Low-voltage infrared electrothermal film and preparation method thereof

文档序号:1101781 发布日期:2020-09-25 浏览:15次 中文

阅读说明:本技术 一种低压红外电热膜及其制备方法 (Low-voltage infrared electrothermal film and preparation method thereof ) 是由 罗屹东 刘耀春 王国忠 李玉柱 魏巍 于 2020-06-29 设计创作,主要内容包括:本发明提供了一种低压红外电热膜及其制备方法,电热膜包括第一绝缘隔水层、第一导电层、辐射增强层以及第二绝缘隔水层,所述第一绝缘隔水层、所述第一导电层、所述辐射增强层以及所述第二绝缘隔水层依次连接,且所述第一导电层为导电石墨材料,所述辐射增强层包括氮化钛材料或碳化钛材料。制备得到的电热膜层间的粘合力优异,能长时间有效地保持电热膜的绝缘性和稳定性;并通过辐射增强层的设置,能有效提高红外发射效率以及防水性能,总体上制备的电热膜成本低,发热均匀,具有节能的优点。有效解决现有技术中电热膜制备工艺复杂、制备成本高、不能长时间有效的保持电热膜的绝缘性和稳定性以及红外发射率差、防水性差的问题。(The invention provides a low-voltage infrared electrothermal film and a preparation method thereof, wherein the electrothermal film comprises a first insulating water-resisting layer, a first conducting layer, a radiation enhancement layer and a second insulating water-resisting layer, wherein the first insulating water-resisting layer, the first conducting layer, the radiation enhancement layer and the second insulating water-resisting layer are sequentially connected, the first conducting layer is made of a conductive graphite material, and the radiation enhancement layer comprises a titanium nitride material or a titanium carbide material. The prepared electrothermal film has excellent interlayer adhesive force, and can effectively maintain the insulativity and stability of the electrothermal film for a long time; and through the setting of radiation enhancement layer, can effectively improve infrared emission efficiency and waterproof performance, the electric heat membrane of preparation on the whole is with low costs, and it is even to generate heat, has energy-conserving advantage. The problems that in the prior art, the preparation process of the electrothermal film is complex, the preparation cost is high, the insulativity and the stability of the electrothermal film can not be effectively maintained for a long time, the infrared emission rate is low, and the waterproofness is poor are effectively solved.)

1. The utility model provides a low pressure infrared electric heat membrane, its characterized in that, low pressure infrared electric heat membrane includes first insulating water barrier, first conducting layer, radiation enhancement layer and second insulating water barrier, first insulating water barrier first conducting layer the radiation enhancement layer and the second insulating water barrier connects gradually, just first conducting layer is the electrically conductive graphite material, the radiation enhancement layer includes titanium nitride material or titanium carbide material.

2. The low-voltage infrared electrothermal film according to claim 1, further comprising a second conductive layer disposed between the radiation enhancement layer and the second insulating and water-barrier layer, wherein the second conductive layer is a conductive graphite material.

3. The low-voltage infrared electrothermal film according to claim 1, wherein the titanium nitride material or the titanium carbide material is a nano-scale or micro-scale material.

4. A method of preparing an infrared electrothermal film according to any one of claims 1 to 3, comprising the steps of:

step 1: drying a water-proof material with the thickness of 10-500 mu m at 60-80 ℃ for 1-8h to obtain a first insulating water-proof layer and a second insulating water-proof layer;

step 2: attaching conductive ink to one surface of the first insulating and water-resisting layer to obtain a first conductive layer;

and step 3: attaching conductive ink to one surface of the second insulating and water-resisting layer to obtain a second conductive layer;

and 4, step 4: dispersing a titanium nitride material or a titanium carbide material in a mixed solution of liquid hot melt adhesive and PVB to obtain a mixture A;

and 5: the mixture A is attached to the first conducting layer and/or the second conducting layer through a spraying or blade coating process, and then is dried for 20-60min at the temperature of 60-100 ℃ to form the radiation enhancement layer;

step 6: and hot-pressing the materials of the first insulating water-resisting layer, the first conducting layer, the radiation enhancement layer, the second conducting layer and the second insulating water-resisting layer which are connected in sequence at the temperature of 100 ℃ and 150 ℃ to prepare the low-voltage infrared electrothermal film.

