Heat dissipation damping base for electronic product transportation

文档序号:1081970 发布日期:2020-10-20 浏览:21次 中文

阅读说明:本技术 电子产品运输的散热减震底座 (Heat dissipation damping base for electronic product transportation ) 是由 不公告发明人 于 2020-05-22 设计创作,主要内容包括:本发明公开了电子产品运输的散热减震底座,包括:底座本体和设置于所述底座本体内部的承接座,以及能与所述承接座耦合的第一减震机构、第二减震机构和第三减震机构,其中,在底座本体受到的冲击传递至所述承接座的过程中,所述冲击能够依次被所述第三减震机构、所述第二减震机构和所述第一减震机构所吸收。在底座本体受到冲击时,冲击能够依次被第三减震机构、第二减震机构和第一减震机构吸收,通过多级减震机制,能够提高减震效果。(The invention discloses a heat dissipation damping base for electronic product transportation, which comprises: the base body with set up in the inside seat of accepting of base body, and can with accept the first damper, second damper and the third damper of seat coupling, wherein, the impact that receives at base body transmits extremely accept the in-process of seat, the impact can be in proper order by third damper second damper with first damper absorbs. When base body receives the impact, the impact can be absorbed by third damper, second damper and first damper in proper order, through multistage damper, can improve the shock attenuation effect.)

1. Heat dissipation vibration damping mount of electronic product transportation includes: base body (1) with set up in base body (1) inside socket (2), characterized by: the shock absorber is characterized by further comprising a first shock absorption mechanism (3), a second shock absorption mechanism (4) and a third shock absorption mechanism (5), wherein the first shock absorption mechanism, the second shock absorption mechanism and the third shock absorption mechanism can be coupled with the bearing seat (2), and in the process that the impact received by the base body (1) is transmitted to the bearing seat (2), the impact can be absorbed by the third shock absorption mechanism (5), the second shock absorption mechanism (4) and the first shock absorption mechanism (3) in sequence.

2. The heat dissipating shock absorbing mount of claim 1, wherein: the shock absorber further comprises a heat dissipation mechanism (13) which can be coupled with the third shock absorption mechanism (5), and under the condition that the third shock absorption mechanism (5) absorbs the shock and changes the form of the third shock absorption mechanism, the heat dissipation mechanism (13) can work based on the driving force generated by the change of the form of the third shock absorption mechanism (5), so that the gas in the base body (1) can be discharged to exchange heat with the heat dissipation mechanism (13).

3. The heat dissipating shock absorbing mount of claim 2, wherein: heat dissipation mechanism (13) include gas cylinder (13a) and heat transfer portion (13e) at least, gas cylinder (13a) set up in the inside of base body (1), heat transfer portion (13e) set up in the outside of base body (1), gas cylinder (13a) through air intake duct (13c) and hollow cavity (6) intercommunication of base body (1), heat transfer portion (13e) through exhaust duct (13d) with gas cylinder (13a) intercommunication, air intake duct (13c) with exhaust duct (13d) can be in the state of not opening simultaneously.

4. The heat dissipating shock absorbing mount of claim 3, wherein: the heat dissipation mechanism (13) further comprises a buffer portion (13f), and under the condition that the electronic product is placed on the bearing seat (2), the buffer portion (13f) can coat the electronic product, wherein the buffer portion (13f) is communicated with the heat exchanging portion (13e), so that the gas cooled by the heat exchanging portion (13e) can enter the buffer portion (13 f).

5. The heat dissipating shock absorbing mount of claim 4, wherein: when the gas cooled by the heat exchange part (13e) enters the buffer part (13f) so that the pressure inside the buffer part (13f) is greater than a set threshold value, the gas in the buffer part (13f) can be partially discharged to enter the hollow cavity (6).

6. The heat dissipating shock absorbing mount of claim 5, wherein: be provided with sliding tray (8) on the inner wall of base body (1), be provided with slip arch (7) on accepting seat (2), slip arch (7) nestification in sliding tray (8) so that accept seat (2) can slide along the extending direction of sliding tray (8), wherein, first damper (3) set up in sliding tray (8), and with slip arch (7) are connected.

7. The heat dissipating shock absorbing mount of claim 6, wherein: the second damping mechanism (4) at least comprises a first elastic body (4a) and a mounting plate (4b), the mounting plate (4b) is arranged inside the bearing seat (2), and the first elastic body (4a) is arranged between the mounting plate (4b) and a first inner wall (2a) of the bearing seat (2).

