of heat-generating device holders,

wherein each of the plurality of heat-generating device holders comprises:

n surfaces, where N is an integer greater than 1, and N grooves on each of the N surfaces, respectively;

a plurality of heat generating devices comprising:

a first conductive plate;

a second conductive plate and a third conductive plate;

a first semiconductor device disposed between the first conductive plate and the second conductive plate; and

a second semiconductor device disposed between the first conductive plate and the third conductive plate, wherein the first semiconductor device and the second semiconductor device have different types of doping,

wherein a first heat-generating device of the plurality of heat-generating devices is disposed in a first slot of the N slots, the first conductive plate facing outward,

wherein a second heat generating device of the plurality of heat generating devices is disposed in a second slot of the N slots with the second and third conductive plates facing outward, and

wherein a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively.

13. The thermal control system of claim 12, wherein the plurality of heat-generating device holders each define a plurality of cavities.

14. The thermal control system of claim 13, further comprising a wire rope passing through the plurality of cavities of the plurality of heat-generating device holders.

15. The thermal control system of claim 14, wherein the wire rope and the plurality of heat-generating device holders are attached to a vehicle component.

16. The thermal control system of claim 15, wherein the vehicle component is selected from the group consisting of a seat and a steering wheel.

17. The thermal control system of claim 13, wherein the first and second heat-generating devices of the plurality of heat-generating devices are alternately disposed around the circumference of at least one of the plurality of heat-generating device holders.

18. The thermal control system of claim 12, wherein the plurality of heat-generating device holders have a polygonal cross-section.

19. A thermal control system, comprising:

a vehicle component selected from the group consisting of a seat, a seat cushion, and a steering wheel, wherein the vehicle component comprises a surface;

a plurality of heat generating devices comprising:

a first conductive plate;

a second conductive plate and a third conductive plate;

a first semiconductor device disposed between the first conductive plate and the second conductive plate; and

a second semiconductor device disposed between the first conductive plate and the third conductive plate,

wherein the first semiconductor device and the second semiconductor device have different types of doping,

wherein a first heat-generating device of the plurality of heat-generating devices is arranged with the first electrically conductive plate positioned adjacent to a surface of the component,

wherein a second heat-generating device of the plurality of heat-generating devices is arranged with a second electrically conductive plate and a third electrically conductive plate positioned adjacent to the surface of the component, and

wherein a first heat-generating device and a second heat-generating device of the plurality of heat-generating devices perform heating and cooling of the surface, respectively; and

a controller comprising a heating and cooling profile that defines a temperature differential of the plurality of heat-generating devices attached to the component based on positions of the plurality of heat-generating devices, wherein the controller controls power to the plurality of heat-generating devices based on the heating and cooling profile.

20. The thermal control system of claim 19, wherein a first heat-generating device of the plurality of heat-generating devices senses a plurality of temperatures.

Further areas of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Drawings

The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

FIG. 1 illustrates an example of a thermoelectric cooler/heater apparatus according to the present disclosure;

fig. 2A is an isometric view of an example of a heat-generating device including a plurality of thermoelectric cooler/heater devices according to the present disclosure;

fig. 2B is another isometric view of an example of a heat-generating device including a plurality of thermoelectric cooler/heater devices according to the present disclosure;

fig. 3 illustrates an example of a seat cushion including a plurality of heat generating devices according to the present disclosure;

FIG. 4 is a cross-sectional view of an example of a plurality of heat-generating devices disposed in one or more foam substrates according to the present disclosure;

FIG. 5 is a plan view of an example of a plurality of heat-generating devices disposed in a foam substrate according to the present disclosure;

FIG. 6 is another plan view of an example of a plurality of heat-generating devices disposed in a foam substrate according to the present disclosure;

FIG. 7 is another plan view of an example of a plurality of heat-generating devices disposed in a foam substrate according to the present disclosure;

fig. 8A and 8B are isometric views of an example of a heat-generating device holder according to the present disclosure;

FIG. 9 is an isometric view of an example of heat-generating device holders connected together using wire ropes in accordance with the present disclosure;

FIG. 10 is a schematic illustration of an example of a seat including a plurality of heat generating devices according to the present disclosure;

FIG. 11 is a schematic diagram of an example system for providing localized heating and cooling using one or more thermoelectric cooler/heater devices according to the present disclosure; and

fig. 12 is a flow diagram illustrating an example method of providing localized heating and cooling using one or more thermoelectric cooler/heater devices.

