阅读说明：本技术 一种电路板、x射线探测器及检测方法 (Circuit board, X-ray detector and detection method ) 是由 李博 王洪波 刘强 于 2020-11-19 设计创作，主要内容包括：本申请的一个实施例公开了一种电路板、X射线探测器及检测方法,该电路板包括：第一电路区、第二电路区、第三电路区和第四电路区,其中,第一电路区用于电连接光电二极管阵列芯片；第二电路区包括贯穿于所述第一电路区和第三电路区的导通孔,用于实现第一电路区与第三电路区的电连接导通；第三电路区包括焊盘部和安装部,其中,所述焊盘部用于连接电荷电流处理芯片,所述安装部用于连接探测器支架；第四电路区用于连接探测器连接器,以使得探测器连接器将所述电荷电流处理芯片的信号输出至数据采集处理装置。本申请针所述技术方案降低了X射线对电路板的损伤,通过构造新的探测器结构,减少了工艺步骤,降低了成本,提高了产品的可靠性。(An embodiment of the application discloses a circuit board, an X-ray detector and a detection method, wherein the circuit board comprises: the photoelectric conversion device comprises a first circuit area, a second circuit area, a third circuit area and a fourth circuit area, wherein the first circuit area is used for being electrically connected with a photodiode array chip; the second circuit area comprises a through hole penetrating through the first circuit area and the third circuit area and is used for realizing the electric connection and conduction of the first circuit area and the third circuit area; the third circuit area comprises a pad part and a mounting part, wherein the pad part is used for connecting a charge current processing chip, and the mounting part is used for connecting a detector support; the fourth circuit area is used for connecting a detector connector, so that the detector connector outputs the signal of the charge current processing chip to a data acquisition and processing device. The technical scheme reduces the damage of X-rays to the circuit board, reduces the process steps, reduces the cost and improves the reliability of products by constructing a new detector structure.)

1. A circuit board for an X-ray detector, comprising: a first circuit region, a second circuit region, a third circuit region and a fourth circuit region, wherein,

the first circuit area is used for electrically connecting the photodiode array chip;

the second circuit area comprises a via hole penetrating through the first circuit area and the third circuit area and is used for realizing the electric connection and the conduction of the first circuit area and the third circuit area;

the third circuit area comprises a bonding pad part and an installation part, wherein the bonding pad part is used for connecting a charge current processing chip, and the installation part is used for connecting a detector support;

and the fourth circuit area is used for connecting a detector connector so that the detector connector outputs the signal of the charge current processing chip to a data acquisition and processing device.

2. The circuit board of claim 1, wherein the second circuit area further comprises: and the X-ray shielding material is arranged in the second circuit area and is used for absorbing the X-rays which are not absorbed by the scintillator.

3. The circuit board of claim 1, wherein the fourth circuit area is made of a flexible material that can be bent for realizing splicing expansion of the circuit board.

4. An X-ray detector, characterized in that it comprises a circuit board according to any one of claims 1-3.

5. The probe of claim 4, further comprising:

a scintillator for absorbing X-rays and converting the X-rays into visible light signals;

the photodiode array chip is used for converting the visible light signal into a current signal;

the charge-current conversion chip is used for converting the current signal into a voltage signal or a digital signal;

and the detector connector is used for sending the voltage signal or the digital signal to a data acquisition and processing device, wherein the data acquisition and processing device is used for processing the voltage signal or the digital signal to obtain an identifiable image.

6. The detector of claim 5, wherein the scintillator and the photodiode array chip are connected by an optical coupling glue.

7. The detector of claim 5, wherein the photodiode array chip is connected to the circuit board by a structural adhesive, and electrodes of the photodiode array chip are connected to electrodes of the circuit board by a conductive adhesive.

