阅读说明：本技术 闪烁体面板、放射线检测器和闪烁体面板的制造方法 (Scintillator panel, radiation detector, and method for manufacturing scintillator panel ) 是由 宫尾将 谷野贵广 松村宣夫 于 2020-02-04 设计创作，主要内容包括：闪烁体面板,其具有基板、在基板上形成的格子状的隔离壁、以及在被隔离壁区隔的单元内的荧光体层,隔离壁在隔离壁的表面上按顺序具有金属反射层、和以非晶性含氟树脂作为主成分的有机保护层。(A scintillator panel includes a substrate, lattice-shaped partition walls formed on the substrate, and phosphor layers in cells partitioned by the partition walls, wherein the partition walls have a metal reflective layer and an organic protective layer containing an amorphous fluorine-containing resin as a main component in this order on the surface of the partition walls.)

1. A scintillator panel having a substrate, lattice-shaped partition walls formed on the substrate, and phosphor layers in cells partitioned by the partition walls,

the partition wall has a metal reflective layer and an organic protective layer containing an amorphous fluorine-containing resin as a main component in this order on the surface of the partition wall.

2. The scintillator panel according to claim 1, wherein the amorphous fluorine-containing resin has fluorine atoms directly bonded to atoms of a main chain.

3. The scintillator panel according to claim 1 or 2, wherein the amorphous fluorine-containing resin is a compound having a repeating unit represented by the following general formula (2) as a main component,

[ solution 1]

In the general formula (2), X represents oxygen, s and u each independently represents 0 or 1, and t represents an integer of 1 or more; r⁵~R⁸Represents hydrogen, halogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted alkynyl, hydroxyl, substituted or unsubstituted alkoxy, substituted or unsubstituted aryl, cyano, aldehyde, substituted or unsubstituted ester, acyl, carboxyl, substituted or unsubstituted amino, nitro, or substituted or unsubstituted epoxy.

4. The scintillator panel according to any one of claims 1 to 3, wherein the amorphous fluorine-containing resin has a refractive index of 1.41 or less.

5. The scintillator panel according to any one of claims 1 to 4, wherein the metal reflective layer contains silver as a main component.

6. The scintillator panel according to claim 5, wherein the aforementioned metal reflective layer comprises a silver alloy containing at least any one of palladium and copper.

7. The scintillator panel according to any one of claims 1 to 6, wherein the partition wall contains 98 vol% or more of a low softening point glass having a softening point of 650 ℃ or less.

8. A radiation detector having the scintillator panel according to any one of claims 1 to 7.

9. A method of manufacturing a scintillator panel, comprising:

forming a partition wall and partition walls of the partition cells on the substrate;

a reflective layer forming step of forming a metal reflective layer on the surface of the partition wall;

an organic protective layer forming step of forming an organic protective layer on the surface of the reflective layer; and

a filling step of filling the cells partitioned by the partition walls with a phosphor,

the organic protective layer contains an amorphous fluorine-containing resin as a main component.

Technical Field

The invention relates to a scintillator panel, a radiation detector, and a method of manufacturing the scintillator panel.

Background

Conventionally, radiographic images using films have been widely used in medical practice. However, the radiographic image using the film is analog image information. Therefore, in recent years, digital radiation detectors such as flat panel radiation detectors (hereinafter referred to as "FPDs") have been developed. The FPD uses a scintillator panel in order to convert radiation into visible light. The scintillator panel contains a radioactive ray phosphor. The radioactive fluorescent body emits visible light according to the irradiated radiation. The emitted light is converted into an electric signal by a TFT (thin film transistor) or a CCD (charge-coupled device), and information of the radiation is converted into digital image information. However, in the scintillator panel, light emitted from the radioactive fluorescent material is scattered in the layer containing the fluorescent material (fluorescent material layer), and there is a problem that the resolution is lowered.

Therefore, in order to reduce the influence of scattering of emitted light, a method of filling a phosphor in a space partitioned by a partition wall having a reflective layer on the surface, that is, a cell is proposed. As materials for the reflective layer, a method using a powder of a metal oxide having a high refractive index such as titanium oxide powder (patent document 1) and a method using a metal having a high refractive index such as silver (patent documents 2 and 3) are known.

Documents of the prior art

Patent document

Patent document 1: international publication No. 2016/021540

Patent document 2: japanese patent laid-open publication No. 2011-257339

Patent document 3: japanese Kokai publication 2001-516888.

Disclosure of Invention

However, the reflection layer using the metal oxide powder described in patent document 1 has insufficient reflectance. In addition, in order to obtain high reflectance, the thickness of the reflective layer needs to be increased. However, since the reflective layer is thickened, the volume in the cell is reduced, and the filling amount of the phosphor is reduced. As a result, the luminance of the scintillator panel decreases. In addition, in the method of using a metal reflective layer such as silver described in patent document 2, the reflectance is easily lowered due to corrosion of the metal reflective layer. Therefore, the luminance of the resulting scintillator panel is easily lowered. Patent document 2 describes a method of forming a protective layer of acrylic resin on the surface of the metal reflective layer. However, even in this case, the effect of suppressing the luminance reduction is not sufficient. Further, the method described in patent document 2 forms a resin layer having a high refractive index on the metal reflective layer. Therefore, a large reduction in reflectance occurs on the metal surface. As a result, the luminance of the scintillator panel decreases. Patent document 3 describes a method of forming a low refractive index resin layer containing colloidal silica on a metal reflective layer. The method forms a resin layer having a low refractive index on a metal reflective layer. However, the protective performance of the resulting scintillator panel is insufficient, and the luminance is reduced.

The present invention has been made in view of the above conventional problems, and an object thereof is to provide a scintillator panel with high luminance and high definition, a radiation detector, and a method for manufacturing the scintillator panel.

The scintillator panel of the present invention for solving the above problems includes a substrate, lattice-shaped partition walls formed on the substrate, and phosphor layers in cells partitioned by the partition walls, wherein the partition walls have a metal reflective layer and an organic protective layer containing an amorphous fluorine-containing resin as a main component in this order on the surface of the partition walls.

Further, a radiation detector of the present invention for solving the above problems includes the scintillator panel.

Further, a method for manufacturing a scintillator panel according to the present invention for solving the above problems includes: forming a partition wall on the substrate to partition the unit regions; a reflective layer forming step of forming a metal reflective layer on the surface of the partition wall; an organic protective layer forming step of forming an organic protective layer on the surface of the reflective layer; and a filling step of filling the cells partitioned by the partition walls with a phosphor; the organic protective layer contains an amorphous fluorine-containing resin as a main component.

Drawings

Fig. 1 is a sectional view schematically showing a radiation detector member including a scintillator panel according to an embodiment of the present invention.

Fig. 2 is a sectional view schematically showing a scintillator panel according to an embodiment of the present invention.

Detailed Description

< scintillator panel >

Hereinafter, a specific configuration of a scintillator panel according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a sectional view schematically showing a radiation detector member 1 including a scintillator panel 2 of the present embodiment. The radiation detector member 1 includes a scintillator panel 2 and an output substrate 3. The scintillator panel 2 has a substrate 4, a partition wall 5, and a phosphor layer 6 in a cell partitioned by the partition wall 5. The output substrate 3 has a substrate 10, an output layer 9 formed on the substrate 10, and a photoelectric conversion layer 8 having a photodiode formed on the output layer 9. A separator layer 7 may be provided on the photoelectric conversion layer 8. The light emission surface of the scintillator panel 2 and the photoelectric conversion layer 8 of the output substrate 3 are preferably bonded or closely adhered to each other via the diaphragm layer 7. The light emitted from the phosphor layer 6 reaches the photoelectric conversion layer 8, is subjected to photoelectric conversion, and is output. Hereinafter, the description will be given separately.

(substrate 4)

The substrate 4 is a member provided in the scintillator panel 2 of the present embodiment. The material constituting the substrate 4 is preferably a material having a radiation permeability. For example, the material constituting the substrate 4 is various glass, polymer material, metal, or the like. The glass is quartz, borosilicate glass, chemically strengthened glass, or the like. The polymer compound is a polyester such as cellulose acetate or polyethylene terephthalate, a polyamide, a polyimide, triacetate, polycarbonate, a carbon fiber-reinforced resin, or the like. Examples of the metal include aluminum, iron, and copper. They may be used in combination. Among these materials, the material constituting the substrate 4 is preferably a polymer material having high radiation permeability. The material constituting the substrate 4 is preferably a material having excellent flatness and heat resistance.

The thickness of the substrate 4 is preferably 2.0mm or less, and more preferably 1.0mm or less in the case of a glass substrate, from the viewpoint of weight reduction of the scintillator panel 2. In the case of a substrate including a polymer material, the thickness of the substrate 4 is preferably 3.0mm or less.

