阅读说明：本技术 一种用于半导体模块封装的视觉检测设备 (Visual inspection equipment for semiconductor module packaging ) 是由 王芳 刘连桥 王忠平 于 2020-07-28 设计创作，主要内容包括：本发明公开了一种用于半导体模块封装的视觉检测设备,包括底座,底座上固定有缸体,缸体的活塞杆上固定有第一环形板,第一环形板上设置有环形槽,环形槽内滑动设置有滑块,滑块上固定有第二环形板,第二环形板上固定有支撑杆,支撑杆上固定有支撑板,支撑板上固定嵌入有灯珠,支撑板还固定有摄像头,摄像头通过数据线与计算机主机连接,可通过计算机边进行摄像头的操作以及边观看拍摄情况。通过摄像头的上下移动以及转动,可在半导体在操作台上加工时,进行拍摄,且摄像头可进行位置调整,满足拍摄需求。(The invention discloses visual detection equipment for packaging a semiconductor module, which comprises a base, wherein a cylinder body is fixed on the base, a first annular plate is fixed on a piston rod of the cylinder body, an annular groove is formed in the first annular plate, a sliding block is arranged in the annular groove in a sliding manner, a second annular plate is fixed on the sliding block, a supporting rod is fixed on the second annular plate, a supporting plate is fixed on the supporting rod, a lamp bead is fixedly embedded in the supporting plate, a camera is also fixed on the supporting plate, and the camera is connected with a computer host through a data line and can be operated by the computer and can be watched at the same time. Through reciprocating and the rotation of camera, can add man-hour on the operation panel at the semiconductor, shoot, and the camera can carry out position control, satisfies the shooting demand.)

1. A visual inspection apparatus for semiconductor module packaging, comprising a base (1), characterized in that: be fixed with cylinder body (11) on base (1), be fixed with first annular slab (12) on the piston rod of cylinder body (11), be provided with ring channel (13) on first annular slab (12), it is provided with slider (14) to slide in ring channel (13), be fixed with second annular slab (15) on slider (14), be fixed with bracing piece (16) on second annular slab (15), be fixed with backup pad (17) on bracing piece (16), fixed embedding has lamp pearl (18) on backup pad (17), backup pad (17) still are fixed with camera (19).

2. The visual inspection apparatus for semiconductor module packages according to claim 1, wherein: the sliding block (14) is provided with a ball groove (2), a ball (21) is arranged in the ball groove (2) in a rolling mode, and the ball (21) is in rolling contact with the inner wall of the annular groove (13).

3. The visual inspection apparatus for semiconductor module packages according to claim 1, wherein: a motor (3) is fixed on the first annular plate (12), and a drive bevel gear (31) is fixed on a rotating shaft of the motor (3).

4. The visual inspection apparatus for semiconductor module packages according to claim 3, wherein: and a linkage bevel gear (32) is fixed on the second annular plate (15), and the linkage bevel gear (32) is meshed with the driving bevel gear (31).

5. The visual inspection apparatus for semiconductor module packages according to claim 1, wherein: the support rod (16) is provided with a positioning groove (4), the support plate (17) is fixed with a positioning block (41), and the positioning block (41) and the positioning groove (4) are arranged in a sliding insertion mode.

6. The visual inspection apparatus for semiconductor module packages according to claim 5, wherein: a groove (42) is formed in the aligning block (41), a clamping pin (43) is arranged in the groove (42) in a sliding mode, and the clamping pin (43) is connected with the groove (42) through a spring (44).

7. The visual inspection apparatus for semiconductor module packages according to claim 6, wherein: a through hole (45) is communicated with the alignment groove (4), and the bayonet pin (43) and the through hole (45) are arranged in a springing manner.

8. The visual inspection apparatus for semiconductor module packages according to claim 1, wherein: the base (1) is fixed with a support and is fixed with an operating platform (5), and the operating platform (5) is of a disc structure.

Technical Field

The invention belongs to the technical field of semiconductors, and particularly relates to a visual detection device for semiconductor module packaging.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip.