5. The method for preparing a low-voltage infrared electrothermal film according to claim 4, wherein the water-barrier material is a coiled material or a sheet material or a non-woven fabric obtained by using any one of PET, PP, nylon and HDPE as a base material.

6. The method for preparing a low-voltage infrared electrothermal film according to claim 4, wherein the method for attaching the conductive ink to one surface of the first insulating and water-proof layer comprises the following steps: and uniformly attaching the conductive ink to one surface of the first insulating water-proof layer by means of blade coating or printing, and drying at 80-130 ℃ for 1-60min to form a first conductive layer with the thickness of 10-200 mu m.

7. The method for preparing a low-voltage infrared electrothermal film according to claim 4, wherein the method for attaching the conductive ink to one surface of the second insulating and water-proof layer comprises the following steps: and uniformly attaching the conductive ink to one surface of the second insulating water-proof layer in a blade coating or printing mode, and drying at the temperature of 80-130 ℃ for 1-60min to form a second conductive layer with the thickness of 10-200 mu m.

8. The method for preparing a low-voltage infrared electrothermal film according to claim 4, wherein the particle size of the titanium nitride material or the titanium carbide material is 10nm to 20 μm.

9. The preparation method of the low-voltage infrared electrothermal film according to claim 4, wherein in the mixture A, the mass ratio of the titanium nitride material or the titanium carbide material to the mixed solution is 1-10%.

10. The method of claim 4 wherein the thickness of the radiation enhancement layer is 10-200 μm.

Technical Field

The invention relates to the field of material preparation, in particular to a low-voltage infrared electrothermal film and a preparation method thereof.

Background

The electrothermal film is a resistance film which converts electric energy into heat energy through joule effect, and the heat energy is mainly radiated to the space in an infrared ray form. The electrothermal film has the characteristics of high heat generation efficiency, high electrothermal safety, planar heat generation and the like, and is widely applied to the fields of floor heating, intelligent heating of fabrics, infrared physiotherapy, electrothermal antifogging and the like.

At present, the common infrared electrothermal film on the market is printed or coated with conductive ink on coiled materials, sheets or non-woven fabrics made of PET, PP, nylon and the like, and the conductive ink is introduced into conductive slurry to improve the conductivity and reduce the resistance, so that the heating efficiency is improved, and the cost is relatively high. Meanwhile, the adhesive force of the electric heating film is unstable, and the insulativity and the stability of the electric heating film cannot be effectively maintained for a long time. For example, patent No. CN111019541A discloses a protective film for an electrothermal film, in which a manufacturer of the electrothermal film only needs to print heating elements such as conductive ink on a common PET film by screen printing or gravure printing, but has the disadvantage of complex processing technology. For example, patent No. CN110903704A provides a conductive ink, a method for preparing the same, and an electrothermal film, which has a simple preparation process, and can ensure that the electrothermal film has a good electrothermal effect and a good bending property, but has a high cost.

In summary, in the field of preparation of low-voltage infrared electrothermal films, the problems of complex preparation process, high preparation cost, unstable adhesive force of the electrothermal film, incapability of effectively maintaining the insulativity and stability of the electrothermal film for a long time, poor infrared emissivity and poor waterproofness still exist.

Disclosure of Invention

The invention provides a low-voltage infrared electrothermal film and a preparation method thereof, and aims to solve the problems that the preparation process of the low-voltage infrared electrothermal film in the prior art is complex, the preparation cost is high, the insulativity and stability of the electrothermal film cannot be effectively maintained for a long time, and the infrared emissivity and the waterproofness are poor.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a low pressure infrared electric heat membrane, low pressure infrared electric heat membrane includes first insulating water barrier, first conducting layer, radiation enhancement layer and the insulating water barrier of second, first insulating water barrier first conducting layer radiation enhancement layer and the insulating water barrier of second connects gradually, just first conducting layer is the conductive graphite material, the radiation enhancement layer includes titanium nitride material or titanium carbide material.

Optionally, the low-voltage infrared electrothermal film further comprises a second conductive layer, the second conductive layer is arranged between the radiation enhancement layer and the second insulating water-resisting layer, and the second conductive layer is made of a conductive graphite material.

Optionally, the titanium nitride material or the titanium carbide material is a nano-scale or micro-scale material.

