阅读说明：本技术 一种导引板mems探针结构模板烧刻方法 (Template burning method for guide plate MEMS probe structure ) 是由 赵梁玉 王艾琳 于 2020-08-14 设计创作，主要内容包括：本发明一种导引板MEMS探针结构模板烧刻方法属于IC制作业技术领域,具体涉及微机电系统制造、半导体裸芯测试及相关关键技术；该方法首先放置导引板MEMS探针结构模板,然后调整两个狭缝展开板,再采集烧刻图像,最后对导引板MEMS探针结构模板进行烧刻；本发明不仅公开了一种导引板MEMS探针结构模板烧刻方法,而且公开了一种MEMS探针卡的全新制作工艺,从MEMS探针卡的结构,到导引板MEMS探针结构模板烧刻设备与方法,面向导引板MEMS探针结构模板烧刻的探针定位方法,再到导引板MEMS探针结构制作方法,最后到导引板MEMS探针结构与转接层的对接装置与方法,最终实现亚微米级MEMS探针卡的制造。(The invention discloses a template burning method for a guide plate MEMS (micro-electromechanical system) probe structure, belongs to the technical field of IC (integrated circuit) manufacturing industry, and particularly relates to manufacturing of a micro-electromechanical system, testing of a semiconductor bare chip and related key technologies; firstly, placing a guide plate MEMS probe structure template, then adjusting two slit expansion plates, then collecting burning and carving images, and finally burning and carving the guide plate MEMS probe structure template; the invention discloses a template burning method of a guide plate MEMS probe structure, and also discloses a brand new manufacturing process of an MEMS probe card.)

1. A template burning method for a guide plate MEMS probe structure is characterized by comprising the following steps:

a, placing a guide plate MEMS probe structure template (6), wherein the mark position of the guide plate MEMS probe structure template (6) is positioned at the edge of a slit plate (7-45-3) when a coaxial step roller (7-45-1) is positioned at the initial position;

b, adjusting the x-direction slit unfolding plate (7-4) and the y-direction slit unfolding plate (7-5), and rotating a coaxial step roller (7-45-1) in the x-direction slit unfolding plate (7-4) according to the distance between two MEMS probes adjacent to each other in the x direction to ensure that the product of the linear speed and the rotation time is the distance between two MEMS probes adjacent to each other in the x direction; rotating a coaxial step roller (7-45-1) in a y-direction slit unfolding plate (7-5) according to the distance between two adjacent MEMS probes in the y direction to ensure that the product of the linear speed and the rotation time is the distance between the two adjacent MEMS probes in the y direction;

step c, collecting the burning image

Installing a plane reflector (7-7), lighting a light source (7-1), wherein light beams emitted by the light source (7-1) form a point light source through a pinhole (7-2), the pinhole (7-2) is positioned at the focus of a collimating mirror (7-3), the point light source forms parallel light through the collimating mirror (7-3), the parallel light forms an x-direction stripe array through an x-direction slit expansion plate (7-4), the x-direction stripe array forms a point array through a y-direction slit expansion plate (7-5), the point array is respectively transmitted through a first prism (7-6), reflected by the plane reflector (7-7), reflected by the first prism (7-6), transmitted by a second prism (7-8) and incident to a first image sensor (7-9);

step d, burning and carving the template of the MEMS probe structure of the guide plate

And (c) removing the plane reflector (7-7), controlling the laser array (7-11) to emit laser beams by the first image sensor (7-9) according to the image collected in the step c, reflecting the laser beams by the second prism (7-8) and the first prism (7-6), and enabling the laser beams to be incident to the surface of the guide plate MEMS probe structure template (6) under the condition that the plane reflector (7-7) is not arranged, so that burning is realized.

2. The template burning method for the guide plate MEMS probe structure is characterized by being applied to template burning equipment for the guide plate MEMS probe structure, wherein the template burning equipment for the guide plate MEMS probe structure is sequentially provided with a light source (7-1), a pinhole (7-2), a collimating mirror (7-3), an x-direction slit expanding plate (7-4), a y-direction slit expanding plate (7-5), a first prism (7-6), a plane reflector (7-7), a second prism (7-8), a first image sensor (7-9), a controller (7-10) and a laser array (7-11) along the light propagation direction.

Technical Field

The invention discloses a template burning method for a guide plate MEMS (micro-electromechanical system) probe structure, belongs to the technical field of IC (integrated circuit) manufacturing industry, and particularly relates to manufacturing of a micro-electromechanical system, testing of a semiconductor bare chip and related key technologies.