The visual inspection is to use a machine to replace human eyes for measurement and judgment, the visual inspection is to convert an object to be picked into an image signal through a machine vision product (namely an image pickup device, which is divided into a CMOS and a CCD), transmit the image signal to a special image processing system, convert the image signal into a digital signal according to information such as pixel distribution, brightness, color and the like, perform various operations on the signal by the image system to extract the characteristics of the object, and further control the on-site equipment action according to a judgment result, and the visual inspection is a valuable mechanism for production, assembly or packaging and has immeasurable value in the aspects of detecting defects and preventing the defective products from being distributed to consumers.

The quality identification of products needs to be carried out through visual inspection after the semiconductor packaging, but the camera on the visual equipment for the semiconductor packaging inspection at present is inconvenient to adjust when shooting, thereby greatly influencing the shooting effect and quality and influencing the detection result.

Disclosure of Invention

The invention aims to provide a visual inspection device for a semiconductor module package, which aims to solve the problem that a camera is inconvenient to adjust.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a visual detection equipment for semiconductor module encapsulation, includes the base, be fixed with the cylinder body on the base, be fixed with first annular slab on the piston rod of cylinder body, be provided with the ring channel on the first annular slab, it is provided with the slider to slide in the ring channel, be fixed with the second annular slab on the slider, be fixed with the bracing piece on the second annular slab, be fixed with the backup pad on the bracing piece, fixed embedding has the lamp pearl in the backup pad, and the lamp pearl is the LED lamp, and inserts row's grafting circular telegram through wire plug and indoor 220V power, the backup pad still is fixed with the camera, and the camera passes through the data line and is connected with the computer mainframe, and the accessible computer limit carries out the operation of camera and the limit and watches the shooting condition.

Preferably, the slider is provided with a ball groove, balls are arranged in the ball groove in a rolling mode, and the balls are in rolling contact with the inner wall of the annular groove and can rotate on the second annular plate, so that friction is reduced.

Preferably, a motor is fixed on the first annular plate, a drive bevel gear is fixed on a rotating shaft of the motor, the model of the motor is 4RK25GN-C, a forward and reverse rotation switch is fixed on a shell of the motor through a lead, the model of the forward and reverse rotation switch is HY2-8, and the motor is connected with an indoor 220V power strip in a plugging mode through a lead plug and is electrified.

Preferably, a linkage bevel gear is fixed on the second annular plate and meshed with the driving bevel gear, so that the second annular plate can rotate in a forward and reverse quarter circle.

Preferably, be provided with the counterpoint groove on the bracing piece, be fixed with the counterpoint piece in the backup pad, counterpoint piece and counterpoint groove sliding insertion set up, and convenient to detach backup pad carries out the maintenance position of lamp pearl and camera.

Preferably, the aligning block is provided with a groove, a bayonet lock is arranged in the groove in a sliding manner, and the bayonet lock is connected with the groove through a spring, so that the telescopic reset stability of the bayonet lock is ensured.

Preferably, a through hole is communicated with the alignment groove, and the clamping pin and the through hole are arranged in an elastic mode, so that the support plate and the support rod can be conveniently detached.

Preferably, a support fixed on the base is fixed with an operation table, and the operation table is of a disc structure, so that the semiconductor can be packaged on the operation table.

Compared with the prior art, the invention has the beneficial effects that: through reciprocating and the rotation of camera, can add man-hour on operation panel 5 at the semiconductor, shoot, and the camera can carry out position control, satisfies the shooting demand.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a partially enlarged view of the support plate and the support rod of the present invention;

FIG. 3 is a partially enlarged view of the slider and annular groove of the present invention;

FIG. 4 is a top view layout of a second annular plate and linked bevel gear of the present invention.

In the figure: 1. a base; 11. a cylinder body; 12. a first annular plate; 13. an annular groove; 14. a slider; 15. a second annular plate; 16. a support bar; 17. a support plate; 18. a lamp bead; 19. a camera; 2. a ball groove; 21. a ball bearing; 3. a motor; 31. a drive bevel gear; 32. linkage bevel gear; 4. a positioning groove; 41. a positioning block; 42. a groove; 43. a bayonet lock; 44. a spring; 45. a through hole; 5. an operation platform.

