阅读说明：本技术 Mems探针卡 (MEMS probe card ) 是由 赵梁玉 王艾琳 于 2020-08-14 设计创作，主要内容包括：本发明MEMS探针卡属于IC制作业技术领域,具体涉及微机电系统制造、半导体裸芯测试及相关关键技术；该探针卡从上到下依次包括加强件、PCB板、转接层、导引板和MEMS探针；本发明不仅公开了一种MEMS探针卡,而且公开了一种MEMS探针卡的全新制作工艺,从MEMS探针卡的结构,到导引板MEMS探针结构模板烧刻设备与方法,面向导引板MEMS探针结构模板烧刻的探针定位方法,再到导引板MEMS探针结构制作方法,最后到导引板MEMS探针结构与转接层的对接装置与方法,最终实现亚微米级MEMS探针卡的制造。(The invention MEMS probe card belongs to the technical field of IC manufacturing industry, in particular to the manufacturing of a micro electro mechanical system, the testing of a semiconductor bare chip and related key technologies; the probe card sequentially comprises a reinforcing piece, a PCB (printed circuit board), an adapter layer, a guide plate and an MEMS (micro-electromechanical systems) probe from top to bottom; the invention discloses an MEMS probe card, and also discloses a brand new manufacturing process of the MEMS probe card, which comprises a device and a method for burning and carving a template of an MEMS probe structure of an MEMS probe card from a structure of the MEMS probe card to a guide plate, a probe positioning method facing the burning and carving of the template of the MEMS probe structure of the guide plate, a manufacturing method of the MEMS probe structure of the guide plate, and finally a device and a method for butting the MEMS probe structure of the guide plate and a switching layer, so as to finally realize the manufacturing of the submicron MEMS probe card.)

The MEMS probe card sequentially comprises a reinforcing piece (1), a PCB (printed circuit board) 2, an adapter layer (3), a guide plate (4) and an MEMS probe (5) from top to bottom; the MEMS probe card comprises a reinforcing piece (1), a PCB (printed circuit board) and a guide plate (4), wherein the reinforcing piece (1) is used for increasing the strength of the MEMS probe card, the PCB (2) is used for connecting a testing machine and signal routing, the switching layer (3) is a medium of the PCB (2) and an MEMS probe (5) and used for realizing the fixed switching of signals, the guide plate (4) is used for accommodating the MEMS probe (5), and the MEMS probe (5) is used for connecting a wafer to be tested and realizing the test of the electrical property of the wafer;

it is characterized in that the preparation method is characterized in that,

the guide plate (4) and the MEMS probe (5) jointly form a guide plate MEMS probe structure, and the guide plate MEMS probe structure is manufactured by utilizing a guide plate MEMS probe structure template; the guide plate MEMS probe structure template can be dissolved in a solution in which a guide plate (4) and an MEMS probe (5) cannot be dissolved, a mark position is arranged on the guide plate MEMS probe structure template, and a coating protrusion is arranged on the guide plate (4).

2. The MEMS probe card of claim 1, wherein the guide plate MEMS probe structure template is formed by burning and carving a guide plate MEMS probe structure template burning and carving device, and the guide plate MEMS probe structure template burning and carving device is sequentially provided with a light source (7-1), a pinhole (7-2), a collimating mirror (7-3), an x-direction slit expanding plate (7-4), a y-direction slit expanding plate (7-5), a first prism (7-6), a plane reflector (7-7), a second prism (7-8), a first image sensor (7-9), a controller (7-10) and a laser array (7-11) along a light propagation direction.

3. The MEMS probe card of claim 2 wherein the guide plate MEMS probe structure template is fired using a guide plate MEMS probe structure template firing apparatus comprising three steps:

step a, positioning in the x direction;

b, positioning in the y direction;

and c, two-dimensional positioning.

Technical Field

The invention discloses an MEMS probe card, belongs to the technical field of IC manufacturing industry, and particularly relates to manufacturing of a micro-electro-mechanical system, testing of a semiconductor bare chip and related key technologies.

Background

The probe card is an important technology in the chip manufacturing process, before the chip is packaged, the probe on the probe card is directly contacted with the welding pad or the lug on the chip, the chip signal is led out, and then the automatic measurement is realized by matching with a peripheral test instrument and software control, so that the defective product is screened out, and the product yield is ensured.