Background

The probe card is an important technology in the chip manufacturing process, before the chip is packaged, the probe on the probe card is directly contacted with the welding pad or the lug on the chip, the chip signal is led out, and then the automatic measurement is realized by matching with a peripheral test instrument and software control, so that the defective product is screened out, and the product yield is ensured.

With the development of micro-electro-mechanical systems (MEMS) technology, the size of a chip is smaller and smaller, and reaches millimeter level, and the integration level inside the chip is higher and higher, and reaches micron level, even submicron level, which requires the volume of a probe card to be reduced along with the probe, so that the probe manufacturing faces new challenges.

With respect to probe card manufacturing, a number of prior art techniques have been disclosed, which in chronological order, come in sequence, including:

02100980.5 wafer level probe card and method of making the same

03802632.5 Probe card and method for manufacturing the same

200580041495.1 manufacturing method of probe card including detecting probe

200580049139.4 Probe card and method of manufacturing the same

200680009115.0 Probe card and method of manufacturing the same

200680027726.8 method and apparatus for manufacturing probe card

200680031627.7 Probe card and method of manufacturing the same

200610103270.0 manufacturing method of probe card

200710110928.5 Probe card for testing and manufacturing method thereof

200710162691.5A method for manufacturing conductive film, structure thereof, and probe card with the conductive film

200710306120.4 manufacturing method of probe card

200810088590.2 manufacturing method and device for probe card

200810099307.6 Probe card and method of manufacturing the same

200910207279.X probe card manufacturing method comprising detection probe, probe card and probe card inspection system

201010000429.2A microprobe structure and its manufacturing method

201010551930.8 Probe card, method of manufacturing the same, and method of testing semiconductor device

201010602334.8 Probe card Structure and method of assembling the same

201110229503.2 Probe card and its manufacturing method

201220520534.3 Probe card mounting Table and Probe measuring device

201310303035.8 Probe card and method of manufacturing the same

201410262345.4 Probe card and method of manufacturing the same

201410328012.7 Board for Probe card, method of manufacturing the same, and Probe card

201510543596.4 Integrated Circuit Probe card, method of manufacturing the same, and apparatus and method for inspecting the Probe card

201510929670.6 Probe card and method of manufacturing the same

201710242941.X guide plate for probe card and method of manufacturing the guide plate for probe card

201711042258.8 Probe for Probe card and method of manufacturing the same

201810863816.5 Probe card, testing apparatus including the same, and related manufacturing method

201810871834.8 method for manufacturing vertical probe card and silicon substrate structure

201880030578.8 method for manufacturing multi-layer structure of probe card for testing equipment of electronic device

201910435481.1 space transformer, probe card and manufacturing method thereof

201910781444.6 apparatus for probe card manufacturing, inspection and maintenance and method of using the same

201911021188.7 guide plate for probe card, method for manufacturing the same, and probe card provided with the same

Therefore, from the beginning of the new century to the present, various national scholars and various enterprises make extensive trials and innovations in probe card manufacturing, and strive for probe cards to meet the test requirements of semiconductor devices along with the development of semiconductor technology.

Among these techniques, there are some for manufacturing a probe card with a larger size, and some for avoiding needle burning during a test, and although there are also techniques for manufacturing a probe card with a higher integration, it is still impossible to realize a probe card with a probe size in a sub-micron order. The reason is that, for the probe with the size of submicron order, the bending of the probe cannot be effectively avoided in the manufacturing process, and once the probe is slightly bent, the probe will contact another probe with the distance of submicron order, which causes the manufacturing failure.

Disclosure of Invention

The invention discloses a template burning method of a guide plate MEMS probe structure, aiming at the manufacturing requirement of a submicron-order probe card, and further comprising a brand-new manufacturing process of the MEMS probe card, wherein the method comprises the steps of starting from the structure of the MEMS probe card to template burning equipment and a method of the guide plate MEMS probe structure, facing to a probe positioning method of the guide plate MEMS probe structure template burning, then starting to a guide plate MEMS probe structure manufacturing method, and finally starting to a butting device and a method of the guide plate MEMS probe structure and a switching layer, so that the manufacture of the submicron-order MEMS probe card is finally realized.

