阅读说明：本技术 金属有机结构体 (Metal organic structure ) 是由 大桥良央 于 2020-04-20 设计创作，主要内容包括：本发明涉及金属有机结构体。提供了能够兼得在低相对湿度下吸附水蒸气、及缩小吸附湿度与解吸湿度的湿度差的范围的金属有机结构体。金属有机结构体,其中,金属离子为铝离子,第一配体为由具有2个羧基的第一杂环形成的有机化合物离子,并且构成第一杂环的杂原子存在于2个羧基形成的角的劣角侧,第二配体为不同于第一配体并且由具有2个羧基的第二杂环形成的有机化合物离子,并且构成第二杂环的杂原子存在于2个羧基形成的角的优角侧,第三配体为不同于第一配体和第二配体并且具有2个羧基的有机化合物离子,并且第一配体、第二配体和第三配体以特有的比例存在。(The present invention relates to metal organic structures. Provided is a metal-organic structure which can adsorb water vapor at a low relative humidity and can reduce the range of the humidity difference between the adsorption humidity and the desorption humidity. A metal-organic structure, wherein the metal ion is an aluminum ion, the first ligand is an organic compound ion formed of a first hetero ring having 2 carboxyl groups, and a hetero atom constituting the first hetero ring is present on a minor angle side of an angle formed by the 2 carboxyl groups, the second ligand is an organic compound ion different from the first ligand and formed of a second hetero ring having 2 carboxyl groups, and a hetero atom constituting the second hetero ring is present on a major angle side of an angle formed by the 2 carboxyl groups, the third ligand is an organic compound ion different from the first ligand and the second ligand and having 2 carboxyl groups, and the first ligand, the second ligand, and the third ligand are present in a unique ratio.)

1. A metal-organic structure comprising a metal ion, a first ligand, a second ligand, and optionally a third ligand, wherein,

the metal ions are aluminum ions, and the metal ions are aluminum ions,

the first ligand is an organic compound ion formed of a first heterocycle having 2 carboxyl groups, and in the first ligand, a hetero atom constituting the first heterocycle is present on a side of a poor angle of an angle formed by 2 carboxyl groups,

the second ligand is an organic compound ion different from the first ligand and formed of a second heterocycle having 2 carboxyl groups, and in the second ligand, a hetero atom constituting the second heterocycle is present on the reflex side of an angle formed by 2 carboxyl groups,

the third ligand is an organic compound ion different from the first ligand and the second ligand and having 2 carboxyl groups, and

with respect to the total of the first ligand, the second ligand and the third ligand,

the first ligand is present in a proportion of more than 0 mol% and 70 mol% or less,

the second ligand is present in a proportion of more than 0 mol% and 90 mol% or less, and

the third ligand is present in a proportion of 0 mol% or more and 80 mol% or less.

2. A metal organic structure according to claim 1, wherein the first heterocyclic ring is a five-membered ring or a six-membered ring, and the second heterocyclic ring is a five-membered ring or a six-membered ring.

3. A metal organic structure according to claim 1 or 2, wherein the first heterocyclic ring is a five-membered ring, and the second heterocyclic ring is a six-membered ring.

4. The metal-organic structure according to any one of claims 1 to 3, wherein the first ligand is a 2, 5-furandicarboxylate ion, the second ligand is a 3, 5-pyridinedicarboxylate ion, and the third ligand is an isophthalate ion.

5. The metal-organic structure according to any one of claims 1 to 4, wherein when the water vapor adsorption amount at a relative humidity of 0 to 20% is 100%, the humidity at which the water vapor adsorption amount is 70% is an adsorption humidity, and the humidity at which the water vapor adsorption amount is 30% is a desorption humidity, the adsorption humidity is 11.5% or less, and the difference between the adsorption humidity and the desorption humidity (adsorption humidity-desorption humidity) is 3.0% or less.

6. A chemical heat pump having the metal-organic structure according to any one of claims 1 to 5 as a moisture absorbing material.

7. A humidity control system comprising the metal-organic structure according to any one of claims 1 to 5 as a moisture absorbent.

Technical Field

The present disclosure relates to metal-organic structures.

Background

Metal Organic structures (MOF) which are Porous compounds are materials which are also referred to as Porous Coordination Polymers (PCP). MOFs have a high surface area coordination network structure formed by the interaction of metals with organic ligands.

In recent years, various studies and developments have been made on such a metal-organic structure.

For example, patent document 1 discloses a composition of Al³⁺And is provided on the Al³⁺An aluminum organic structure formed by a first ligand derived from at least one aromatic dicarboxylic acid selected from isophthalic acid and derivatives thereof and a second ligand derived from at least one heterocyclic dicarboxylic acid.

Further, non-patent document 1 discloses Al³⁺An aluminum organic structure (CAU-10) in which an ion is coordinated to an isophthalate ion as a ligand.

