阅读说明：本技术 一种热熔型粘合剂 (Hot-melt adhesive ) 是由 唐传荣 于 2020-09-10 设计创作，主要内容包括：本发明公开了一种热熔型粘合剂,包括以下重量份数计的组分：乙烯-醋酸乙烯30-40份、石蜡2-3份、聚乙烯34-47份、抗氧剂0.1-2份、山梨酸钾1-5份、乙烯-丙烯-丁烯三元共聚物15-20份。本发明粘度高,抗剥离能力强,工艺简单,适合工业化生产。(The invention discloses a hot-melt adhesive which comprises the following components in parts by weight: 30-40 parts of ethylene-vinyl acetate, 2-3 parts of paraffin, 34-47 parts of polyethylene, 0.1-2 parts of antioxidant, 1-5 parts of potassium sorbate and 15-20 parts of ethylene-propylene-butylene terpolymer. The invention has high viscosity, strong anti-stripping capability and simple process, and is suitable for industrial production.)

1. The hot-melt adhesive is characterized by comprising the following components in parts by weight: 30-40 parts of ethylene-vinyl acetate, 2-3 parts of paraffin, 34-47 parts of polyethylene, 0.1-2 parts of antioxidant, 1-5 parts of potassium sorbate and 15-20 parts of ethylene-propylene-butylene terpolymer.

2. A hot melt adhesive according to claim 1, comprising the following components in parts by weight: 35 parts of ethylene-vinyl acetate, 2.5 parts of paraffin, 40 parts of polyethylene, 0.15 part of antioxidant, 3 parts of potassium sorbate and 18 parts of ethylene-propylene-butylene terpolymer.

3. A method of preparing a hot melt adhesive as claimed in claim 1 or 2, comprising the steps of:

1) sequentially adding the components into a stirrer, and controlling the stirring temperature and time;

2) and stopping adding after all the components are completely melted and uniformly mixed, cooling and filtering to obtain the product.

4. The method as claimed in claim 3, wherein the heating temperature is 120 ℃ and 130 ℃ and the heating time is 4-5 h.

Technical Field

The invention relates to the technical field of industrial adhesives, in particular to a hot-melt adhesive.

Background

The hot melt adhesive is a common adhesive in industrial adhesives, and is used for bonding products of different materials together in a hot melt mode, but the hot melt adhesive has the common problems of poor water resistance and easy colloid stripping caused by dissolution.

Disclosure of Invention

The invention aims to provide a hot-melt adhesive with high moisture resistance and higher peeling resistance.

The invention provides the following technical scheme:

the hot melt adhesive comprises the following components in parts by weight: 30-40 parts of ethylene-vinyl acetate, 2-3 parts of paraffin, 34-47 parts of polyethylene, 0.1-2 parts of antioxidant, 1-5 parts of potassium sorbate and 15-20 parts of ethylene-propylene-butylene terpolymer.

Preferably, the composition comprises the following components in parts by weight: 35 parts of ethylene-vinyl acetate, 2.5 parts of paraffin, 40 parts of polyethylene, 0.15 part of antioxidant, 3 parts of potassium sorbate and 18 parts of ethylene-propylene-butylene terpolymer.

The invention also provides a preparation method of the hot melt adhesive, which comprises the following steps:

1) sequentially adding the components into a stirrer, and controlling the stirring temperature and time;

2) and stopping adding after all the components are completely melted and uniformly mixed, cooling and filtering to obtain the product.

Further, the heating temperature is 120-130 ℃, and the time is 4-5 h.

Compared with the prior art, the invention has the following advantages:

the hot-melt adhesive has higher peeling force, moderate initial adhesion and good elastic recovery rate; the preparation process is simple, the operability is strong, the production efficiency is high, and the method is suitable for large-scale production.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

The hot melt adhesive comprises the following components in parts by weight: 32 parts of ethylene-vinyl acetate, 2 parts of paraffin, 35 parts of polyethylene, 0.2 part of antioxidant, 4 parts of potassium sorbate and 18 parts of ethylene-propylene-butylene terpolymer.

Example 2

The hot melt adhesive comprises the following components in parts by weight: 35 parts of ethylene-vinyl acetate, 2.5 parts of paraffin, 40 parts of polyethylene, 0.15 part of antioxidant, 3 parts of potassium sorbate and 18 parts of ethylene-propylene-butylene terpolymer.

The results are shown in Table 1.

TABLE 1

Example of detection	Viscosity (cps) at 150 DEG C	Resistance to peeling after wetting
			Example 1	11240	Can not fall off
Example 2	9982	Can not fall off

The ginseng extracting solution has good stability, does not generate precipitate after being stored for a long time, better keeps the flavor and the effective component saponin of the ginseng, has good application in liquid food and health care products, and can meet the requirements of clients for internal and external sales. Compared with the traditional method for extracting ginseng, the method has the advantages of low concentration of alcohol solvent, low cost, environment-friendly process and high extraction rate of saponin.

The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.