阅读说明：本技术 基板归正装置及半导体加工设备 (Substrate reforming device and semiconductor processing equipment ) 是由 李宏岩 潘忠怀 于 2020-07-29 设计创作，主要内容包括：本发明提供一种基板归正装置及半导体加工设备,其中,基板归正装置包括成对设置的归正组件,用于通过夹持基板以使基板位于指定位置,归正组件包括主体支架、弹性缓冲组件和测控组件,主体支架用于与基板接触,以对基板进行归正,弹性缓冲组件设置在主体支架上,用于减缓主体支架与基板接触所产生的作用力,测控组件设置在主体支架上,用于驱动主体支架移动,并对主体支架的位置进行检测及控制。本发明提供的基板归正装置及半导体加工设备,能够降低废品率,并提高生产效率。(The invention provides a substrate reforming device and semiconductor processing equipment, wherein the substrate reforming device comprises reforming assemblies which are arranged in pairs and used for clamping a substrate to enable the substrate to be located at an appointed position, each reforming assembly comprises a main body support, an elastic buffer assembly and a measurement and control assembly, the main body support is used for being in contact with the substrate to reform the substrate, the elastic buffer assembly is arranged on the main body support and used for slowing down acting force generated by the contact of the main body support and the substrate, and the measurement and control assembly is arranged on the main body support and used for driving the main body support to move and detecting and controlling the position of the main body support. The invention provides a substrate reforming device and a semiconductor processing device, which can reduce the rejection rate and improve the production efficiency.)

1. The utility model provides a base plate device of reforming, is used for making through the centre gripping base plate including the subassembly of reforming that sets up in pairs the base plate is located the assigned position, a serial communication port, the subassembly of reforming includes main part support, elastic buffer subassembly and observes and controls the subassembly, wherein, the main part support be used for with the base plate contact is in order to right the base plate reforms, the elastic buffer subassembly sets up on the main part support, be used for slowing down the main part support with the produced effort of base plate contact, it sets up to observe and control the subassembly is in on the main part support, be used for the drive the main part support removes, and right the position of main part support detects and controls.

2. The substrate reforming device according to claim 1, wherein the main body support comprises a bearing table and a reforming component, the bearing table is used for bearing the elastic buffer component and the measurement and control component, the reforming component is movably arranged on the bearing table and can move along with the main body support and is used for contacting with the substrate, the elastic buffer component is respectively connected with the bearing table and the reforming component to reduce the acting force generated by the reforming component and the substrate contacting, and the measurement and control component is used for driving the bearing table to move and respectively detecting and controlling the relative position between the bearing table and the reforming component.

3. The substrate reforming device according to claim 2, wherein the measurement and control assembly comprises a driving unit, a first sensor and a second sensor, wherein the first sensor is disposed at a first preset position and is configured to send a first detection signal to the driving unit when the stage moves to the first preset position;

the second sensor is arranged on the bearing table, is positioned at a second preset position far away from the specified position relative to the correcting component, and is used for sending a second detection signal to the driving unit when the correcting component moves to the second preset position relative to the bearing table;

the driving unit is used for providing driving force for the bearing table so as to drive the bearing table to move, and the bearing table is controlled to stop moving when the first detection signal and/or the second detection signal are/is received.

4. The substrate reforming device according to claim 3, wherein the first sensor comprises a first photoelectric sensor, and the measurement and control assembly further comprises a first baffle plate, the first baffle plate is disposed on the carrier and can move along with the carrier, so as to shield the first photoelectric sensor when the carrier moves to the first preset position.

5. The substrate reforming device according to claim 3, wherein the second sensor comprises a second photoelectric sensor, and the measurement and control assembly further comprises a second shutter disposed on the reforming member and movable along with the reforming member, for shielding the second photoelectric sensor when the reforming member is moved to the second preset position.

6. The substrate reforming device according to claim 2, wherein the body support further comprises a guide rail and a slider; the guide rail sets up on the plummer, the slider with the part of reforming is connected, and with the guide rail cooperation sets up, be used for the elastic buffer subassembly slows down the part of reforming with during the produced effort of base plate contact, make the part of reforming can follow the guide rail slides.