The purpose of the invention is realized as follows:

a template burning method for a guide plate MEMS probe structure comprises the following steps:

step a, placing a guide plate MEMS probe structure template, wherein the mark position of the guide plate MEMS probe structure template is positioned on the edge of a slit plate when a coaxial step roller is positioned at an initial position;

b, adjusting the x-direction slit expansion plate and the y-direction slit expansion plate, rotating the coaxial step rollers in the x-direction slit expansion plate according to the distance between two adjacent MEMS probes in the x direction, and ensuring that the product of the linear speed and the rotation time is the distance between two adjacent MEMS probes in the x direction; rotating the coaxial step rollers in the y-direction slit unfolding plate according to the distance between two adjacent MEMS probes in the y direction to ensure that the product of the linear speed and the rotation time is the distance between two adjacent MEMS probes in the y direction;

step c, collecting the burning image

Installing a plane reflector, lighting a light source, enabling light beams emitted by the light source to pass through a pinhole to form a point light source, enabling the pinhole to be located at the focus of a collimating mirror, enabling the point light source to pass through the collimating mirror to form parallel light, enabling the parallel light to pass through an x-direction slit expansion plate to form an x-direction stripe array, enabling the x-direction stripe array to pass through a y-direction slit expansion plate to form a point array, and enabling the point array to be transmitted through a first prism, reflected by the plane reflector, reflected by the first prism, transmitted by a second prism and incident to a first image sensor respectively;

step d, burning and carving the template of the MEMS probe structure of the guide plate

And d, removing the plane reflector, controlling the laser array to emit laser beams by the first image sensor according to the image collected in the step c, reflecting the laser beams by the second prism and the first prism respectively, and enabling the laser beams to enter the surface of the template of the MEMS probe structure of the guide plate under the condition that the plane reflector is not arranged so as to realize burning.

The guide plate MEMS probe structure template burning and engraving method is applied to guide plate MEMS probe structure template burning and engraving equipment, and the guide plate MEMS probe structure template burning and engraving equipment is sequentially provided with a light source, a pinhole, a collimating mirror, an x-direction slit expansion plate, a y-direction slit expansion plate, a first prism, a plane reflecting mirror, a second prism, a first image sensor, a controller and a laser array along the light propagation direction.

Has the advantages that:

the key technologies work in coordination with each other, and the key technologies are all inexhaustible, and the key technologies are taken as a whole to finally realize the manufacture of the submicron-grade MEMS probe card.

The invention discloses a device and a method for burning and engraving a template of a guide plate MEMS probe structure, which can be used for manufacturing a submicron guide plate MEMS probe structure template, thereby laying a device and method foundation for providing a new method for manufacturing the guide plate MEMS probe structure; it should be noted here that in the apparatus, a lens for amplification may also be added between the plane mirror and the first image sensor to realize imaging of sub-micron level images in a micron pixel level imaging device; and a lens with a shrinking effect is added between the laser array and the MEMS probe structure template of the quasi-guide plate, so that the effect of realizing submicron-level burning and carving of the non-submicron-level laser array is realized.

The invention discloses a probe positioning method for template burning and carving of a guide plate MEMS probe structure.

The invention also discloses a method for manufacturing the guide plate MEMS probe structure by utilizing the guide plate MEMS probe structure template.

Fifthly, aiming at the specific process of the application, the invention also designs a butt joint technology of the guide plate MEMS probe structure and the switching layer, the probe card is divided into an upper part and a lower part, wherein the upper part is formed by the reinforcing piece, the PCB and the switching layer, the lower part is formed by the guide plate MEMS probe structure, and the butt joint of the two parts is realized through the butt joint device and the butt joint method of the guide plate MEMS probe structure and the switching layer, so that the manufacture of the MEMS probe card is finally completed.

Drawings

FIG. 1 is a schematic diagram of a MEMS probe card.

Fig. 2 is a schematic structural diagram of a template burning device for a guide plate MEMS probe structure.

FIG. 3 is a schematic view showing a structure of a slit exploding plate.

Fig. 4 is a flow chart of a guide plate MEMS probe structure template burning method.

Fig. 5 is a flow chart of a probe positioning method facing a guide plate MEMS probe structure template burn.

FIG. 6 is a flow chart of a method of fabricating a guide plate MEMS probe structure.

FIG. 7 is a schematic structural diagram of a docking device for the guide plate MEMS probe structure and the interposer.

FIG. 8 is a flow chart of a method of interfacing a guide plate MEMS probe structure with an interposer.

In the figure: 1 reinforcing piece, 2PCB (printed Circuit Board), 3 switching layer, 4 guide plate, 5MEMS probe, 6 quasi-guide plate MEMS probe structure template, 7-1 light source, 7-2 pinhole, 7-3 collimating mirror, 7-4x slit expanding plate, 7-5y slit expanding plate, 7-45-1 coaxial ladder roller, 7-45-2 stay wire, 7-45-3 slit plate, 7-6 first prism, 7-7 plane reflector, 7-8 second prism, 7-9 first image sensor, 7-10 controller, 7-11 laser array, 8-1 third prism, 8-2 imaging objective lens, 8-3 second image sensor, 8-4 lifting platform, 8-5 support, 8-6 cylinder, 8-7 support plate, 8-8 two-dimensional translation stage.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.