阅读说明：本技术 显示模组、终端及制备方法 (Display module, terminal and preparation method ) 是由 古蒋林 颜嘉甫 于 2019-03-29 设计创作，主要内容包括：本公开是关于一种显示模组、终端及制备方法,属于电子设备技术领域。所述显示模组包括：基板层、设置在所述基板层上的OLED显示层和驱动组件；所述基板层上形成有至少一组导电通孔,所述导电通孔中设置有导电材料,所述导电材料形成所述驱动组件的信号通路。本公开通过在显示屏的基板层上设置导电通孔,在导电通孔中设置导电材料,将导电材料作为信号通路,避免了线路从显示屏的侧面通过所占用的空间,减小了显示屏和设备边框之间的距离,提高了电子设备的屏占比。(The disclosure relates to a display module, a terminal and a preparation method, and belongs to the technical field of electronic equipment. The display module assembly includes: the OLED display device comprises a substrate layer, an OLED display layer and a driving assembly, wherein the OLED display layer and the driving assembly are arranged on the substrate layer; at least one group of conductive through holes are formed in the substrate layer, conductive materials are arranged in the conductive through holes, and the conductive materials form a signal path of the driving assembly. This is disclosed through set up electrically conductive through-hole on the base plate layer at the display screen, sets up electrically conductive material in electrically conductive through-hole, regards electrically conductive material as signal path, has avoided the circuit to pass through shared space from the side of display screen, has reduced the distance between display screen and the equipment frame, has improved electronic equipment's screen and has accounted for the ratio.)

1. The display module is characterized by comprising a substrate layer, an OLED display layer and a driving assembly, wherein the OLED display layer and the driving assembly are arranged on the substrate layer;

at least one group of conductive through holes are formed in the substrate layer, conductive materials are arranged in the conductive through holes, and the conductive materials form a signal path of the driving assembly.

2. The display module of claim 1, wherein the driving assembly comprises: the flexible circuit board and the driving chip;

the signal path is a path between the OLED display layer and the driving chip;

or the like, or, alternatively,

the signal path is a path between the OLED display layer and the flexible circuit board;

or the like, or, alternatively,

the signal path is a path between the driving chip and the flexible circuit board.

3. The display module assembly according to claim 1, wherein the driving chip is disposed on a lower surface of the substrate layer, an output pin of the driving chip is connected to the input terminal of the OLED display layer through the conductive material, and an input pin of the driving chip is connected to one end of the flexible circuit board.

4. The display module assembly according to claim 1, wherein the flexible circuit board is disposed on a lower surface of the substrate layer, an output end of the flexible circuit board is connected to an input end of the OLED display layer through the conductive material, and an input end of the flexible circuit board is connected to an output pin of the driving chip.

5. The display module assembly according to claim 1, wherein the driving chip is disposed on an upper surface of the substrate layer, the flexible circuit board is disposed on a lower surface of the substrate layer, an output pin of the driving chip is connected to an input terminal of the OLED display layer, and an input pin of the driving chip is connected to an output terminal of the flexible circuit board through the conductive material.

6. The display module assembly of any one of claims 1-5, wherein the aperture of the conductive via is between 5um and 30 um.

7. A terminal, characterized by means for: the display module comprises a control unit, a middle frame and a display module arranged on the front face of the middle frame, wherein the display module comprises the display module as claimed in any one of claims 1 to 6.

8. A preparation method of a display module is characterized by comprising the following steps:

determining the calibration position of the conductive through hole on the substrate layer;

carrying out micropore machining on the substrate layer according to the calibration position to form the conductive through hole;

arranging a conductive material in the conductive through hole;

leading out the conductive material in a wiring mode;

and attaching the driving assembly to the surface of the substrate layer, and electrically connecting the pins of the driving assembly with the conductive material through the wires.

9. The method of claim 8, wherein the micro-via processing on the substrate layer comprises:

processing the micropores on the substrate layer by adopting any mode of laser, ultrasonic punching, dry etching and wet etching to form the conductive through holes;

wherein, the aperture of the conductive through hole is 5um-30 um.

10. The method of claim 8, wherein the disposing a conductive material within the conductive via comprises:

filling silver paste in the conductive through hole;

or the like, or, alternatively,

and depositing a conductive material in the conductive through hole by adopting an illumination process.

11. The method of claim 8, wherein the driver assembly comprises a driver chip and a flexible circuit board;

the laminating of drive assembly sets up on the surface of base plate layer, through walk line with drive assembly's pin and conducting material electric connection include:

the driving chip is arranged on the lower surface of the substrate layer in an attaching mode and is connected with the conductive material through the routing;

or the like, or, alternatively,

the flexible circuit board is arranged on the lower surface of the substrate layer in a fitting mode and is connected with the conductive material through the routing;

or the like, or, alternatively,

the drive chip is arranged on the upper surface of the substrate layer in an attaching mode, the flexible circuit board is arranged on the lower surface of the substrate layer in an attaching mode and is connected with the conductive materials through wires.