7. The substrate reforming device according to claim 6, wherein the elastic buffer member comprises a compression spring and a fixing plate; the fixed plate is arranged on the bearing table and is far away from the designated position relative to the correcting component, one end of the compression spring is connected with the fixed plate, and the other end of the compression spring is connected with the correcting component.

8. The substrate reforming device according to claim 7, wherein the reforming part comprises a reforming head, a reforming rod and a connecting plate; the connecting plate is arranged on the sliding block and connected with the other end of the compression spring, the correcting rod is arranged on the connecting plate along the vertical direction, and the correcting head is arranged on the correcting rod and is used for being in contact with the substrate.

9. The substrate reforming apparatus as claimed in claim 8, wherein the elastic buffer assembly further comprises a guide rod, the connecting plate is provided with a guide hole, one end of the guide rod is connected to the fixing plate, the other end of the guide rod is inserted into the guide hole and can move in the guide hole, and the compression spring is sleeved around the guide rod.

10. A semiconductor processing apparatus, characterized in that a substrate is aligned using the substrate alignment apparatus as claimed in any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of semiconductor equipment, in particular to a substrate reforming device and semiconductor processing equipment.

Background

The glass substrate correcting device is applied to the liquid crystal panel production line and the solar cell production line, and the glass substrate is corrected by the glass substrate correcting device, so that the glass substrate can run more stably in production equipment, and the safety of the glass substrate in the conveying process is ensured.

As shown in fig. 1, the conventional glass substrate correcting device includes two sets of correcting assemblies which are arranged oppositely, each set of correcting assembly includes a correcting head 11, a support rod 12, a push plate 13, a blocking piece 14 and a sensor 15, wherein two ends of the support rod 12 are respectively connected with the push plate 13 and the correcting head 11, the blocking piece 14 is fixed on the push plate 13, the sensors 15 in the two sets of correcting assemblies are fixed at preset positions, and the preset positions meet the requirement that when the blocking pieces 14 in the two sets of correcting assemblies are all moved to positions for shielding the sensors 15 in each set, the distance between the correcting heads 11 in the two sets of correcting assemblies is the length a of the glass substrate 10 with preset standard size in the opposite direction of the two sets of correcting assemblies. When the glass substrate 10 to be corrected is corrected, the push plates 13 in the two sets of correcting assemblies drive the support rod 12, the correcting head 11 and the blocking piece 14 to move relatively under the driving of the driving unit, when the push plates 13 drive the blocking piece 14 to move to the position blocking the sensor 15, the sensor 15 sends a signal to the driving unit, and the driving unit stops driving the push plates 13 after receiving the signal, so that the correction of the glass substrate 10 is completed.

However, in the liquid crystal panel production line and the solar cell production line, there may occur a situation that an upstream device transfers a glass substrate 10 with a wrong size, when the length of the glass substrate 10 with the wrong size in the direction in which the two sets of restoring assemblies are opposite is greater than the length a, since the driving device of the conventional glass substrate restoring device is stopped only when the sensor 15 is shielded by the blocking piece 14, the glass substrate is seriously deformed and even broken (as shown in fig. 2), which not only causes an increase in rejection rate and economic loss, but also affects the normal operation of the production equipment, and reduces the processing efficiency.

Disclosure of Invention

The present invention is directed to solve at least one of the problems of the prior art, and provides a substrate reforming apparatus and a semiconductor processing apparatus, which can reduce the rejection rate and improve the production efficiency.

The substrate reforming device comprises reforming components which are arranged in pairs and are used for clamping a substrate to enable the substrate to be located at a designated position, wherein each reforming component comprises a main body support, an elastic buffer component and a measurement and control component, the main body support is used for being in contact with the substrate to reform the substrate, the elastic buffer component is arranged on the main body support and is used for slowing acting force generated by the contact of the main body support and the substrate, and the measurement and control component is arranged on the main body support and is used for driving the main body support to move and detecting and controlling the position of the main body support.