8. A method of performing an assay using the probe of any one of claims 4 to 7, comprising:

the method comprises the steps that a scintillator absorbs X-rays carrying information of a detected target, and the X-rays are converted into visible light signals;

the photodiode array chip receives the optical signal and converts the visible light signal into a current signal, wherein the current signal is transmitted to the interior of the circuit board through an electrode of the photodiode array chip;

and the current signal flows through the first circuit region, bypasses the X-ray shielding material and is transmitted to a charge current processing chip connected with the third circuit region.

9. The method of claim 8, further comprising:

the charge current processing chip converts the current signal into a voltage signal or a digital signal;

the detector connector sends the voltage signal or the digital signal to a data acquisition and processing device;

and the data acquisition and processing device processes the voltage signal or the digital signal to obtain an identifiable image.

10. The method of claim 8, further comprising: the X-ray shielding material absorbs X-rays that are not completely absorbed by the scintillator.

Technical Field

The present application relates to the field of X-rays. And more particularly, to a circuit board, an X-ray detector and a detection method.

Background

In practical applications, the scintillator often has a non-sensitive region, and the radiation can directly pass through the non-sensitive region with little attenuation, and at the same time, the scintillator is difficult to completely absorb the X-ray, so that a small amount of high-energy X-ray passes through the scintillator. The X-rays that are not absorbed pass through the low density circuit board and the X-rays pass through the charge current handling chip. Because the charge current processing chip is manufactured by a semiconductor process, displacement damage and ionization damage are two typical forms of damage of a semiconductor chip device by high-energy rays, and the performance of the charge current processing chip is reduced by long-time X-ray irradiation, which is often expressed in the aspects of electric leakage increase, poor linearity, noise increase and the like.

The existing method for solving the irradiation damage has the problems of high cost, complex detector structure and difficult process design.

Disclosure of Invention

In order to solve at least one of the above problems, the present application proposes a circuit board, an X-ray detector and a detection method.

In a first aspect, the present application provides a circuit board for an X-ray detector, the circuit board comprising: a first circuit region, a second circuit region, a third circuit region and a fourth circuit region, wherein,

the first circuit area is used for electrically connecting the photodiode array chip;

the second circuit area comprises a via hole penetrating through the first circuit area and the third circuit area and is used for realizing the electric connection and the conduction of the first circuit area and the third circuit area;

the third circuit area comprises a bonding pad part and an installation part, wherein the bonding pad part is used for connecting a charge current processing chip, and the installation part is used for connecting a detector support;

and the fourth circuit area is used for connecting a detector connector so that the detector connector outputs the signal of the charge current processing chip to a data acquisition and processing device.

In a specific embodiment, the second circuit area further includes: and the X-ray shielding material is arranged in the second circuit area and is used for absorbing the X-rays which are not absorbed by the scintillator.

In a specific embodiment, the fourth circuit area is made of a flexible material capable of being bent, and is used for realizing splicing and expansion of the circuit board.

In a second aspect, the present application provides an X-ray detector comprising the circuit board of the first aspect.

In one embodiment, the detector further comprises:

a scintillator for absorbing X-rays and converting the X-rays into visible light signals;

the photodiode array chip is used for converting the visible light signal into a current signal;

the charge-current conversion chip is used for converting the current signal into a voltage signal or a digital signal;

and the detector connector is used for sending the voltage signal or the digital signal to a data acquisition and processing device, wherein the data acquisition and processing device is used for processing the voltage signal or the digital signal to obtain an identifiable image.

In one embodiment, the scintillator and the photodiode array chip are connected by an optical adhesive.

In a specific embodiment, the photodiode array chip and the circuit board are connected by structural adhesive.

In a third aspect, the present application provides a method for detecting with the detector of the second aspect, the method comprising:

the method comprises the steps that a scintillator absorbs X-rays carrying information of a detected target, and the X-rays are converted into visible light signals;

the photodiode array chip receives the optical signal and converts the visible light signal into a current signal, wherein the current signal is transmitted to the interior of the circuit board through an electrode of the photodiode array chip;

and the current signal flows through the first circuit region, bypasses the X-ray shielding material and is transmitted to a charge current processing chip connected with the third circuit region.

