阅读说明：本技术 一种无损测量薄膜的探针和测量仪器 (Probe and measuring instrument for nondestructive measurement of thin film ) 是由 郁彩艳 白莹 赵慧玲 李世玉 尹延锋 于 2020-08-04 设计创作，主要内容包括：本发明提供一种无损测量薄膜的探针及测量仪器,包含导电针体、导电弹性针头、固定环、感应收缩簧。感应收缩簧的感应端超出导电弹性针头一定距离,能够监测到与纳米级厚度薄膜的接触和接触后的应力大小,能够精准地控制再次推进时间,使探针恰好接触薄膜而不损坏薄膜。该探针及测量仪适合对半导体薄膜进行接触式无损、稳定、可重复的准确检测,同时也适合推广到其它薄膜材料的电学检测。(The invention provides a probe and a measuring instrument for nondestructive measurement of a film, which comprise a conductive needle body, a conductive elastic needle head, a fixing ring and an induction contraction spring. The sensing end of the sensing contraction spring exceeds the conductive elastic needle head for a certain distance, the contact with the nano-scale thickness film and the stress after the contact can be monitored, the re-propulsion time can be accurately controlled, and the probe just contacts the film without damaging the film. The probe and the measuring instrument are suitable for performing contact type nondestructive, stable and repeatable accurate detection on the semiconductor film, and are also suitable for being popularized to electrical detection of other film materials.)

1. A probe for non-destructive measurement of thin films,

a conductive needle body;

the conductive elastic needle head is connected with one end of the conductive needle body, and the conductive elastic needle head and the conductive needle body can conduct electricity, so that when the conductive elastic needle head is contacted with the film, the conductive elastic needle head can deform to prevent the film from being damaged;

the conductive needle body and the conductive elastic needle head are arranged in the induction contraction spring so as to ensure that the induction end at the tail end of the induction contraction spring is preferentially contacted with the film no matter the probe approaches the film at any angle.

2. The probe for non-destructive measurement of thin film according to claim 1, wherein a fixing ring is provided, the fixing ring is connected to the other end of the conductive needle body and is electrically insulated from the conductive needle body.

3. The probe for non-destructive measurement of thin film according to claim 2, wherein one end of the inductive contraction spring is disposed on the fixing ring, and the inductive contraction spring not only can be passively contracted but also has an active contraction function.

4. The probe for non-destructive measurement of membranes according to claim 1, wherein said spring is a sensing end terminating in a sensing end and extending a distance beyond said conductive elastomeric tip.

5. The probe for non-destructive measurement of thin film according to claim 4, wherein the sensing end comprises at least a touch sensor for monitoring whether the sensing coil is touching the thin film.

6. The probe for nondestructive testing of a thin film according to claim 3 wherein the sensing end comprises a stress sensor for testing the contact stress of the sensing end 5 with the thin film.

7. The probe for nondestructive measurement of a film of claim 1 wherein the induced shrinkage spring is in the form of a spring.

8. The probe for nondestructive measurement of a thin film according to claim 7, wherein the sensing contraction spring is in a spring shape having a large upper portion and a small lower portion, so that the cross-sectional area of the sensing end is relatively small, thereby satisfying the measurement requirement of the electrode point of the thin film with a small area.

9. The probe for non-destructive measurement of membranes of claim 1, wherein said sensing end of said sensing retraction spring is circular in cross-section to reduce contact damage to said membrane.

10. A precision-advancing nondestructive electrical measurement measuring instrument, comprising:

a host computer, a test table, a sensing end sensing signal receiver, a controller, and a probe for nondestructive measurement of a thin film according to any one of claims 1 to 9;

the controller controls the advancing speed of the probe and/or the contraction speed of the induction contraction spring according to the sensing signal of the sensing end;

the induction end sensing signal receiver is connected with the induction contraction spring and the controller, the induction end sensing signal receiver obtains signals of the induction end through the induction contraction spring and then transmits the signals to the controller, and the controller controls the propelling speed of the probe and/or the contraction speed of the induction contraction spring according to the signals.