Further, non-patent document 2 discloses Al³⁺An aluminum organic structure in which an ion is coordinated to a 2, 5-furandicarboxylate ion as a ligand.

Patent document 2 discloses a metal-organic structure having a group 4 element ion having a valence of 4 or a rare earth ion as a metal ion, and containing an ion of an organic molecule having a trimesic acid skeleton and an ion of an organic molecule having an isophthalic acid skeleton as polydentate ligands.

Further, patent document 3 discloses a compound having the formula Me₆O₄(OH)₄(L)₆(Me is at least one metal atom selected from Zr and Ti, and L is a ligand coordinated to the metal atom Me) as a basic skeleton, and L as a ligand is a metal-organic structure composed of a ligand derived from a nitrogen-containing aromatic heterocyclic dicarboxylic acid and a ligand derived from an aromatic dicarboxylic acid.

Disclosure of Invention

Problems to be solved by the invention

MOFs are capable of adsorbing water vapor and are therefore considered to be used as moisture-absorbing materials in chemical heat pumps, humidity control systems, and the like used in automobiles, residences, manufacturing facilities, and the like.

In the case where MOFs are used as the moisture absorbing material, it is important to be able to absorb water vapor at a low relative humidity and to narrow the range of the humidity difference between the absorption humidity and the desorption humidity.

However, most of the MOFs reported so far cannot adsorb water vapor at low relative humidity or have a wide range of difference in humidity between the adsorption humidity and the desorption humidity. Therefore, when such MOFs are used as a moisture absorbing material for a chemical heat pump, the heat output may be insufficient, and when such MOFs are used as a moisture absorbing material for a humidity control system, the dehumidification performance may be insufficient.

Accordingly, the present disclosure has been made in view of the above circumstances, and an object thereof is to provide a MOF capable of adsorbing water vapor at a low relative humidity and reducing the range of the humidity difference between the adsorption humidity and the desorption humidity.

Means for solving the problems

The present inventors have conducted intensive studies and, as a result, have found that the above problems can be solved by the following means.

< scheme 1>

A metal-organic structure comprising a metal ion, a first ligand, a second ligand, and optionally a third ligand, wherein,

the metal ions are aluminum ions, and the metal ions are aluminum ions,

the first ligand is an organic compound ion formed of a first heterocycle having 2 carboxyl groups, and in the first ligand, a hetero atom constituting the first heterocycle is present on a side of a poor angle of an angle formed by 2 carboxyl groups,

the second ligand is an organic compound ion different from the first ligand and formed of a second heterocycle having 2 carboxyl groups, and in the second ligand, a hetero atom constituting the second heterocycle is present on the reflex side of an angle formed by 2 carboxyl groups,

the third ligand is an organic compound ion different from the first ligand and the second ligand and having 2 carboxyl groups, and

with respect to the total of the first ligand, the second ligand and the third ligand,

the first ligand is present in a proportion of more than 0 mol% and 70 mol% or less,

the second ligand is present in a proportion of more than 0 mol% and 90 mol% or less, and

the third ligand is present in a proportion of 0 mol% or more and 80 mol% or less.

< scheme 2>

The metal-organic structure according to scheme 1, wherein the first heterocyclic ring is a five-membered ring or a six-membered ring, and the second heterocyclic ring is a five-membered ring or a six-membered ring.

< scheme 3>

The metal-organic structure according to claim 1 or 2, wherein the first heterocyclic ring is a five-membered ring, and the second heterocyclic ring is a six-membered ring.

< scheme 4>

The metal-organic structure according to any one of claims 1 to 3, wherein the first ligand is a 2, 5-furandicarboxylate ion, the second ligand is a 3, 5-pyridinedicarboxylate ion, and the third ligand is an isophthalate ion.

< scheme 5>

A metal-organic structure according to any one of claims 1 to 4, wherein when the water vapor adsorption amount at a relative humidity of 0 to 20% is 100%, the humidity at which the water vapor adsorption amount is 70% is an adsorption humidity, and the humidity at which the water vapor adsorption amount is 30% is a desorption humidity, the adsorption humidity is 11.5% or less, and the difference between the adsorption humidity and the desorption humidity (adsorption humidity-desorption humidity) is 3.0% or less.

< scheme 6>

A chemical heat pump having the metal-organic structure according to any one of claims 1 to 5 as a moisture absorbent.

< scheme 7>

A humidity control system comprising the metal-organic structure according to any one of claims 1 to 5 as a moisture absorbent.

Effects of the invention

According to the MOF of the present disclosure, it is possible to achieve both adsorption of water vapor at a low relative humidity and reduction of the range of the humidity difference between the adsorption humidity and the desorption humidity.

