Method for improving measurement precision of PCBA (printed circuit board assembly)

文档序号:1055605 发布日期:2020-10-13 浏览:9次 中文

阅读说明:本技术 一种提高pcba板测量精度的方法 (Method for improving measurement precision of PCBA (printed circuit board assembly) ) 是由 张亚锋 陶俊 邓罗成 韦伟东 赵斌 于 2020-06-03 设计创作,主要内容包括:本发明公开了一种提高PCBA板测量精度的方法,该PCBA板包括PCBA板材、设于PCBA板材上表面的若干个元器件和设于PCBA板材下表面的插接件,该方法包括以下步骤:S1:采用与PCBA板材相同材质的第一部分板材,在第一部分板材上成型,成型后所述元器件和PCBA板材能够完全镶嵌入第一部分板材内;S2:采用木浆纸板,在木浆纸板上成型,成型后所述插接件能够完全镶嵌入木浆纸板内;S3:将上述成型后的第一部分板材和木浆纸板固定在一起,作为PCBA板测量的辅助工具;S4:将PCBA板嵌入所述辅助工具后,再对PCBA板进行数据测量。本发明通过辅助工具来提高PCBA板的测量准确度和精度,提高了测量的效率,能够有效区分、筛选出不良品,确保产品的品质,降低生产的成本。(The invention discloses a method for improving the measurement precision of a PCBA (printed circuit board assembly), which comprises a PCBA board, a plurality of components arranged on the upper surface of the PCBA board and plug connectors arranged on the lower surface of the PCBA board, and comprises the following steps: s1: forming a first part of plate made of the same material as the PCBA plate on the first part of plate, wherein the formed components and the PCBA plate can be completely embedded in the first part of plate; s2: the wood pulp board is adopted and molded, and the plug connector can be completely embedded into the wood pulp board after molding; s3: fixing the formed first part of the board and the wood pulp board together as an auxiliary tool for measuring the PCBA board; s4: and embedding the PCBA board into the auxiliary tool, and then carrying out data measurement on the PCBA board. According to the invention, the measurement accuracy and precision of the PCBA are improved through the auxiliary tool, the measurement efficiency is improved, defective products can be effectively distinguished and screened out, the quality of products is ensured, and the production cost is reduced.)

1. A method for improving the measurement precision of a PCBA board is characterized in that: the PCBA comprises a PCBA board, a plurality of components arranged on the upper surface of the PCBA board and plug connectors arranged on the lower surface of the PCBA board, and the method comprises the following steps:

s1: forming a first part of plate made of the same material as the PCBA plate on the first part of plate, wherein the formed components and the PCBA plate can be completely embedded in the first part of plate;

s2: the wood pulp board is adopted and formed on the wood pulp board, and the plug connector can be completely embedded into the wood pulp board after the forming;

s3: fixing the formed first part of the board and the wood pulp board together as an auxiliary tool for measuring the PCBA board;

s4: and embedding the PCBA board into the auxiliary tool, and then carrying out data measurement on the PCBA board.

2. A method of improving the measurement accuracy of a PCBA board as recited in claim 1, wherein: the step S1 specifically includes the following steps:

s11: according to the size of the PCBA board, depth control forming is carried out on the first part of the board, and the PCBA board can be completely embedded into the first part of the board after depth control;

s12: and determining the components with the maximum size, and performing secondary forming on the first part of the plate material, wherein the components can be completely embedded into the first part of the plate material after the secondary forming.

3. A method of improving the measurement accuracy of a PCBA board as claimed in claim 1 or 2, wherein: the first part of the board material adopts FR-4 resin glass fiber board without copper.

4. A method of improving the measurement accuracy of a PCBA board as recited in claim 2, wherein: the precision of the depth control molding is controlled to be 0.2 mm-0.4 mm.

5. A method of improving the measurement accuracy of a PCBA board as recited in claim 1, wherein: the step S2 specifically includes the following steps:

and carrying out graphic forming on the wood pulp paperboard according to the peripheral shape of the PCBA board, wherein the graphic forming means that the wood pulp paperboard is hollowed according to the peripheral shape, and the thickness of the wood pulp paperboard is greater than the maximum height of the plug connector.

6. A method of improving the measurement accuracy of a PCBA board as recited in claim 5, wherein: the wood pulp paper board is formed by overlapping a plurality of paper boards, the pattern forming is carried out on the position corresponding to each paper board, the plurality of paper boards are overlapped after the pattern forming, and the thickness of the overlapped paper boards is larger than the maximum height of the plug connectors.

7. A method of improving the measurement accuracy of a PCBA board as recited in claim 1, wherein: the first portion of the board material and the wood pulp sheets of step S3 are fixed together by an adhesive tape.