Detailed Description

Referring to fig. 1 and 2, a visual inspection device for semiconductor module packaging includes a base 1, a cylinder body 11 is fixed on the base 1, a first annular plate 12 is fixed on a piston rod of the cylinder body 11, an annular groove 13 is arranged on the first annular plate 12, a slider 14 is arranged in the annular groove 13 in a sliding manner, a second annular plate 15 is fixed on the slider 14, a support rod 16 is fixed on the second annular plate 15, a support plate 17 is fixed on the support rod 16, a lamp bead 18 is fixed on the support plate 17, the lamp bead 18 is an LED lamp and is plugged with an indoor 220V power strip through a wire plug to be powered on, a camera 19 is further fixed on the support plate 17, the camera 19 is connected with a computer host through a data line, and the operation of the camera 19 and the shooting condition can be viewed while the computer is operating.

Referring to fig. 1 and 3, the slider 14 is provided with a ball groove 2, the ball groove 2 is provided with balls 21 in a rolling manner, and the balls 21 are in rolling contact with the inner wall of the annular groove 13 and can rotate on the second annular plate 15 to reduce friction.

Referring to fig. 1, a motor 3 is fixed on a first annular plate 12, a driving bevel gear 31 is fixed on a rotating shaft of the motor 3, the model of the motor 3 is 4RK25GN-C, a forward and reverse rotation switch is fixed on a shell of the motor 3 through a lead, the model of the forward and reverse rotation switch is HY2-8, and the motor 3 is connected with an indoor 220V power strip through a lead plug in a plugging mode for electrifying.

Referring to fig. 1 and 4, a linkage bevel gear 32 is fixed on the second annular plate 15, and the linkage bevel gear 32 is engaged with the driving bevel gear 31, so that the second annular plate 15 can rotate forward and backward by a quarter of a circle.

Referring to fig. 2, the supporting rod 16 is provided with a positioning groove 4, the supporting plate 17 is fixed with a positioning block 41, the positioning block 41 and the positioning groove 4 are arranged in a sliding and inserting manner, and the supporting plate 17 is convenient to disassemble to carry out maintenance positions of the lamp beads 18 and the camera 19.

Referring to fig. 2, a groove 42 is formed in the aligning block 41, a bayonet 43 is slidably disposed in the groove 42, and the bayonet 43 is connected with the groove 42 through a spring 44 to ensure the telescopic resetting stability of the bayonet 43.

Referring to fig. 2, a through hole 45 is formed in the alignment groove 4, and the locking pin 43 and the through hole 45 are inserted into each other to facilitate the detachment of the support plate 17 from the support rod 16.

Referring to fig. 1, a support is fixed on a base 1, and a console 5 is fixed on the support, and the console 5 is a disk structure, so that a semiconductor can be packaged on the console 5.

The working principle of the scheme is as follows: when the detection is needed, the camera 19 is connected with the computer host through a data line, then the semiconductor module is packaged and processed on the operating table 5, a single or two cameras 19 and the lamp beads 18 are started according to any requirements, and the lamp beads 18 provide light sources.

When the height of the camera 19 needs to be adjusted, the height of the camera 19 can be moved up and down by pushing the piston rod of the cylinder 11.

When the camera 19 needs to rotate circumferentially around the operating table 5, the power supply of the motor 3 is switched on, the motor 3 is started through a forward switch or a reverse switch of the forward and reverse switches, and the motor 3 drives the drive bevel gear 31 to be meshed with the linkage bevel gear 32 to rotate, so that the second annular plate 15 performs forward rotation quarter circle or reverse rotation quarter circle operation, and therefore omnibearing shooting is guaranteed.

The sliding block 14 slides in the annular groove 13, and then the ball 21 is matched to be in rolling contact with the annular groove 13, so that the rotation stability of the second annular plate 15 is ensured.

When the maintenance lamp bead 18 or the camera 19 needs to be disassembled, the clamping pin 43 is pressed, so that the clamping pin 43 compresses the spring 44 to enter the groove 42, the separation from the through hole 45 is completed, and the disassembling work of the support plate 17 and the support rod 16 is completed.