Drawings

Fig. 1 is a graph showing the water vapor adsorption isotherms of the MOFs of example 1 and comparative examples 1 and 3.

FIG. 2 shows the pore structure of CAU-10-PyDC.

FIG. 3 shows 2, 5-furandicarboxylic acid (H)₂FDC) and 3, 5-Pyridinedicarboxylic acid (H)₂PyDC) molecular structure.

FIG. 4 is an X-ray diffraction chart summarizing data of comparative examples 1 to 3.

FIG. 5 is an X-ray diffraction chart summarizing data of examples 1 and 2 and comparative examples 4 to 6.

FIG. 6 is an X-ray diffraction chart summarizing data of examples 3 to 9 and comparative example 7.

FIG. 7 is a graph showing the water vapor adsorption isotherms of the MOFs of comparative examples 1-3.

FIG. 8 is a graph showing the water vapor adsorption isotherms of the MOFs of examples 1 and 2 and comparative examples 4 to 6.

FIG. 9 is a graph showing the water vapor adsorption isotherms of the MOFs of examples 3-5 and comparative example 7.

FIG. 10 is a graph showing the water vapor adsorption isotherms of the MOFs of examples 6-9.

Fig. 11 is a diagram showing the composition ratio of MOFs synthesized in examples and comparative examples.

Fig. 12 is a graph showing the correlation between the adsorption humidity and the humidity difference between the adsorption humidity and the desorption humidity of MOFs synthesized in examples and comparative examples.

Fig. 13 is a schematic showing a heat pump using the MOF of the present disclosure.

Fig. 14 is a schematic diagram showing a humidity conditioning system using the MOF of the present disclosure.

Description of the reference numerals

10 water storage part

20. 25 hygroscopic material holding part

30 steam flow path

32 air supply flow path

34 air outlet flow path

Detailed Description

The present disclosure will be described below with reference to the drawings. The schemes shown below are examples of the present disclosure, and the present disclosure is not limited to the schemes shown below.

Metal organic Structure

MOFs of the present disclosure are metal-organic structures comprising a metal ion, a first ligand, a second ligand, and optionally a third ligand, wherein,

the metal ions are aluminum ions, and the aluminum ions,

the first ligand is an organic compound ion formed of a first hetero ring having 2 carboxyl groups, and in the first ligand, hetero atoms constituting the first hetero ring are present on the inferior angle side of an angle formed by the 2 carboxyl groups,

the second ligand is an organic compound ion which is different from the first ligand and is formed of a second hetero ring having 2 carboxyl groups, and in the second ligand, hetero atoms constituting the second hetero ring are present on the reflex side of the angle formed by the 2 carboxyl groups,

the third ligand is an organic compound ion different from the first ligand and the second ligand and having 2 carboxyl groups, and

relative to the sum of the first ligand, the second ligand and the third ligand,

the first ligand is present in a proportion of more than 0 mol% and 70 mol% or less,

the second ligand is present in a proportion of more than 0 mol% and 90 mol% or less, and

the third ligand is present in a proportion of 0 mol% or more and 80 mol% or less.

In the present disclosure, "heterocycle" refers to a saturated or unsaturated cyclic compound composed of two or more elements. Here, the two or more elements preferably contain a carbon atom and a hetero atom. Further, the "hetero atom" is at least one atom selected from an oxygen atom, a nitrogen atom and a sulfur atom.

The heterocyclic compound or the heterocyclic compound ion according to the present disclosure includes a derivative thereof substituted with an appropriate substituent, as long as the effect of the present disclosure is not impaired. Here, the substituent other than the carboxyl group is not particularly limited, and may be at least one selected from the group consisting of a hydroxyl group, a nitro group, a fluoro group, a chloro group, a bromo group, an iodo group, a cyano group, a methyl group, an ethyl group, a tert-butyl group, an ethynyl group, a carbonyl group, an amino group, and the like.

In the present disclosure, "inferior angle" means an angle exceeding 0 ° and less than 180 °. The term "reflex angle" means an angle of 180 ° or more and less than 360 °.

The reason why the MOF of the present disclosure can adsorb water vapor at a low relative humidity and reduce the range of the humidity difference between the adsorption humidity and the desorption humidity is not necessarily determined, but is presumed as follows.

As a result of intensive studies by the inventors of the present disclosure, Al disclosed in, for example, non-patent document 1 is used as a conventional MOF³⁺In CAU-10 (corresponding to MOF of comparative example 1 of the present disclosure) in which ions are coordinated to isophthalate ions as ligands, the range of the humidity difference between the adsorption humidity and the desorption humidity is narrow as shown in fig. 1, but the relative humidity of adsorbed water vapor shows a high value of about 13%.

