阅读说明：本技术 一种蚀液蒸汽双重处理的刻蚀设备 (Etching equipment for double treatment of etching liquid and steam ) 是由 秦小燕 于 2020-07-27 设计创作，主要内容包括：本发明公开了一种蚀液蒸汽双重处理的刻蚀设备,刻蚀室的左右侧壁上部之间固定有上阻挡板；上阻挡板的上端面上成型有上收纳槽；上阻挡板的前后端面与刻蚀室的前后侧壁之间分别设置有间隙；刻蚀室的上侧壁中心设置有排气孔；刻蚀室的上端面设置有风机；排气孔与风机的进风孔连通；刻蚀室的左右侧壁上部分别成型有开口朝上设置的“凵”字形的左右贯穿的左右移动槽；上阻挡板位于左右移动槽开口内；左右移动槽内移动设置有与其配合的“凵”字形的左右平移架；左右平移架的外侧端设置有外封口板、内侧端竖直升降设置有刮拭封板。(The invention discloses etching equipment for double treatment of etching liquid and steam.A top barrier plate is fixed between the upper parts of the left side wall and the right side wall of an etching chamber; an upper accommodating groove is formed on the upper end surface of the upper barrier plate; gaps are respectively arranged between the front end surface and the rear end surface of the upper barrier plate and the front side wall and the rear side wall of the etching chamber; the center of the upper side wall of the etching chamber is provided with an exhaust hole; a fan is arranged on the upper end face of the etching chamber; the exhaust hole is communicated with an air inlet hole of the fan; left and right through left and right moving grooves with upward openings are respectively formed at the upper parts of the left and right side walls of the etching chamber; the upper blocking plate is positioned in the opening of the left-right moving groove; a left and right translation frame in a shape of a Chinese character 'ji' is arranged in the left and right moving groove in a moving way; the outer side end of the left translation frame and the outer side end of the right translation frame are provided with outer sealing plates, and the inner side end of the left translation frame and the right translation frame is vertically lifted and arranged with scraping sealing plates.)

1. The etching equipment for etching liquid and steam double treatment is characterized in that: comprises an etching chamber (10); an etching liquid spraying device (20) is arranged in the middle of the etching chamber (10); a plurality of spray heads (21) are arranged at the bottom of the etching liquid spraying device (20); the substrate (40) is arranged at the lower part of the etching chamber (10) and is positioned right below the etching liquid spraying device (20); an etching liquid steam treatment device (30) is arranged at the upper part of the etching chamber (10); the etching liquid vapor treatment device (30) comprises an upper baffle plate (12) fixed between the upper parts of the left and right side walls of the etching chamber (10); an upper receiving groove (120) in the shape of a rectangular groove is formed on the upper end surface of the upper blocking plate (12); gaps are respectively arranged between the front end surface and the rear end surface of the upper blocking plate (12) and the front side wall and the rear side wall of the etching chamber (10); an exhaust hole (101) is formed in the center of the upper side wall of the etching chamber (10); a fan (31) is arranged on the upper end surface of the etching chamber (10); the exhaust hole (101) is communicated with an air inlet hole of the fan (31); left and right through left and right moving grooves (100) with upward openings are respectively formed on the upper parts of the left and right side walls of the etching chamber (10); the upper blocking plate (12) is positioned in an opening of the left-right moving groove (100); a left and right translation frame (33) in a shape like a Chinese character 'ji' is arranged in the left and right moving groove (100) in a moving way; a gap is arranged between the upper end surface of the horizontal part of the left and right translation frame (33) and the upper side wall of the horizontal part of the left and right movement groove (100); an outer sealing plate (331) is arranged at the outer side end of the left and right translation frames (33), and a wiping sealing plate (332) is arranged at the inner side end of the left and right translation frames in a vertical lifting mode.

2. An etching apparatus for etching liquid vapor double treatment according to claim 1, characterized in that: an upper guide plate (11) is formed on the upper side wall of the etching chamber (10); the cross section of the upper guide plate (11) is isosceles trapezoid; the inclined plane of the upper guide plate (11) is positioned right above the gap between the upper blocking plate (12) and the front and rear side walls of the etching chamber (10), and the lower end surface of the upper guide plate (11) is smaller than the opening range of the upper accommodating groove (120); the exhaust hole (101) extends downwards to penetrate through the upper guide plate (11).

3. An etching apparatus for etching liquid vapor double treatment according to claim 1, characterized in that: the upper end surfaces of the horizontal parts of the left and right translation frames (33) are arranged downwards from inside to outside in an inclined way.