In the drawings, reference numbers may be reused to identify similar and/or identical elements.

Detailed Description

The present disclosure relates to systems for providing localized heating and/or cooling to surfaces of components such as seats, seat cushions, steering wheels, and the like. In one or more embodiments, the component may be located in a vehicle. The component includes one or more heat generating devices. The heat generating device includes a plurality of thermoelectric cooler/heater devices that generate heating and/or cooling via a voltage difference applied to the thermoelectric cooler/heater devices. For example, the thermoelectric cooler/heater device may provide thermoelectric heating or cooling according to the peltier effect, as described in more detail below.

Fig. 1 shows an example thermoelectric cooler/heater apparatus 100. As shown, the thermoelectric cooler/heater devices 100-1, 100-2, 100-3, … (collectively referred to as thermoelectric cooler/heater devices 100) include semiconductor devices 102, 104 having different doping types. The semiconductor device 102 is an n-doped semiconductor device and the semiconductor device 104 is a p-doped semiconductor device. Referring to fig. 1 and 2A, the semiconductor devices 102, 104 are connected to a first conductive plate 106, a second conductive plate 108, and a third conductive plate 110. The first ceramic structure 120 is disposed over the first conductive plate 106 and in contact with the first conductive plate 106. The second ceramic structure 122 is disposed over and in contact with the second and third conductive plates 108, 110.

Fig. 2A shows an example heat-generating device 200 including a plurality of thermoelectric cooler/heater devices 100. For example, the heat generating device 200 includes a first thermoelectric cooler/heater device 100-1 having semiconductor devices 102, 104, a second thermoelectric cooler/heater device 100-2 having semiconductor devices 102, 104, and a third thermoelectric cooler/heater device 100-3 having semiconductor devices 102, 104.

First conductive plate 106 is connected to one side of semiconductor device 102 and one side of semiconductor device 104 of thermoelectric cooler/heater device 100-1. The second conductive plate 108 is connected to an opposite side of the semiconductor device 102 and a corresponding side of the semiconductor device 104. The third conductive plate 110 is connected to an opposite side of the semiconductor device 104 and a corresponding side of the semiconductor device 102.

A voltage is applied to the heat generating device 200 via the electrodes 202, 204. The electrodes 202, 204 may be connected to a power source, such as a battery, via electrical connections 206, 208. The electrical connections may be wires, traces, etc. Once a voltage is applied to the heat generating device 200, heat is transferred from one side of the heat generating device 200 to the other side due to the flow of current, allowing one side to be relatively cold.

Fig. 3 illustrates an example seat cushion 300. The seat cushion 300 may be positioned over a seat 302, such as a vehicle seat. The seat cushion 300 includes a plurality of heat generating devices 200, the heat generating devices 200 providing localized heating and/or cooling to one or more portions of the seat cushion 300. In one or more embodiments, the seat cushion 300 may be a foam cushion in which the heat generating device 200 is integrated. The seat cushion 300 also includes a sensor 304 capable of detecting an environmental parameter proximate the seat cushion 300. For example, the environmental parameter may include, but is not limited to, temperature or humidity. In some examples, the non-activated thermoelectric cells may function as temperature sensors. For example, during cooling, the thermoelectric unit used for heating is not activated, and may be used to generate a voltage proportional to the temperature difference between the two sides of the corresponding thermoelectric unit (and so during heating).

Fig. 4 shows an example cross-sectional view of the seat cushion 300. As shown, the seat cushion 300 includes a first foam substrate 402 and a second foam substrate 404. The heat generating device 200 may be disposed between the foam substrates 402, 404. As shown, the foam substrates 402, 404 include thermally conductive channels 406, 408 disposed therein. The thermally conductive channels 406, 408 are formed of a suitable thermally conductive material that allows for heat or cold transfer. For example, the thermally conductive channels 406, 408 may be formed from metal foam. In another example, the thermally conductive vias 406, 408 are holes defined within the foam substrates 402, 404.

The heat generating device 200 is positioned between the foam substrates 402, 404 such that the heat generating device 200 is in contact with the corresponding thermally conductive channels 406, 408. The heat-generating device 200 may be disposed within the foam substrate 410, with the foam substrate 410 holding the heat-generating device 200 in place relative to other heat-generating devices 200 within the foam substrate 410.

The seat cushion 300 may further include a heat sink 412 disposed along a bottom side of the foam substrate 404 (a side opposite to a side contacting the heat generating device 200). The heat sink 412 may be formed of a suitable thermally conductive foam material. The heat sink 412 may absorb heat generated by the heat-generating device 200 and transfer the absorbed heat to a fluid medium, such as air.