On the other hand, in CAU-10-PyDC (corresponding to MOF of comparative example 3 of the present disclosure) in which the ligand of CAU-10 was replaced with 3, 5-pyridinedicarboxylate ion having 2 carboxyl groups, it is known that, as shown in fig. 1, although the relative humidity at which water vapor is adsorbed is lower than in the case of CAU-10, the water vapor adsorption isotherm is two stages in the range of the humidity difference between the adsorption humidity and the desorption humidity, and thus is significantly wider than in the case of CAU-10.

In addition, as shown in FIG. 2, it is found that in the pore structure of CAU-10-PyDC, a region having a nitrogen atom and a region not having a nitrogen atom are clearly distinguished. Since the nitrogen atom has a lone pair of electrons and is therefore capable of forming a hydrogen bond with a water molecule, it is considered that the "region having a nitrogen atom" is a relatively hydrophilic region and the "region not having a nitrogen atom" is a relatively hydrophobic region in the pore structure of CAU-10-PyDC. The reason why the water vapor adsorption isotherm of CAU-10-PyDC in fig. 1 is two stages is considered to be that, in the pore structure of CAU-10-PyDC, water vapor is adsorbed at a low relative humidity (about 4%) in a relatively hydrophilic region first, and then water vapor is adsorbed at a high relative humidity (about 8%) in a relatively hydrophobic region.

Therefore, the present inventors of the present disclosure considered that, in order to achieve both adsorption of water vapor at a low relative humidity and reduction of the range of the humidity difference between the adsorption humidity and the desorption humidity, it is important to adjust the balance between the hydrophilic region and the hydrophobic region in the pore structure of the new MOF. It is considered that the MOF of the present disclosure, which has been developed, can adjust the balance between hydrophilic regions and hydrophobic regions in the pore structure of the MOF by including the first ligand, the second ligand, and the optional third ligand as mutually different ligands and including the specific structures of these ligands in a specific presence ratio, thereby exerting the above-described effects of the present disclosure.

For example, in the MOF of example 1 of the present disclosure shown in fig. 1, by using the first ligand and the second ligand which are different in structure in combination, the amount of the hetero element in the hydrophilic region can be reduced and the degree of hydrophilicity can be reduced, and the amount of the hetero element in the relatively hydrophobic region can be increased and the degree of hydrophobicity can be reduced, as compared with the pore structure of the conventional CAU-10-PyDC. Accordingly, the degree of hydrophilicity can be relatively uniformly improved as a whole, and therefore, a curve of only one stage can be obtained in the water vapor adsorption isotherm.

In the present disclosure, the ligands having different structures are defined as follows: the first ligand is an organic compound ion formed of a first hetero ring having 2 carboxyl groups, and in the first ligand, a hetero atom constituting the first hetero ring is present on the inferior angle side of an angle formed of 2 carboxyl groups, and in addition, the second ligand is an organic compound ion different from the first ligand and formed of a second hetero ring having 2 carboxyl groups, and in the second ligand, a hetero atom constituting the second hetero ring is present on the superior angle side of an angle formed of 2 carboxyl groups.

For example, FIG. 3(a) shows 2, 5-furandicarboxylic acid (H) which can be used as a first ligand₂FDC) molecular structure. As shown in FIG. 3(a), at H₂In FDC, an oxygen atom as a hetero atom constituting a furan ring is present on the inferior side of the angle α 1 formed by 2 carboxyl groups. FIG. 3(b) shows 3, 5-pyridinedicarboxylic acid (H) that can be used as a second ligand₂PyDC) molecular structure. As shown in FIG. 3(b), at H₂In PyDC, a nitrogen atom as a heteroatom constituting a pyridine ring is present on the excellent side of an angle α 2 formed by 2 carboxyl groups.

As an example of the effect of the present disclosure, for example, when the water vapor adsorption amount at a relative humidity of 0 to 20% is 100%, the humidity at which the water vapor adsorption amount is 70% is adsorption humidity, and the humidity at which the water vapor adsorption amount is 30% is desorption humidity, the adsorption humidity of the MOF of the present disclosure may be 11.5% or less, 11.2% or less, 11.0% or less, 10.5% or less, or 9.5% or less, and may be 8.0% or more. The difference between the adsorption humidity and the desorption humidity (adsorption humidity-desorption humidity) may be 3.0% or less, 2.9% or less, 2.5% or less, 2.0% or less, 1.5% or less, or 1.0% or less, and may be 0.5% or more.

Hereinafter, each component constituting the MOF of the present disclosure will be described in detail.

< Metal ion >

The metal ion used in the MOFs of the present disclosure is an aluminum ion (Al)³⁺). In the MOFs of the present disclosure, the aluminum ion is coordinately bound to 6 oxygen atoms, forming AlO₆Octahedral structure of (1).