Technical Field

The invention relates to the field of electrical testing of semiconductor films, in particular to a probe and a measuring instrument for nondestructive electrical measurement of films.

Background

At present, the method commonly used for measuring the electrical properties of the film is mainly a contact probe method, the probe is made of hard metal, when the film material which can bear certain pressure and has unobvious damage or negligible damage is tested, the testing process can be smoothly carried out, and certain accuracy and repeatability of test data are ensured. However, when a nanoscale film type material is tested, the mechanical pressure of the hard metal probe is large, and mechanical damage is easily caused to materials such as graphene and a nanoscale film, so that the contact between the probe and a sample is poor, the test process cannot be smoothly carried out, or certain accuracy, repeatability and reproducibility of test data cannot be guaranteed.

In order to solve the problems, some technologies adopt that punctiform conductive silver paste is coated on a film and is dried to be used as an auxiliary test point, or adopt a liquid metal mercury electrode as a flexible electrode. Although the methods have certain effects, the operation process is complex, the technical difficulty is high or mercury has toxicity, so that the method is difficult to popularize and use.

In order to test the electrical test of the nano-scale film, patent with publication number CN 209656786U proposes a probe, a probe head and a measuring instrument for nondestructive measurement of the sheet resistance of the graphene film, wherein the probe comprises a conductive needle body and a conductive elastic needle head. When electrically conductive elasticity syringe needle and thin layer material contact, electrically conductive elasticity syringe needle can produce deformation in order to prevent to destroy thin layer material to and the probe can be through elastic component and this body coupling of probe, utilizes the cushioning effect of elastic component to further reduce the risk that produces the damage to the film in the test procedure. However, the effect of the elastic buffer alone cannot completely avoid damage to the film, especially the semiconductor film. The patent publication No. CN104422824A discloses a method for measuring the resistivity of a metal film, which comprises the steps of manufacturing an organic protective film on the surface of the metal film, rapidly lowering a probe to the surface of the organic protective film at a first speed, and then puncturing the organic protective film by the probe at a second speed and slowly lowering the organic protective film to the surface of the metal film. The patent adopts two different probe speeds, so that the probability of puncturing the metal film is greatly reduced, but the preparation of an organic protective film on the surface of part of the film can influence the electrical and optical properties of the film, particularly the semiconductor film. In addition, CN104422824A does not disclose a method for judging the surface of the metal thin film, and there is still a risk of damaging the thin film. Therefore, in order to realize the testing of the completely lossless thin film, a new related technical method still needs to be developed.

Disclosure of Invention

In view of the above, the present invention is directed to overcome the drawbacks and disadvantages of the prior art, and to provide a probe and a measuring instrument for accurately advancing, which are particularly suitable for performing nondestructive measurement on a semiconductor thin film, and the probe and the measuring instrument are suitable for performing contact-type nondestructive, stable, repeatable and accurate detection on the semiconductor thin film, and are also suitable for being popularized to electrical detection of other thin film materials.

In order to achieve the purpose, the invention is realized by the following technical scheme:

the first aspect of the present invention provides a probe for non-destructive measurement of thin films, the assembly of which comprises, as shown in FIG. 1:

a conductive needle body 1;

the conductive elastic needle head 2 is connected with one end part of the conductive needle body 1, and the conductive elastic needle head and the conductive needle body can conduct electricity, so that when the conductive elastic needle head 2 is contacted with the film, the conductive elastic needle head can deform to prevent the film from being damaged;

the fixing ring 3 is connected with the other end of the conductive needle body 1, and the fixing ring 3 is electrically insulated from the conductive needle body 1;

the induction contraction spring 4 is provided with one end arranged on the fixing ring 3, and the induction contraction spring 4 not only can be passively contracted, but also has an active contraction function and can be actively contracted under the control of the controller;

the other end of the induction contraction spring 4 is an induction end 5 and exceeds the conductive elastic needle by a certain distance D;

the sensing end 5 is at least provided with a contact sensor for monitoring whether the sensing contraction spring 5 contacts the film;

preferably, the sensing tip 5 is further provided with a stress sensor for testing the contact stress of the sensing tip 5 with the thin film. Further, the contact sensor and the contact sensor may be the same stress sensing element that is capable of monitoring the amount of stress in contact with the membrane and after contact.