(partition wall 5)

The partition wall 5 is provided at least for forming the partitioned space (cell). The partition wall 5 has a metal reflective layer 11 and an organic protective layer 12 containing an amorphous fluorine-containing resin as a main component in this order. The metal reflective layer 11 and the organic protective layer 12 may be provided on at least a part of the partition wall 5.

Seed and seed metal reflective layer 11

The metal reflective layer 11 has high reflectivity even if it is a thin film. Therefore, the metal reflective layer 11 formed as a thin film hardly decreases the filling amount of the phosphor 13, and the luminance of the scintillator panel 2 is easily improved. The metal constituting the metal reflective layer 11 is not particularly limited. For example, the metal reflective layer 11 preferably contains a metal having a high reflectance such as silver or aluminum as a main component, and more preferably contains silver as a main component. The metal reflective layer 11 may be an alloy. The metal reflective layer 11 preferably contains a silver alloy containing at least any one of palladium and copper, and more preferably contains palladium and copper. Such a metal reflective layer 11 containing a silver alloy is excellent in resistance to discoloration in the atmosphere. In the present embodiment, "containing … … as the main component" means that the predetermined component is contained so as to be 50 to 100% by mass.

The thickness of the metal reflective layer 11 is not particularly limited. For example, the thickness of the metal reflective layer 11 is preferably 10nm or more, and more preferably 50nm or more. The thickness of the metal reflective layer 11 is preferably 500nm or less, and more preferably 300nm or less. The thickness of the metal reflective layer 11 is 10nm or more, whereby the scintillator panel 2 can obtain sufficient light shielding property and the sharpness can be improved. When the thickness of the metal reflective layer 11 is 500nm or less, the surface of the metal reflective layer 11 is less likely to have large irregularities, and the reflectance is less likely to decrease.

Here, the unit type scintillator having the metal reflective layer has a problem in that the luminance is lowered due to corrosion of the metal reflective layer. The decrease in luminance means that the actual luminance is decreased from the luminance of the scintillator panel expected from the reflectance of the metal reflective layer as it is. This is presumably because, at the time of forming the metal reflective layer, at the time of forming the phosphor layer after forming the metal reflective layer, or the like, components in the phosphor layer react with the metal reflective layer, and the metal reflective layer corrodes, thereby lowering the reflectance. This decrease in luminance can be suppressed by providing an organic protective layer on the metal reflective layer. However, the reflectivity of the metal reflective layer is affected by the organic protective layer. Therefore, the higher the refractive index of the organic protective layer, the lower the reflectivity of the metal reflective layer. As a result, the luminance of the scintillator panel is easily lowered. The scintillator panel 2 of the present embodiment solves these problems by forming the organic protective layer 12 described later.

Seed and seed organic protective layer 12

In the scintillator panel 2 of the present embodiment, the organic protective layer 12 containing an amorphous fluorine-containing resin as a main component is formed on the metal reflective layer 11. By forming the organic protective layer 12, the scintillator panel 2 suppresses a decrease in the reflectance of the metal reflective layer 11 due to a reaction between the metal reflective layer 11 and the phosphor layer 6 when the phosphor layer 6 is formed, and improves the luminance.

The organic protective layer contains an amorphous fluorine-containing resin as a main component. By forming the organic protective layer containing the amorphous fluorine-containing resin as a main component, the luminance of the scintillator panel 2 is improved. Here, the reflectance of the metal reflective layer is affected by the organic protective layer, and the lower the refractive index of the organic protective layer, the more easily the reflectance is increased. As a result, the luminance of the scintillator panel is easily improved. The fluorine-containing resin has a low refractive index. Therefore, by containing the amorphous fluorine-containing resin as a main component, the reflectance of the metal reflective layer of the scintillator panel 2 is improved, and the luminance is easily improved. The phrase "comprising an amorphous fluorine-containing resin as a main component" means that 50 to 100 mass% of the material constituting the organic protective layer 12 is the amorphous fluorine-containing resin.

The organic protective layer 12 is amorphous. The amorphous fluorine-containing resin has excellent solvent solubility. Therefore, the organic protective layer 12 can be easily formed by a known means such as solution coating or spray coating. Here, "the fluorine-containing resin is amorphous" means that when the fluorine-containing resin is measured by a powder X-ray diffraction method, substantially no peak originating in a crystal structure is observed, and only a broad halo (ブロードなハロー) is observed.

The organic protective layer 12 contains an amorphous fluorine-containing resin as a main component, and the other components are not particularly limited. The organic protective layer 12 containing an amorphous fluorine-containing resin as a main component suppresses corrosion of the metal reflective layer, and the reflectance of silver is less likely to decrease. The amorphous fluorine-containing resin is preferably a resin in which fluorine atoms are directly bonded to atoms in the main chain. Fluorine-containing resins in which fluorine atoms are directly bonded to atoms of the main chain have excellent solvent resistance. Therefore, swelling and dissolution of the organic protective layer are less likely to occur when the phosphor layer is formed. Thus, the scintillator panel 2 suppresses a decrease in reflectance due to a reaction between the component contained in the phosphor layer and the metal reflective layer, and the luminance is easily improved.

The refractive index of the organic protective layer is preferably 1.41 or less, more preferably 1.39 or less. By forming the organic protective layer having a refractive index of 1.41 or less, a decrease in the refractive index difference at the interface between the metal reflective layer and the organic protective layer is easily suppressed, and the reflectance of the metal reflective layer is more easily improved. As a result, the luminance of the scintillator panel 2 is more easily improved. The refractive index of the organic protective layer can be determined by measuring the coating film by an ellipsometry method.

In the present embodiment, the amorphous fluorine-containing resin as a main component of the organic protective layer preferably has a structure represented by the following general formula (1) as a repeating unit. The fluorine-containing resin may be a copolymer having a structure represented by the following general formula (1) and another structure, and preferably has a structure represented by the following general formula (1) as a main component. When the fluorine-containing resin is a copolymer having 2 different structures represented by the following general formula (1), the fluorine-containing resin may be any of an alternating copolymer, a block copolymer, and a random copolymer.

[ solution 1]

In the above general formula (1), R¹~R⁴Represents hydrogen, halogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted alkynyl, hydroxyl, substituted or unsubstituted alkoxy, substituted or unsubstituted aryl, cyano, aldehyde, substituted or unsubstituted ester, acyl, carboxyl, substituted or unsubstituted amino, nitro, or substituted or unsubstituted epoxy. Furthermore, can be represented by R¹~R⁴2 of which form 1 ring structure. However, R¹~R⁴Of these, at least 1 is fluorine or a group having fluorine. R¹~R⁴Among them, 1 or more is preferably fluorine, and more preferably 2 or more is fluorine. Examples of the substituent in the case where these groups are substituted include halogen, alkyl, aryl, alkoxy, and the like. In addition, R is¹~R⁴Each of which may be the same or different.

In the general formula (1), the alkyl group may be linear or cyclic, and the number of carbon atoms is preferably 1 to 12. The number of carbon atoms of the alkenyl group is preferably 1 to 15. The number of carbon atoms of the alkynyl group is preferably 1 to 10. The number of carbon atoms of the alkoxy group is preferably 1 to 10. The number of carbon atoms of the aryl group is preferably 6 to 40.

The structure represented by the above general formula (1) preferably has a saturated ring structure. In the amorphous fluorine-containing resin having a saturated ring structure, the structure represented by the general formula (1) is preferably a structure represented by the following general formula (2).

[ solution 2]

In the general formula (2), X represents oxygen, s and u each independently represents 0 or 1, and t represents an integer of 1 or more.

In the above general formula (2), R⁵~R⁸Represents hydrogen, halogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted alkynyl, hydroxyl, substituted or unsubstituted alkoxy, substituted or unsubstituted aryl, cyano, aldehyde, substituted or unsubstituted aryl, cyano, substituted or unsubstituted aryl, or substituted or unsubstituted aryl, or substituted aryl, cyano, or substituted aryl, or substituted aryl, or substituted orAn ester group, an acyl group, a carboxyl group, a substituted or unsubstituted amino group, a nitro group, or a substituted or unsubstituted epoxy group. R⁵~R⁶At least 1 of (a) is preferably fluorine. Furthermore, R⁷~R⁸At least 1 of which is preferably fluorine.

In the above general formula (2), s and u represent the number of oxygen. However, in the case where s or u is 0, X_sOr X_uIs a single bond. If at least either of s and u is 1, the glass transition temperature is appropriate, and is therefore preferable.

In the general formula (2), t represents the number of repetitions, preferably 1 to 4, more preferably 1 to 3. When t is 2 or more, a plurality of R⁷And R⁸May be the same as or different from each other.