The AlO is₆The octahedron of (a) may comprise a helical structure having a common vertex in cis-isomer (cis-form) [ Al (COO) ]₂OH]_∞MOFs forming, for example, CAU-10, or lines [ Al (COO) which may contain common vertices in trans isomers (trans type)₂OH]_∞Forming, for example, a MOF of type MIL-53.

The aluminum ion source is not particularly limited as long as it contains an aluminum atom, and at least one selected from aluminum chloride, aluminum nitrate, and aluminum sulfate, for example, can be used from the viewpoint of high solubility in water and polar solvents. In addition, hydrates of the compounds of the above-described aluminum ion sources can also be used as the aluminum ion source. More specifically, the hydrate of the compound of the aluminum ion source includes, for example, aluminum chloride hexahydrate (AlCl)₃·6H₂O), aluminum nitrate nonahydrate (Al (NO)₃)₃·9H₂O) or aluminum sulfate tetradecadecanoic octadecahydrate (Al)₂(SO₄)₃·14～18H₂O), etc., but are not limited thereto.

< first ligand >

The first ligand used in the MOF of the present disclosure is an organic compound ion formed of a first heterocyclic ring having 2 carboxyl groups, and is an organic compound ion in which a heteroatom constituting the first heterocyclic ring is present on the inferior side of the angle formed by the 2 carboxyl groups in the first ligand.

The number of atoms constituting the first heterocyclic ring is not particularly limited, and may be, for example, 3 or more and 10 or less. That is, the first heterocyclic ring may be a three-membered ring, a four-membered ring, a five-membered ring, a six-membered ring, a seven-membered ring, an eight-membered ring, a nine-membered ring or a ten-membered ring, and among these, the first heterocyclic ring is preferably a five-membered ring or a six-membered ring.

The first heterocyclic ring may be a saturated heterocyclic ring or an unsaturated heterocyclic ring.

Preferably, the first heterocyclic ring is an unsaturated heterocyclic ring. Examples of the first heterocyclic ring include a pyrrole ring, furan ring, thiophene ring, pyridine ring, pyran ring, thiopyran ring, imidazole ring, pyrazole ring, and heterocyclic ring having 2 carboxyl groups,

An azole ring, a thiazole ring, an imidazoline ring, or a pyridazine ring, and the like, but are not limited thereto. Among these, the first heterocyclic ring is preferably a pyran ring, pyridine ring, furan ring or thiophene ring having 2 carboxyl groups, and more preferably a furan ring having 2 carboxyl groups.

The first ligand according to the present disclosure is an organic compound ion in which a hetero atom constituting the first hetero ring is present in the inferior side of the angle formed by 2 carboxyl groups in the first hetero ring.

More specifically, the first ligand to which the present disclosure relates may be, for example, chelidonate ion, 2, 6-pyridinedicarboxylate ion, 2, 5-furandicarboxylate ion, 2, 5-thiophenedicarboxylate ion, but is not limited thereto. Among these, the first ligand is preferably 2, 5-furandicarboxylate ion. As the first ligand source, dicarboxylic acids corresponding to these sources can be used. For example, as the 2, 5-furandicarboxylic acid ion source, 2, 5-furandicarboxylic acid can be used.

In the MOFs of the present disclosure, the first ligand is present in a proportion of more than 0 mol% and 70 mol% or less relative to the total of the first, second and third ligands. More specifically, the first ligand may be more than 0 mol%, 5 mol% or more, 7 mol% or more, 10 mol% or more, 15 mol% or more, 20 mol% or more, 25 mol% or more, 30 mol% or more, 35 mol% or more, 40 mol% or more, 45 mol% or more, 50 mol% or more, 55 mol% or more, 60 mol% or more, or 65 mol% or more with respect to the total of the first ligand, the second ligand, and the third ligand, and may be 70 mol% or less, 65 mol% or less, 60 mol% or less, 55 mol% or less, 50 mol% or less, 45 mol% or less, 40 mol% or less, 35 mol% or less, 30 mol% or less, 25 mol% or less, 20 mol% or less, 15 mol% or less, 10 mol% or less, 8 mol% or less, 5 mol% or less, 2 mol% or less, or 1 mol% or less.

< second ligand >

The second ligand used in the MOF of the present disclosure is an organic compound ion which is different from the above-described first ligand and is formed of a second heterocyclic ring having 2 carboxyl groups, and is an organic compound ion in which a hetero atom constituting the second heterocyclic ring is present on the side of the angle formed by the 2 carboxyl groups in the second ligand.

The number of atoms constituting the second heterocyclic ring is not particularly limited, and may be, for example, 3 or more and 10 or less. That is, the second heterocyclic ring may be a three-membered ring, a four-membered ring, a five-membered ring, a six-membered ring, a seven-membered ring, an eight-membered ring, a nine-membered ring or a ten-membered ring, and among these, the second heterocyclic ring is preferably a five-membered ring or a six-membered ring. In addition, from the viewpoint of making the first ligand and the second ligand different, for example, in the case where the first heterocyclic ring is a five-membered ring, the second heterocyclic ring is preferably a six-membered ring.