Preferably, the sensing contraction spring 4 is in a spring shape, and the conductive needle 1 and the conductive elastic needle 2 are arranged in the sensing contraction spring 4 to ensure that the sensing end 5 at the end of the sensing contraction spring 4 preferentially contacts the film no matter what angle the probe approaches the film.

Preferably, the sensing contraction spring 4 is in a spring shape with a large upper part and a small lower part, so that the sectional area of the sensing end 5 is relatively small, and the measurement requirement of a small-area film electrode point is met.

Preferably, the sensing end 5 of the sensing pinch spring 4 is circular in cross-section to reduce contact damage to the membrane.

Preferably, the sensing end 5 of the sensing pinch spring 4 is wrapped with a flexible material.

The object of measurement is preferably a semiconductor thin film, but is not limited to a semiconductor thin film, and can be applied to measurement of other thin film materials with nanometer-scale thickness.

Specifically, when the sensing end 5 senses that it is not in contact with the film, the probe is at a first speed V₁Propelling, and inducing the shrinkage spring not to shrink; when the sensing end 5 senses that the film is contacted, the probe has a second speed V₂Propelling with propelling time T ═ D/V₂。

Preferably, when the sensing end 5 senses that it is in contact with the film and the probe advances at the second speed, the active retraction speed of the spring and the advancing speed of the probe are sensed to change synchronously at the same speed.

Preferably, the sensing tip 5 senses contact with the membrane and the sensing retraction spring 4 does not actively retract, but only passively, as the probe advances at the second speed.

The invention provides a measuring instrument for realizing nondestructive electrical measurement by accurate propulsion, which comprises:

the system comprises a host, a computer, a test board, a sensing end sensing signal receiver and a controller; the probe also comprises a probe for nondestructive measurement of the thin film provided by the embodiment of the first aspect of the application;

the controller controls the advancing speed of the probe and/or the contraction speed of the induction contraction spring according to the sensing signal of the sensing end;

the induction end sensing signal receiver is connected with the induction contraction spring and the controller, the induction end sensing signal receiver obtains a signal of the induction end through the induction contraction spring and then transmits the signal to the controller, and the controller controls the propelling speed of the probe and the contraction speed of the induction contraction spring according to the signal;

specifically, when the sensing end 5 senses that it does not contact the film, the controller controls the probe to rotate at a first speed V₁Propelling, and inducing the shrinkage spring not to shrink; when the sensing end 5 senses that the film is contacted, the controller controls the probe to rotate at a second speed V₂Propelling with propelling time T ═ D/V₂. Limited ground, V₂Less than V₁。

Preferably, when the film to be detected is a semiconductor film, the sensing end 5 senses that the film is contacted with the sensing end, and the controller controls the probe to advance at the second speed, so that the active contraction speed of the sensing contraction spring and the advancing speed of the probe synchronously change, and the speeds are consistent.

Preferably, when the film to be detected is a metal or semiconductor film, the sensing end 5 senses that the film is contacted, and the controller controls the sensing contraction spring 4 not to actively contract but only to passively contract when the probe advances at the second speed.

Preferably, when the film to be detected is a metal or semiconductor film, the sensing terminal 5 senses that the film is contacted, and the controller controls the probe to have the second speed V₂When the vehicle is propelled, the induction contraction spring 4 does not actively contract but only passively contracts, and the propelling time is T ═ D/V₂. When the pushing time is not reached, if the induction end 5 reaches a preset stress threshold value in advance, the controller controls the probe to finish pushing in advance, and the film is further prevented from being damaged. The preset stress threshold is a stress critical value sensed by the sensing end 5 when the probe set in advance damages the film to be tested.