In the general formula (2), the number of carbon atoms in the alkyl group is preferably 1 to 8. The number of carbon atoms of the alkenyl group is preferably 1 to 12. The number of carbon atoms of the alkoxy group is preferably 1 to 10. The number of carbon atoms of the aryl group is preferably 5 to 15.

In the present embodiment, the end of the main chain of the amorphous fluorine-containing resin may be substituted with a functional group such as a substituted or unsubstituted alkyl group, a substituted or unsubstituted amino group, a substituted or unsubstituted carboxyl group, an alcohol group, an acyl group, a substituted or unsubstituted silyl group, a substituted or unsubstituted phosphoryl group, a substituted or unsubstituted sulfonyl group, a halogen group, a cyano group, a nitro group, a vinyl group, or a substituted or unsubstituted epoxy group. Examples of the substituent in the case where these groups are substituted include halogen, alkyl, aryl, alkoxy, acyl, silyl and the like. In this case, the number of carbon atoms in the alkyl group is preferably 1 to 8. The number of carbon atoms of the alkenyl group is preferably 1 to 10. The number of carbon atoms of the alkoxy group is preferably 1 to 10. The number of carbon atoms of the aryl group is preferably 5 to 15. Among these functional groups, carboxyl group, acyl group, silyl group, and phosphoryl group are preferable from the viewpoint of adhesion to the substrate.

In the present embodiment, the number average molecular weight of the amorphous fluorine-containing resin is preferably 3,000 or more, more preferably 5,000 or more, from the viewpoint of weather resistance and solvent resistance. The number average molecular weight of the amorphous fluorine-containing resin is preferably 300,000 or less, more preferably 250,000 or less, 60,000 or less, and even more preferably 50,000 or less, from the viewpoint of solubility in a solvent at the time of forming the protective layer. The amorphous fluorine-containing resin has a number average molecular weight of 3,000 or more, and thus has good weather resistance and solvent resistance, and the protective layer is less likely to swell and dissolve during formation of the phosphor layer. As a result, the scintillator panel can be further improved in luminance. The number average molecular weight is 300,000 or less, whereby the solubility in a solvent at the time of forming the protective layer of the amorphous fluorine-containing resin becomes good, and the protective layer can be easily formed by a known method.

The thickness of the organic protective layer is preferably 0.05 μm or more, more preferably 0.2 μm or more. The thickness of the organic protective layer is preferably 10 μm or less, and more preferably 5 μm or less. The thickness of the organic protective layer is 0.05 μm or more, whereby the scintillator panel 2 can further increase the effect of suppressing the decrease in luminance. In addition, the thickness of the organic protective layer is 10 μm or less, and thus the scintillator panel 2 can further increase the volume in the cell and fill the phosphor 13 with a sufficient amount, thereby further improving the luminance. In this embodiment, the thickness of the organic protective layer can be measured by observation with a scanning electron microscope. The organic protective layer formed in the organic protective layer forming step described later tends to be thin on the side surface near the top of the partition wall and thick on the side surface near the bottom. Therefore, when there is a difference in thickness as described above, the thickness of the organic protective layer is the thickness of the partition wall 5 at the side surface of the central portion in the height direction.

Returning to the explanation of the entire partition wall 5, the partition wall 5 is preferably made of an inorganic material for the purpose of improving strength and heat resistance. The inorganic substance refers to a simple compound of a part of carbon (an allotrope of carbon such as graphite or diamond) and a compound composed of an element other than carbon. Note that the phrase "formed of an inorganic substance" means that the presence of a component other than an inorganic substance is not strictly excluded, and the presence of a component other than an inorganic substance is permissible to the extent of impurities contained in the inorganic substance itself as a raw material and impurities mixed in during the production of the partition wall 5.

The partition wall 5 preferably contains glass as a main component. Glass refers to inorganic amorphous solids containing silicates. If the partition wall 5 is mainly composed of glass, the strength and heat resistance of the partition wall 5 are improved, and deformation and damage in the step of forming the metal reflective layer 11 and the step of filling the phosphor 13 are less likely to occur. The phrase "mainly composed of glass" means that 50 to 100 mass% of the material constituting the partition wall 5 is glass.

The partition wall 5 preferably contains 95 vol% or more of a low softening point glass having a softening point of 650 ℃ or less, and more preferably 98 vol% or more. The content of the low-softening-point glass is 95 vol% or more, and therefore the surface of the partition wall 5 is easily flattened in the firing step of the partition wall 5. Thereby, the scintillator panel 2 easily forms the uniform metal reflective layer 11 on the surface of the partition wall 5. As a result, the reflectance is increased, and the luminance is easily further improved.

The components other than the low-softening-point glass contained in the partition wall 5 are high-softening-point glass powder, ceramic powder, and the like. These powders easily adjust the shape of the partition wall 5 in the partition wall forming step. In order to increase the content of the low-softening-point glass, the content of the component other than the low-softening-point glass is preferably less than 5 vol%.

Fig. 2 is a schematic cross-sectional view of the scintillator panel 2 of the present embodiment (the phosphor layer 6 is not shown; the phosphor layer 6 is shown in fig. 1). The height L1 of the partition wall 5 is preferably 50 μm or more, more preferably 70 μm or more. The height of the partition wall 5 is preferably 3000 μm or less, more preferably 1000 μm or less. Since L1 is 3000 μm or less, absorption of emitted light by the phosphor 13 itself is less likely to occur, and the luminance of the scintillator panel 2 is less likely to decrease. On the other hand, when L1 is 50 μm or more, the amount of the phosphor 13 that can be filled in the scintillator panel 2 becomes appropriate, and the luminance is less likely to decrease.

The interval L2 between adjacent partition walls 5 is preferably 30 μm or more, and more preferably 50 μm or more. The interval L2 between the partition walls 5 is preferably 1000 μm or less, and more preferably 500 μm or less. Since L2 is 30 μm or more, the scintillator panel 2 can be easily filled with the phosphor 13. On the other hand, since L2 is 1000 μm or less, the scintillator panel 2 is excellent in resolution.

The bottom width L3 of the partition wall 5 is preferably 5 μm or more, more preferably 10 μm or more. The bottom width L3 is preferably 150 μm or less, and more preferably 50 μm or less. Since L3 is 5 μm or more, pattern defects are less likely to occur in the scintillator panel 2. On the other hand, when L3 is 150 μm or less, the amount of the phosphor 13 that can be filled in the scintillator panel 2 becomes appropriate, and the luminance is less likely to decrease.

The top width L4 of the partition wall 5 is preferably 3 μm or more, more preferably 5 μm or more. The top width L4 is preferably 80 μm or less, and more preferably 50 μm or less. When L4 is 3 μm or more, the strength of the partition wall 5 of the scintillator panel 2 becomes appropriate, and a pattern defect is less likely to occur. On the other hand, when L4 is 80 μm or less, the region of the scintillator panel 2 where the light emitted from the phosphor 13 is extracted becomes appropriate, and the luminance is less likely to decrease.

The height L1 of the partition wall 5 is preferably 1.0 or more, more preferably 2.0 or more, in terms of the aspect ratio (L1/L3) with respect to the bottom width L3 of the partition wall 5. The aspect ratio (L1/L3) is preferably 100.0 or less, and more preferably 50.0 or less. The aspect ratio (L1/L3) is 1.0 or more, and thus the filling amount of the phosphor 13 in the scintillator panel 2 can be easily adjusted to a suitable level. Further, the aspect ratio (L1/L3) is 100.0 or less, whereby the strength of the partition wall of the scintillator panel 2 is easily made appropriate.

The height L1 of the partition wall 5 preferably has an aspect ratio (L1/L2) of 0.5 or more, more preferably 1.0 or more, with respect to the interval L2 of the partition wall 5. The aspect ratio (L1/L2) is preferably 20.0 or less, and more preferably 10.0 or less. The aspect ratio (L1/L2) is 0.5 or more, and thus the X-ray absorption efficiency of the scintillator panel 2 is hardly lowered. Further, the aspect ratio (L1/L2) is 20.0 or less, whereby the extraction efficiency of the emitted light within the cells of the scintillator panel 2 is difficult to decrease, and the luminance is difficult to decrease.

The height L1 of a partition wall 5 and the spacing L2 of adjacent partition walls 5 can be determined by: the cross section perpendicular to the substrate is cut or exposed by a polishing device such as a cross-section polisher, and the cross section is observed by a scanning electron microscope to measure. Here, the width of the partition wall 5 at the contact portion of the partition wall 5 and the substrate is denoted as L3. Further, the width of the topmost portion of the partition wall 5 is denoted as L4.