The second heterocyclic ring may be a saturated heterocyclic ring or an unsaturated heterocyclic ring.

Preferably, the second heterocyclic ring is an unsaturated heterocyclic ring. Examples of such a second heterocyclic ring include a pyrrole ring, furan ring, thiophene ring, pyridine ring, pyran ring, thiopyran ring, imidazole ring, pyrazole ring, 2-carboxyl group-containing ring,An azole ring, a thiazole ring, an imidazoline ring, or a pyridazine ring, and the like, but are not limited thereto. Among these, the second heterocyclic ring is preferably a pyran ring, a pyridine ring, a furan ring or a thiophene ring having 2 carboxyl groups, and more preferably a pyridine ring having 2 carboxyl groups.

The second ligand according to the present disclosure is an organic compound ion in which a heteroatom constituting the second heterocycle is present in the second heterocycle on the side of the angle formed by 2 carboxyl groups.

More specifically, the second ligand to which the present disclosure relates may be, for example, 3, 5-pyridinedicarboxylate ion, 2, 4-pyridinedicarboxylate ion, pyrazole-3, 5-dicarboxylate ion, but is not limited thereto. Among these, the second ligand is preferably 3, 5-pyridinedicarboxylate ion. As the second ligand source, dicarboxylic acids corresponding to these sources can be used. For example, as the 3, 5-pyridinedicarboxylate ion source, 3, 5-pyridinedicarboxylic acid can be used.

In the MOFs of the present disclosure, the second ligand is present in a proportion of more than 0 mol% and 90 mol% or less relative to the total of the first, second and third ligands. More specifically, the second ligand may be more than 0 mol%, 5 mol% or more, 7 mol% or more, 10 mol% or more, 15 mol% or more, 20 mol% or more, 25 mol% or more, 30 mol% or more, 35 mol% or more, 40 mol% or more, 45 mol% or more, 50 mol% or more, 55 mol% or more, 60 mol% or more, 65 mol% or more, 70 mol% or more, 75 mol% or more, 80 mol% or more, or 85 mol% or more with respect to the total of the first ligand, the second ligand, and the third ligand, and may be 90 mol% or less, 85 mol% or less, 80 mol% or less, 75 mol% or less, 70 mol% or less, 65 mol% or less, 60 mol% or less, 55 mol% or less, 50 mol% or less, 45 mol% or less, 40 mol% or less, 35 mol% or less, 30 mol% or less, 25 mol% or less, 20 mol% or less, 15 mol% or less, 10 mol% or less, 8 mol% or less, or less, 5 mol% or less, 2 mol% or less, or 1 mol% or less.

< third ligand >

The MOFs of the present disclosure may optionally comprise a third ligand. Here, the third ligand optionally used is an organic compound ion different from the first ligand and the second ligand described above and having 2 carboxyl groups.

Such optionally used third ligand is, for example, isophthalate ion, 1, 3-cyclohexanedicarboxylate ion, glutarate ion, terephthalate ion, oxalate ion, fumarate ion, malonate ion, trans-muconate ion, cis-muconate ion, 2, 6-naphthalenedicarboxylate ion, 9, 10-anthracenedicarboxylate ion, 2 '-diamino-4, 4' -diphenylethylene dicarboxylate ion, 2 '-dinitro-4, 4' -diphenylethylene dicarboxylate ion, 2, 3-pyrazinedicarboxylate ion or the like, but is not limited thereto. Among these, the third ligand optionally used is preferably an isophthalate ion. As the third ligand source, dicarboxylic acids corresponding to these sources may be used. For example, as the source of the isophthalic acid radical ion, isophthalic acid can be used.

In the MOFs of the present disclosure, the optionally used third ligand is present in a proportion of 0 mol% or more and 80 mol% or less relative to the total of the first, second and third ligands. More specifically, the third ligand may be 0 mol% or more, 5 mol% or more, 7 mol% or more, 10 mol% or more, 15 mol% or more, 20 mol% or more, 25 mol% or more, 30 mol% or more, 35 mol% or more, 40 mol% or more, 45 mol% or more, 50 mol% or more, 55 mol% or more, 60 mol% or more, 65 mol% or more, 70 mol% or more, or 75 mol% or more with respect to the total of the first ligand, the second ligand, and the third ligand, and may be 80 mol% or less, 75 mol% or less, 70 mol% or less, 65 mol% or less, 60 mol% or less, 55 mol% or less, 50 mol% or less, 45 mol% or less, 40 mol% or less, 35 mol% or less, 30 mol% or less, 25 mol% or less, 20 mol% or less, 15 mol% or less, 10 mol% or less, 8 mol% or less, 5 mol% or less, 2 mol% or less, or 1 mol% or less.