4. An etching apparatus for etching liquid vapor double treatment according to claim 3, characterized in that: a downward backflow hole (330) which penetrates downwards is formed at the outer side end of the horizontal part of the left and right translation frames (33); the lower reflux hole (330) is connected with an external recovery device through a hose; a pair of upper recovery conduits (34) are arranged on the upper side wall of the etching chamber (10) in a penetrating way; the lower end of the upper recovery conduit (34) is positioned in the upper storage groove (120) and the lower end surface of the upper recovery conduit (34) is higher than the bottom surface of the upper storage groove (120); the upper end of the upper recovery conduit (34) is connected with an external recovery device; an air outlet of the fan (31) is provided with an exhaust duct (311); the exhaust duct (311) is connected to an external recovery device.

5. An etching apparatus for etching liquid vapor double treatment according to claim 1, characterized in that: a pair of left and right driving cylinders (32) which are arranged in a left-right symmetrical mode are fixed on the upper end face of the etching chamber (10); the upper end surface of the outer sealing plate (331) is higher than the upper end surface of the etching chamber (10); the upper end of the outer sealing plate (331) is fixedly connected with a piston rod of the left and right driving cylinders (32).

6. An etching apparatus for etching liquid vapor double treatment according to claim 1, characterized in that: the scraping seal plate (332) is L-shaped; vertical driving plates (3321) extend from the front end and the rear end of the horizontal part of the wiping sealing plate (332); vertical driving cylinders (333) are respectively fixed at the inner side ends of the pair of vertical parts of the left and right translation frames (33); the vertical driving plate (3321) is fixed at the lower end of the piston rod of the vertical driving cylinder (333) at the corresponding side; when the wiper seal plate (332) is at the uppermost end, the upper end of the wiper seal plate (332) abuts against the bottom surface of the upper blocking plate (12).

7. An etching apparatus for etching liquid vapor double treatment according to claim 1, characterized in that: four side walls of the upper receiving groove (120) are arranged obliquely inwards from top to bottom.

Technical Field

The invention relates to the technical field of etching equipment, in particular to etching equipment for double treatment of etching liquid and steam.

Background

The manufacturing process of the array substrate mainly comprises five processes of cleaning, film forming, exposure and development, etching and stripping. The etching process is divided into dry etching and wet etching, and the wet etching is widely used for etching metal films and oxide films. The wet etching process mainly refers to a technology for removing an etching object by using chemical liquid. When the substrate to be etched is subjected to wet etching, the thin film which is not covered by the photoresist is removed through chemical reaction between the chemical liquid medicine and the etching object, so that electrode patterning is realized.

In wet etching equipment, acid etching liquid is generally sprayed to the surface of a substrate to be etched through a nozzle, and the acid etching liquid and a film layer on the surface of the substrate are subjected to chemical reaction, so that the purpose of etching is achieved. However, in the middle of the actual production process, the etching liquid drops sprayed and volatilized can be attached to the cover plate of the etching equipment, the etching liquid drops attached to the cover plate of the etching equipment are gradually accumulated to form larger and larger etching liquid drops, and finally the etching liquid drops are dropped on the substrate to be etched, so that the etching is uneven, and the yield of the product is seriously influenced.

Disclosure of Invention

The invention aims to solve the technical problem that the existing etching steam is easy to condense to form etching liquid to accidentally damage a substrate, and provides etching equipment for double treatment of the etching liquid and the steam.

The technical scheme for solving the technical problems is as follows: an etching device for etching liquid and steam double treatment comprises an etching chamber; an etching liquid spraying device is arranged in the middle of the etching chamber; the bottom of the etching liquid spraying device is provided with a plurality of spray heads; the substrate is arranged at the lower part of the etching chamber and is positioned right below the etching liquid spraying device; an etching liquid steam treatment device is arranged at the upper part of the etching chamber; the etching liquid vapor treatment device comprises an upper barrier plate fixed between the upper parts of the left side wall and the right side wall of the etching chamber; an upper receiving groove in a rectangular groove shape is formed on the upper end surface of the upper barrier plate; gaps are respectively arranged between the front end surface and the rear end surface of the upper barrier plate and the front side wall and the rear side wall of the etching chamber; the center of the upper side wall of the etching chamber is provided with an exhaust hole; a fan is arranged on the upper end face of the etching chamber; the exhaust hole is communicated with an air inlet hole of the fan; left and right through left and right moving grooves with upward openings are respectively formed at the upper parts of the left and right side walls of the etching chamber; the upper blocking plate is positioned in the opening of the left-right moving groove; a left and right translation frame in a shape of a Chinese character 'ji' is arranged in the left and right moving groove in a moving way; a gap is arranged between the upper end surface of the horizontal part of the left and right translation frame and the upper side wall of the horizontal part of the left and right movement groove; the outer side end of the left translation frame and the outer side end of the right translation frame are provided with outer sealing plates, and the inner side end of the left translation frame and the right translation frame is vertically lifted and arranged with scraping sealing plates.