Preferably, when the film to be detected is an electrode array consisting of a plurality of film electrode points, the sensing end 5 senses that the film is contacted with the sensing end, and the controller controls the probe to rotate at the second speed V₂When the vehicle is propelled, the induction contraction spring 4 does not actively contract but only passively contracts, and the propelling time is T ═ D/V₂. When the propelling time is reached, the propelling is finished, the detection value of the induction end 5 is recorded, the electrode points with the same detection value are selected for test comparison, and the influence of the probe stress on the test result is avoided.

The invention has the beneficial effects that: the probe adopts the conductive elastic needle head to be contacted with a film material, and when the probe is applied to the probe, compared with the traditional hard metal probe, the probe avoids mechanical damage to the film material, can ensure good electrical contact between the probe and a film sample, and ensures the accuracy, repeatability and reproducibility of film electrical data measurement. In addition, most importantly, the probe can monitor the propelling process of the probe, change the propelling speed when the preset distance between the probe and the film is reached, and accurately control the propelling time again so that the probe just contacts the film without damaging the film. The probe can also monitor the stress value between the probe and the film in the electrical test process, and the test points with consistent stress values are selected, so that the test accuracy can be greatly improved, and the influence of the difference of the probe stress on the test result is avoided.

Drawings

The invention is further described below with reference to the accompanying drawings.

FIG. 1 is a probe for non-destructive measurement of thin films in accordance with the present invention.

Detailed Description

The following embodiments are provided to illustrate the embodiments of the present invention, and those skilled in the art will appreciate further advantages and effects of the present invention. Moreover, the invention is capable of other and different embodiments and of being practiced or being carried out in various ways without departing from the spirit of the invention.

[ example 1]

As shown in fig. 1, the present embodiment provides a probe for non-destructive measurement of a semiconductor thin film, comprising:

a conductive needle body 1;

the conductive elastic needle head 2 is connected with one end part of the conductive needle body 1, and the conductive elastic needle head 2 and the conductive needle body 1 can conduct electricity, so that when the conductive elastic needle head 2 is contacted with the semiconductor film, the conductive elastic needle head 2 can deform to prevent the semiconductor film from being damaged;

the fixing ring 3 is connected with the other end of the conductive needle body 1, and the fixing ring 3 is electrically insulated from the conductive needle body 1;

an induction contraction spring 4, one end of the induction contraction spring 4 is arranged on the fixing ring 3, and the induction contraction spring 4 actively contracts under the control of a controller (not shown in the figure);

the other end of the induction contraction spring 4 is an induction end 5 and exceeds the conductive elastic needle by a certain distance D;

the sensing terminal 5 has a contact sensor for monitoring the contact of the sensing contraction spring 5 to the semiconductor thin film;

the induction end 5 is provided with a stress sensor for testing the contact stress of the induction end 5 and the semiconductor film; the contact sensor and the contact sensor can be the same stress sensing element which can monitor the contact with the semiconductor film and the stress after the contact;

the induction contraction spring 4 is in a spring shape, and the conductive needle body 1 and the conductive elastic needle head 2 are arranged in the induction contraction spring 4 so as to ensure that the induction end 5 at the tail end of the induction contraction spring 4 is preferentially contacted with the semiconductor film no matter which angle the probe approaches to the semiconductor film; the induction contraction spring 4 is in a spring shape with a large upper part and a small lower part, so that the sectional area of the induction end 5 is relatively small, and the measurement requirement of a small-area semiconductor film point is met;

the section of the induction end 5 of the induction contraction spring 4 is a circular ring so as to reduce the contact damage to the semiconductor film; the sensing end 5 of the sensing retraction spring 4 is wrapped with a flexible material.