Method for producing metal-organic Structure

The metal-organic structures of the present disclosure can be manufactured using, for example, a hydrothermal synthesis method or a solvothermal synthesis method.

More specifically, the metal-organic structure of the present disclosure can be manufactured by heating and reacting a raw material solution including an aluminum ion source as a metal ion source, a first ligand source, a second ligand source, an optional third ligand source, and a solvent.

The concentration of aluminum ions contained in the raw material solution is not particularly limited, and may be, for example, 10mmol/L or more, 25mmol/L or more, 50mmol/L or more, 75mmol/L or more, 100mmol/L or more, 125mmol/L or more, 150mmol/L or more, 175mmol/L or more, 200mmol/L or more, 225mmol/L or more, 250mmol/L or more, or 300mmol/L or more, or 500mmol/L or less, 400mmol/L or less, 300mmol/L or less, or 250mmol/L or less, with respect to the solvent.

The concentrations of the first ligand, the second ligand, and the optional third ligand contained in the raw material solution are not particularly limited, and may be, for example, 10mmol/L or more, 20mmol/L or more, 30mmol/L or more, 40mmol/L or more, 50mmol/L or more, 60mmol/L or more, 70mmol/L or more, 80mmol/L or more, 90mmol/L or more, 100mmol/L or more, 150mmol/L or more, or 200mmol/L or more, and 300mmol/L or less, 250mmol/L or less, or 200mmol/L or less, relative to the solvent.

The mixing ratio of the first ligand source, the second ligand source, and the optional third ligand source is not particularly limited as long as the first ligand, the second ligand, and the third ligand can be obtained within the above-described specific range of the existing ratio.

For example, the first ligand source may be mixed in an amount of more than 0 mol% and less than 100 mol%, 5 mol% or more and 85 mol% or less, or 10 mol% or more and 80 mol% or less, the second ligand source may be mixed in an amount of more than 0 mol% and less than 90 mol%, 5 mol% or more and 85 mol% or less, or 10 mol% or more and 80 mol% or less, and the third ligand source may be mixed in an amount of 0 mol% or more and less than 100 mol%, 5 mol% or more and 70 mol% or less, or 10 mol% or more and 60 mol% or less, based on the total amount (mol) of the first ligand source, the second ligand source, and the optional third ligand source.

Examples of the solvent include, but are not limited to, N-Dimethylformamide (DMF), N-Diethylformamide (DEF), formic acid, acetic acid, methanol, ethanol, water, and a mixture thereof.

In the heating, the raw material solution may be charged into an optional sealed container and heated, and the raw material solution may be heated while being refluxed.

The heating temperature is not particularly limited, and may be, for example, 100 ℃ or more or 120 ℃ or more from the viewpoint of improvement in reactivity, or 150 ℃ or less from the viewpoint of prevention of vapor leakage during the reaction.

The heating time is not particularly limited, and may be appropriately adjusted according to the heating temperature. The heating time may be, for example, 6 hours or more, 10 hours or more, 12 hours or more, 18 hours or more, 24 hours or more, 30 hours or more, 36 hours or more, 42 hours or more, 48 hours or more, 54 hours or more, or 60 hours or more, or 96 hours or less, 84 hours or less, 72 hours or less, 60 hours or less, 48 hours or less, 24 hours or less, 12 hours or less, or 10 hours or less, from the viewpoint of completely completing the reaction.

After the reaction is completed, the obtained product may be appropriately subjected to post-treatment.

The post-treatment may be, for example, filtration of the obtained product. Further, if necessary, a lean solvent or the like is added to the cake obtained by filtration, and the mixture is dispersed at room temperature or appropriately heated, and then filtered again. Here, as the lean solvent, a solvent in which the target MOF is not easily soluble may be used, and for example, water, acetonitrile, hexane, or ethanol may be used. The temperature at the time of heating may be, for example, 40 ℃ or more, 50 ℃ or more, 60 ℃ or more, 70 ℃ or more, or 80 ℃ or more, or 100 ℃ or less, 90 ℃ or less, or 80 ℃ or less. The heating time in the case of heating may be, for example, 1 hour or more, 2 hours or more, 6 hours or more, 10 hours or more, or 12 hours or more, or 24 hours or less, or 16 hours or less.

In addition, the filter cake obtained by filtration or re-filtration is appropriately dried, whereby the target MOF can be obtained. Here, the drying may be performed under normal pressure or under reduced pressure, and is preferably performed under reduced pressure from the viewpoint of improving efficiency. The temperature at the time of drying may be, for example, 20 ℃ or higher, 25 ℃ or higher, 40 ℃ or higher, 50 ℃ or higher, or 60 ℃ or higher, or 100 ℃ or lower, 90 ℃ or lower, 80 ℃ or lower, or 60 ℃ or lower. The drying time in the case of drying may be, for example, 1 hour or more, 2 hours or more, 6 hours or more, 10 hours or more, or 12 hours or more, or 24 hours or less, or 16 hours or less.