With the development of micro-electro-mechanical systems (MEMS) technology, the size of a chip is smaller and smaller, and reaches millimeter level, and the integration level inside the chip is higher and higher, and reaches micron level, even submicron level, which requires the volume of a probe card to be reduced along with the probe, so that the probe manufacturing faces new challenges.

With respect to probe card manufacturing, a number of prior art techniques have been disclosed, which in chronological order, come in sequence, including:

02100980.5 wafer level probe card and method of making the same

03802632.5 Probe card and method for manufacturing the same

200580041495.1 manufacturing method of probe card including detecting probe

200580049139.4 Probe card and method of manufacturing the same

200680009115.0 Probe card and method of manufacturing the same

200680027726.8 method and apparatus for manufacturing probe card

200680031627.7 Probe card and method of manufacturing the same

200610103270.0 manufacturing method of probe card

200710110928.5 Probe card for testing and manufacturing method thereof

200710162691.5A method for manufacturing conductive film, structure thereof, and probe card with the conductive film

200710306120.4 manufacturing method of probe card

200810088590.2 manufacturing method and device for probe card

200810099307.6 Probe card and method of manufacturing the same

200910207279.X probe card manufacturing method comprising detection probe, probe card and probe card inspection system

201010000429.2A microprobe structure and its manufacturing method

201010551930.8 Probe card, method of manufacturing the same, and method of testing semiconductor device

201010602334.8 Probe card Structure and method of assembling the same

201110229503.2 Probe card and its manufacturing method

201220520534.3 Probe card mounting Table and Probe measuring device

201310303035.8 Probe card and method of manufacturing the same

201410262345.4 Probe card and method of manufacturing the same

201410328012.7 Board for Probe card, method of manufacturing the same, and Probe card

201510543596.4 Integrated Circuit Probe card, method of manufacturing the same, and apparatus and method for inspecting the Probe card

201510929670.6 Probe card and method of manufacturing the same

201710242941.X guide plate for probe card and method of manufacturing the guide plate for probe card

201711042258.8 Probe for Probe card and method of manufacturing the same

201810863816.5 Probe card, testing apparatus including the same, and related manufacturing method

201810871834.8 method for manufacturing vertical probe card and silicon substrate structure

201880030578.8 method for manufacturing multi-layer structure of probe card for testing equipment of electronic device

201910435481.1 space transformer, probe card and manufacturing method thereof

201910781444.6 apparatus for probe card manufacturing, inspection and maintenance and method of using the same

201911021188.7 guide plate for probe card, method for manufacturing the same, and probe card provided with the same

Therefore, from the beginning of the new century to the present, various national scholars and various enterprises make extensive trials and innovations in probe card manufacturing, and strive for probe cards to meet the test requirements of semiconductor devices along with the development of semiconductor technology.

Among these techniques, there are some for manufacturing a probe card with a larger size, and some for avoiding needle burning during a test, and although there are also techniques for manufacturing a probe card with a higher integration, it is still impossible to realize a probe card with a probe size in a sub-micron order. The reason is that, for the probe with the size of submicron order, the bending of the probe cannot be effectively avoided in the manufacturing process, and once the probe is slightly bent, the probe will contact another probe with the distance of submicron order, which causes the manufacturing failure.

Disclosure of Invention

The invention discloses an MEMS probe card, which further comprises a brand new manufacturing process of the MEMS probe card, and the manufacturing of the submicron MEMS probe card is finally realized from the structure of the MEMS probe card, a device and a method for burning and carving a template of an MEMS probe structure of a guide plate, a probe positioning method facing the burning and carving of the template of the MEMS probe structure of the guide plate, a manufacturing method of the MEMS probe structure of the guide plate, and finally a butting device and a method of the MEMS probe structure of the guide plate and a switching layer.

The purpose of the invention is realized as follows:

the MEMS probe card sequentially comprises a reinforcing piece, a PCB (printed circuit board), an adapter layer, a guide plate and an MEMS probe from top to bottom; the MEMS probe card comprises a reinforcing piece, a PCB (printed circuit board) and an MEMS probe, wherein the reinforcing piece is used for enhancing the strength of the MEMS probe card, the PCB is used for connecting a testing machine and signal routing, the switching layer is a medium of the PCB and the MEMS probe and is used for realizing the fixed switching of signals, the guide plate is used for accommodating the MEMS probe, and the MEMS probe is used for connecting a wafer to be tested and realizing the test of the electrical property of the wafer;

the guide plate and the MEMS probe jointly form a guide plate MEMS probe structure, and the guide plate MEMS probe structure is manufactured by utilizing a guide plate MEMS probe structure template; the guide plate MEMS probe structure template can be dissolved in a solution in which a guide plate and an MEMS probe cannot be dissolved, a mark position is arranged on the guide plate MEMS probe structure template, and a coating protrusion is arranged on the guide plate.