As the optimization of the technical scheme, an upper guide plate is formed on the upper side wall of the etching chamber; the cross section of the upper guide plate is in an isosceles trapezoid shape; the inclined plane of the upper guide plate is positioned right above the gap between the upper barrier plate and the front and rear side walls of the etching chamber, and the lower end surface of the upper guide plate is smaller than the opening range of the upper accommodating groove; the exhaust hole extends downwards to penetrate through the upper guide plate.

Preferably, in the above-described aspect, the upper end surfaces of the horizontal portions of the left and right pan frames are inclined downward from the inside to the outside.

Preferably, the outer side ends of the horizontal parts of the left and right translation frames are formed with downward through-going downward backflow holes; the lower reflux hole is connected with an external recovery device through a hose; a pair of upper recovery guide pipes penetrate through the upper side wall of the etching chamber; the lower end of the upper recovery conduit is positioned in the upper containing groove, and the lower end surface of the upper recovery conduit is higher than the bottom surface of the upper containing groove; the upper end of the upper recovery conduit is connected with an external recovery device; the air outlet of the fan is provided with an air exhaust pipeline; the exhaust duct is connected with an external recovery device.

Preferably, a pair of left and right driving cylinders which are arranged symmetrically left and right are fixed on the upper end surface of the etching chamber; the upper end surface of the outer sealing plate is higher than the upper end surface of the etching chamber; the upper end of the outer sealing plate is fixedly connected with the piston rods of the left and right driving cylinders.

Preferably, the wiping sealing plate is L-shaped; vertical driving plates extend from the front end and the rear end of the horizontal part of the scraping sealing plate; vertical driving cylinders are respectively fixed at the inner side ends of a pair of vertical parts of the left and right translation frames; the vertical driving plate is fixed at the lower end of a piston rod of the vertical driving cylinder on the corresponding side; when the wiping seal plate is positioned at the uppermost end, the upper end of the wiping seal plate abuts against the bottom surface of the upper blocking plate.

Preferably, the four side walls of the upper receiving groove are inclined inward from top to bottom.

The invention has the beneficial effects that: the etching liquid steam is treated by a double mode of discharging and condensing and wiping, so that the etching liquid steam is thoroughly treated.

Drawings

FIG. 1 is a schematic structural view of a cross section of the present invention;

FIG. 2 is a schematic structural view of a cross section A-A of FIG. 1 according to the present invention.

In the figure, 10, an etching chamber; 100. a groove is moved left and right; 101. an exhaust hole; 11. an upper deflector; 12. an upper barrier plate; 120. an upper receiving groove; 20. an etching liquid spraying device; 21. a spray head; 30. an etching liquid vapor treatment device; 31. a fan; 311. an exhaust duct; 32. a left and right driving cylinder; 33. a left translation frame and a right translation frame; 330. a lower return hole; 331. an outer seal plate; 332. wiping the seal plate; 3321. a vertical drive plate; 333. a vertical driving cylinder; 34. an upper recovery conduit.

Detailed Description

As shown in fig. 1 and 2, an etching apparatus for dual processing of etching liquid vapor includes an etching chamber 10; an etching liquid spraying device 20 is arranged in the middle of the etching chamber 10; the bottom of the etching liquid spraying device 20 is provided with a plurality of spray heads 21; the substrate 40 is arranged at the lower part of the etching chamber 10 and is positioned right below the etching liquid spraying device 20; the upper part of the etching chamber 10 is provided with an etching liquid steam treatment device 30; the etching liquid vapor treatment device 30 includes an upper barrier plate 12 fixed between upper portions of left and right sidewalls of the etching chamber 10; an upper receiving groove 120 in the shape of a rectangular groove is formed on the upper end surface of the upper barrier plate 12; gaps are respectively arranged between the front end surface and the rear end surface of the upper barrier plate 12 and the front side wall and the rear side wall of the etching chamber 10; the center of the upper side wall of the etching chamber 10 is provided with an exhaust hole 101; the upper end surface of the etching chamber 10 is provided with a fan 31; the exhaust hole 101 is communicated with an air inlet hole of the fan 31; left and right moving grooves 100 which are arranged with upward openings and run through left and right are respectively formed on the upper parts of the left and right side walls of the etching chamber 10; the upper barrier plate 12 is positioned in the opening of the left-right moving groove 100; a left and right translation frame 33 in a shape of a Chinese character 'ji' is arranged in the left and right movement groove 100; a gap is provided between the upper end surface of the horizontal part of the left and right translational frames 33 and the upper side wall of the horizontal part of the left and right moving groove 100; an outer sealing plate 331 is provided at the outer end of the left and right translational frames 33, and a wiper sealing plate 332 is provided at the inner end thereof to be vertically lifted.