In the scintillator panel 2 of the present embodiment, each cell is partitioned by the partition wall 5. Therefore, in the scintillator panel 2, the size and pitch of the pixels of the photoelectric conversion elements arranged in a lattice shape are made to coincide with the size and pitch of the cells of the scintillator panel 2, whereby the pixels of the photoelectric conversion elements and the cells of the scintillator panel 2 can be associated with each other. Thereby, the scintillator panel 2 can easily obtain high definition.

(phosphor layer 6)

The phosphor layer 6 is formed in a cell partitioned by the partition wall 5 as shown in fig. 1. The phosphor layer 6 absorbs energy of incident radiation such as X-rays and emits electromagnetic waves having a wavelength of 300nm to 800nm, that is, light having a visible light as a center and ranging from ultraviolet light to infrared light. The light emitted from the phosphor layer 6 is photoelectrically converted by the photoelectric conversion layer 8, and is output as an electric signal through the output layer 9. The phosphor layer 6 preferably includes a phosphor 13 and a binder resin 14.

Seed and seed phosphor 13

The phosphor 13 is not particularly limited. Examples of the phosphor 13 include a sulfide-based phosphor, a germanate-based phosphor, a halide-based phosphor, a barium sulfate-based phosphor, a hafnium phosphate-based phosphor, a tantalate-based phosphor, a tungstate-based phosphor, a rare earth-based silicate-based phosphor, a rare earth oxysulfide-based phosphor, a rare earth phosphate-based phosphor, a rare earth oxyhalide-based phosphor, an alkaline earth metal phosphate-based phosphor, and an alkaline earth metal fluorohalide-based phosphor. Examples of the rare earth silicate phosphor include a cerium-activated rare earth silicate phosphor, a rare earth oxysulfide phosphor, a praseodymium-activated rare earth oxysulfide phosphor, a terbium-activated rare earth oxysulfide phosphor, and a europium-activated rare earth oxysulfide phosphor, examples of the rare earth phosphate phosphor include a terbium-activated rare earth phosphate phosphor, a terbium-activated rare earth oxyhalogen phosphor, a thulium-activated rare earth oxyhalide phosphor, an alkaline earth phosphate phosphor, a europium-activated alkaline earth phosphate phosphor, and an alkaline earth fluorohalide phosphor. The phosphors 13 may be used in combination. Among these, the phosphor 13 is preferably a phosphor selected from a halide-based phosphor, a terbium-activated rare earth oxysulfide-based phosphor, and a europium-activated rare earth oxysulfide-based phosphor, and more preferably a terbium-activated rare earth oxysulfide-based phosphor, from the viewpoint of high luminous efficiency.

Seeding Binder resin 14

The adhesive resin 14 is not particularly limited. For example, the adhesive resin 14 is a thermoplastic resin, a thermosetting resin, a photocurable resin, or the like. More specifically, the adhesive resin 14 is a polyester resin such as an acrylic resin, an acetal resin, a cellulose derivative, a silicone resin, an epoxy resin, a melamine resin, a phenol resin, a polyurethane resin, a urea resin, a vinyl chloride resin, polyethylene terephthalate, polyethylene naphthalate, or the like, polyethylene, polypropylene, polystyrene, polyvinyltoluene, polyphenylbenzene, or the like. The adhesive resin 14 may be used in combination. Of these, the adhesive resin 14 preferably contains at least one of an acrylic resin, an acetal resin, an epoxy resin, and a cellulose derivative, and more preferably contains 1 to 3 of these as main components. This can suppress the attenuation of light in the cell, and the scintillator panel 2 can easily extract the emitted light sufficiently. The main component of at least one of the acrylic resin, the acetal resin, the epoxy resin, and the cellulose derivative means that the total amount of the acrylic resin, the acetal resin, and the cellulose derivative is 50 to 100 mass% of the material constituting the resin.

The adhesive resin 14 is preferably in contact with the organic protective layer 12. In this case, the adhesive resin 14 may be in contact with at least a part of the organic protective layer 12. Thus, the fluorescent material 13 is less likely to fall out of the cell in the scintillator panel 2. As shown in fig. 1, the adhesive resin 14 may be filled in the cells with almost no voids or may be filled with voids.

As described above, the scintillator panel 2 according to the present embodiment has high luminance and high definition.

< radiation detector >

The radiation detector according to one embodiment of the present invention can be manufactured by disposing the radiation detector member 1 in a housing. Alternatively, the radiation detector may be manufactured by removing a scintillator of a commercially available radiation detector and arranging the scintillator panel 2 according to one embodiment of the present invention instead.

< method for manufacturing scintillator panel >

A method for manufacturing a scintillator panel according to an embodiment of the present invention includes: forming a partition wall on the substrate to partition the unit regions; a reflective layer forming step of forming a metal reflective layer on a surface of the partition wall; an organic protective layer forming step of forming an organic protective layer on a surface of the reflective layer; and a filling step of filling the cells partitioned by the partition walls with a phosphor. Hereinafter, each step will be described. In the following description, the description of the common matters with those described in the above-described embodiment of the scintillator panel will be omitted as appropriate.

(spacer formation step)

The partition wall forming step is a step of forming a partition wall on the substrate. The method for forming the partition wall on the substrate is not particularly limited. The method for forming the partition wall can be any of various known methods, and is preferably a photosensitive paste method from the viewpoint of easy shape control.

The partition wall having glass as a main component can be formed by, for example, the following method: a coating step of coating a photosensitive paste containing a glass powder on the surface of a substrate to obtain a coating film; a pattern forming step of exposing and developing the coating film to obtain a pre-calcination pattern of the partition wall; and a calcination step of calcining the pattern to obtain a partition wall pattern.

Seed coating step

The coating step is a step of coating the entire surface or a part of the surface of the substrate with a paste containing a glass powder to obtain a coating film. The substrate may be a highly heat-resistant support such as a glass plate or a ceramic plate. Examples of the method of applying the paste containing glass powder include screen printing, bar coater, roll coater, die coater, and blade coater. The thickness of the obtained coating film can be adjusted depending on the number of times of coating, the mesh size of the screen, the viscosity of the paste, and the like.

In order to produce a partition wall containing glass as a main component, 50 to 100 mass% of the inorganic component contained in the glass powder-containing paste used in the coating step needs to be glass powder.

The glass powder contained in the glass powder-containing paste is preferably glass that softens at the firing temperature, and more preferably glass having a low softening point and a softening temperature of 650 ℃. The softening temperature can be determined by: the endothermic end temperature in the endothermic peak was extrapolated by a tangent method from the DTA curve obtained by measuring the sample using a differential thermal analyzer (for example, differential thermal balance TG8120 (manufactured by Kabushiki Kaisha) リガク, and was obtained. More specifically, first, the inorganic powder to be a measurement sample was measured by using a differential thermal analyzer and using alumina powder as a standard sample, and the temperature was raised at 20 ℃/min from room temperature, to obtain a DTA curve. The softening point Ts obtained by extrapolating the 3 rd inflection point in the DTA curve obtained by the tangent method can be referred to as the softening temperature.

In order to obtain a low softening point glass, a compound effective for bringing the glass to a low softening point, that is, a metal oxide selected from the group consisting of lead oxide, bismuth oxide, zinc oxide and oxides of alkali metals can be used. The softening temperature of the glass is preferably adjusted by using an oxide of an alkali metal. The alkali metal means a metal selected from lithium, sodium and potassium.

The proportion of the alkali metal oxide in the low softening point glass is preferably 2% by mass or more, and more preferably 5% by mass or more. The proportion of the alkali metal oxide in the low softening point glass is preferably 20 mass% or less, and more preferably 15 mass% or less. When the proportion of the alkali metal oxide is 2 mass% or more, the softening temperature becomes appropriate, and it becomes difficult to cause the necessity of performing the calcination step at a high temperature and to cause defects in the partition wall. On the other hand, when the proportion of the alkali metal oxide is 20 mass% or less, the viscosity of the glass is less likely to be excessively reduced in the firing step, and strain is less likely to be generated in the shape of the resulting lattice-like pattern after firing.

The low softening point glass preferably contains 3 to 10 mass% of zinc oxide in order to appropriately adjust the viscosity at high temperature. The proportion of zinc oxide in the low softening point glass is 3% by mass or more, whereby the viscosity of the low softening point glass at high temperature can easily be made appropriate. On the other hand, the content of zinc oxide is 10 mass% or less, so that the production cost of the low softening point glass can be easily adjusted to a suitable level.

The low softening point glass preferably contains at least 1 metal oxide selected from the group consisting of silicon oxide, boron oxide, aluminum oxide and oxides of alkaline earth metals in order to adjust stability, crystallinity, transparency, refractive index or thermal expansion characteristics. Here, the alkaline earth metal means a metal selected from magnesium, calcium, barium and strontium. An example of a preferable composition range of the low softening point glass is shown below.