Fig. 5 to 7 show plan views of example arrangements of the heat generating device 200 located within the foam substrate 410. As shown in fig. 5, the plan view 500 shows that the foam substrate 410 includes a first column 502 and a second column 504 of heat-generating devices 200. The first column 502 includes heat-generating devices 200 having a first ceramic structure 120 oriented along a top surface 506 of a foam substrate 410. The second column 504 includes heat-generating devices 200 having second ceramic structures 122 oriented along a top surface 506 of the foam substrate 410.

The first ceramic structure 120 corresponds to a heating side of the heat generating device 200, and the second ceramic structure 122 corresponds to a cooling side of the heat generating device 200. As shown in fig. 5, each heat-generating device 200 in the first column 502 is parallel to the other heat-generating devices 200 in the first column 502, and each heat-generating device 200 in the second column 504 is parallel to the other heat-generating devices 200 in the second column 504.

Fig. 6 is a plan view 600 showing the foam substrate 410 including a first column 602 and a second column 604 of heat-generating devices 200. The columns 602, 604 include heat-generating devices 200 having alternating ceramic structures 120, 122 oriented along a top surface 606 of the foam substrate 410.

As shown in fig. 6, each heat-generating device 200 in the first column 602 is offset or staggered with respect to other heat-generating devices 200 in the first column 602, and each heat-generating device 200 in the second column 604 is offset or staggered with respect to other heat-generating devices 200 in the second column 604.

Fig. 7 is a plan view 700 showing that the foam substrate 410 includes a plurality of heat-generating devices 200 arranged in a circular pattern. In one embodiment, the heat-generating devices 200 having the first ceramic structures 120 are arranged in a first circular arrangement 702, and the heat-generating devices 200 having the second ceramic structures 122 are arranged in a second circular arrangement 704 within the first circular arrangement 702. Further, the heat-generating device 200 with the first ceramic structures 120 is arranged in a third circular arrangement 706 within the second circular arrangement 704.

Fig. 8A, 8B, and 9 show heat-generating device holders 810, 812 each including a thermoelectric cooler/heater device 800, 802, respectively. In some examples, the heat generating device holders 810, 812 may be formed of aluminum, copper, or the like, although other materials may also be used.

The heat generating device holders 810, 812 include central cavities 820, 822 extending through the middle of the heat generating device holders 810, 812, respectively. Each side 814, 816 of the heat-generating device holders 810, 812 includes one of the thermoelectric cooler/heater devices 800, 802, respectively. In some examples, the heat-generating device holders 810, 812 have N sides and N thermoelectric cooler/heater devices 800-1, 800-2, …, and 800-N. For example, in fig. 8A, N = 6. In fig. 8B, N = 4. In some examples, the exposed surfaces of the N thermoelectric cooler/heater devices 800-1, 800-2, …, and 800-N are alternately disposed around the circumference of the heat-generating device holders 810, 812 to provide heating or cooling. Although hexagonal and rectangular shapes are shown, other polygonal or non-polygonal shapes may be used. In some examples, electrical connections (not shown) may be formed within or outside of the central lumens 820, 822.

In FIG. 9, a heat-generating device 850 includes a plurality of heat-generating device holders 810 that are coupled together as shown using cords 860 (e.g., yarn, thread, or other material). In some examples, the heat-generating device holders 810 are connected in close proximity to each other. In other examples, spacers 850-1, 850-2, … may be used between the heat-generating device holders 810. In some examples, the spacers 850-1, 850-2, … are made of a flexible material, such as plastic, rubber, or other material to increase flexibility.

Fig. 10 shows an example seat 1000 that includes a heat generating device 850. In one embodiment, a heat generating device 850 is attached to the seat 1000. For example, during construction of the seat 1000, the heat generating device 850 is sewn or otherwise attached to the seat 1000.

It should be understood that the heat generating devices described herein may also be used as thermoelectric generators. For example, the thermoelectric device may be used for energy harvesting during times when the heat generating device is not being used to thermally adjust the seat and/or cushion.

