阅读说明：本技术 一种贴片式导通弹性连接器 (SMD elastic connector that switches on ) 是由 钟正祁 张宇堃 桂文静 于 2020-07-31 设计创作，主要内容包括：本发明公开了一种贴片式导通弹性连接器,包括下导电弹性体,下导电弹性体底部镶装有下金属片,下金属片与下芯片板或下电子元件焊接连接,下导电弹性体上端面具有上接触面,通过上接触面与上芯片板或上电子元件的触点挤压接触,实现上、下芯片板或上、下电子元件触点之间的精确点对点动态接触导通。本发明可快速固定在不同电子元件或不同芯片板之间,精确实现点对点的多方向多角度的动态接触导通。(The invention discloses a patch type conductive elastic connector which comprises a lower conductive elastomer, wherein a lower metal sheet is embedded at the bottom of the lower conductive elastomer, the lower metal sheet is welded with a lower chip board or a lower electronic element, the upper end surface of the lower conductive elastomer is provided with an upper contact surface, and the upper contact surface is in extrusion contact with a contact of an upper chip board or an upper electronic element, so that accurate point-to-point dynamic contact conduction between the contacts of the upper chip board and the lower chip board or the upper electronic element and the lower electronic element is realized. The invention can be quickly fixed among different electronic elements or different chip boards, and accurately realizes point-to-point multi-direction multi-angle dynamic contact conduction.)

1. The utility model provides a SMD elastic connector that switches on, includes lower conductive elastomer, its characterized in that, lower conductive elastomer bottom is inlayed and is equipped with down the sheetmetal, sheetmetal and lower chip board or electronic component welded connection down, lower conductive elastomer up end has the contact surface, through go up the contact surface and go up the contact extrusion contact of chip board or last electronic component, realize the accurate point-to-point dynamic contact between upper and lower chip board or upper and lower electronic component contact and switch on. .

2. The patch type conductive elastic connector according to claim 1, wherein a lower groove is formed in the center of the bottom of the lower conductive elastomer, a lower metal sheet is embedded in the lower groove, and the lower metal sheet is flush with the lower end surface of the lower conductive elastomer.

3. The patch type conductive elastomeric connector of claim 2, wherein said lower grooves are T-shaped grooves and said lower metal sheet is a corresponding T-shaped metal sheet.

4. The patch type conductive elastic connector according to claim 1, wherein the bottom of the lower conductive elastomer has recessed steps on both sides, and the recessed steps are embedded with matching step metal sheets.

5. The patch type conductive elastic connector according to claim 2 or 4, further comprising an upper conductive elastic body having the same main structure as the lower conductive elastic body and having a lower contact surface with a shape corresponding to the upper contact surface.

6. The patch type conductive elastomeric connector of claim 5, wherein the upper and lower contact surface surfaces are adapted V-shaped bevels therebetween.

7. The patch type conductive elastomeric connector of claim 5, wherein the upper contact surface and the lower contact surface are adapted to form a spherical surface therebetween.

8. The patch type conductive elastomeric connector of claim 5, wherein the upper contact surface is spherical and the lower contact surface is a stepped surface.

9. The patch type conductive elastic connector according to any one of claims 6 to 8, wherein the lower conductive elastic body is provided with a through hole.

10. The patch type conductive elastic connector according to any one of claims 6 to 8, wherein the upper conductive elastic body is provided with a through hole.

Technical Field

The invention relates to the technical field of conduction between different electronic elements or between chip boards, in particular to a patch type conduction elastic connector.

Background

In the electronic industry, various high and low frequency signals, currents and data are generally required to be transmitted among different electronic components or different chip boards, and interconnection is a very common technical means and is widely applied to various subdivision fields of the electronic industry:

for example, the communication between the bottom chip board and the top chip board golden fingers is a conventional connection technique within the electronics industry. With the continuous development of science and technology, the types of electronic products are more and the miniaturization requirement, and the mode of performing welding, fixing and communication by inserting pins arranged on the upper chip board into the corresponding holes of the lower chip board is shown in fig. 1 in the early stage.

For another example, the socket and the plug of different electronic components are connected and conducted to each other by direct contact of the different electronic components.

The technology cannot meet the requirements of industrialization on convenience, high efficiency, low cost and miniaturization. The prior art is a conductive adhesive tape, and the conduction between different electronic elements or different chip boards is realized through the conductive performance of the conductive adhesive tape. For example, the lower chip board is connected to the golden finger of the upper chip board, the conductive adhesive tape saves the pins of the upper chip board and the process of inserting into the corresponding holes of the lower chip board, and the conductive adhesive tape directly realizes the functional conduction connection between the pins of the upper chip board and the golden finger of the lower chip board, as shown in fig. 2.

Although the conductive adhesive tape is greatly improved relative to the early technology of welding and connecting the upper chip board and the lower chip board by inserting pins into corresponding holes of the lower chip board, how to quickly fix the conductive adhesive tape on the lower chip board cannot always obtain a good solution to meet the requirement of automatic installation and production, and the conductive adhesive tape only realizes static Z-direction strip contact conduction between the golden fingers of the upper chip board and the lower chip board, and cannot accurately realize some point-to-point dynamic contact conduction, especially some complex multi-direction point-to-point dynamic contact conduction, for example, the dynamic contact conduction in the horizontal swing conduction of an antenna or the radian activity of a liquid crystal screen reaches the purpose of normal display.

Disclosure of Invention

Aiming at the defects of the prior art, the technical problem solved by the invention is how to solve the problem of accurate point-to-point dynamic contact conduction between different electronic elements or different chip boards.

In order to solve the technical problems, the technical scheme adopted by the invention is that the patch type conductive elastic connector comprises a lower conductive elastic body, a lower metal sheet is embedded at the bottom of the lower conductive elastic body and is connected with a lower chip board or a lower electronic element in a welding mode, the upper end face of the lower conductive elastic body is provided with an upper contact surface, and the upper contact surface is in extrusion contact with a contact of the upper chip board or an upper electronic element, so that accurate point-to-point dynamic contact conduction between the contacts of the upper chip board and the lower chip board or the upper electronic element and the lower electronic element is realized. .

Furthermore, the center of the bottom of the lower conductive elastomer is provided with a lower groove, a lower metal sheet is embedded in the lower groove, and the lower metal sheet is flush with the lower end face of the lower conductive elastomer.

Still further, in order to increase the embedding force between the lower metal sheet and the lower conductive elastic body and between the upper metal sheet and the upper conductive elastic body, as an improvement of the present invention, the lower groove is a T-shaped groove, and the lower metal sheet is a corresponding T-shaped metal sheet.

As another improvement of the invention, the two sides of the bottom of the lower conductive elastomer are provided with concave steps, and the concave steps are embedded with matched step metal sheets.

In order to solve the problem of point-to-point multidirectional dynamic contact conduction between an upper chip board and a lower chip board and between an upper electronic element contact and a lower electronic element contact under the complex situation, the invention further comprises an upper conductive elastic body, wherein the upper conductive elastic body and the lower conductive elastic body have the same main body structure and a lower contact surface adaptive to the shape of the upper contact surface.

In order to ensure the effect of the pressing contact conduction between the upper contact surface and the surface of the lower contact surface, as an improvement of the invention, a corresponding V-shaped inclined surface is arranged between the upper contact surface and the surface of the lower contact surface.

In order to ensure the pressing contact conduction effect of the upper contact surface and the surface of the lower contact surface and prevent contact from falling, as another improvement of the invention, a matched spherical surface is arranged between the upper contact surface and the surface of the lower contact surface.

In order to ensure the multi-angle and different-direction extrusion contact conduction effect of the surface of the upper contact surface and the surface of the lower contact surface, as another improvement of the invention, the upper contact surface is a spherical surface, and the surface of the lower contact surface is a step plane.

Further, in order to meet the use effect of the contact conduction of some special components such as the antenna after being randomly swung, as another improvement of the invention, the lower conductive elastic body or the upper conductive elastic body can be provided with a through hole so as to facilitate the random swinging contact conduction of the antenna after being inserted.

Compared with the prior art, the invention can be quickly fixed among different electronic elements or different chip boards, and accurately realizes point-to-point multi-direction multi-angle dynamic contact conduction.

Drawings

FIG. 1 is a diagram illustrating a conventional technique for connecting a lower chip board and a gold finger of an upper chip board by a pin soldering contact;

FIG. 2 is a diagram illustrating a conventional technique for connecting a lower chip board and an upper chip board with gold fingers by means of contact with a conductive adhesive tape;

FIG. 3 is a front view of the structure of the present invention;

FIG. 4 is a front view of the structure of the present invention;

FIG. 5 is a third front view of the structure of the present invention;

FIG. 6 is a four-front view of the structure of the present invention;

FIG. 7 is a five-dimensional front view of the structure of the present invention;

FIG. 8 is a six-sided cross-sectional view of the structure of the present invention;

FIG. 9 is a seven sectional view of the structure of the present invention;

FIG. 10 is a schematic diagram of the structure of the process of using the present invention;

FIG. 11 is a top view of the lower chip board.

Detailed Description

The following description will be made with reference to the accompanying drawings and examples, but the present invention is not limited thereto.

Fig. 1 shows that the existing pin welding contact conduction technology is adopted between the golden fingers of the lower chip board and the upper chip board, the golden fingers of the upper chip board are inserted into through holes arranged on corresponding golden fingers on the lower chip board through pins a arranged on the golden fingers, and the golden fingers on the upper chip board are connected and conducted with the golden fingers on the lower chip board through soldering tin welding.

Fig. 2 shows that the prior art adopts the conductive adhesive tape contact conduction technology between the golden fingers of the lower chip board and the upper chip board, and adopts the conductive adhesive tape b to replace the pins on the upper chip board, so as to achieve the purpose of realizing the golden finger connection conduction between the golden fingers on the upper chip board and the lower chip board through the deformation of the conductive adhesive tape b compressed between the golden fingers of the lower chip board and the upper chip board.