Preferably, the main part support includes the plummer and reforms the part, the plummer is used for bearing the elastic buffer subassembly with observe and control the subassembly, the mobilizable setting of part of reforms is in on the plummer, and can follow the main part support removes, be used for with the base plate contact, the elastic buffer subassembly respectively with the plummer with the part of reforms is connected, in order to slow down the part of reforms with the produced effort of base plate contact, it is used for the drive to observe and control the subassembly the plummer removes, and is right respectively the plummer with relative position between the part of reforms detects and controls.

Preferably, the measurement and control assembly comprises a driving unit, a first sensor and a second sensor, wherein the first sensor is arranged at a first preset position and used for sending a first detection signal to the driving unit when the plummer moves to the first preset position;

the second sensor is arranged on the bearing table, is positioned at a second preset position far away from the specified position relative to the correcting component, and is used for sending a second detection signal to the driving unit when the correcting component moves to the second preset position relative to the bearing table;

the driving unit is used for providing driving force for the bearing table so as to drive the bearing table to move, and the bearing table is controlled to stop moving when the first detection signal and/or the second detection signal are/is received.

Preferably, first sensor includes a photoelectric sensor, observe and control the subassembly and still include first baffle, first baffle sets up on the plummer, and can follow the plummer removes, is used for the plummer removes extremely during first predetermined position, will a photoelectric sensor shelters from.

Preferably, the second sensor includes second photoelectric sensor, observe and control the subassembly and still include the second baffle, the second baffle sets up on the part of reforming to can follow the part of reforming removes, be used for the part of reforming removes to when the second presets the position, will second photoelectric sensor shelters from.

Preferably, the main body bracket further comprises a guide rail and a slide block; the guide rail sets up on the plummer, the slider with the part of reforming is connected, and with the guide rail cooperation sets up, be used for the elastic buffer subassembly slows down the part of reforming with during the produced effort of base plate contact, make the part of reforming can follow the guide rail slides.

Preferably, the elastic buffer assembly comprises a compression spring and a fixing plate; the fixed plate is arranged on the bearing table and is far away from the designated position relative to the correcting component, one end of the compression spring is connected with the fixed plate, and the other end of the compression spring is connected with the correcting component.

Preferably, the correcting part comprises a correcting head, a correcting rod and a connecting plate; the connecting plate is arranged on the sliding block and connected with the other end of the compression spring, the correcting rod is arranged on the connecting plate along the vertical direction, and the correcting head is arranged on the correcting rod and is used for being in contact with the substrate.

Preferably, the elastic buffering assembly further comprises a guide rod, a guide hole is formed in the connecting plate, one end of the guide rod is connected with the fixing plate, the other end of the guide rod penetrates through the guide hole and can move in the guide hole, and the compression spring is sleeved on the periphery of the guide rod.

The invention also provides semiconductor processing equipment, and the substrate is corrected by adopting the substrate correcting device provided by the invention.

The invention has the following beneficial effects:

according to the substrate correcting device provided by the invention, the substrates are clamped by the correcting assemblies arranged in pairs so as to be positioned at the designated positions, and the correction of the substrates is realized. The component of reforming includes main part support, elastic buffer subassembly and observes and controls the subassembly, and the component of reforming carries out the in-process of centre gripping to the base plate, through observing and controlling the removal of subassembly drive main part support to make main part support can contact with the base plate, and detect and control the position of main part support through observing and controlling the subassembly, so that main part support can reform the base plate at the in-process with the base plate contact. In the process of contacting the main body support and the substrate, the acting force generated by contacting the main body support and the substrate is reduced by the elastic buffer assembly, namely, the mutual acting force between the main body support and the substrate in the process of contacting can be reduced, so that the acting force applied to the substrate by the main body support in the process is reduced, the damage of the substrate due to the overlarge acting force applied to the substrate by the main body support is avoided, the rejection rate can be reduced, the probability of influencing the normal operation of production equipment due to the damage of the substrate is reduced, and the production efficiency can be improved.

The semiconductor processing equipment provided by the invention has the advantages that the substrate is corrected by the substrate correcting device provided by the invention, so that the rejection rate can be reduced, and the production efficiency can be improved.

Drawings

Fig. 1 is a schematic view illustrating a conventional glass substrate reforming apparatus when reforming a glass substrate of a standard size;

fig. 2 is a schematic view illustrating a conventional glass substrate reforming apparatus when a glass substrate of an incorrect size is reformed;

fig. 3 is a schematic structural diagram of a substrate return apparatus according to an embodiment of the present invention when return is not performed;

fig. 4 is a schematic structural diagram illustrating a substrate reforming apparatus according to an embodiment of the present invention when reforming a substrate with a predetermined size a;

fig. 5 is a schematic structural diagram of a substrate reforming device according to an embodiment of the present invention, when reforming a substrate with a size B larger than a predetermined size a;

fig. 6 is a schematic structural diagram of a substrate reforming device according to an embodiment of the present invention, relative to a substrate having a size C smaller than a predetermined size a;

description of reference numerals:

10-a glass substrate; 11-correcting the head; 12-a support bar; 13-push plate; 14-a baffle plate; 15-a sensor; 20-a reforming assembly; 21-a bearing platform; 22-a righting member; 221-correcting the head; 222-a righting rod; 223-connecting plate; 23-a resilient cushioning component; 231-a compression spring; 232-fixing plate; 241-a first sensor; 242 — a second sensor; 243-first baffle; 244 — a second baffle; 25-a guide rail; 26-a slide block; 27-a guide bar; 28-a lock nut; 30-substrate.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the substrate reforming apparatus and the semiconductor processing apparatus provided by the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 3-6, the present embodiment provides a substrate aligning apparatus, which includes aligning assemblies 20 disposed in pairs for clamping a substrate 30 to enable the substrate 30 to be located at a designated position, the aligning assemblies 20 include a main body support, an elastic buffer assembly 23, and a measurement and control assembly, wherein the main body support is used for contacting the substrate 30 to align the substrate 30, the elastic buffer assembly 23 is disposed on the main body support for slowing down an acting force generated by the contact between the main body support and the substrate 30, and the measurement and control assembly is disposed on the main body support for driving the main body support to move and detecting and controlling a position of the main body support.

The substrate reforming device provided by this embodiment clamps the substrate 30 through the reforming assemblies 20 arranged in pairs, so that the substrate 30 is located at a designated position, and reforming of the substrate 30 is realized. The component 20 of reforming includes main part support, elasticity buffering subassembly 23 and observes and controls the subassembly, and the component 20 of reforming carries out the in-process of centre gripping to base plate 30, through observing and controlling the removal of subassembly drive main part support to make main part support can contact with base plate 30, and detect and control the position of main part support through observing and controlling the subassembly, so that main part support can reform the base plate 30 at the in-process with the contact of base plate 30. In the process of contacting the main body bracket and the substrate 30, the acting force generated by the contact of the main body bracket and the substrate 30 is reduced by the elastic buffer assembly 23, namely, the mutual acting force between the main body bracket and the substrate 30 in the contact process is reduced, so that the acting force applied to the substrate 30 by the main body bracket in the process is reduced, the damage of the substrate 30 due to the overlarge acting force applied to the substrate by the main body bracket is avoided, the rejection rate can be reduced, the probability of influencing the normal operation of production equipment due to the damage of the substrate 30 is reduced, and the production efficiency can be improved.

As shown in fig. 3-6, in a preferred embodiment of the present invention, the main body support may include a supporting platform and a centering component, the supporting platform is used for supporting an elastic buffer component and a measurement and control component, the centering component is movably disposed on the supporting platform and can move along with the main body support for contacting with the substrate, the elastic buffer component is respectively connected with the supporting platform and the centering component to reduce an acting force generated by the contact between the centering component and the substrate, and the measurement and control component is used for driving the supporting platform to move and respectively detecting and controlling a relative position between the supporting platform and the centering component.

Specifically, as shown in fig. 3 and 4, in the process of aligning the substrate 30 by the aligning assembly 20, the measurement and control assemblies in the aligning assembly 20 that are arranged in pairs simultaneously drive the respective carrier table 21 to move toward the direction close to the substrate 30, so as to drive the aligning member 22 arranged on the carrier table 21 to move toward the direction close to the substrate 30, and in the process of driving the carrier table 21 to move by the measurement and control assemblies, the measurement and control assemblies detect the relative position between the carrier table 21 and the aligning member 22, so as to control the carrier table 21 to move or stop. After the aligning component 22 contacts the substrate 30, if the relative position between the carrier table 21 and the aligning component 22 does not satisfy the condition that the measurement and control component stops driving the carrier table 21, the measurement and control component continues to drive the carrier table 21 to move toward the substrate 30, and if the relative position between the carrier table 21 and the aligning component 22 satisfies the condition that the measurement and control component stops driving the carrier table 21, the measurement and control component stops driving the carrier table 21.

After the aligning member 22 contacts the substrate 30 and the measurement and control assembly continues to drive the carrier 21 to move toward the substrate 30, an interaction force is generated between the aligning member 22 and the substrate 30, since the aligning member 22 is movably disposed on the carrier 21, the substrate 30 applies a force to the aligning member 22, so that the aligning member 22 moves relative to the carrier 21 in a direction away from the substrate 30, since the elastic buffer assembly 23 is respectively connected to the carrier 21 and the aligning member 22, when the carrier 21 and the aligning member 22 move relative to each other, an interaction force is generated between the aligning member 22 and the elastic buffer assembly 23, so that the interaction force between the aligning member 22 and the substrate 30 is converted into an interaction force between the aligning member 22 and the elastic buffer assembly 23 by the elastic buffer assembly 23, so as to slow down the interaction force between the aligning member 22 and the substrate 30, so as to avoid the substrate 30 from being damaged due to the excessive force applied by the centering member 22 to the substrate 30, and to still apply a certain force to the carrier 21 due to the elastic buffer assembly 23 when the interaction force between the centering member 22 and the substrate 30 is reduced, so that the centering member 22 can center the substrate 30.

After the substrate 30 is aligned, the measurement and control assembly may drive the carrier 21 to move in a direction away from the substrate 30, so as to drive the alignment component 22 disposed on the carrier 21 to move in a direction away from the substrate 30, so as to separate the alignment component 22 from the substrate 30, and as the alignment component 22 is separated from the substrate 30, the interaction force between the alignment component 22 and the substrate 30 disappears, at this time, the alignment component 22 moves in a direction away from the substrate 30 relative to the carrier 21, and the interaction force between the alignment component 22 and the elastic buffer assembly 23 generated by the movement of the alignment component 22 relative to the carrier 21 may move in a direction close to the substrate 30, so that the relative position between the alignment component 22 and the carrier 21 is restored to a state before the alignment component 22 contacts the substrate 30, so that the alignment component 20 can continue to align the next substrate 30.

As shown in fig. 3 to 6, in a preferred embodiment of the present invention, the measurement and control assembly may include a driving unit (not shown), a first sensor 241 and a second sensor 242, wherein the first sensor 241 is disposed at a first preset position and is configured to send a first detection signal to the driving unit when the carrier table 21 moves to the first preset position; the second sensor 242 is disposed on the carrying table 21 and located at a second preset position away from the designated position relative to the righting member 22, and is configured to send a second detection signal to the driving unit when the righting member 22 moves to the second preset position relative to the carrying table 21; the driving unit is used for providing a driving force to the bearing table 21 so as to drive the bearing table 21 to move, and controlling the bearing table 21 to stop moving when receiving the first detection signal and/or the second detection signal.

As shown in fig. 3 to 6, alternatively, the first sensor 241 may be disposed at a position (i.e., a first preset position) where the stage 21 is located when the centering member 22 contacts the substrate 30 of the preset size a and centers the substrate 30 of the preset size a, and the second sensor 242 may be disposed on the stage 21, and may be disposed at a position (i.e., a second preset position) where the centering member 22 can move in a direction away from the substrate 30 with respect to the stage 21 when the stage 21 continues to move in a direction close to the substrate 30 and does not move to the first preset position after the centering member 22 contacts the substrate 30 of the size B larger than the preset size a.

In the process of aligning the substrate 30 by the aligning assembly 20, as shown in fig. 3 and 4, if the size of the substrate 30 is the preset size a, when the driving unit drives the carrier 21 to move toward the direction close to the substrate 30 with the preset size a, and when the aligning member 22 on the carrier 21 aligns the substrate 30 with the preset size a, the carrier 21 moves to the first preset position, the first sensor 241 sends a first detection signal to the driving unit, and the driving unit controls the carrier 21 to stop moving after receiving the first detection signal, so as to complete aligning the substrate 30 with the preset size a.

