阅读说明：本技术 一种基于底部振动实现电铸层沉积均匀的设备 (Equipment for realizing uniform deposition of electroformed layer based on bottom vibration ) 是由 刘法明 于 2020-07-10 设计创作，主要内容包括：本发明涉及电铸制造技术领域,且公开了一种基于底部振动实现电铸层沉积均匀的设备,包括设备主体,设备主体的底部设置有液压杆,液压杆的外侧活动连接有活动轴心,活动轴心的外侧活动连接有液压弹簧,安装块的外侧活动连接有振动杆,振动杆的内侧设置有振动弹簧,振动弹簧远离振动杆的一端活动连接有振动板,振动板的外侧活动连接有连接弹簧。该基于底部振动实现电铸层沉积均匀的设备,通过安装块的向外侧推动,也推动其外侧连接的电解丝,电解丝继而推动电磁线圈以及电磁杆,同时,电磁触发头随即也抵接接触到电磁阀,电磁阀继而启动,产生电流,电解触点继而对设备主体内部的电铸沉积层进行电解。(The invention relates to the technical field of electroforming manufacturing, and discloses equipment for realizing uniform deposition of an electroforming layer based on bottom vibration. This realize even equipment of electroforming layer deposit based on bottom vibration, the outside promotion through the installation piece promotes the electrolysis silk that its outside is connected yet, and the electrolysis silk promotes solenoid and electromagnetic bar then, and simultaneously, electromagnetism triggers the head and also the butt contact solenoid valve immediately, and the solenoid valve starts then, produces electric current, and the electrolysis contact carries out the electrolysis to the inside electroforming deposit layer of equipment main part then.)

1. An apparatus for realizing uniform deposition of an electroformed layer based on bottom vibration, comprising an apparatus main body (1), characterized in that: a hydraulic rod (2) is arranged at the bottom of the equipment main body (1), the outer side of the hydraulic rod (2) is movably connected with a movable axis (3), the outer side of the movable axis (3) is movably connected with a hydraulic spring (4), one end of the hydraulic spring (4) far away from the movable axis (3) is connected with a pushing plate (5), the inner side of the pushing plate (5) is movably connected with a return spring (6), one end of the pushing plate (5) far away from the hydraulic spring (4) is movably connected with a mounting block (7), the outer side of the mounting block (7) is movably connected with a vibrating rod (8), the inner side of the vibrating rod (8) is provided with a vibrating spring (9), one end of the vibration spring (9) far away from the vibration rod (8) is movably connected with a vibration plate (10), and a connecting spring (11) is movably connected to the outer side of the vibrating plate (10).

2. The apparatus for achieving uniformity of deposition of the electroformed layer based on the bottom vibration as set forth in claim 1, wherein: the outer side of the mounting block (7) is movably connected with an electrolysis device (12).

3. The apparatus for realizing uniform deposition of the electroformed layer based on the bottom vibration as set forth in claim 2, wherein: an electrolytic wire (13) is arranged in the electrolysis device (12).

4. The apparatus for achieving uniformity of deposition of the electroformed layer based on the bottom vibration as set forth in claim 3, wherein: the outer side of the electrolytic wire (13) is movably connected with an electromagnetic coil (14).

5. The apparatus for realizing uniform deposition of the electroformed layer based on the bottom vibration as set forth in claim 4, wherein: one end of the electromagnetic coil (14) far away from the electrolytic wire (13) is movably connected with an electromagnetic rod (15).

6. The apparatus for achieving uniformity of deposition of the electroformed layer based on the bottom vibration as set forth in claim 5, wherein: one end, far away from the electromagnetic coil (14), of the electromagnetic rod (15) is movably connected with an electromagnetic trigger head (16).

7. The apparatus for achieving uniformity of deposition of the electroformed layer based on the bottom vibration as set forth in claim 6, wherein: an electromagnetic valve (17) is arranged on the inner side of the electromagnetic trigger head (16).

8. The apparatus for achieving uniformity of deposition of the electroformed layer based on the bottom vibration as set forth in claim 7, wherein: the top end of the electrolysis device (12) is provided with an electrolysis contact (18).

Technical Field

The invention relates to the technical field of electroforming manufacturing, in particular to equipment for realizing uniform deposition of an electroforming layer based on bottom vibration.

Background

The electroforming is a precise special processing method, the processing and manufacturing of parts are realized by utilizing the electrochemical reduction reaction of metal ions on the surface of a cathode and gradual deposition forming, the method has high replication precision and repeatability precision, and compared with other precise processing technologies, the electroforming manufacturing also has the advantages of high precision, no cutting force and the like.