Alkali metal oxides: 2 to 20% by mass

Zinc oxide: 3 to 10% by mass

Silicon oxide: 20 to 40% by mass

Boron oxide: 25 to 40% by mass

Alumina: 10 to 30% by mass

Alkaline earth metal oxide: 5 to 15 mass%.

The particle size of the inorganic powder including the glass powder can be measured using a particle size distribution measuring apparatus, for example, MT3300 (manufactured by japanese unexamined patent publication). More specifically, the particle size can be measured after the inorganic powder is put into a sample chamber of a particle size distribution measuring apparatus filled with water and subjected to ultrasonic treatment for 300 seconds.

The 50% volume average particle diameter (hereinafter referred to as "D50") of the low-softening-point glass powder is preferably 1.0 μm or more, more preferably 2.0 μm or more. Further, D50 is preferably 4.0 μm or less, more preferably 3.0 μm or less. When D50 is 1.0 μm or more, the glass powder is less likely to aggregate and uniform dispersibility is obtained, and the flow stability of the paste obtained is appropriate. On the other hand, when D50 is 4.0 μm or less, the surface irregularities of the calcined pattern obtained in the calcination step are less likely to increase, and the calcined pattern is less likely to cause the partition wall to be broken afterwards.

The glass powder-containing paste may contain, as a filler, glass having a high softening point and a softening temperature of more than 700 ℃, or ceramic particles such as silica, alumina, titania, or zirconia, in addition to the low softening point glass, in order to control the shrinkage of the lattice pattern in the firing step and to maintain the shape of the finally obtained partition wall. The proportion of the filler in the entire inorganic component is preferably 2 vol% or less in order to improve the flatness of the partition wall. The filler D50 is preferably the same as the low softening point glass powder.

In the photosensitive glass powder-containing paste, in order to suppress light scattering during exposure and form a high-precision pattern, the refractive index n1 of the glass powder and the refractive index n2 of the organic component preferably satisfy the relationship of-0.1 < n1-n2<0.1, more preferably satisfy the relationship of-0.01. ltoreq. n1-n 2. ltoreq.0.01, and still more preferably satisfy the relationship of-0.005. ltoreq. n1-n 2. ltoreq.0.005. The refractive index of the glass powder can be appropriately adjusted according to the composition of the metal oxide contained in the glass powder.

The refractive index of the glass powder can be measured by the Becker line method. The refractive index of the organic component can be determined by measuring a coating film containing the organic component by an ellipsometry method. More specifically, the refractive index (ng) at a wavelength of 436nm (g line) at 25 ℃ of the glass powder or the organic component can be respectively noted as n1 or n 2.

The photosensitive organic component contained in the photosensitive glass powder-containing paste is not particularly limited. Examples of the photosensitive organic component include photosensitive monomers, photosensitive oligomers, and photosensitive polymers. The photosensitive monomer, photosensitive oligomer, and photosensitive polymer refer to a monomer, oligomer, and polymer that undergo a reaction such as photocrosslinking or photopolymerization upon irradiation with active light to change their chemical structures.

The photosensitive monomer is preferably a compound having an activated carbon-carbon unsaturated double bond. Examples of such a compound include compounds having a vinyl group, an acryloyl group, a methacryloyl group, or an acrylamide group. The photosensitive monomer is preferably a polyfunctional acrylate compound or a polyfunctional methacrylate compound in order to increase the photocrosslinking density and form a high-precision pattern.

The photosensitive oligomer or photosensitive polymer is preferably an oligomer or polymer having a carboxyl group and a reactive carbon-carbon unsaturated double bond. Such an oligomer or polymer is obtained by copolymerizing a carboxyl group-containing monomer such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid or an acid anhydride thereof, or a methacrylate, an acrylate, styrene, acrylonitrile, vinyl acetate or a 2-hydroxy acrylate. Examples of the method for introducing an activated carbon-carbon unsaturated double bond into an oligomer or polymer include: a method of reacting a mercapto group, an amino group, a hydroxyl group or a carboxyl group of an oligomer or a polymer with a carboxylic acid such as acryloyl chloride, methacryloyl chloride or allyl chloride, an ethylenically unsaturated compound having a glycidyl group or an isocyanate group, or maleic acid.

By using a photosensitive monomer or photosensitive oligomer having a urethane bond, a paste containing glass powder which is capable of relaxing the initial stress of the calcination step and in which pattern defects are difficult to generate in the calcination step is obtained. The photosensitive glass powder-containing paste may contain a photopolymerization initiator, if necessary. The photopolymerization initiator is a compound that generates radicals by irradiation with active light.

The photopolymerization initiator is not particularly limited. Examples of the photopolymerization initiator include benzophenone, methyl o-benzoylbenzoate, 4-bis (dimethylamino) benzophenone, 4-bis (diethylamino) benzophenone, 4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenylketone, benzhydrylketone, fluorenone, 2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzil, benzylmethoxyethylacetal, benzoin methyl ether, benzoin butyl ether, anthraquinone, 2-tert-butylanthraquinone, anthrone, benzanthrone, dibenzosuberone, methyleneanthrone, toluanthrone, and the like, 4-azidobenzylidene acetophenone, 2, 6-bis (p-azidobenzylidene) cyclohexanone, 2, 6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 1-phenyl-1, 2-butanedione-2- (O-methoxycarbonyl) oxime, 1-phenyl-1, 2-propanedione-2- (O-ethoxycarbonyl) oxime, 1, 3-diphenylpropanetrione-2- (O-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxypropanetrione-2- (O-benzoyl) oxime, Michler's ketone, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholino-1-propanone, N-methyl-2-oxomethyl-1-propanone, N-methyl-ethyl-1-oxomethyl-2-oxomethyl-one, N-methyl-2-oxomethyl-one, N-2-methyl-2-oxomethyl-2-one, N-2-N-one, N-methyl-2-one, N, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1, naphthalenesulfonyl chloride, quinolinesulfonyl chloride, N-thiophenylacridone, benzothiazole disulfide, triphenylphosphine, benzoin peroxide, a photoreducible pigment such as eosin or methylene blue, and a reducing agent such as ascorbic acid or triethanolamine.

The photosensitive glass powder-containing paste contains a polymer having a carboxyl group as a photosensitive polymer, whereby the solubility of the photosensitive glass powder-containing paste in an aqueous alkaline solution during development is improved. The acid value of the polymer having a carboxyl group is preferably 50 to 150 mgKOH/g. The development edge (a "image マージン") is broadened by the acid value being 150mgKOH/g or less. On the other hand, when the acid value is 50mgKOH/g or more, the solubility of the photosensitive glass powder-containing paste in an aqueous alkali solution is not lowered, and a high-definition pattern can be obtained.

The photosensitive glass powder-containing paste can be obtained by kneading various components so as to have a predetermined composition, and then uniformly mixing and dispersing the kneaded product by a three-roll mill or a kneader.

The viscosity of the photosensitive glass powder-containing paste can be adjusted as appropriate by the addition ratio of the inorganic powder, the thickener, the organic solvent, the polymerization inhibitor, the plasticizer, the anti-settling agent, or the like. The viscosity of the photosensitive glass powder-containing paste is preferably 2000mPa, seeds or more, more preferably 5000mPa, seeds or more. The viscosity is preferably 200000mPa seeds or less, and more preferably 100000mPa seeds or less. For example, when a photosensitive glass powder-containing paste is applied to a substrate by a spin coating method, the viscosity is preferably 2 to 5Pa, and when the paste is applied to a substrate by a blade coater method or a die coater method, the viscosity is preferably 10 to 50 Pa. When a photosensitive glass powder-containing paste is applied by 1 screen printing method to obtain a coating film having a thickness of 10 to 20 μm, the viscosity is preferably 50 to 200Pa seeds.

Seed and seed pattern formation step

The pattern forming step includes, for example: an exposure step of exposing the coating film obtained in the coating step to light through a photomask having a predetermined opening; and a developing step of dissolving and removing a portion of the exposed coating film that is soluble in a developing solution.

The exposure step is a step of photo-curing a necessary portion of the coating film by exposure, or photo-decomposing an unnecessary portion of the coating film to make an arbitrary portion of the coating film soluble in a developer. The developing step is a step of dissolving and removing a developer-soluble portion of the exposed coating film with a developer to obtain a lattice-like pattern before firing in which only a necessary portion remains.

In the exposure step, an arbitrary pattern can be directly drawn with a laser or the like without using a photomask. Examples of the exposure apparatus include a proximity exposure apparatus. Examples of the actinic light to be irradiated in the exposure step include near infrared rays, visible light rays, and ultraviolet rays are preferred. Examples of the light source include a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a halogen lamp, and a germicidal lamp, and an ultrahigh-pressure mercury lamp is preferable.