8. A method of improving the measurement accuracy of a PCBA board as recited in claim 1, wherein: the method further comprises the following steps after the step S3:

and determining that the PCBA can be completely embedded into the auxiliary tool, and manufacturing a plurality of patterns capable of being embedded into the PCBA on the first part of the board and the wood pulp board according to the steps S1-S2, wherein the patterns are arranged on the first part of the board and the wood pulp board in an array mode, and each pattern can be embedded into one PCBA.

9. A method of improving the measurement accuracy of a PCBA board as claimed in claim 1 or 2, wherein: the thickness of the first portion of sheet material was 0.5mm more than the thickness of the PCBA sheet material.

Technical Field

The invention relates to the field of PCBA (printed circuit board assembly) boards, in particular to a method for improving the measurement precision of a PCBA board.

Background

The measurement of the dimension data of the circuit board is basically completed by a vernier caliper and a three-dimensional (three-coordinate measuring instrument), the vernier caliper generally only confirms the key data of the circuit board, and most of the control measurement and the batch measurement of the data are completed by the three-dimensional. The non-defective products and the defective products can be distinguished by measuring the size of the circuit board, the selected defective products can be scrapped, if the measuring result is inaccurate, the quality of the circuit board cannot be confirmed, the cost of an enterprise can be increased if the non-defective products are scrapped, and the efficiency can be reduced if the non-defective products are screened again.

The advantage of three-dimensional measurement lies in the accuracy and efficiency of the data. The laser test head can test the data of the corresponding point positions of the circuit board of the platform surface within the range of the platform plane in 360 degrees. That is, the object to be measured three-dimensionally must be a parallel plane test, and if the height difference of the object in the vertical direction occurs and the horizontal plane cannot reach the parallel, the object cannot be measured or has a slight height difference, resulting in an error in the measurement result, and the authenticity of the measurement data is lost, resulting in an error in the determination result.

For a circuit board with assembled parts, which is commonly referred to as a PCBA board in the industry, it is basically unrealistic to measure statistical data, and particularly, a small PCBA which is divided into single bodies is easy to cause errors of measured data when the PCBA board is measured three-dimensionally because the PCBA board is an object with a three-dimensional space and is not an object with a planar structure.

Disclosure of Invention

The invention provides a method for improving the measurement precision of a PCBA (printed circuit board assembly) plate, aiming at solving the problems of inaccurate data and low precision in the measurement of the PCBA plate.

A method for improving the measurement accuracy of a PCBA (printed circuit board assembly) comprises a PCBA board, a plurality of components arranged on the upper surface of the PCBA board and plug connectors arranged on the lower surface of the PCBA board, and the method comprises the following steps:

s1: forming a first part of plate made of the same material as the PCBA plate on the first part of plate, wherein the formed components and the PCBA plate can be completely embedded in the first part of plate;

s2: the wood pulp board is adopted and molded, and the plug connector can be completely embedded into the wood pulp board after molding;

s3: fixing the formed first part of the board and the wood pulp board together as an auxiliary tool for measuring the PCBA board;

s4: and embedding the PCBA board into the auxiliary tool, and then carrying out data measurement on the PCBA board.

Optionally, the step S1 specifically includes the following steps:

s11: according to the size of the PCBA board, depth control forming is carried out on the first part of the board, and the PCBA board can be completely embedded into the first part of the board after depth control;

s12: and determining the components with the maximum size, and performing secondary forming on the first part of the plate material, wherein the components can be completely embedded into the first part of the plate material after the secondary forming.

Optionally, the first part of the board material is made of FR-4 resin glass fiber board without copper.

Optionally, the precision of the depth control molding is controlled to be 0.2 mm-0.4 mm.

Optionally, the step S2 specifically includes the following steps:

and carrying out graphic forming on the wood pulp paperboard according to the peripheral shape of the PCBA board, wherein the graphic forming means that the wood pulp paperboard is hollowed according to the peripheral shape, and the thickness of the wood pulp paperboard is greater than the maximum height of the plug connector.

Optionally, the wood pulp paper board is formed by stacking a plurality of paper boards, the pattern forming is performed on the position corresponding to each paper board, the plurality of paper boards are stacked after the pattern forming, and the thickness of the stacked paper boards is larger than the maximum height of the plug connector.

Alternatively, the first portion of the board material and the wood pulp sheets of step S3 are fixed together by adhesive tape.

Optionally, after step S3, the method further includes the following steps:

and determining that the PCBA can be completely embedded into the auxiliary tool, and manufacturing a plurality of patterns capable of being embedded into the PCBA on the first part of the board and the wood pulp board according to the steps S1-S2, wherein the patterns are arranged on the first part of the board and the wood pulp board in an array mode, and each pattern can be embedded into one PCBA.