According to the MEMS probe card, the guide plate MEMS probe structure template is formed by burning and carving the guide plate MEMS probe structure template by using the guide plate MEMS probe structure template burning and carving equipment, and the guide plate MEMS probe structure template burning and carving equipment is sequentially provided with a light source, a pinhole, a collimating mirror, an x-direction slit expanding plate, a y-direction slit expanding plate, a first prism, a plane reflector, a second prism, a first image sensor, a controller and a laser array along the light propagation direction.

The template of the guide plate MEMS probe structure is formed by burning and carving a guide plate MEMS probe structure template by using a burning and carving device, and comprises the following three steps:

step a, positioning in the x direction;

b, positioning in the y direction;

and c, two-dimensional positioning.

Has the advantages that:

the invention discloses an MEMS probe card, which further comprises a brand new manufacturing process of the MEMS probe card, wherein the manufacturing process comprises the following steps of carrying out burning and carving on an MEMS probe structure template from the structure of the MEMS probe card to a guide plate MEMS probe structure template, carrying out a probe positioning method facing the burning and carving on the guide plate MEMS probe structure template, carrying out a manufacturing method of the guide plate MEMS probe structure, and finally carrying out a butt joint device and a butt joint method of the guide plate MEMS probe structure and a switching layer.

The invention discloses a device and a method for burning and engraving a template of a guide plate MEMS probe structure, which can be used for manufacturing a submicron guide plate MEMS probe structure template, thereby laying a device and method foundation for providing a new method for manufacturing the guide plate MEMS probe structure; it should be noted here that in the apparatus, a lens for amplification may also be added between the plane mirror and the first image sensor to realize imaging of sub-micron level images in a micron pixel level imaging device; and a lens with a shrinking effect is added between the laser array and the MEMS probe structure template of the quasi-guide plate, so that the effect of realizing submicron-level burning and carving of the non-submicron-level laser array is realized.

The invention discloses a probe positioning method for template burning and carving of a guide plate MEMS probe structure.

The invention also discloses a method for manufacturing the guide plate MEMS probe structure by utilizing the guide plate MEMS probe structure template.

Fifthly, aiming at the specific process of the application, the invention also designs a butt joint technology of the guide plate MEMS probe structure and the switching layer, the probe card is divided into an upper part and a lower part, wherein the upper part is formed by the reinforcing piece, the PCB and the switching layer, the lower part is formed by the guide plate MEMS probe structure, and the butt joint of the two parts is realized through the butt joint device and the butt joint method of the guide plate MEMS probe structure and the switching layer, so that the manufacture of the MEMS probe card is finally completed.

Drawings

FIG. 1 is a schematic diagram of a MEMS probe card.

Fig. 2 is a schematic structural diagram of a template burning device for a guide plate MEMS probe structure.

FIG. 3 is a schematic view showing a structure of a slit exploding plate.

Fig. 4 is a flow chart of a guide plate MEMS probe structure template burning method.

Fig. 5 is a flow chart of a probe positioning method facing a guide plate MEMS probe structure template burn.

FIG. 6 is a flow chart of a method of fabricating a guide plate MEMS probe structure.

FIG. 7 is a schematic structural diagram of a docking device for the guide plate MEMS probe structure and the interposer.

FIG. 8 is a flow chart of a method of interfacing a guide plate MEMS probe structure with an interposer.

In the figure: 1 reinforcing piece, 2PCB (printed Circuit Board), 3 switching layer, 4 guide plate, 5MEMS probe, 6 quasi-guide plate MEMS probe structure template, 7-1 light source, 7-2 pinhole, 7-3 collimating mirror, 7-4x slit expanding plate, 7-5y slit expanding plate, 7-45-1 coaxial ladder roller, 7-45-2 stay wire, 7-45-3 slit plate, 7-6 first prism, 7-7 plane reflector, 7-8 second prism, 7-9 first image sensor, 7-10 controller, 7-11 laser array, 8-1 third prism, 8-2 imaging objective lens, 8-3 second image sensor, 8-4 lifting platform, 8-5 support, 8-6 cylinder, 8-7 support plate, 8-8 two-dimensional translation stage.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.