When the sensing end 5 senses that the sensing end does not contact the semiconductor film, the probe is at a first speed V₁Propelling, and inducing the shrinkage spring not to shrink; when the sensing end 5 senses that the sensing end touches the film, the probe is at a second speed V₂Propelling with propelling time T ═ D/V₂Simultaneously, the active contraction speed of the induced contraction spring and the advancing speed of the probe are synchronously changed, and the speeds are consistent, wherein V₁＞V₂。

[ example 2]

As shown in FIG. 1, the present embodiment provides a probe for non-destructive measurement of a nano-scale thickness thin film, comprising:

a conductive needle body 1;

the conductive elastic needle head 2 is connected with one end part of the conductive needle body 1, and the conductive elastic needle head 2 and the conductive needle body 1 can conduct electricity, so that when the conductive elastic needle head 2 is contacted with the nano-scale thickness film, the conductive elastic needle head 2 can deform to prevent the nano-scale thickness film from being damaged;

the fixing ring 3 is connected with the other end of the conductive needle body 1, and the fixing ring 3 is electrically insulated from the conductive needle body 2;

the induction contraction spring 4, one end part of the induction contraction spring 4 is arranged on the fixed ring 3, and the induction contraction spring 4 only passively contracts;

the other end of the induction contraction spring 4 is an induction end 5 and exceeds the conductive elastic needle head 2 by a certain distance D;

the sensing end 5 at least comprises a contact sensor for monitoring whether the sensing contraction spring 5 contacts the nanometer-scale thickness film;

the induction end 5 also comprises a stress sensor for testing the contact stress of the induction end 5 and the nanometer-scale thickness film; the contact sensor and the contact sensor can be the same stress sensing element which can monitor the contact with the nanometer-scale thickness film and the stress after the contact;

the induction contraction spring 4 is in a spring shape, and the conductive needle body 1 and the conductive elastic needle head 2 are arranged in the induction contraction spring 4 so as to ensure that the induction end 5 at the tail end of the induction contraction spring 4 is preferentially contacted with the nanometer-scale thickness film no matter which angle the probe approaches the nanometer-scale thickness film; the induction contraction spring 4 is in a spring shape with a large upper part and a small lower part, so that the sectional area of the induction end 5 is relatively small, and the measurement requirement of a small-area nanometer-scale thickness film point is met;

the section of the induction end 5 of the induction contraction spring 4 is a circular ring so as to reduce the contact damage to the nano-scale thickness film; the sensing end 5 of the sensing contraction spring 4 is wrapped by a flexible material;

when the sensing end 5 senses that the sensing end does not contact with the nanometer-scale thickness film, the probe is at a first speed V₁Propelling, and inducing the shrinkage spring not to shrink; the sensing terminal 5 senses that it is touched to the filmWhile the film is being formed, the probe is at a second speed V₂Propelling with propelling time T ═ D/V₂In which V is₁＞V₂；

When the advancing time T is not reached, if the induction end 5 reaches a preset stress threshold value in advance, the controller controls the probe to finish advancing in advance, and the film is further prevented from being damaged. The preset stress threshold is a stress critical value sensed by the sensing end 5 when the probe set in advance damages the film to be tested.

When the propulsion time is reached, the propulsion is finished, the detection value of the induction end 5 is recorded, test points with the same detection value are selected for test comparison, and the influence of different probe stresses on test results is avoided.

[ example 3]

The embodiment provides a measuring instrument for realizing nondestructive electrical measurement by accurate propulsion, which comprises:

the system comprises a host, a computer, a test board, a sensing end sensing signal receiver and a controller; the probe also comprises the probe for nondestructive measurement of the thin film provided in the embodiment 1 or 2;

the controller controls the advancing speed of the probe and/or the contraction speed of the induction contraction spring according to the sensing signal of the sensing end;

the sensing end senses signals, the receiver is connected with the sensing contraction spring and the controller, the receiver obtains the signals of the sensing end through the sensing contraction spring and then transmits the signals to the controller, and the controller controls the propelling speed of the probe and/or the contraction speed of the sensing contraction spring according to the signals.