阅读说明：本技术 一种高粘结强度导热聚酯粘合剂及其制备方法 (High-bonding-strength heat-conducting polyester adhesive and preparation method thereof ) 是由 许辉 叶凤莲 尹建军 邵小雷 于 2020-08-04 设计创作，主要内容包括：本发明公开了一种高粘结强度导热聚酯粘合剂的制备方法：(1)制备粘合剂基体胶液：将聚酯树脂溶解在溶剂中,通过带加热的磁力搅拌均匀后得到粘合剂胶液；(2)在胶液中依次加入纳米玻璃纤维、醇类扩链剂、固化剂和无机导热材料,边加边搅拌至溶液混合均匀并稳定不发生沉降。通过以上制备方法得到的粘结剂,强度高、粘结层薄、导热性能好。(The invention discloses a preparation method of a high-bonding-strength heat-conducting polyester adhesive, which comprises the following steps: (1) preparing adhesive matrix glue solution: dissolving polyester resin in a solvent, and uniformly stirring by using magnetic force with heating to obtain an adhesive liquid; (2) and adding the nano glass fiber, the alcohol chain extender, the curing agent and the inorganic heat conduction material into the glue solution in sequence, and stirring while adding until the solution is uniformly mixed and stable without sedimentation. The adhesive prepared by the preparation method has high strength, thin adhesive layer and good heat-conducting property.)

1. A high-bonding-strength heat-conducting polyester adhesive and a preparation method thereof are characterized by being prepared by the following steps:

(1) preparing adhesive matrix glue solution: dissolving polyester resin in solvent, and heating by magnetic force

Stirring uniformly by a stirrer to obtain adhesive liquid;

wherein the mass ratio is as follows: 80-120 parts of polyester resin;

solvent 300-500 parts;

(2) preparation of the binder: adding nano glass fiber, alcohol chain extender, curing agent and inorganic heat conducting material into the glue solution in the step (1) in sequence, and stirring while adding until the solution is uniformly mixed and stable without sedimentation;

wherein the mass ratio is as follows: 0-10 parts of nano glass fiber;

2-15 parts of an alcohol chain extender;

2-8 parts of a curing agent;

inorganic heat conductive material: 30-80 parts.

2. A high bonding strength heat conductive polyester adhesive and a method for preparing the same according to claim 1, wherein: the solvent is one or more of ethyl acetate, butanone, toluene or xylene.

3. A high bonding strength heat conductive polyester adhesive and a method for preparing the same according to claim 1, wherein: the heating temperature is 50-90 ℃.

4. A high bonding strength heat conductive polyester adhesive and a method for preparing the same according to claim 1, wherein: the particle size of the nano glass fiber is 0.5-20 nm.

5. A high bonding strength heat conductive polyester adhesive and a method for preparing the same according to claim 1, wherein: the curing agent is isocyanate.

6. A high bonding strength heat conductive polyester adhesive and a method for preparing the same according to claim 1, wherein: the inorganic heat conduction material is one or more of boron nitride, silicon carbide and boron carbide.

7. A high bond strength, thermally conductive polyester adhesive as claimed in claim 1, wherein: the high-bonding-strength heat-conducting polyester adhesive has the bonding force of more than 2N/mm, the heat conductivity of more than 1.5W/m.K and the dry adhesive thickness of less than 50 um.

Technical Field

The invention relates to a preparation method of an adhesive, in particular to a preparation method of a high-bonding-strength heat-conducting adhesive

Background

In recent years, with the rapid increase of the variety and usage of electronic products, people pay more attention to the lightness and small portability of electronic products. High-density heat-generating electronic parts in electronic products constitute large-scale integrated circuits, and the heat dissipation performance of electronic components directly affects the stability and the service life of the whole electronic product, so that it is very important to develop an electronic component adhesive with high heat conductivity and adhesiveness.

Currently, as a heat conductive adhesive used for electronic and electric appliances, mainly, there are rubber type heat conductive adhesives, acrylic type heat conductive adhesives, silicone type heat conductive adhesives, epoxy type heat conductive adhesives, and the like. Patent CN104817985A discloses a heat-conducting adhesive, which comprises raw materials of a softening agent, a rubber toughening agent, a heat-conducting filler, a tackifier, an antioxidant and an aging agent, wherein the preparation method comprises the steps of sequentially adding the raw materials of the softening agent, the heat-conducting filler, the tackifier, the antioxidant and the aging agent, mixing at the temperature of 80-150 ℃, and mixing for 1-2 hours to obtain the heat-conducting adhesive. The patent CN200780019381.6 takes acrylic polymer as a substrate, heat conduction material expanded graphite powder and aluminum hydroxide are added, catalyst organic peroxide and organic monomer are subjected to thermal polymerization to obtain the heat conduction adhesive, the adhesive has heat conduction pressure sensitivity and good flame retardance, hardness and heat conductivity, but the preparation process is complex, the cost is high, and the adhesive is not suitable for electric appliances or electronic products using a large amount of adhesive. Patent CN104559904A invented a heat-conductive adhesive to prepare adhesive matrix glue: bisphenol A epoxy resin and phenolic resin are dissolved in acetone and are placed in a strong magnetic stirrer to be uniformly stirred to prepare adhesive matrix glue solution, and then the prepared nano silicon carbide, alumina and silicon dioxide solution are added into the glue solution, so that the prepared adhesive has good adhesive property, but has strict requirement on use time and is not beneficial to operation.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides the preparation method of the high-bonding-strength heat-conducting polyester adhesive, and the obtained adhesive has high bonding strength, thin bonding layer and good heat-conducting property.

In order to achieve the purpose, the invention adopts the technical scheme that:

a high-bonding-strength heat-conducting polyester adhesive and a preparation method thereof are characterized by being prepared by the following steps:

(1) preparing adhesive matrix glue solution: dissolving polyester resin in a solvent, and uniformly stirring the mixture by a magnetic stirrer with a heating function to obtain an adhesive liquid;

wherein the mass ratio is as follows: 80-120 parts of polyester resin;

solvent 300-500 parts;

(2) preparation of the binder: adding nano glass fiber, alcohol chain extender, curing agent and inorganic heat conducting material into the glue solution in the step (1) in sequence, and stirring while adding until the solution is uniformly mixed and stable without sedimentation;

wherein the mass ratio is as follows: 0-10 parts of nano glass fiber;

2-15 parts of an alcohol chain extender;

2-8 parts of a curing agent;

inorganic heat conductive material: 30-80 parts of a solvent;

preferably, the solvent is one or more of ethyl acetate, butanone, toluene or xylene.

Preferably, the heating temperature is 50-90 ℃.

Preferably, the particle size of the nano glass fiber is 0.5-20 nm.

Preferably, the curing agent is one or two of isocyanate and iso-dibutyl alcohol.

Preferably, the inorganic heat conducting material is one or more of boron nitride, silicon carbide and boron carbide.

Preferably, the high bonding strength heat-conducting polyester adhesive has the bonding force of >2N/mm, the heat conductivity of >1.5W/m.K and the dry glue thickness of <50 um.

The invention has the beneficial effects that:

(1) the invention adopts the polyester resin, has low price and good aging resistance, and does not need to add an aging additive;

(2) the nano glass fiber is added into the polyester viscose fiber, so that the pressure deformation resistance strength of the polyester viscose agent is enhanced, and the application of the polyester viscose agent in the electronic and electric appliance industries is initiated;

(3) the polyester adhesive prepared by the invention has high adhesion, good conductivity and thin adhesive layer.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION