阅读说明：本技术 一种用于航天器增加隔热效果的多层隔热组件系统 (Multilayer heat insulation assembly system for increasing heat insulation effect of spacecraft ) 是由 殷亚州 付伟纯 杨琦 韩东阳 肖朋 江利锋 余雷 张新伟 于 2020-06-30 设计创作，主要内容包括：本发明涉及一种用于航天器增加隔热效果的多层隔热组件系统,包括第一多层隔热组件、第二多层隔热组件；第一多层隔热组件、第二多层隔热组件先后包覆在被隔热航天器结构的外表面,第一多层隔热组件与被隔热航天器结构表面贴合；第一多层隔热组件、第二多层隔热组件之间保持一定间隙。本发明解决了现有航天器热控设计中因反射屏之间接触导热造成多层隔热组件隔热不充分,以及为加强多层隔热组件隔热效果而增加结构套筒等大型结构件导致热控设计尺寸和重量超限的问题。(The invention relates to a multi-layer heat insulation assembly system for increasing heat insulation effect of a spacecraft, which comprises a first multi-layer heat insulation assembly and a second multi-layer heat insulation assembly; the first multilayer heat insulation assembly and the second multilayer heat insulation assembly are sequentially coated on the outer surface of the insulated spacecraft structure, and the first multilayer heat insulation assembly is attached to the surface of the insulated spacecraft structure; a certain gap is kept between the first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly. The invention solves the problems that the heat insulation of the multilayer heat insulation assembly is insufficient due to the contact heat conduction between the reflecting screens in the existing spacecraft heat control design, and the size and weight of the heat control design are over-limit due to the addition of large structural members such as structural sleeves and the like for enhancing the heat insulation effect of the multilayer heat insulation assembly.)

1. A multi-layer insulation assembly system for increasing the insulation effectiveness of a spacecraft, comprising a first multi-layer insulation assembly, a second multi-layer insulation assembly;

the first multilayer heat insulation assembly and the second multilayer heat insulation assembly are sequentially coated on the outer surface of the insulated spacecraft structure, and the first multilayer heat insulation assembly is attached to the surface of the insulated spacecraft structure; a certain gap is kept between the first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly.

2. The system of claim 1, wherein the first and second multi-layer insulation assemblies are supported and secured by pins and tabs adapted thereto;

three clamping grooves with annular structures are sequentially arranged on the periphery of the pin along the axial direction and are marked as a first clamping groove, a second clamping groove and a third clamping groove; the pressing sheet is of an annular sheet structure with a gap in the radial direction, the inner diameter of the pressing sheet is matched with the outer diameters of pins at the first clamping groove, the second clamping groove and the third clamping groove, and the pressing sheet can be embedded into the clamping grooves by staggering the gap of the pressing sheet; a first pressing sheet is embedded into the first clamping groove and used for fixing a first multilayer heat insulation assembly on the surface of the heat-insulated spacecraft structure; a second pressing sheet is embedded into the second clamping groove and used for separating the first multi-layer heat insulation assembly from the second multi-layer heat insulation assembly and supporting the second multi-layer heat insulation assembly; and a third pressing sheet is embedded into the third clamping groove and used for fixing the second multilayer heat insulation assembly.

3. The multi-layer thermal insulation assembly system for the spacecraft to increase the thermal insulation effect according to claim 1, wherein the first multi-layer thermal insulation assembly and the second multi-layer thermal insulation assembly are laid according to the superposition of a layer of reflecting screen and a layer of spacing layer, and after the number of the laid multi-layer thermal insulation assembly layers meets the thermal insulation requirement, a layer of thickened reflecting screen is laid on the uppermost layer.

4. The system of claim 1, wherein the reflective screen and the spacer layer of the first and second multi-layered insulation assemblies are made of a double-sided aluminized polyester film and a polyester mesh in a use environment of not more than 120 ℃, a double-sided aluminized polyimide film and a polyester mesh in a use environment of 120-300 ℃, and a nickel foil and a high-silica glass fiber cloth in a use environment of more than 300 ℃.

5. The system of claim 1, wherein the number of spacer layers between adjacent reflective screens is increased to reduce the total number of reflective screens of the multi-layer insulation assembly when the multi-layer insulation assembly requires weight reduction.

6. A multi-layer insulation assembly system for spacecraft for increasing insulation according to claim 2, wherein said pin and said preform are made of low thermal conductivity material having a thermal conductivity of less than 20W/(m-K).

7. A multi-layer insulation assembly system for spacecraft for increasing the insulation of claim 2, wherein the overall height L of said pin satisfies the condition: and the pin does not fall off under the action of 9.8N horizontal tension acting on the third clamping groove.

8. The system of claim 2, wherein the L2 spacing between the first and second slots on the pin ranges from:

(Φ_hole(s)-Φ)²+2S(Φ_Hole(s)-Φ)≤L2≤L-(L1+L3+R+H+3σ)

Wherein phi_Hole(s)The diameter of the opening of the multi-layer heat insulation assembly; phi is the diameter of the pin; s is the distance between two adjacent pins, L1 is the height of the corresponding pin in the first multi-layer heat insulation assembly mounting area, L3 is the height of the corresponding pin in the second multi-layer heat insulation assembly mounting area, sigma is the height of the clamping groove, R is the radius of the spherical surface of the end part, and H is the sum of the thickness of the pin mounting base and the height of the pin bulb along the pin.

9. The system of claim 2, wherein the pin has a pin height L1 corresponding to the pin height of the first multi-layer insulation assembly mounting region and a pin height L3 corresponding to the pin height L3, which is an increase of 1mm in the process margin based on the thickness of the corresponding first and second multi-layer insulation assemblies.

10. The multi-layer thermal insulation assembly system for the spacecraft of claim 2, wherein the diameter of the neck on the pin is 1.3mm to 1.7mm smaller than the diameter of the pin, and the height of the neck is 0.5mm to 1 mm; the adaptation relation of the pressing sheet and the clamping groove is as follows: the inner diameter of the pressing sheet is between the diameter of the clamping groove and the diameter of the pin, and the optimal value is the intermediate value of the clamping groove and the pin; the outer diameter of the pressing sheet is equal to that of the pin installation base; the thickness of the tablet is 0-0.2 mm smaller than the height of the clamping groove.

Technical Field

The invention belongs to the field of thermal control of spacecrafts, and relates to a multilayer thermal insulation assembly system for increasing thermal insulation effect of a spacecraft.

Background

In the thermal control design of the spacecraft, a thermal insulation method of coating a plurality of layers of thermal insulation assemblies is generally adopted to realize the thermal insulation of the spacecraft or reduce the influence of external heat flow, thereby realizing the relative stability of the temperature of the spacecraft.

The multilayer heat insulation assembly commonly used in the thermal control of the spacecraft at present consists of a reflecting screen with high reflectivity and a spacing layer; the installation method generally adopts a mode that a pair of nylon hasps which are respectively fixed on the structural member and the multi-layer heat insulation assembly are oppositely adhered, or a pressing sheet is matched with a pin which is fixed on the structural member to limit the multi-layer heat insulation assembly. The heat insulation principle is that the layer-by-layer reflection of the reflecting screens is utilized to cause high heat resistance to radiation heat flow, the contact between the reflecting screens is reduced as much as possible by utilizing the spacing layers among the reflecting screens, and a certain vacuum degree is kept, so that the whole system can effectively insulate heat. However, with the increasingly complex functions of the spacecraft, the requirements for stability and consistency of temperature control are higher and higher, and while a high-precision active temperature control technology is adopted, the influence of external space environment heat flow also provides a new challenge to the multilayer heat insulation effect, for example, in order to adapt to a complex and variable external heat environment, a large-size camera main structure needs to have temperature fluctuation and temperature difference within a certain range, and the requirements for external envelope size and weight cannot be increased to carry out multilayer installation on a baffle structure. By adopting a multi-layer heat insulation system with one assembly, the structural temperature difference caused by the difference of external heat flows in different directions exceeds 2 ℃, and the requirement of the system on the temperature cannot be met; the addition of external baffles makes the thermal control design significantly exceed the envelope size and adds more weight, not meeting the overall weight reduction requirement.

Disclosure of Invention

The technical problem solved by the invention is as follows: the defects of the prior art are overcome, the multilayer heat insulation assembly system for increasing the heat insulation effect of the spacecraft is provided, and the problems that the multilayer heat insulation assembly is insufficient in heat insulation due to contact heat conduction between reflecting screens in the thermal control design of the existing spacecraft, and the thermal control design size and the weight are out of limit due to the fact that large structural members such as structural sleeves are added for enhancing the heat insulation effect of the multilayer heat insulation assembly are solved.

The technical solution adopted by the invention is as follows: a multi-layer insulation assembly system for increasing the insulation effectiveness of a spacecraft, the multi-layer insulation assembly system comprising a first multi-layer insulation assembly, a second multi-layer insulation assembly;

the first multilayer heat insulation assembly and the second multilayer heat insulation assembly are sequentially coated on the outer surface of the insulated spacecraft structure, and the first multilayer heat insulation assembly is attached to the surface of the insulated spacecraft structure; a certain gap is kept between the first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly.

The first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly are supported and fixed through pins and pressing sheets matched with the pins;

three clamping grooves with annular structures are sequentially arranged on the periphery of the pin along the axial direction and are marked as a first clamping groove, a second clamping groove and a third clamping groove; the pressing sheet is of an annular sheet structure with a gap in the radial direction, the inner diameter of the pressing sheet is matched with the outer diameters of pins at the first clamping groove, the second clamping groove and the third clamping groove, and the pressing sheet can be embedded into the clamping grooves by staggering the gap of the pressing sheet; a first pressing sheet is embedded into the first clamping groove and used for fixing a first multilayer heat insulation assembly on the surface of the heat-insulated spacecraft structure; a second pressing sheet is embedded into the second clamping groove and used for separating the first multi-layer heat insulation assembly from the second multi-layer heat insulation assembly and supporting the second multi-layer heat insulation assembly; and a third pressing sheet is embedded into the third clamping groove and used for fixing the second multilayer heat insulation assembly.

The first multilayer heat insulation assembly and the second multilayer heat insulation assembly are laid according to the superposition of a layer of reflection screen and a layer of spacing layer, and after the number of layers of the laid multilayer heat insulation assemblies meets the heat insulation requirement, a layer of thickened reflection screen is laid on the uppermost layer.

The reflecting screen and the spacing layer of the first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly respectively adopt a double-sided aluminum-plated polyester film and a polyester net in a use environment of not more than 120 ℃, respectively adopt a double-sided aluminum-plated polyimide film and a polyester net in a use environment of 120-300 ℃, and respectively adopt a nickel foil and high silica glass fiber cloth in a use environment of more than 300 ℃.

When the multilayer heat insulation assembly has the weight reduction requirement, the number of spacing layers between adjacent reflecting screens can be properly increased, and the total number of reflecting screens of the multilayer heat insulation assembly is reduced.

The pin and the pressing sheet are both made of low-heat-conduction materials with heat conductivity coefficient lower than 20W/(m.K).

The total height L of the pin satisfies the following condition: the pin does not fall off under the action of 9.8N horizontal tension acting on the third clamping groove;

the value range of the distance L2 between the first clamping groove and the second clamping groove on the pin is as follows:

(Φ_hole(s)-Φ)²+2S(Φ_Hole(s)-Φ)≤L2≤L-(L1+L3+R+H+3σ)

Wherein phi_Hole(s)The diameter of the opening of the multi-layer heat insulation assembly; phi is the diameter of the pin; s is the distance between two adjacent pins, L1 is the height of the corresponding pin in the first multi-layer heat insulation assembly mounting area, L3 is the height of the corresponding pin in the second multi-layer heat insulation assembly mounting area, sigma is the height of the clamping groove, R is the radius of the spherical surface of the end part, and H is the sum of the thickness of the pin mounting base and the height of the pin bulb along the pin.

The height L1 of the pins corresponding to the first multi-layer heat insulation assembly mounting area and the height L3 of the pins corresponding to the two multi-layer heat insulation assembly mounting areas on the pins are increased by 1mm for the machining allowance on the basis of the thicknesses of the first non-multi-layer heat insulation assembly and the second multi-layer heat insulation assembly at the corresponding positions.

The diameter of the clamping groove on the pin is 1.3 mm-1.7 mm smaller than that of the pin, and the height of the clamping groove is 0.5 mm-1 mm; the adaptation relation of the pressing sheet and the clamping groove is as follows: the inner diameter of the pressing sheet is between the diameter of the clamping groove and the diameter of the pin, and the optimal value is the intermediate value of the clamping groove and the pin; the outer diameter of the pressing sheet is equal to that of the pin installation base; the thickness of the tablet is 0-0.2 mm smaller than the height of the clamping groove.