As shown in fig. 5, if the size of the substrate 30 is the size B larger than the predetermined size a, when the driving unit drives the carrier 21 to move toward the substrate 30 close to the size B, since the size B is larger than the predetermined size a, when the restoring component 22 on the carrier 21 contacts the substrate 30 of the size B, the carrier 21 has not moved to the first predetermined position, at this time, since the carrier 21 has not moved to the first predetermined position, the restoring component 22 has not moved to the second predetermined position, therefore, the driving unit will not receive the first detection signal nor the second detection signal, which makes the driving unit further drive the carrier 21 to move toward the substrate 30 close to the size B, at this time, the restoring component 22 will move toward the substrate 30 far from the size B relative to the carrier 21, and the angelica component 22 will move toward the substrate 30 far from the size B relative to the carrier 21 to the second predetermined position, the second sensor 242 sends a second detection signal to the driving unit, and the driving unit controls the carrier 21 to stop moving after receiving the second detection signal, so as to prevent the substrate 30 of the size B larger than the preset size a from being damaged by being crushed by the centering components 22 in the centering assemblies 20 arranged in pairs.

As shown in fig. 6, if the size of the substrate 30 is the size C smaller than the preset size a, when the driving unit drives the carrier table 21 to move toward the substrate 30 close to the size C, since the size C is smaller than the preset size a, when the carrier table 21 moves to the first preset position, the centering members 22 still do not contact the substrate 30 of the size C, so that the substrate 30 of the size C smaller than the preset size a is not damaged by being crushed by the centering members 22 arranged in pairs.

In practical applications, the first predetermined position of the first sensor 241 and the second predetermined position of the second sensor 242 are not limited to the above positions. For example, the first sensor 241 may be disposed at a position to which the stage 21 can move in a direction to approach the substrate 30 of the predetermined size a after the aligning member 22 aligns the substrate 30 of the predetermined size a, and the second sensor 242 may be disposed at a position where the aligning member 22 is located relative to the stage 21 when the stage 21 moves in a direction to approach the substrate 30 of the size B to the first predetermined position after the aligning member 22 contacts the substrate 30 of the size B larger than the predetermined size a.

Alternatively, the driving unit may include a linear driving device such as an electric cylinder, and a linear driving force is applied to the carrier table 21 by the linear driving device such as the electric cylinder to enable the carrier table 21 to move.

As shown in fig. 3 to fig. 6, in a preferred embodiment of the present invention, the first sensor 241 may include a first photoelectric sensor, and the measurement and control assembly further includes a first barrier 243, where the first barrier 243 is disposed on the carrier table 21 and can move along with the carrier table 21, so as to shield the first photoelectric sensor when the carrier table 21 moves to the first preset position.

Specifically, in the process that the bearing platform 21 moves to the first preset position, the first baffle 243 arranged on the bearing platform 21 moves along with the bearing platform 21, and shields the first photoelectric sensor when the bearing platform 21 moves to the first preset position, so that the first photoelectric sensor can generate a first detection signal when the bearing platform 21 moves to the first preset position, and sends the first detection signal to the driving unit, so that the bearing platform 21 is controlled by the driving unit to stop moving.

In practical applications, the type of the first sensor 241 is not limited to the first photoelectric sensor, and a first collision sensor may be used, in which case, the first barrier 243 may be configured to collide with the first collision sensor when the carrier table 21 moves to the first preset position, so that the first collision sensor can generate a first detection signal when the carrier table 21 moves to the first preset position, and send the first detection signal to the driving unit, so as to control the carrier table 21 to stop moving through the driving unit. In addition, the first baffle 243 is not arranged on the bearing platform 21, but the first photoelectric sensor is arranged at a position where the bearing platform 21 can directly shield the first photoelectric sensor when the bearing platform 21 moves to the first preset position, or the first collision sensor is directly arranged at a position where the bearing platform 21 can collide with the first photoelectric sensor when the bearing platform 21 moves to the first preset position, and the first baffle 243 is arranged on the bearing platform 21, so that the position of the bearing platform 21 can be determined more accurately, the operation accuracy of the substrate correcting device is improved, the rejection rate is further reduced, and the production efficiency is further improved.