In addition, the invention also provides a method for the infrared electrothermal film, which comprises the following steps:

step 1: drying a water-proof material with the thickness of 10-500 mu m at 60-80 ℃ for 1-8h to obtain a first insulating water-proof layer and a second insulating water-proof layer;

step 2: attaching conductive ink to one surface of the first insulating and water-resisting layer to obtain a first conductive layer;

and step 3: attaching conductive ink to one surface of the second insulating and water-resisting layer to obtain a second conductive layer;

and 4, step 4: dispersing a titanium nitride material or a titanium carbide material in a mixed solution of liquid hot melt adhesive and PVB to obtain a mixture A;

and 5: the mixture A is attached to the first conducting layer and/or the second conducting layer through a spraying or blade coating process, and then is dried for 20-60min at the temperature of 60-100 ℃ to form the radiation enhancement layer;

step 6: and hot-pressing the materials of the first insulating water-resisting layer, the first conducting layer, the radiation enhancement layer, the second conducting layer and the second insulating water-resisting layer which are connected in sequence at the temperature of 100 ℃ and 150 ℃ to prepare the low-voltage infrared electrothermal film.

Optionally, the water-barrier material is a roll or sheet or non-woven fabric obtained by using any one of PET, PP, nylon and HDPE as a base material.

Optionally, the method for attaching the conductive ink to the first insulating and water-blocking layer includes: and uniformly attaching the conductive ink to one surface of the first insulating water-proof layer by means of blade coating or printing, and drying at 80-130 ℃ for 1-60min to form a first conductive layer with the thickness of 10-200 mu m.

Optionally, the method for attaching the conductive ink to one side of the second insulating and water-blocking layer includes: and uniformly attaching the conductive ink to one surface of the second insulating water-proof layer in a blade coating or printing mode, and drying at the temperature of 80-130 ℃ for 1-60min to form a second conductive layer with the thickness of 10-200 mu m.

Optionally, the particle size of the titanium nitride material or the titanium carbide material is 10nm-20 μm.

Optionally, in the mixture a, the mass ratio of the titanium nitride material or the titanium carbide material to the mixed solution is 1-10%.

Optionally, the thickness of the radiation enhancement layer is 10-200 μm.

Compared with the prior art, the invention has the beneficial technical effects that:

1. the low-voltage infrared electrothermal film prepared by the invention has simple preparation process, stable adhesive force among the prepared electrothermal film layers and capability of effectively keeping the insulativity and stability of the electrothermal film for a long time; in addition, the radiation enhancement layer arranged on the electrothermal film prepared in the invention can effectively absorb and reflect the infrared radiation of the first conducting layer and the second conducting layer, thereby effectively improving the infrared emission efficiency of the first conducting layer and the second conducting layer.

2. The radiation enhancement layer of the invention adopts the mixed solution of the liquid hot melt adhesive and the PVB as the base material, and disperses the nanometer or micron titanium nitride material or the nanometer or micron titanium carbide material in the base material, thereby not only having obvious infrared radiation absorption and reflection effects, but also further improving the waterproof performance of the low-voltage infrared electrothermal film, enhancing the service life of the electrothermal film, and simultaneously having positive effects of saving energy, reducing heat loss and reducing cost.

3. The low-voltage infrared electrothermal film has the advantages of simple structure, low processing cost, high heating rate, uniform heating, energy conservation and safety under the condition of low voltage (less than 36 v).

Drawings

The invention will be further understood from the following description in conjunction with the accompanying drawings.

FIG. 1 is a schematic view of a low-voltage infrared electrothermal film according to one embodiment of the present invention;

FIG. 2 is a schematic view of a low-voltage infrared electrothermal film according to one embodiment of the present invention;

FIG. 3 is an infrared radiation diagram of a low voltage infrared electrothermal film in accordance with one embodiment of the present invention;

fig. 4 is an infrared radiation pattern of a low-voltage infrared electrothermal film according to one comparative example of the present invention.

Description of reference numerals:

1-a first insulating and water-barrier layer; 2-a first conductive layer; 3-a radiation enhancement layer; 4-a second conductive layer; 5-a second insulating and water-barrier layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

The invention relates to a low-voltage infrared electrothermal film and a preparation method thereof, which are described in the following embodiments according to figures 1-4:

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