Compared with the prior art, the invention has the beneficial effects that:

(1) the size limitation is realized by the matching of the pinning and the pressing sheet, so that the contact heat conduction between the two reflecting screens is completely isolated, the multilayer heat insulation assembly is completely isolated, and the heat insulation effect of the multilayer heat insulation assembly is effectively improved.

(2) The invention avoids the influence of isolating external heat flow by using a sleeve, a baffle and other traditional modes for a precise structure exposed outside the spacecraft, and greatly reduces the weight requirement of thermal control design.

(3) Compared with the conventional pin, the height of the pin is increased by no more than 20mm, and the size requirement of a thermal control design is reduced.

Drawings

FIG. 1 is a schematic view of an installation of a multi-layer insulation assembly embodying the present invention;

FIG. 2(a) is a schematic illustration of a pin construction embodying the present invention;

FIG. 2(b) is a schematic diagram of a pin-adapted wafer embodying the present invention;

FIG. 3(a) is a pin design size for implementing the present invention;

figure 3(b) is a design size of a tablet adapted to figure 3(a) to implement the present invention.

Detailed Description

The invention is described in detail below with reference to the accompanying drawings and specific embodiments.

The invention provides a multilayer heat insulation assembly system for increasing heat insulation effect of a spacecraft, which adopts a three-clamping-groove pin made of low heat conduction material and a pressing sheet with the inner diameter matched with the size of a pin clamping groove as a fixed structure; the multilayer heat insulation assembly adopts a fixing mode of limiting positions by pressing sheets: the first multilayer heat insulation assembly closest to the spacecraft structure is fixed by a first pressing sheet, and the second multilayer heat insulation assembly is supported and fixed by a second pressing sheet and a third pressing sheet.

In one embodiment of the present invention, as shown in FIGS. 1 and 2, a multi-layer insulation assembly system comprises a first multi-layer insulation assembly, a second multi-layer insulation assembly;

the first multilayer heat insulation assembly and the second multilayer heat insulation assembly are sequentially coated on the outer surface of the insulated spacecraft structure, and the first multilayer heat insulation assembly is attached to the surface of the insulated spacecraft structure; a certain gap is kept between the first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly.

The first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly are supported and fixed through pins and pressing sheets matched with the pins;

three clamping grooves with annular structures are sequentially arranged on the periphery of the pin along the axial direction and are marked as a first clamping groove, a second clamping groove and a third clamping groove; the pressing sheet is of an annular sheet structure with a gap in the radial direction, the inner diameter of the pressing sheet is matched with the outer diameters of pins at the first clamping groove, the second clamping groove and the third clamping groove, and the pressing sheet can be embedded into the clamping grooves by staggering the gap of the pressing sheet; a first pressing sheet is embedded into the first clamping groove and used for fixing a first multilayer heat insulation assembly on the surface of the heat-insulated spacecraft structure; a second pressing sheet is embedded into the second clamping groove and used for separating the first multi-layer heat insulation assembly from the second multi-layer heat insulation assembly and supporting the second multi-layer heat insulation assembly; and a third pressing sheet is embedded into the third clamping groove and used for fixing the second multilayer heat insulation assembly.

The first multilayer heat insulation assembly and the second multilayer heat insulation assembly are laid according to the superposition of a reflection screen and a spacer layer, after the number of layers of the laid multilayer heat insulation assembly meets the requirement, a reflection screen is laid on the uppermost layer, for example, the multilayer heat insulation assembly with 15 units is formed by mutually overlapping 16 reflection screens and 15 spacer layers, wherein the reflection screen on the outermost layer is a thickened surface film, and the surface film of the second multilayer heat insulation assembly facing the external space meets the irradiation requirement of the space environment.

The reflecting screen and the spacing layer of the first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly respectively adopt a double-sided aluminum-plated polyester film and a polyester net in a use environment of not more than 120 ℃, respectively adopt a double-sided aluminum-plated polyimide film and a polyester net in a use environment of 120-300 ℃, and respectively adopt a nickel foil and high silica glass fiber cloth in a use environment of more than 300 ℃.

When the multilayer heat insulation assembly has the weight reduction requirement, the number of spacing layers between adjacent reflecting screens can be properly increased, and the total number of reflecting screens of the multilayer heat insulation assembly is reduced.

The pin and the pressing sheet are both made of low-heat-conduction materials with heat conductivity coefficient lower than 20W/(m.K). For example: polyimide, titanium alloy, stainless steel, and the like.