Chinese patent "method and apparatus for high-speed jet-flow jet electroforming of revolving body parts" proposes (patent No. CN 201010588837): the electroforming core mould is half-buried in the electroforming groove full of hard particles and rotates, the electroforming jet nozzle scans along a certain track, the selective scanning electroforming is carried out on the surface of the bare electroforming core mould, the required parts are piled layer by layer, and the hard particles or friction parts rub the surface of the casting layer to remove the defects of accumulated tumors, burrs and the like on the deposition surface. However, due to the action of gravity, the extrusion friction force on the electroforming layer of the core mould part embedded in the bottom layer is large, and the extrusion friction force on the electroforming layer of the core mould part embedded in the surface layer is small, so that the uneven material of the upper and lower settled layers can be still caused. The obtained deposition layer has the defects of cracks, even delamination and the like, so that the mechanical property of the part is reduced.

Therefore, the device for realizing uniform deposition of the electroforming layer based on bottom vibration is provided, and the problem that the deposition layer is accumulated at the bottom of the electroforming device to cause uneven deposition of the electroforming deposition layer is solved through high-speed vibration of the bottom of the electroforming device.

Disclosure of Invention

Technical scheme

In order to realize the advantages, the invention provides the following technical scheme: the utility model provides an equipment based on bottom vibration realizes that electroforming layer deposit is even, includes the equipment principal, the bottom of equipment principal is provided with the hydraulic stem, the outside swing joint of hydraulic stem has the activity axle center, the outside swing joint in activity axle center has hydraulic spring, hydraulic spring keeps away from the one end in activity axle center and is connected with the slurcam, the inboard swing joint of slurcam has reset spring, the one end swing joint that hydraulic spring was kept away from to the slurcam has the installation piece, the outside swing joint of installation piece has the vibrating arm, the inboard of vibrating arm is provided with vibrating spring, vibrating spring keeps away from the one end swing joint of vibrating arm has the vibration board, the outside swing joint of vibration board has connecting spring.

Preferably, the outer side of the mounting block is movably connected with an electrolysis device.

Preferably, an electrolytic wire is arranged inside the electrolytic device.

Preferably, the outer side of the electrolytic wire is movably connected with an electromagnetic coil.

Preferably, one end of the electromagnetic coil, which is far away from the electrolytic wire, is movably connected with an electromagnetic rod.

Preferably, one end of the electromagnetic rod, which is far away from the electromagnetic coil, is movably connected with an electromagnetic trigger head.

Preferably, an electromagnetic valve is arranged on the inner side of the electromagnetic trigger head and can generate electrolytic magnetic force.

Preferably, the top end of the electrolysis device is provided with an electrolysis contact for electrolyzing a deposition layer placed in the device body.

Advantageous effects

Compared with the prior art, the invention provides equipment for realizing uniform deposition of an electroformed layer based on bottom vibration, which has the following beneficial effects:

1. this realize even equipment of electroforming layer deposit based on bottom vibration, the outside promotion through the installation piece promotes the electrolysis silk that its outside is connected yet, and the electrolysis silk promotes solenoid and electromagnetic bar then, and simultaneously, electromagnetism triggers the head and also the butt contact solenoid valve immediately, and the solenoid valve starts then, produces electric current, and the electrolysis contact carries out the electrolysis to the inside electroforming deposit layer of equipment main part then.

2. According to the equipment for realizing uniform deposition of the electroforming layer based on the bottom vibration, the mounting block moves outwards, the vibrating rods connected with the two ends of the mounting block push outwards immediately, then abut against the vibrating springs, the vibrating springs push the vibrating plates immediately, the vibrating plates are made of flexible materials, the two ends of the vibrating plates are fixedly provided with the connecting springs, the vibrating plates are pressed and then bent and vibrate, the electroforming deposition layer is deposited on the bottom of the equipment main body to vibrate above the vibrating plates, and the depositing layer is prevented from being accumulated on the bottom of the equipment main body; the material quality of the settled layer is not uniform, and the obtained settled layer has the defects of cracks, even delamination and the like, so that the mechanical property of the part is reduced.

Drawings

FIG. 1 is a schematic view of the connection structure of the main body of the apparatus of the present invention;

FIG. 2 is a schematic view of the connection structure of the vibrating plate according to the present invention;

FIG. 3 is a schematic view of the movable axis connection structure of the present invention;

FIG. 4 is a schematic view of the vibration spring connection structure of the present invention;

FIG. 5 is a schematic view of the connection structure of the electrolytic device of the present invention;

FIG. 6 is a schematic view of an electrolytic wire connection structure according to the present invention;

FIG. 7 is a schematic view of an electrolytic contact connection structure according to the present invention;

FIG. 8 is a schematic view of the solenoid connection of the present invention;

FIG. 9 is a schematic view of an electromagnetic trigger head connection structure according to the present invention;

FIG. 10 is a schematic view of a coupling structure of the electromagnetic lever according to the present invention;

FIG. 11 is an enlarged view of the structure of area A in FIG. 10 according to the present invention.