Optionally, the thickness of the first portion of sheet material is 0.5mm more than the thickness of the PCBA sheet material.

Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for improving the measurement precision of a PCBA (printed circuit board assembly), which improves the measurement accuracy and precision of the PCBA by an auxiliary tool, wherein the auxiliary tool adopts wood pulp paper boards and a first part of board materials to be fixed together after molding, improves the measurement efficiency, can effectively distinguish and screen out defective products, ensures the quality of products and reduces the production cost.

Detailed Description

In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.

A method for improving the measurement accuracy of a PCBA (printed circuit board assembly) comprises a PCBA board, a plurality of components arranged on the upper surface of the PCBA board and plug connectors arranged on the lower surface of the PCBA board, and the method comprises the following steps:

s1: adopt the first part panel with the same material of PCBA panel, the shaping on first part panel, in the first part panel can be inlayed completely to shaping back components and parts and PCBA panel, in an embodiment, the surface parallel and level of the components and parts surface that highly is the biggest and first panel, the surface parallel and level of the lower surface of PCBA panel and first part panel.

Step S1 specifically includes the following steps:

s11: according to the size of the PCBA board, depth control forming is carried out on the first part of the board, the PCBA board can be completely embedded into the first part of the board after depth control, and in one embodiment, the depth of the depth control is equal to the thickness of the PCBA board; and (3) determining the size of the PCBA, namely determining the length, width and thickness of the PCBA, wherein the program data of depth control forming is designed according to 1: 1.

S12: and determining the components with the maximum size, and performing secondary forming on the first part of the plate, wherein the components can be completely embedded into the first part of the plate after the secondary forming, and the depth of the secondary forming is equal to the maximum distance from the components to the upper surface of the PCBA plate. And determining the maximum size of the component, namely determining the maximum value of the height and the width of the component, wherein the secondary forming can be realized by a routing way, and the position where the subsequent PCBA board is embedded is ensured to be horizontally parallel after the secondary forming.

In some embodiments, the first part of the plate material is made of FR-4 resin glass fiber board without copper, the precision of depth control forming is controlled to be 0.2 mm-0.4 mm, and the thickness of the first part of the plate material is 0.5mm more than that of the PCBA plate material.

S2: the wood pulp board is adopted and molded on the wood pulp board, and the molded plug connector can be completely embedded into the wood pulp board;

step S2 specifically includes the following steps:

the method comprises the following steps of carrying out graphic forming on the wood pulp board according to the peripheral shape of the PCBA board, wherein the graphic forming refers to hollowing the wood pulp board according to the peripheral shape, subsequently embedding the PCBA board into the wood pulp board, and the thickness of the wood pulp board is larger than the maximum height of a connector clip. It will be appreciated that the gong-blank portion is a portion of the PCBA board that protrudes in the horizontal direction.

In one embodiment, the wood pulp board is formed by overlapping a plurality of paper boards, the corresponding position of each paper board is subjected to graphic forming, the plurality of paper boards are overlapped after the graphic forming, the thickness of the overlapped paper boards is larger than the maximum height of the plug connectors, the thickness of a single paper board is not limited, the number of the overlapped paper boards is determined according to the height of the PCBA board, and the effective vertical height of the PCBA board is not exceeded by three-dimensional measurement.

S3: fixing the formed first part of the board and the wood pulp board together as an auxiliary tool for measuring the PCBA board; in one embodiment, the first portion of sheet material and the wood pulp sheet are secured together by adhesive tape.

The method further comprises the following steps after the step S3: and determining that the PCBA can be completely embedded into the auxiliary tool, and manufacturing a plurality of patterns capable of being embedded into the PCBA on the first part of the board and the wood pulp board according to the steps S1-S2, wherein the patterns are arranged on the first part of the board and the wood pulp board in an array mode, and each pattern can be embedded into one PCBA. A plurality of PCBA boards can be embedded into the auxiliary tool, so that the measuring instrument can conveniently measure data, and the measuring efficiency is greatly improved.

S4: after embedding the PCBA board into the auxiliary tool, the PCBA board is subjected to data measurement, and a three-coordinate measuring instrument can be adopted for measurement.

This first part panel adopts the material the same with PCBA panel, can avoid first part panel to lead to the size of shaping figure to appear the difference because of the atress difference in the forming process. The wood pulp paper board is adopted to mainly play a suspended role, so that the plug connectors on the PCBA board can be embedded into the wood pulp paper board.

The invention provides a method for improving the measurement precision of a PCBA (printed circuit board assembly), which improves the measurement accuracy and precision of the PCBA by an auxiliary tool, wherein the auxiliary tool adopts wood pulp paper boards and a first part of board materials to be fixed together after molding, improves the measurement efficiency, can effectively distinguish and screen out defective products, ensures the quality of products and reduces the production cost.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.

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