In a particular embodiment, the method further comprises:

the charge current processing chip converts the current signal into a voltage signal or a digital signal;

the detector connector sends the voltage signal or the digital signal to a data acquisition and processing device;

and the data acquisition and processing device processes the voltage signal or the digital signal to obtain an identifiable image.

In a particular embodiment, the method further comprises: the X-ray shielding material absorbs X-rays that are not completely absorbed by the scintillator.

The beneficial effect of this application is as follows:

the circuit board for the X-ray detector is provided aiming at the defects of the prior art, the damage of X-rays to semiconductor chip devices arranged on the circuit board is reduced, the integration level of an X-ray detector system is further improved by constructing a new detector structure, the process steps are reduced, the cost is reduced, the reliability of products is improved, and the circuit board has a very wide application prospect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 shows a schematic structural view of an X-ray detector according to an embodiment of the present application.

Fig. 2 shows a schematic diagram of a first circuit area according to an embodiment of the present application.

Fig. 3 shows a schematic diagram of a photodiode array chip according to one embodiment of the present application.

Fig. 4 shows a schematic diagram of a third circuit area according to an embodiment of the present application.

Fig. 5 shows a schematic diagram of a second circuit area according to an embodiment of the present application.

Fig. 6 shows a schematic view of a laminated structure of a circuit board according to an embodiment of the present application.

Fig. 7 shows a schematic diagram of the current flow direction inside the circuit board according to an embodiment of the application.

Fig. 8 shows a schematic diagram of the absorption of X-rays by the second circuit area according to an embodiment of the present application.

Detailed Description

In order to make the technical solutions and advantages of the present application more clear, the following detailed description of the embodiments of the present application will be made with reference to the accompanying drawings.

How to design a detector which is more compact, simple and feasible and has lower cost becomes a problem which the technical personnel in the field want to solve.

The present application provides a new X-ray detector structure, as shown in fig. 1, which comprises

The detector comprises a scintillator 6, a photodiode array chip 7, a charge current conversion chip 9, a detector connector 105 and a circuit board 100, wherein the scintillator 6 is used for absorbing X-rays and converting the X-rays into visible light signals; the photodiode array chip 7 is used for converting the visible light signal into a current signal; a charge-current conversion chip 9 for converting the current signal into a voltage signal or a digital signal; the scintillator 6 and the photodiode array chip 7 are bonded by an optical coupling adhesive 31, the photodiode array chip 7 and the circuit board 100 are bonded by a structural filling adhesive 32 and a conductive adhesive 33, wherein the conductive adhesive 33 is used for connecting electrodes 206 (anode) and 209 (cathode) of the photodiode array chip 7 and electrodes 201 (anode) and 208 (cathode) of the circuit board 100.

And the detector connector 105 is used for sending the voltage signal or the digital signal to a data acquisition and processing device, wherein the data acquisition and processing device is used for processing the voltage signal or the digital signal to obtain an identifiable image. Wherein the probe connector 105 may also be formed directly from a portion of the flexible circuit board to form a gold finger for connection with a corresponding mating connector.

The circuit board 100 is an innovative integrated circuit design, the circuit board 100 includes a first circuit region 101, a second circuit region 102, a third circuit region 103 and a fourth circuit region 104,

specifically, as shown in fig. 2, the first circuit region 101 provides contact electrodes 201 and 208 connected to the photodiode array chip 7, where 201 is an anode and 208 is a cathode; the schematic diagram of the photodiode array chip 7 is shown in fig. 3, wherein 205 is an array pixel, 206 and 209 are electrodes of the photodiode array chip for realizing transmission of electrical signals, 206 is an anode, and 209 is a cathode.

As shown in fig. 4, the third circuit region 103 provides a pad portion connected to the charge current processing chip 9; meanwhile, the third circuit region 103 provides a mounting region for connecting the X-ray detector with the detector support 11, and the detector support and the detector can be fixed by bonding through structural adhesive or by connecting through a circuit board welding screw. The detector support may provide threaded holes and locating pins for mounting and locating the detector module.