8. The heat dissipating shock absorbing mount of claim 7, wherein: the third shock absorption mechanism (5) at least comprises a first telescopic rod (5a) and a second telescopic rod (5b), one end of each of the first telescopic rod (5b) and the second telescopic rod (5b) can be connected with the mounting plate (4b) in a mode of penetrating through the second inner wall (2b) of the bearing seat (2), and under the condition that the third shock absorption mechanism (5) absorbs the impact to change the shape of the third shock absorption mechanism, the length of each of the first telescopic rod (5a) and the second telescopic rod (5b) can be increased or decreased.

9. The heat dissipating shock absorbing mount of claim 8, wherein: the heat dissipation mechanism (13) further comprises a squeezing portion (13b), wherein the squeezing portion (13b) can be connected to the first telescopic rod (5a), the second telescopic rod (5b) and the inflator (13a) at the same time, under the condition that the respective lengths of the first telescopic rod (5a) and the second telescopic rod (5b) are reduced, the squeezing portion (13b) can apply external force to the inflator (13a) to enable the volume of the inflator (13a) to be reduced, or under the condition that the respective lengths of the first telescopic rod (5a) and the second telescopic rod (5b) are increased, the squeezing portion (13b) can apply external force to the inflator (13a) to enable the volume of the inflator (13a) to be increased.

10. The heat dissipating shock absorbing mount of claim 9, wherein: the intake passage (13c) is opened and the exhaust passage (13d) is closed when the volume of the inflator (13a) increases, or the intake passage (13c) is closed and the exhaust passage (13d) is opened when the volume of the inflator (13a) decreases.

Technical Field

The invention belongs to the field of auxiliary transport equipment, and particularly relates to a heat dissipation damping base for electronic product transport.

Background

In actual life, present electronic product is more and more common, and it is very important to the electronic product transportation safety problem already to seem, and present conveyer shock attenuation effect is poor, can not be fine carry out effectual protection to electronic product, causes the damage of electronic product easily, has reduced conveyer's practicality, and it is troublesome to give people to cause unnecessary, has caused certain economic loss often in the transportation. Therefore, in the prior art, there are many heat dissipation shock absorption bases with different functions. For example, patent document No. CN107218482A discloses a heat dissipation damping mount for electronic product transportation, which includes a fixing frame, a motor fixedly connected to the bottom of the inner wall of the fixing frame, a threaded rod fixedly connected to the output shaft of the motor through a coupling, moving blocks threadedly connected to both ends of the surface of the threaded rod, a support column fixedly connected to the top of the moving block through a support plate, an electric fan fixedly connected to the top of the support column, support plates fixedly connected to both sides of the top of the fixing frame, and a damping device fixedly connected to one side of the support plates. This a heat dissipation vibration damping mount for electronic product transportation, it is poor to have solved present conveyer shock attenuation effect, and the problem of carrying out effective protection to electronic product that can not be fine has guaranteed electronic product's safety fine, has improved conveyer's practicality, has improved the ability of transporting electronic product, avoids giving people and causes unnecessary troublesome, avoids transporting and leads to the fact economic loss for people.

Disclosure of Invention

The invention aims to provide a heat dissipation damping base which can perform multi-stage damping, can protect an electronic product and can fully dissipate heat of the electronic product.

The technical scheme adopted by the invention for realizing the purpose is as follows: a heat dissipation vibration damping mount for electronic product transportation comprises: the base body with set up in the inside seat of accepting of base body, and can with accept the first damper, second damper and the third damper of seat coupling, wherein, the impact that receives at base body transmits extremely accept the in-process of seat, the impact can be in proper order by third damper second damper with first damper absorbs. When base body receives the impact, the impact can be absorbed by third damper, second damper and first damper in proper order, through multistage damper, can improve the shock attenuation effect.

Preferably, the heat dissipation damper further includes a heat dissipation mechanism that is couplable to the third damper mechanism, and when the third damper mechanism absorbs the impact and changes its own form, the heat dissipation mechanism is operable based on a driving force generated by the change in the form of the third damper mechanism, so that the gas inside the base body can be discharged to exchange heat with the heat dissipation mechanism. In the prior art, a fan is often arranged in a base body, and the fan continuously works to cool an electronic product. The fan needs to be driven by an external power supply, and the transportation cost of the electronic product in the long-distance transportation process can be further improved. The heat dissipation mechanism can be driven by the impact force generated by bumping in the transportation process, so that the energy consumption in the transportation process can be reduced.