As shown in fig. 3-6, in a preferred embodiment of the present invention, the second sensor 242 may include a second photoelectric sensor, and the measurement and control assembly further includes a second blocking plate 244, where the second blocking plate 244 is disposed on the righting member 22 and can move along with the righting member 22, and is used for blocking the second photoelectric sensor when the righting member 22 moves to the second preset position.

Specifically, when the correcting part 22 moves relative to the carrier table 21 in a direction away from the substrate 30, the second blocking plate 244 disposed on the correcting part 22 moves along with the correcting part 22, and blocks the second photoelectric sensor when the correcting part 22 moves to the second preset position relative to the carrier table 21, so that the second photoelectric sensor can generate the second detection signal when the correcting part 22 moves to the second preset position relative to the carrier table 21, and send the second detection signal to the driving unit, so as to control the carrier table 21 to stop moving through the driving unit.

In practical applications, the type of the second sensor 242 is not limited to the second photoelectric sensor, and a second collision sensor may be used, in which case, the second baffle 244 may be configured to collide with the second collision sensor when the righting member 22 moves to the second preset position relative to the carrier table 21, so that the second collision sensor can generate a second detection signal when the righting member 22 moves to the second preset position relative to the carrier table 21, and send the second detection signal to the driving unit to control the carrier table 21 to stop moving through the driving unit. In addition, the second baffle 244 may not be disposed on the reforming part 22, but the second photoelectric sensor is disposed at a position where the reforming part 22 can directly shield the reforming part 22 when the reforming part 22 moves to the second preset position relative to the plummer 21, or the second collision sensor is disposed at a position where the reforming part 22 can directly collide with the plummer 21 when the reforming part 22 moves to the second preset position relative to the plummer 21, and the second baffle 244 is disposed on the reforming part 22, so that the position of the reforming part 22 can be determined more accurately, thereby improving the accuracy of the operation of the substrate reforming device, further reducing the rejection rate, and further improving the production efficiency.

As shown in fig. 3 to 6, in a preferred embodiment of the present invention, the main body frame may further include a guide rail and a slider; the guide rail 25 is disposed on the carrier 21, and the slider 26 is connected to the centering member 22 and disposed in cooperation with the guide rail 25 for enabling the centering member 22 to slide along the guide rail 25 when the elastic buffer assembly 23 reduces the force generated by the contact between the centering member 22 and the substrate 30. Thereby, the movable arrangement of the righting member 22 on the carrier table 21 is realized, however, the movable arrangement of the righting member 22 on the carrier table 21 is not limited to this manner.

As shown in fig. 3 to 6, in a preferred embodiment of the present invention, the elastic buffer assembly 23 may include a compression spring 231 and a fixing plate 232; the fixing plate 232 is disposed on the carrier table 21 and is away from a predetermined position with respect to the centering unit 22, and one end of the compression spring 231 is connected to the fixing plate 232 and the other end is connected to the centering unit 22.

When the aligning member 22 receives the urging force applied thereto from the substrate 30, the aligning member 22 applies the urging force to the compression spring 231 to compress the compression spring 231, and after the aligning member 22 is separated from the substrate 30, the urging force applied to the aligning member 22 from the substrate 30 disappears, so that the compression spring 231 applies the urging force to the aligning member 22 opposite to the urging force applied when the compression spring 231 is compressed, and the relative position between the aligning member 22 and the stage 21 is returned to the relative position between the aligning member 22 and the stage 21 before the aligning member 22 comes into contact with the substrate 30.