As shown in fig. 5, the second circuit region 102 provides via holes (via holes) 204 interconnecting the first circuit region 101 and the third circuit region 103, and the number of via holes is different depending on the number of pixels included in different photodiodes 7. The via 204 is used for connecting the electrodes of the front surface 201 and the back surface 202 through the internal leads of the circuit board, and is used for realizing the conduction between the first circuit area and the third circuit area.

In a specific example, the second circuit region 102 further includes an X-ray shielding material (high atomic number material) embedded inside the second circuit region 102 for absorbing X-rays that are not absorbed by the scintillator 6, which may be a material of tungsten, lead, molybdenum, an alloy thereof, or the like. The second circuit area 102 is directly pressed into the X-ray shielding material 12 by means of direct milling.

As shown in fig. 1, the fourth circuit region 104 provides a fan-out function of signals and power sources of the charge current processing chip 9, and the circuit board 100 is an innovative integrated circuit design, and the fourth circuit region is integrated with the first, second and third circuit regions by pressing. The fourth circuit area is made of a bendable flexible material, such as a flexible copper clad laminate made of a flexible circuit board material, and the flexible copper clad laminate refers to a copper clad laminate formed by bonding a single surface or double surfaces of a flexible insulating material such as a polyester film or a polyimide film with a copper foil through certain process treatment. The fourth circuit regions 104 may provide the ability to fan out signals perpendicular to the direction of the circuit board.

207 are the flexible circuit board and the opening part of the circuit board matrix, and the flexible circuit board is not combined with the hard board, so that the downward bending part of the flexible circuit board is not beyond the range of the circuit board edge, and the capability of splicing and expanding the detector module in the X direction and the Z direction is provided.

The integrated design of the circuit board 100 is independently completed by a circuit board manufacturer, and additional processing manufacturers are not needed to perform processing, so that the high-reliability connection of the detector and the reliability of product operation are realized, the product cost is greatly reduced, the compact basic framework of the detector is realized, the integration level is improved, and the integrated circuit has a very wide application prospect.

Referring to fig. 6, an embodiment of a circuit board is shown at 100. fig. 6 defines a schematic diagram of the process components and layer-to-layer interconnections of the particular circuit board. Of course, the number of layers of the circuit board can be arbitrarily set to be more, so as to realize similar design.

Fig. 7 shows the current flowing in the circuit board, the current will flow from each electrode of the photodiode array to the inside of the circuit board, the circuit board passes through the 101 area to make the signal flow to bypass the embedded high atomic number material, and finally passes through the 103 area to the charge processing chip, the charge processing chip converts the charge into a voltage signal or a digital signal, and finally sends the voltage signal or the digital signal to the previous stage of data processing system for processing through the connector 105 on 104. At the same time, 105 will also receive the control signal of the data processing system to control the charge processing chip 9.

As can be seen from fig. 8, in real system application, the radiation will be absorbed by the embedded high atomic number material 12, thereby protecting the charge current processing chip 9 and improving the reliability of the system.

By designing the detector module of the integrated circuit board, the integration level of an X-ray detector system can be improved, the process steps are reduced, the cost is reduced, and the reliability of a product is improved.

The circuit board for the X-ray detector is provided aiming at the defects of the prior art, the damage of X-rays to semiconductor devices arranged on the circuit board is reduced, the integration level of an X-ray detector system is further improved by constructing a new detector structure, the process steps are reduced, the cost is reduced, the reliability of products is improved, and the circuit board has a very wide application prospect.

It is noted that, in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

It should be understood that the above-mentioned examples are given for the purpose of illustrating the present application clearly and not for the purpose of limiting the same, and that various other modifications and variations of the present invention may be made by those skilled in the art in light of the above teachings, and it is not intended to be exhaustive or to limit the invention to the precise form disclosed.