Preferably, heat dissipation mechanism includes gas cylinder and heat transfer portion at least, the gas cylinder sets up in base body's inside, heat transfer portion sets up in base body's outside, the gas cylinder is through inlet channel and base body's cavity die cavity intercommunication, heat transfer portion through exhaust passage with the gas cylinder intercommunication, inlet channel with exhaust passage can be in the state of not opening simultaneously. Among the prior art, through the fan to electronic product, in hot summer, the wind that the fan blew off is also hot-blast to the heat in the base body is not discharged yet to the fan, and then the fan is not good to electronic product's cooling effect. This application is through gas cylinder and heat transfer portion for the heat exchange takes place outside the base body.

Preferably, the heat dissipation mechanism further comprises a buffering part, and when an electronic product is placed on the bearing seat, the buffering part can coat the electronic product, wherein the buffering part is communicated with the heat exchange part, so that the gas cooled by the heat exchange part can enter the buffering part. The inflator pump can discharge the heat in the base body, and the gas after the cooling of the heat exchange portion enters the buffering portion, so that the temperature of the buffering portion can be reduced, and the buffering portion abuts against the electronic product to be contacted, so that the buffering portion can achieve the purpose of cooling while providing protection for the electronic product.

Preferably, when the gas cooled by the heat exchanging part enters the buffer part so that the pressure inside the buffer part is greater than a set threshold, the gas in the buffer part can be partially discharged to enter the hollow cavity.

Preferably, a sliding groove is formed in the inner wall of the base body, a sliding protrusion is arranged on the bearing seat, and the sliding protrusion is nested in the sliding groove so that the bearing seat can slide along the extending direction of the sliding groove, wherein the first damping mechanism is arranged in the sliding groove and connected with the sliding protrusion.

Preferably, the second damping mechanism at least comprises a first elastic body and a mounting plate, the mounting plate is arranged inside the bearing seat, and the first elastic body is arranged between the mounting plate and the first inner wall of the bearing seat.

Preferably, the third shock absorbing mechanism includes at least a first telescopic rod and a second telescopic rod, and one end of each of the first telescopic rod and the second telescopic rod is connectable to the mounting plate so as to penetrate through the second inner wall of the socket, and the length of each of the first telescopic rod and the second telescopic rod is capable of being increased or decreased when the third shock absorbing mechanism absorbs the impact to change its form.

Preferably, the heat dissipation mechanism further comprises an extrusion portion, the extrusion portion can be connected to the first telescopic rod, the second telescopic rod and the inflator pump simultaneously, under the condition that the respective lengths of the first telescopic rod and the second telescopic rod are reduced, the extrusion portion can apply external force to the inflator pump so that the volume of the inflator pump is reduced, or under the condition that the respective lengths of the first telescopic rod and the second telescopic rod are increased, the extrusion portion can apply external force to the inflator pump so that the volume of the inflator pump is increased.

Preferably, the intake passage is opened and the exhaust passage is closed when the volume of the inflator increases, or the intake passage is closed and the exhaust passage is opened when the volume of the inflator decreases.

According to the invention, as the first damping mechanism, the second damping mechanism and the third damping mechanism which can be coupled with the bearing seat are adopted, in the process that the impact applied to the base body is transmitted to the bearing seat, the impact can be absorbed by at least one of the first damping mechanism, the second damping mechanism and the third damping mechanism. Therefore, the following beneficial effects are achieved: when base body receives the impact, the impact can be absorbed by third damper, second damper and first damper in proper order, through multistage damper, can improve the shock attenuation effect. Therefore, the radiating and damping base is good in damping effect.

Drawings

Fig. 1 is a schematic diagram of an internal structure of an embodiment of the present invention.

Reference numerals: the base comprises a base body 1, a bearing seat 2, a first damping mechanism 3, a second damping mechanism 4, a third damping mechanism 5, a hollow cavity 6, a sliding protrusion 7, a sliding groove 8, a first cavity 6a, a second cavity 6b, a first elastic body 4a, an installation plate 4b, a first inner wall 2a, a second inner wall 2b, a first telescopic rod 5a, a second telescopic rod 5b, a first rod body 9, a second rod body 10, a second elastic body 11, a sealing cover 12, a heat dissipation mechanism 13, an inflator 13a, an extrusion part 13b, an air inlet channel 13c, an exhaust channel 13d, a heat exchange part 13e, a buffering part 13f, a temperature sensor 14, a push rod motor 15, a through hole 16 and a controller 17.

Detailed Description

The technical solution of the present invention is further described in detail below with reference to the following detailed description and the accompanying drawings:

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