The total height L of the pin satisfies the following condition: the pin does not fall off under the action of 9.8N horizontal tension acting on the third clamping groove;

the value range of the distance L2 between the first clamping groove and the second clamping groove on the pin is as follows:

(Φ_hole(s)-Φ)²+2S(Φ_Hole(s)-Φ)≤L2≤L-(L1+L3+R+H+3σ)

Wherein phi_Hole(s)The diameter of the opening of the multi-layer heat insulation assembly; phi is the diameter of the pin; s is the distance between two adjacent pins, L1 is the height of the corresponding pin in the first multi-layer heat insulation assembly mounting area, L3 is the height of the corresponding pin in the second multi-layer heat insulation assembly mounting area, sigma is the height of the clamping groove, R is the radius of the spherical surface of the end part, and H is the sum of the thickness of the pin mounting base and the machining allowance of the pin ball head along the height of the pin. The thickness of the pin installation base is usually 1 mm-1.5 mm, and the H value is 2mm by considering the machining allowance of the ball head along the pin.

The height L1 of the pins corresponding to the installation area of the first multi-layer heat insulation assembly on the pins and the height L3 of the pins corresponding to the installation area of the two multi-layer heat insulation assemblies are increased by 1mm for the machining allowance on the basis of the thicknesses of the first multi-layer heat insulation assembly and the second multi-layer heat insulation assembly at the corresponding positions, so that the fixed point is in a multi-layer fluffy and non-tight state.

The diameter of the clamping groove on the pin is 1.3 mm-1.7 mm smaller than that of the pin, and the height of the clamping groove is 0.5 mm-1 mm; the adaptation relation of the pressing sheet and the clamping groove is as follows: the inner diameter of the pressing sheet is between the diameter of the clamping groove and the diameter of the pin, and the optimal value is the intermediate value of the clamping groove and the pin; the outer diameter of the pressing sheet is equal to that of the pin installation base; the thickness of the tablet is 0-0.2 mm smaller than the height of the clamping groove.

According to the invention, through the installation mode that the clamping groove pin is matched with the pressing sheets, one pressing sheet is used for supporting the multilayer gap, and the other pressing sheet is used for fixing the multilayer heat insulation assembly. Multiple layers of insulation assemblies of different cell counts can be used in combination.

The preparation steps of the multilayer insulation assembly system with the function of increasing the insulation effect comprise the following steps:

(1) selecting multilayer heat insulation according to temperature stability design requirements in spacecraft thermal control designThe number of components and the number of units, L1 and L3 are determined by the thickness of the multiple layers and the fluffy and untightened state in the multiple layer installation process; the diameter phi of the pin is usually 3-5 mm according to the portable design idea and the reverse constraint of the diameter of the clamping groove, and the larger the predicted design height of the pin is, the larger the diameter value is; pin hole diameter phi of multi-layer matched punching_Hole(s)The diameter of the pin is 0.5 mm-1 mm larger than the diameter phi of the pin, and the larger the fluctuation of the external temperature environment is, the larger the value is; installing pins with reasonable plane size distribution in a multi-layer area, wherein the spacing S of the pins is 150-250 mm, and determining the minimum value of L2 according to a value range formula of L2; the height L of the pin stuck by the adhesive GD414 silicone rubber meets the requirement that the horizontal tension of 9.8N does not fall off within the range of 50mm, and other fixing modes need to determine the height L through the horizontal tension of 9.8N at the end part in advance so as to determine the maximum value of L2; the height of the clamping groove is 0.5 mm-1 mm; the diameter of the clamping groove is 1.3 mm-1.7 mm smaller than that of the pin;

(2) the pins of the three clamping grooves are arranged on the surface of the spacecraft structure by adopting adhesives such as silicon rubber, and after the pins are solidified, a 9.8N horizontal pulling force is applied to the third clamping groove one by one to carry out a tensile test verification;

(3) the first multilayer heat insulation assembly is provided with mounting holes according to the positions of the pins, the pins are sequentially sleeved in the mounting holes, and after the first multilayer heat insulation assembly is laid to be flat, the first pressing sheets are embedded one by one, and the second pressing sheets are embedded at the same time;

(4) and the second multilayer heat insulation assembly is provided with mounting holes according to the positions of the pins, the pins are sequentially sleeved, and after the pins are laid to be flat, third pressing sheets are embedded one by one.