The exposure conditions differ depending on the thickness of the coating film. Usually, the exposure is performed with 1-100 mW/cm²The output ultra-high pressure mercury lamp is exposed for 0.01-30 minutes.

The developing method in the developing step may include, for example, a dipping method, a spraying method, or a brushing method. The developing solution is appropriately selected from solvents that can dissolve unnecessary portions of the coating film after exposure. The developer is preferably an aqueous solution containing water as a main component. For example, in the case where the paste containing the glass powder contains a polymer having a carboxyl group, an aqueous alkali solution may be selected as the developer. Examples of the aqueous alkaline solution include an aqueous inorganic alkaline solution such as sodium hydroxide, sodium carbonate or calcium hydroxide, and an aqueous organic alkaline solution such as tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine or diethanolamine. Among these, the aqueous alkali solution is preferably an organic aqueous alkali solution from the viewpoint of ease of removal in the calcination step. The concentration of the aqueous alkali solution is preferably 0.05% by mass or more, more preferably 0.1% by mass or more. The concentration of the aqueous alkali solution is preferably 5% by mass or less, more preferably 1% by mass or less. The concentration of the aqueous alkali solution is 0.05 mass% or more, and thus unnecessary portions of the coating film after exposure can be easily removed sufficiently. On the other hand, when the alkali concentration is 5 mass% or less, the lattice-like pattern is less likely to be peeled off or corroded before firing. The developing temperature is preferably 20 to 50 ℃ in order to facilitate the step control.

In order to perform pattern formation by exposure and development, the paste containing glass powder applied in the coating step needs to be photosensitive. That is, the paste containing the glass powder needs to contain a photosensitive organic component. The proportion of the organic component in the photosensitive glass powder-containing paste is preferably 30% by mass or more, and more preferably 40% by mass or more. The ratio of the organic component in the photosensitive glass powder-containing paste is preferably 80 mass% or less, and more preferably 70 mass% or less. When the proportion of the organic component is 30% by mass or more, the dispersibility of the inorganic component in the paste is lowered, and defects are less likely to occur in the firing step. Further, the paste has a suitable viscosity and is excellent in coatability and stability. On the other hand, when the ratio of the organic component is 80 mass% or less, the shrinkage of the lattice pattern in the firing step is less likely to increase, and defects are less likely to occur.

The softening temperature of the glass powder contained in the photosensitive glass powder-containing paste is preferably 480 ℃ or higher in order to remove the organic component almost completely in the firing step and ensure the strength of the finally obtained partition wall.

Seed and seed calcination step

The firing step is a step of firing the lattice-shaped pre-firing pattern obtained in the pattern forming step, decomposing and removing organic components contained in the glass powder-containing paste, softening and sintering the glass powder, and obtaining a lattice-shaped post-firing pattern, that is, a partition wall.

The firing conditions vary depending on the composition of the paste containing the glass powder and the type of the substrate. For example, calcination may be carried out with a calciner that is air, nitrogen, or hydrogen atmosphere. Examples of the calciner include a batch calciner and a belt-type continuous calciner. The temperature of the calcination is preferably 500 ℃ or higher, more preferably 550 ℃ or higher. The temperature of the calcination is preferably 1000 ℃ or lower, more preferably 700 ℃ or lower, and still more preferably 650 ℃ or lower. The temperature of the calcination is 500 ℃ or higher, whereby the organic components can be sufficiently decomposed and removed. On the other hand, the calcination temperature is 1000 ℃ or less, and thus the substrate used is not limited to a high heat-resistant ceramic plate or the like. The calcination time is preferably 10 to 60 minutes.

In the method for manufacturing a scintillator panel according to the present embodiment, the base material used in forming the partition wall may be used as the substrate of the scintillator panel, or the partition wall may be peeled off from the base material and then the peeled partition wall may be placed on the substrate. As a method for peeling the partition from the substrate, a known method such as a method of providing a peeling auxiliary layer between the substrate and the partition can be used.

(reflection layer Forming step)

The method for manufacturing a scintillator panel of the present embodiment includes: a reflective layer forming step of forming a metallic reflective layer on the surface of the partition wall. The metal reflective layer may be formed on at least a part of the surface of the partition wall.

The method for forming the metal reflective layer is not particularly limited. For example, the metal reflective layer can be formed by a vacuum film forming method such as a vacuum deposition method, a sputtering method, or a CVD method, a plating method, a paste coating method, or a spraying method using a spray. Among these, a metal reflective layer formed by a sputtering method is preferable because it has higher uniformity of reflectance and higher corrosion resistance than a metal reflective layer formed by another method.

(organic protective layer formation step)

The method of manufacturing a scintillator panel of the present embodiment has an organic protective layer forming step of forming an organic protective layer. The method for forming the organic protective layer is not particularly limited. As described later, the organic protective layer can be formed by applying a solution containing an amorphous fluorine-containing resin under vacuum to the partition wall substrate, and then drying the solution to remove the solvent. The substrate after drying may be cured by heating or light after drying in order to improve heat resistance and chemical resistance.

The organic protective layer preferably contains an amorphous fluorine-containing resin as a main component, and the fluorine-containing resin has a structure represented by the general formula (1) described above in the embodiment of the scintillator panel.

[ solution 3]

In the above general formula (1), R¹~R⁴Represents hydrogen, halogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted alkynyl, hydroxyl, substituted or unsubstituted alkoxy, substituted or unsubstituted aryl, cyano, aldehyde, substituted or unsubstituted ester, acyl, carboxyl, substituted or unsubstituted amino, nitro or substituted or unsubstituted epoxy. Furthermore, can be represented by R¹~R⁴2 of which form 1 ring structure. However, R¹~R⁴Of these, at least 1 is fluorine or a group having fluorine. R¹~R⁴Among them, 1 or more is preferably fluorine, and more preferably 2 or more is fluorine. Examples of the substituent in the case where these groups are substituted include halogen, alkyl, aryl, alkoxy, and the like. In addition, R is¹~R⁴Each may be the same or different.

In the general formula (1), the alkyl group may be linear or cyclic, and the number of carbon atoms is preferably 1 to 12. The number of carbon atoms of the alkenyl group is preferably 1 to 15. The number of carbon atoms of the alkynyl group is preferably 1 to 10. The number of carbon atoms of the alkoxy group is preferably 1 to 10. The number of carbon atoms of the aryl group is preferably 6 to 40.

The structure represented by the above general formula (1) preferably has a saturated ring structure. In the amorphous fluorine-containing resin having a saturated ring structure, the structure represented by the general formula (1) is preferably the structure represented by the general formula (2).

(filling step)

The method for manufacturing a scintillator panel of the present embodiment includes: and a filling step of filling the cells partitioned by the partition walls with a phosphor. The method of filling the phosphor is not particularly limited. For example, in view of the simple process and the ability to fill a homogeneous phosphor in a large area, the filling method is preferably a method in which a phosphor paste obtained by mixing phosphor powder and a binder resin in a solvent is applied to a partition wall substrate under vacuum, and then dried to remove the solvent.

As described above, according to the method for manufacturing a scintillator panel of the present embodiment, the scintillator obtained is high in luminance and high in definition.

The above description has been directed to an embodiment of the present invention. The present invention is not particularly limited to the above embodiments. The above embodiments mainly describe the invention having the following configurations.

(1) A scintillator panel comprises a substrate, lattice-shaped partition walls formed on the substrate, and phosphor layers in cells partitioned by the partition walls, wherein the partition walls have a metal reflective layer and an organic protective layer containing an amorphous fluorine-containing resin as a main component in this order on the surface of the partition walls.

With this configuration, the scintillator panel can easily achieve high brightness and high definition.

(2) The scintillator panel according to (1), wherein the amorphous fluorine-containing resin has fluorine atoms directly bonded to atoms of a main chain.

With such a configuration, the scintillator panel can easily suppress corrosion of the metal reflective layer, and can easily achieve higher luminance and higher definition.

(3) The scintillator panel according to the item (1) or (2), wherein the amorphous fluorine-containing resin is a compound having a repeating unit represented by the following general formula (2) as a main component,

[ solution 4]

(in the above general formula (2), X represents oxygen, s and u each independently represents 0 or 1, t represents an integer of 1 or more; R⁵~R⁸Represents hydrogen, halogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted alkynyl, hydroxyl, substituted or unsubstituted alkoxy, substituted or unsubstituted aryl, cyano, aldehyde, substituted or unsubstitutedA substituted ester group, an acyl group, a carboxyl group, a substituted or unsubstituted amino group, a nitro group, or a substituted or unsubstituted epoxy group).

With such a configuration, the scintillator panel can easily achieve higher luminance.