Fig. 11 illustrates an example control system 1100 for controlling localized heating and/or cooling of a seat cushion and/or seat. The control system 1100 includes a controller 1102, a power supply 1104, switches 1106-1 to 1106-M, thermoelectric cooler/heater devices 100-1 to 100-M, and sensors 304-1 to 304-N, where M and N are integers equal to or greater than 1. The controller 1102 is connected to the switches 1106-1 to 1106-M via a bus 1108. According to the above embodiments, the thermoelectric cooler/heater devices 100-1 to 100-M may be disposed in the seat cushion and/or the seat. The controller 1102 implements a cooling and heating profile 1160 that defines a temperature differential between thermoelectric heaters/coolers or thermoelectric heater/cooler groups. The temperature difference may be set by a user and/or pre-stored. For example only, the temperature differential may be used to provide more heat at some locations (e.g., the edges of the seat cushion) and less heat at other locations (e.g., the center of the seat cushion).

The controller 1102 may be preprogrammed with instructions to generate control signals based on the received inputs. The control signals may cause one or more switches 1106-1 to 1106-M to transition from an open state to a closed state to connect the corresponding thermoelectric cooler/heater devices 100-1 to 100-M to the power supply 1104. In various embodiments, the controller 1102 may activate individual thermoelectric cooler/heater devices 100-1 to 100-M or a subset of the thermoelectric cooler/heater devices 100-1 to 100-M based on one or more input parameters.

The controller 1102 may access a lookup table to determine whether to connect one or more thermoelectric cooler/heater devices 100-1 through 100-M to the power supply 1104 via one or more switches 1106-1 through 1106-N based on the received input. In one embodiment, the lookup table may store the detected input parameters (e.g., humidity, temperature, etc.) and corresponding switch control signals as key-value pairs.

In another embodiment, the controller 1102 may receive input from an occupant via a user interface. For example, the input from the occupant may represent a driving time corresponding to a driving trip, occupant-defined pattern preferences, and the like. Based on the input, the controller 1102 determines a corresponding switch control signal via a look-up table.

Based on the control signals, a predefined number of thermoelectric cooler/heater devices 100-1 to 100-M may generate thermal energy to provide thermal comfort to the seat cushion and/or an occupant of the seat. In one embodiment, a predefined subset (e.g., pattern) of the thermoelectric cooler/heater devices 100-1 to 100-M may be connected to the power supply 1104 to generate thermal energy. For example, a subset of the thermoelectric cooler/heater devices 100-1 to 100-M corresponding to a particular region of the occupant's body (e.g., back, neck, etc.) may be connected to the power source 1104 to generate thermal energy.

Fig. 12 illustrates an example method 1200 for providing localized heating and/or cooling to a seat cushion and/or seat. The method 1200 begins at 1202. At 1204, input indicative of temperature and/or humidity is received at one or more sensors 304-1 to 304-M. At 1204, the controller 1102 determines whether to activate the thermoelectric cooler/heater device based on the input. For example, the controller 1102 accesses a lookup table and compares the received input to lookup table key values to generate control signals for localized heating and/or cooling within the seat cushion and/or seat based on the input. When the received input corresponds to one or more look-up table key values, the controller 1102 retrieves the corresponding value indicating the switches 1106-1 to 1106-M to activate.

If the controller 1102 determines, based on the received input, that the thermoelectric cooler/heater device is not to be activated, the method 1200 returns to 1204. Otherwise, at 1208, the controller 1102 generates a control signal to activate the corresponding switch based on the retrieved value. For example, the controller 1102 generates a control signal 1102 and transmits the control signal 1102 to the corresponding switches 1106-1 to 1106-M to cause one or more predetermined switches 1106-1 to 1106-M to transition from an open state to a closed state to connect one or more thermoelectric cooler/heater devices 100-1 to 100-M to the power supply 1104.

At 1210, the controller 1102 determines whether an input to modify heating/cooling has been received from the user interface 1108. If an input to modify heating/cooling has been received, the controller 1102 activates a switch corresponding to the control signal to activate at least a subset of the thermoelectric cooler/heater devices at 1208. The method 1200 ends at 1212.

The foregoing description is merely illustrative in nature and is not intended to limit the present disclosure, application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps of a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Moreover, although each of these embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure may be implemented in any of the other embodiments and/or combined with the features of any of the other embodiments, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive and substitutions of one or more embodiments with one another are still within the scope of the present disclosure.

Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor substrates, etc.) are described using various terms, including "connected," engaged, "" coupled, "" adjacent, "" proximate, "" on top, "" above, "" below, "and" disposed. Unless explicitly described as "direct", when a relationship between a first element and a second element is described in the above disclosure, the relationship may be a direct relationship in which no other intervening element exists between the first element and the second element, but may also be an indirect relationship in which one or more intervening elements (spatially or functionally) exist between the first element and the second element. As used herein, the phrase "at least one of A, B and C" should be interpreted as using a non-exclusive logical "OR" to mean a logical "A or B or C", and should not be interpreted as meaning "at least one of A, at least one of B, and at least one of C"

In the drawings, the direction of arrows, as indicated by the arrow heads, generally indicate the flow of information (e.g., data or instructions) associated with the diagram. For example, when element a and element B exchange various information, but the information transmitted from element a to element B is related to the illustration, an arrow may point from element a to element B. This one-way arrow does not mean that no other information is transmitted from element B to element a. Further, for information sent from element a to element B, element B may send a request for information or an acknowledgement of receipt to element a

In this application, including the following definitions, the term "module" or the term "controller" may be replaced by the term "circuit". The term "module" may refer to or be part of or include an Application Specific Integrated Circuit (ASIC); digital, analog, or hybrid analog/digital discrete circuits; digital, analog, or hybrid analog/digital integrated circuits; a combinational logic circuit; a Field Programmable Gate Array (FPGA); memory circuitry (shared, dedicated, or group) that stores code executed by the processor circuitry; other suitable hardware components that provide the described functionality; or a combination of some or all of the above, for example in a system on a chip.

The module may include one or more interface circuits. In some examples, the interface circuit may include a wired or wireless interface to a Local Area Network (LAN), the internet, a Wide Area Network (WAN), or a combination thereof. The functionality of any given module of the present disclosure may be distributed among multiple modules connected via interface circuits. For example, multiple modules may allow load balancing. In another example, a server (also referred to as a remote or cloud) module may perform some functions on behalf of a client module.

The term code, as used above, may include software, firmware, and/or microcode, and may refer to programs, routines, functions, classes, data structures, and/or objects. The term shared processor circuit includes a single processor circuit that executes some or all of the code from multiple modules. The term group of processor circuits includes processor circuits that execute some or all code from one or more modules, in combination with additional processor circuits. References to multiple processor circuits include multiple processor circuits on separate dies, multiple processor circuits on a single die, multiple cores of a single processor circuit, multiple threads of a single processor circuit, or combinations thereof. The term shared memory circuit includes a single memory circuit that stores some or all of the code from multiple modules. The term group of memory circuits includes memory circuits in combination with additional memory that store some or all of the code from one or more modules.

The term memory circuit is a subset of the term computer readable medium. The term computer-readable medium as used herein does not include transitory electrical or electromagnetic signals propagating through a medium (e.g., on a carrier wave); thus, the term computer-readable medium may be considered tangible and non-transitory. Non-limiting examples of the non-transitory tangible computer-readable medium are a non-volatile memory circuit (e.g., a flash memory circuit, an erasable programmable read-only memory circuit, or a mask read-only memory circuit), a volatile memory circuit (e.g., a static random access memory circuit or a dynamic random access memory circuit), a magnetic storage medium (e.g., an analog or digital tape or hard drive), and an optical storage medium (e.g., a CD, DVD, or blu-ray disc).

The apparatus and methods described herein may be partially or wholly implemented by a special purpose computer created by configuring a general purpose computer to perform one or more specific functions included in a computer program. The functional blocks, flowchart components and other elements described above are used as software specifications, which can be translated into a computer program by the routine work of a skilled technician or programmer.

The computer program includes processor-executable instructions stored on at least one non-transitory tangible computer-readable medium. The computer program may also comprise or rely on stored data. The computer programs may include a basic input/output system (BIOS) that interacts with the hardware of the special purpose computer, a device driver that interacts with specific devices of the special purpose computer, one or more operating systems, user applications, background services, background applications, and the like.

The computer program may include (i) descriptive text to be parsed, such as HTML (hypertext markup language), XML (extensible markup language), or json (javascript Object Notification), (ii) assembly code, (iii) Object code generated by a compiler from source code, (iv) source code executed by an interpreter, (v) source code compiled and executed by a just-in-time compiler, and so forth. By way of example only, the source code may be written in the syntax of C, C + +, C #, Objective-C, Swift, Haskell, Go, SQL, R, Lisp, Java, Fortran, Perl, Pascal, Curl, OCaml, Javascript, HTML5 (fifth edition HyperText markup language), Ada, ASP (active Server pages), PHP (PHP: HyperText preprocessor), Scala, Eiffel, Smalltalk, Erlang, Ruby, Flash, Visual Basic, Lua, MATLAB, SIMULINK, and Python.