Chemical heat pump

The metal-organic structure of the present disclosure can be used as a moisture absorbing material in a chemical heat pump, for example. The chemical heat pump of this case has: the water storage device includes a water storage portion for storing water of a working medium, a moisture-absorbing material holding portion for holding a moisture-absorbing material, and a steam passage for allowing steam to flow between the water storage portion and the moisture-absorbing material holding portion. Such a chemical heat pump may use a water storage unit as both an evaporator and a condenser, or may use a water storage unit as an evaporator and condense water vapor by using a separate condenser. Such chemical heat pumps can be used for cooling and heating in automobiles, residences, manufacturing facilities, and the like.

In such a chemical heat pump, a configuration in which the water storage portion is used as both the evaporator and the condenser will be described, and for example, as shown on the left side of fig. 13(a), water (H) for supplying heat from the outside to the water storage portion 10 is supplied₂O (liquid)), the water in the water storage part is vaporized to form water vapor (H)₂O (gas)). This stage may be referred to as a stage in which the water in the water storage portion is vaporized to form steam, and thereby cooling energy is supplied from the water storage portion to the outside. In this case, in such a chemical heat pump, as shown on the right side of fig. 13(b), the water vapor generated in the water storage unit 10 is supplied to the moisture absorbent holding unit 20 through the water vapor flow path 30, and then reacts with the moisture absorbent to supply the adsorption heat to the outside. That is, in such a heat pump, heat can be moved from the water storage portion 10 side to the moisture absorbent holding portion 20 side.

In this chemical heat pump, in the regeneration stage in which the reaction shown in fig. 13(a) can be performed again, heat is supplied from the outside to the hygroscopic material holding unit 20 as shown on the right side of fig. 13(b), and water is desorbed from the hygroscopic material to form water vapor. This stage may be referred to as a stage in which the moisture absorbent material holding unit 20 supplies cooling energy to the outside from the moisture absorbent material holding unit 20 by separating water from the moisture absorbent material of the moisture absorbent material holding unit 20. At this time, in such a chemical heat pump, as shown on the left side of fig. 13(b), the water vapor generated in the moisture absorbent holding portion 20 is supplied to the water storage portion 10, and then liquefied, thereby supplying the latent heat of condensation to the outside.

Humidity control System

The metal-organic structure of the present disclosure can be used as a moisture absorbent in a humidity control system, for example. The humidity control system in this case includes: the moisture absorbing material holding unit holds a moisture absorbing material, an air supply passage for supplying air containing water vapor to the moisture absorbing material holding unit, and an air extraction passage for extracting the air supplied to the moisture absorbing material holding unit from the moisture absorbing material holding unit. Such a humidity control system can be used for dehumidification or humidity control in automobiles, residences, manufacturing facilities, and the like.

In this humidity control system, as shown in fig. 14(a), for example, air containing a large amount of water vapor is supplied from the outside to the moisture absorbent holding portion 25 through the air supply flow path 32, and then at least a part of the water vapor in the air is adsorbed to the moisture absorbent and removed in the moisture absorbent holding portion 25. At this time, heat of adsorption due to the adsorption of water vapor to the moisture absorbent material is generated in the moisture absorbent material holding portion 25. Thereafter, the air from which at least a part of the water vapor is removed in the moisture absorbent holding portion 25 and the water vapor is reduced is drawn out from the moisture absorbent holding portion through the air drawing flow path 34. Here, since the relative significance is that the amount of water vapor is small and the amount of water vapor is large, the air with small amount of water vapor means air with small amount of water vapor compared to air with large amount of water vapor.

In the humidity control system, in the regeneration stage in which the reaction shown in fig. 14(a) is allowed to proceed again, as shown in fig. 14(b), while heat is supplied from the outside to the hygroscopic material holding unit 25, air with a small amount of water vapor is supplied from the outside to the hygroscopic material holding unit 25 through the air supply flow path 32, whereby at least a part of the water vapor adsorbed by the hygroscopic material in the hygroscopic material holding unit 25 is taken out to the air. Thereafter, the air having a high water vapor content, which is obtained by adding water vapor to the moisture absorbent holding portion 25, passes through the air drawing flow path 34 and is drawn out from the moisture absorbent holding portion. The regeneration stage may be performed as a stage for humidifying air. In this regeneration stage, the flow of air may be reversed, that is, air may be introduced from the air extraction flow path 34 and then extracted from the air supply flow path 32. Here, as described above, the relative significance of less water vapor and more water vapor is obtained.