Before the substrate return device returns the substrate 30, the compression spring 231 is at the initial length X (as shown in fig. 3), and when the substrate 30 of the preset size a is returned, the length of the compression spring 231 is compressed to the length Y (as shown in fig. 4), and at this time, the amount of deformation of the compression spring 231 that is compressed is X-Y, which is the amount of normal deformation generated by the compression spring 231 when the substrate 30 of the preset size a is returned. When the base plate 30 of the size B larger than the predetermined size a is returned, the length of the compression spring 231 is compressed to the length Z (as shown in fig. 5), and at this time, the amount of deformation of the compression spring 231 compressed is X-Z, which is the amount of abnormal deformation of the compression spring 231 generated when the base plate 30 of the size B larger than the predetermined size a is returned. On the other hand, if the size of the substrate 30 is the size C smaller than the predetermined size a, the restoring member 22 does not contact the substrate 30 of the size C, and thus the length of the compression spring 231 is always the length X (as shown in fig. 6).

As shown in fig. 3-6, in a preferred embodiment of the present invention, the centering part 22 may include a centering head 221, a centering bar 222, and a connecting plate 223; a connection plate 223 is provided on the slider 26 and connected to the other end of the compression spring 231, a return lever 222 is provided on the connection plate 223 in the vertical direction, and a return head 221 is provided on the return lever 222 for contacting the base plate 30. However, the type of the reforming part 22 is not limited thereto.

Alternatively, the second shutter 244 may be provided on the connection plate 223, but the position of the second shutter 244 is not limited thereto.

As shown in fig. 3-6, in a preferred embodiment of the present invention, the elastic buffer assembly 23 may further include a guide rod 27, the connecting plate 223 is provided with a guide hole, one end of the guide rod 27 is connected to the fixing plate 232, the other end of the guide rod 27 is inserted into the guide hole and can move in the guide hole, and the compression spring 231 is sleeved around the guide rod 27. The guide bar 27 allows the connecting plate 223 to move along the guide bar 27 when the aligning member 22 moves relative to the stage 21, so that the aligning member 22 can move along the guide bar 27, thereby improving the stability of the movement of the aligning member 22 relative to the stage 21 and the stability of the use of the substrate aligning apparatus.

As shown in fig. 3-6, in a preferred embodiment of the present invention, the elastic buffer assembly 23 may further include an adjusting member, which is disposed at one end of the compression spring 231 and is used for adjusting the initial length of the compression spring 231, so as to adjust the amount of the force applied to the centering member 22 by the elastic buffer assembly 23 when the centering member 22 moves relative to the carrier 21, so as to prevent the substrate 30 from being damaged due to the damage caused by the grinding of the centering members 22 in the centering assemblies 20 disposed in pairs when the force applied by the centering member 22 is too large, thereby further reducing the rejection rate and further improving the production efficiency. Further, by adjusting the magnitude of the force applied to the aligning member 22 by the elastic buffer unit 23 when the aligning member 22 moves relative to the stage 21, it is possible to align the substrates 30 having different qualities, thereby improving the adaptability of the substrate aligning apparatus and the productivity.

As shown in fig. 3 to 6, in a preferred embodiment of the present invention, the adjusting means includes a lock nut 28, the guide rod 27 is provided with a screw thread to be engaged with the lock nut 28, the lock nut 28 is coupled to one end of the compression spring 231 and is screw-engaged with the guide rod 27, and the initial length of the compression spring 231 is adjusted by rotating the lock nut 28.

Specifically, the lock nut 28 can be moved on the guide rod 27 along the axis of the guide rod 27 by rotating the lock nut 28, and when the lock nut 28 is moved in the direction away from the fixing plate 232 along the axis of the guide rod 27, the distance between the lock nut 28 and the connecting plate 223 decreases, the initial length of the compression spring 231 decreases, and when the lock nut 28 is moved in the direction closer to the fixing plate 232 along the axis of the guide rod 27, the distance between the lock nut 28 and the connecting plate 223 increases, and the initial length of the compression spring 231 increases.

As another technical solution, the present embodiment also provides a semiconductor processing apparatus, which uses the substrate reforming device provided in the present embodiment to reform the substrate 30.

The semiconductor processing equipment provided by the embodiment is used for correcting the substrate 30 by the substrate correcting device provided by the embodiment, so that the rejection rate can be reduced, and the production efficiency can be improved.

In summary, the substrate reforming apparatus and the semiconductor processing apparatus provided in the embodiment can reduce the rejection rate and improve the production efficiency.

It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.