In the figure: 1. an apparatus main body; 2. a hydraulic lever; 3. a movable axis; 4. a hydraulic spring; 5. a push plate; 6. a return spring; 7. mounting blocks; 8. a vibrating rod; 9. a vibration spring; 10. a vibrating plate; 11. a connecting spring; 12. an electrolysis device; 13. electrolyzing the filament; 14. an electromagnetic coil; 15. an electromagnetic rod; 16. an electromagnetic trigger head; 17. an electromagnetic valve; 18. and (4) electrolyzing the contact.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-11, an apparatus for realizing uniform deposition of an electroformed layer based on bottom vibration comprises an apparatus body 1, a hydraulic rod 2 is arranged at the bottom of the apparatus body 1, the outer side of the hydraulic rod 2 is movably connected with a movable axis 3, the outer side of the movable axis 3 is movably connected with a hydraulic spring 4, one end of the hydraulic spring 4, which is far away from the movable axis 3, is connected with a push plate 5, the inner side of the push plate 5 is movably connected with a return spring 6, one end of the push plate 5, which is far away from the hydraulic spring 4, is movably connected with an installation block 7, the outer side of the installation block 7 is movably connected with a vibrating rod 8, the inner side of the vibrating rod 8 is provided with a vibrating spring 9, one end of the vibrating spring 9, which is far away from.

The mounting block 7 moves outwards, the vibrating rods 8 connected with the two ends of the mounting block immediately push outwards, then abut against the vibrating springs 9, the vibrating springs 9 immediately push the vibrating plates 10, the vibrating plates 10 are made of flexible materials, the connecting springs 11 are fixed at the two ends of the vibrating plates 10, the vibrating plates 10 are pressed, immediately bent and vibrated, and deposited layers above the vibrating plates, namely deposited at the bottom of the equipment body 1, vibrate to prevent the deposited layers from accumulating at the bottom of the equipment body 1; the material quality of the settled layer is not uniform, and the obtained settled layer has the defects of cracks, even delamination and the like, so that the mechanical property of the part is reduced.

An electrolytic device 12 is movably connected to the outer side of the mounting block 7, an electrolytic wire 13 is arranged inside the electrolytic device 12, and an electromagnetic coil 14 is movably connected to the outer side of the electrolytic wire 13. An electromagnetic rod 15 is movably connected to one end of the electromagnetic coil 14 far away from the electrolytic wire 13, and an electromagnetic trigger head 16 is movably connected to one end of the electromagnetic rod 15 far away from the electromagnetic coil 14.

By pushing the mounting block 7 to the outside, the electrolytic wire 13 connected to the outside is also pushed, the electrolytic wire 13 in turn pushes the electromagnetic coil 14 and the electromagnetic rod 15, and at the same time, the electromagnetic trigger head 16 is also in abutting contact with the electromagnetic valve 17, the electromagnetic valve 17 is then started, current is generated, and the electrolytic contact 18 in turn electrolyzes the electroformed deposit layer inside the apparatus body 1.

The electromagnetic trigger head 16 is provided with an electromagnetic valve 17 at its inner side for generating electrolysis magnetic force, and the top end of the electrolysis device 12 is provided with an electrolysis contact 18 for electrolyzing the deposition layer placed in the device body 1.

The working principle is as follows: in use, the electroformed layer is placed inside the apparatus body 1, and the user presses the hydraulic rod 2 (in the same manner as using scissors), the hydraulic rod 2 is then relatively held close, the movable axle center 3 arranged above the movable axle center pushes outwards to push the hydraulic spring 4, the hydraulic spring 4 pushes against the pushing plate 5 connected above the movable axle center, the pushing plate 5 pushes against the mounting block 7 connected outside the movable axle center, the mounting block 7 moves outwards, the vibrating rods 8 connected with the two ends of the vibrating plate are immediately pushed outwards and then abut against the vibrating springs 9, the vibrating springs 9 immediately push the vibrating plate 10, the vibrating plate 10 is made of flexible materials, and both ends are fixed with connecting springs 11, the vibrating plate 10 is pressed to bend and vibrate, and for the upper part, namely, the electroformed deposit layer deposited on the bottom of the device body 1 vibrates to prevent the electroformed deposit layer from accumulating on the bottom of the device body 1; the material quality of the settled layer is not uniform, and the obtained settled layer has the defects of cracks, even delamination and the like, so that the mechanical property of the part is reduced.

At the same time, the outward side of the mounting block 7 pushes the electrolytic wire 13 connected to the outside, the electrolytic wire 13 then pushes the electromagnetic coil 14 and the electromagnetic rod 15, and at the same time, the electromagnetic trigger head 16 then also contacts the electromagnetic valve 17 in an abutting manner, the electromagnetic valve 17 is then started, current is generated, and the electrolytic contact 18 then electrolyzes the electroformed deposit layer inside the apparatus body 1.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.