(4) The scintillator panel according to any one of (1) to (3), wherein the amorphous fluorine-containing resin has a refractive index of 1.41 or less.

With such a configuration, the scintillator panel can easily achieve higher luminance.

(5) The scintillator panel according to any one of (1) to (4), wherein the metal reflective layer contains silver as a main component.

With such a configuration, the scintillator panel can more easily improve the luminance.

(6) The scintillator panel according to (5), wherein the metal reflective layer contains a silver alloy containing at least any one of palladium and copper.

With such a configuration, the scintillator panel is more excellent in resistance to discoloration in the atmosphere.

(7) The scintillator panel according to any one of (1) to (6), wherein the partition wall comprises 98 vol% or more of a low softening point glass having a softening point of 650 ℃ or less.

With such a configuration, the luminance of the scintillator panel is easily further improved.

(8) A radiation detector comprising the scintillator panel described in any one of (1) to (7).

With this configuration, a high-definition radiation detector is obtained.

(9) A method of manufacturing a scintillator panel, comprising: forming a partition wall on the substrate to partition the unit regions; a reflective layer forming step of forming a metal reflective layer on the surface of the partition wall; an organic protective layer forming step of forming an organic protective layer on the surface of the reflective layer; and a filling step of filling the cells partitioned by the partition walls with a phosphor, wherein the organic protective layer contains an amorphous fluorine-containing resin as a main component.

With such a configuration, the scintillator panel obtained has high brightness and high definition.

Examples

The present invention will be described in further detail below with reference to examples and comparative examples. The present invention is not limited to these.

(raw Material for organic protective layer)

The raw materials used for the preparation of the resin solution for an organic protective layer are as follows.

Fluorine-based solvent: CT-SOLV180(AGC manufactured by TOYOBO Co., Ltd.)

Non-fluorine-containing solvent A: 1-methyl-2-pyrrolidone (Fuji フイルム, manufactured by Wako pure chemical industries, Ltd.)

Non-fluorine-containing solvent B: decane (Fuji フイルム, manufactured by Wako pure chemical industries, Ltd.)

Non-fluorine-containing solvent C: gamma-butyrolactone (Fuji フイルム, manufactured by Wako pure chemical industries, Ltd.)

Amorphous fluorine-containing resin a: an amorphous fluorine-containing resin prepared by polymerizing CYTOP (registered trademark) CTL-809M (サイトップ M type (having a saturated ring structure, having fluorine atoms directly bonded to main chain atoms, and having silyl groups at terminal ends; in general formula (2), s: 1, u: 0, t: 2, and R⁵~R⁸: F) a solution obtained by diluting the solution to 9% by mass with CT-SOLV180, manufactured by AGC

Amorphous fluorine-containing resin B: CyTOP (registered trademark) CTL-809A (サイトップ A type (amorphous fluorine-containing resin having a saturated ring structure, having fluorine atoms directly bonded to main chain atoms and having carboxyl groups at the terminals; general formula (2) wherein s: 1, u: 0, t: 2, and R⁵~R⁸: F) a solution obtained by diluting the solution to 9% by mass with CT-SOLV180, manufactured by AGC

Amorphous fluorine-containing resin C: a CYTOP (registered trademark) CTX-809SP2(サイトップ S type (amorphous fluorine-containing resin having a saturated ring structure, having fluorine atoms directly bonded to main chain atoms, and having no substituent at the terminal), is prepared by reacting a compound represented by the general formula (2) wherein S: 1, u: 0, t: 2, and R are as defined in the specification⁵~R⁸: F) a solution obtained by diluting the solution to 9% by mass with CT-SOLV180, manufactured by AGC

Amorphous fluorine-containing resin D: hyflon AD60 (having a saturated ring structure, having fluorine atoms directly bonded to main chain atoms, and having fluorine substitution at the terminalAn alkyl group-containing amorphous fluorine-containing resin; in the general formula (2), s: 1. u: 1. t: 1. r⁵：OCF₃、R⁶~R⁸: f; manufactured by Sigma Aldrich Co Ltd

Amorphous fluorine-containing resin E: poly (2, 2,3,3,4,4, 4-heptafluorobutyl methacrylate, Sigma Aldrich Co.)

Amorphous fluorine-containing resin F: poly (1, 1,1,3,3, 3-hexafluoroisopropyl methacrylate, Sigma Aldrich Co.)

Crystalline fluorine-containing resin: 807-NX (produced by Mitsui, seed, ケマーズ, seed, フロロプロダクツ)

Non-fluorine resin A: SYLGARD184 (Dong レ seed ダウコーニング (manufactured by Yao)

Non-fluorine-containing resin B: styrene Polymer (Fuji フイルム manufactured by Wako pure chemical industries, Ltd.)

Non-fluorine-containing resin C: methyl methacrylate Polymer (Fuji フイルム manufactured by Wako pure chemical industries, Ltd.)

Non-fluorine-containing resin D: ETHOCEL (registered trademark) 7cp (manufactured by DOW CHEMICAL Co., Ltd.)

(formation of organic protective layer)

Preparation example 1 fluororesin solution

A resin solution was prepared by mixing 1 part by mass of a fluorine-based solvent with 1 part by mass of an amorphous fluorine-containing resin A as a solvent.

Preparation example 2 fluororesin solution

A resin solution was prepared by mixing 1 part by mass of a fluorine-based solvent with 1 part by mass of the amorphous fluorine-containing resin B as a solvent.

Preparation example 3 fluororesin solution

A resin solution was prepared by mixing 1 part by mass of a fluorine-based solvent with 1 part by mass of the amorphous fluorine-containing resin C as a solvent.

Preparation example 4 fluororesin solution

200 parts by mass of a fluorine-containing solvent was added as a solvent to 9 parts by mass of the amorphous fluorine-containing resin D in a stirring vessel, and the mixture was stirred at room temperature for 12 hours to prepare a resin solution.

Preparation example 5 fluororesin solution

A resin solution was prepared by mixing 95 parts by mass of a non-fluorinated solvent A as a solvent with 5 parts by mass of an amorphous fluorinated resin E.

Preparation example 6 fluorine-containing resin solution

A resin solution was prepared by mixing 95 parts by mass of a non-fluorinated solvent A as a solvent with 5 parts by mass of an amorphous fluorine-containing resin F.

Preparation example 7 fluororesin solution

A mixed solution was prepared by mixing 95 parts by mass of a fluorine-based solvent as a solvent with 5 parts by mass of the crystalline fluorine-containing resin.

Preparation example 8 non-fluorine resin solution

A resin solution was prepared by mixing 95 parts by mass of a non-fluorine-containing solvent B as a solvent with 5 parts by mass of a non-fluorine-containing resin a.

Preparation example 9 non-fluorine resin solution

The resin solution was prepared by mixing 95 parts by mass of the non-fluorine-containing solvent C as a solvent with 5 parts by mass of the non-fluorine-containing resin B.

Preparation example 10 non-fluorine resin solution

The resin solution was prepared by mixing 95 parts by mass of the non-fluorine-containing solvent C as a solvent with 5 parts by mass of the non-fluorine-containing resin C.

Preparation example 11 non-fluorine resin solution

The resin solution was prepared by mixing 95 parts by mass of the non-fluorine-containing solvent C as a solvent with 5 parts by mass of the non-fluorine-containing resin D.

The organic protective layers described in table 1 were formed as follows. The resin solutions described in Table 1 were used for examples 1 to 6 and comparative examples 1 to 5. The resin solution was vacuum-printed on a partition wall substrate, dried at 90 ℃ for 1 hour, and further cured at 190 ℃ for 1 hour to form an organic protective layer. The thickness of the organic protective layer on the side surface of the central portion in the height direction of the partition wall in each partition wall substrate was 1 μm, which was measured by exposing the cross section of the partition wall using a triple ion mill EM TIC 3X (manufactured by LEICA) and imaging the exposed cross section with a field emission scanning electron microscope (FE-SEM) Merlin (manufactured by Zeiss). Comparative example 6 a scintillator panel was produced in the same manner as in the other comparative examples, except that the organic protective layer was not formed.

(raw material for paste containing glass powder)

The raw materials used for preparing the photosensitive glass powder-containing paste are as follows.

Photosensitive monomer M-1: trimethylolpropane triacrylate

Photosensitive monomer M-2: tetrapropylene glycol dimethacrylate

Photosensitive polymer: obtained by addition reaction of carboxyl group of a copolymer having a mass ratio of methacrylic acid/methyl methacrylate/styrene =40/40/30 with 0.4 equivalent of glycidyl methacrylate (weight average molecular weight 43000; acid value 100)

Photopolymerization initiator: 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1 (manufactured by BASF)

Polymerization inhibitor: 1, 6-hexanediol-bis [ (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ])

Ultraviolet absorber solution: スダン IV (manufactured by Tokyo Kogyo Co., Ltd.) solution containing 0.3 mass% of gamma-butyrolactone

Viscosity modifier: フローノン EC121 (manufactured by Kyor Co., Ltd.)