As shown in fig. 1 and fig. 2, an upper baffle 11 is formed on the upper sidewall of the etching chamber 10; the cross section of the upper guide plate 11 is isosceles trapezoid; the inclined surface of the upper guide plate 11 is positioned right above the gap between the upper barrier plate 12 and the front and rear side walls of the etching chamber 10, and the lower end surface of the upper guide plate 11 is smaller than the opening range of the upper receiving groove 120; the exhaust holes 101 extend downward through the upper baffle 11.

As shown in fig. 1 and 2, the upper end surfaces of the horizontal portions of the left and right translational frames 33 are disposed obliquely downward from the inside to the outside.

As shown in fig. 1 and 2, a downward reflow hole 330 is formed at the outer end of the horizontal portion of the left and right translational frames 33; the lower return hole 330 is connected to an external recovery device through a hose; a pair of upper recovery conduits 34 are arranged on the upper side wall of the etching chamber 10 in a penetrating way; the lower end of the upper recovery duct 34 is positioned in the upper receiving groove 120 and the lower end surface of the upper recovery duct 34 is higher than the bottom surface of the upper receiving groove 120; the upper end of the upper recovery duct 34 is connected to an external recovery device; an air outlet of the fan 31 is provided with an exhaust duct 311; the exhaust duct 311 is connected to an external recovery device.

As shown in fig. 1 and 2, a pair of left and right driving cylinders 32 symmetrically arranged left and right are fixed on the upper end surface of the etching chamber 10; the upper end surface of the outer sealing plate 331 is higher than the upper end surface of the etching chamber 10; the upper end of the outer sealing plate 331 is fixedly connected to the piston rod of the left and right driving cylinders 32.

As shown in fig. 1 and 2, the wiper seal plate 332 is L-shaped; vertical driving plates 3321 extend from the front and rear ends of the horizontal part of the wiper sealing plate 332; vertical driving cylinders 333 are fixed to the inner ends of the pair of vertical portions of the left and right translation frames 33, respectively; the vertical driving plate 3321 is fixed to the lower end of the piston rod of the vertical driving cylinder 333 of the corresponding side; when the wiper seal plate 332 is at the uppermost end, the upper end of the wiper seal plate 332 abuts against the bottom surface of the upper blocking plate 12.

As shown in fig. 1 and 2, four side walls of the upper receiving groove 120 are inclined inward from top to bottom.

The working principle of etching equipment for double treatment of etching liquid and steam;

when the etching chamber works, the left and right translation frames 33 are positioned at the outermost ends, the wiping seal plate 332 is positioned at the uppermost end, at the moment, the fan works, and etching liquid steam is discharged by the fan 31 from gaps between the front and rear end surfaces of the upper blocking plate 12 and the front and rear side walls of the etching chamber 10, a distance between the upper blocking plate 12 and the upper guide plate 11 and the exhaust holes 101; then the wiper seal plate 332 is lowered, the pair of left and right translation frames 33 are moved inward until they come into contact, and then the wiper seal plate 332 is raised to the uppermost end, at which time the upper end of the wiper seal plate 332 abuts against the bottom surface of the upper barrier plate 12; then the left and right translation frames 33 move outwards to return, and in the process, condensed small droplets of the etching solution on the bottom surface of the upper blocking plate 12 are scraped, so that the fan works always in cooperation with the left and right translation frames 33 to process the etching solution steam in an intermittent left and right reciprocating motion dual mode, and the etching solution steam is thoroughly processed;

meanwhile, the etching solution is recovered by an external recovery device connected with the lower reflux hole 330, the upper recovery duct 34 and the exhaust duct 311, so that the environmental pollution is prevented, and the etching solution can be recycled after being recovered, thereby solving the cost.

The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description herein, since various changes and modifications can be made in the details of the embodiment and the application range according to the spirit of the present invention.