Solvent: gamma-butyrolactone

Low softening point glass powder:

SiO₂27 mass% and B₂O₃31 mass%, ZnO 6 mass%, Li₂O7 mass%, MgO 2 mass%, CaO 2 mass%, BaO 2 mass%, and Al₂O₃23 mass%, refractive index (ng)1.56, glass softening temperature 588 deg.C, thermal expansion coefficient 70 × 10^-7(K^-1) And an average particle diameter of 2.3. mu.m.

(preparation of glass powder-containing paste)

Paste containing glass powder P-1:

4 parts by mass of a photosensitive monomer M-1, 6 parts by mass of a photosensitive monomer M-2, 24 parts by mass of a photosensitive polymer, 6 parts by mass of a photopolymerization initiator, 0.2 part by mass of a polymerization inhibitor and 12.8 parts by mass of an ultraviolet absorber solution were dissolved in 38 parts by mass of a solvent by heating at 80 ℃. After cooling the obtained solution, 9 parts by mass of a viscosity modifier was added to obtain an organic solution 1. The organic solution 1 thus obtained was coated on a glass plate and dried, and the refractive index (ng) of the organic coating film thus obtained was 1.555. To 50 parts by mass of the organic solution 1, 50 parts by mass of a low-softening-point glass powder was added, followed by kneading with a three-roll mill to obtain a glass powder-containing paste P-1.

(production of partition wall substrate)

Partition wall substrate:

as the substrate, a 125 mm. times.125 mm. times.0.7 mm soda glass plate was used. On the surface of the substrate, a paste P-1 containing a glass powder was applied by a die coater so that the dried thickness became 220 μm and dried to obtain a coating film of the paste containing a glass powder. Next, the coating film of the paste containing the glass powder was subjected to a 300mJ/cm ultra-high pressure mercury lamp at a pitch of 127 μm and a line width of 15 μm through a photomask having openings corresponding to a desired pattern (a chrome mask having lattice-shaped openings and a pitch of 127 μm and a line width of 15 μm), and the resultant coating film was subjected to a sputtering treatment using a mercury ultra-high pressure lamp²Exposure with the exposure amount of (1). The exposed coating film was developed in a 0.5 mass% aqueous ethanolamine solution to remove the unexposed portion, and a grid-like pattern before firing was obtained. The resulting grid-like pre-firing pattern was fired in air at 580 ℃ for 15 minutes to form a grid-like partition wall containing glass as a main component. The height L1 of the partition wall, which was measured by cutting to expose the cross section of the partition wall and imaging with a scanning electron microscope S2400 (manufactured by Hitachi, Ltd.), was 150. mu.m, the interval L2 of the partition wall was 127. mu.m, the bottom width L3 of the partition wall was 30 μm, and the top width L4 of the partition wall was 10 μm.

(formation of Metal reflective layer)

Commercially available sputtering apparatuses and sputtering targets were used. In sputtering, a glass plate is disposed near the partition wall substrate, and sputtering is performed under the condition that the thickness of the metal on the glass plate reaches 300 nm. The sputtering target used was APC (manufactured by ltd. フルヤ metal) which is a silver alloy containing palladium and copper. The thickness of the metal reflective layer on the side surface of the central portion in the height direction of the partition wall in each partition wall substrate measured in the same manner as the thickness of the organic protective layer was 70 nm.

(phosphor)

The commercial GOS was used directly: tb (Tb-doped gadolinium oxysulfide) phosphor powder. The average particle diameter D50 measured by a particle size distribution measuring apparatus MT3300 (manufactured by Nikkiso Kagaku K.K.) was 11 μm.

(adhesive resin for phosphor layer)

The raw materials used for producing the binder resin for the phosphor layer are as follows.

Adhesive resin: ETHOCEL (registered trademark) 7cp (manufactured by DOW CHEMICAL Co., Ltd.)

Solvent: benzyl alcohol (Fuji フイルム manufactured by Wako pure chemical industries, Ltd.).

(formation of phosphor layer)

Phosphor paste was prepared by mixing 10 parts by mass of phosphor powder with 5 parts by mass of a binder resin solution having a concentration of 10% by mass. The phosphor paste was vacuum-printed on a barrier substrate having a reflective layer, an organic protective layer, and the like formed thereon, filled so that the volume fraction of the phosphor became 65%, and dried at 150 ℃ for 15 minutes to form a phosphor layer.

(measurement of refractive index of organic protective layer)

Each of the resin solutions described in preparation examples 1 to 11 was applied to a glass substrate to prepare a resin coating film. The refractive index of the resin coating film thus prepared was measured at 550nm at 22 ℃ using an Otsuka Denshi spectroscopic ellipsometer FE 5000.

(evaluation of reflectance)

A spectrophotometer CM-2600D (manufactured by コニカミノルタ Co.) was provided on the surface of each scintillator panel before the phosphor layer was filled, and the reflectance at 400 to 700nm was measured by SCI method. The obtained reflectance was set to a value at 550nm as the reflectance of the metal reflective layer. In addition, a relative value to the reflectance of example 1 was calculated and referred to as the reflectance of the metal reflective layer.

(evaluation of Brightness)

Each scintillator panel having the phosphor layer filled therein was aligned at the center of the sensor surface of the X-ray detector PaxScan 2520V (manufactured by Varex corporation) so that the unit of the scintillator panel corresponds to the pixel unit 1 of the sensor 1, and the substrate end was fixed with an adhesive tape to manufacture a radiation detector. In this detector, X-rays from an X-ray irradiation apparatus L9181-02 (manufactured by Hamamatsu ホトニクス Co., Ltd.) were irradiated with X-rays under conditions of a tube voltage of 50kV and a distance of 30cm between the X-ray tube and the detector, thereby obtaining an image. The average value of the digital values of the 256 × 256 pixel cells at the center of the light emission position of the scintillator panel in the obtained image is referred to as a luminance value, and a relative value to the luminance value of example 1 is calculated for each sample and referred to as luminance.

(examples 1 to 6 and comparative examples 1 to 6)

The partition wall substrate shown in table 1 was formed with the metal reflective layer by the aforementioned method using the material shown in table 1, and the organic protective layer shown in table 1 was formed by the aforementioned method. Thereafter, the phosphor layer was formed by the aforementioned method using the adhesive resin shown in table 1. The structures of the examples and comparative examples and the results of the evaluations are shown in table 1.

[ Table 1]

。

As shown in Table 1, the scintillator panels of examples 1 to 6, in which the organic protective layer containing the amorphous fluororesin as a main component was formed on the metal reflective layer, had high reflectance and high luminance. Among them, the scintillator panels of examples 1 to 4 provided with the organic protective layer containing the amorphous fluorine-containing resin represented by the general formula (1) or (2) had particularly high luminance. The scintillator panel before filling with the phosphors of examples 5 to 6, in which fluorine atoms were not directly bonded to atoms of the main chain, was excellent in reflectance even though it was an amorphous fluorine-containing resin. In addition, in the scintillator panels of examples 5 to 6, the luminance was slightly lowered but within an acceptable range because the protective layer was swollen and dissolved by the solvent contained in the phosphor paste in the phosphor filling step.

On the other hand, in the scintillator panel of comparative example 1, the crystalline fluorine-containing resin was not dissolved in the solvent, and the organic protective layer could not be formed. The scintillator panels of comparative examples 2 to 5, which did not have the amorphous fluororesin as the protective layer, had both of an inappropriate reflectance and luminance. The scintillator panel of comparative example 2 had insufficient suppression of corrosion of the metal reflective layer, and the luminance was not suitable. In addition, the protective layers of the scintillator panels of comparative examples 3 to 5 had insufficient refractive index and solvent resistance, and had inadequate reflectivity and brightness. Since the scintillator panel of comparative example 6 does not have a protective layer, corrosion of the metal reflective layer occurs due to components contained in the phosphor paste at the time of phosphor filling, and the luminance is not suitable.

From the above results, it is understood that the scintillator panel of the present invention can provide a high-luminance, high-definition scintillator panel.

Description of the reference numerals

1 Member for radiation detector

2 scintillator panel

3 output substrate

4 base plate

5 partition wall

6 phosphor layer

7 separator layer

8 photoelectric conversion layer

9 output layer

10 base plate

11 metal reflective layer

12 organic protective layer

13 fluorescent substance

14 adhesive resin

Height of L1 partition wall

Spacing of adjacent partition walls of L2

Bottom width of L3 partition wall

L4 separates the top width of the walls.