阅读说明：本技术 一种机电设备生产用泵体成型冷却装置 (Pump body forming and cooling device for electromechanical equipment production ) 是由 郭守维 于 2020-05-18 设计创作，主要内容包括：本发明属于泵体冷却成型技术领域,尤其是一种机电设备生产用泵体成型冷却装置,针对传统泵体冷却成型装置大多结构较为简单,随着冷却成型作业的进行,冷却液的温度会慢慢升高,以影响成型效果问题,现提出以下方案,包括底部外壁四角焊接有支腿的主体,所述主体的一侧内壁焊接有U型板,且主体靠近U型板的一侧开有散热口,所述主体的顶端与U型板的相对一侧构成成型腔,且主体内底部与U型板的相对一侧构成冷却端,所述冷却端底端开有安装槽。本发明通过设置的导热板座、换热水道以及矩形支管之间相互配合,能够有效提高换热端与冷却液的接触面积,增加换热面积,从而提高对冷却液的制冷效果,保证该装置对泵体的冷却效果。(The invention belongs to the technical field of pump body cooling forming, in particular to a pump body forming cooling device for electromechanical equipment production, which aims at the problem that most traditional pump body cooling forming devices are simple in structure and the temperature of cooling liquid can be slowly increased along with the proceeding of cooling forming operation so as to influence the forming effect. According to the invention, the heat conducting plate seat, the heat exchange water channel and the rectangular branch pipe are matched with each other, so that the contact area between the heat exchange end and the cooling liquid can be effectively increased, the heat exchange area is increased, the refrigeration effect on the cooling liquid is improved, and the cooling effect of the device on the pump body is ensured.)

1. A pump body forming and cooling device for electromechanical equipment production comprises a main body (1) with supporting legs welded at four corners of the outer wall of the bottom, a U-shaped plate (13) welded on the inner wall of one side of the main body (1), and a heat dissipation port formed in one side, close to the U-shaped plate (13), of the main body (1), and is characterized in that a forming cavity is formed by the top end of the main body (1) and the opposite side of the U-shaped plate (13), a cooling end (6) is formed by the bottom in the main body (1) and the opposite side of the U-shaped plate (13), a mounting groove is formed in the bottom end of the cooling end (6), a heat conducting plate seat (4) is welded on the inner wall of the mounting groove, a semiconductor refrigerator (3) is fixed on the outer wall of the bottom of the heat conducting plate seat (4) through screws, a heat exchange end (2) is welded on the outer wall of, and the inner wall all around of heat transfer water course (19) has welded rectangle branch pipe (20), U template (13) inner wall constitutes heat dissipation chamber (12) with the relative one side of main part (1), air-cooled heat dissipation mechanism is installed to the inner wall in heat dissipation chamber (12), and air-cooled heat dissipation mechanism is including setting up in the bent pipe (16) of the heat dissipation of U template (13), the one end of U template (13) is passed through the bolt fastening and is had fan (5).

2. The pump body forming and cooling device for electromechanical equipment production according to claim 1, wherein mounting holes are formed in the opposite sides of the U-shaped plate (13) and the main body (1) and are distributed at equal intervals, and air inlet pipes (7) are fixedly mounted on the inner walls of the two corresponding mounting holes.

3. The pump body forming and cooling device for the electromechanical device production according to claim 2, wherein a second bucket-shaped end (14) is fixedly mounted on one side of the main body (1) close to the forming cavity, a second water pump (15) is fixedly connected to one side of the second bucket-shaped end (14), and an input end of the second water pump (15) is connected with the heat dissipation curved pipe (16).

4. The pump body forming and cooling device for the electromechanical device production according to claim 3, wherein the circumferential outer wall of the heat dissipation curved pipe (16) is provided with wind grooves (21) which are distributed annularly at equal intervals, and the connecting pipe (18) is installed on the opposite side of one end of the heat dissipation curved pipe (16) away from the second water pump (15) and the main body (1).

5. The pump body forming and cooling device for electromechanical equipment production according to claim 1, wherein the cooling end of the semiconductor cooler (3) is in contact with the heat conducting plate seat (4).

6. The pump body forming and cooling device for the electromechanical device production according to claim 1, wherein a partition plate (9) is welded to one end of the main body (1) close to the forming cavity and the side opposite to the U-shaped plate (13).

7. The pump body forming and cooling device for the electromechanical device production is characterized in that a first bucket-shaped end (10) is fixedly installed on the partition plate (9), and a first water pump (11) is fixedly installed on the opposite side of the first bucket-shaped end (10) and the forming cavity.

8. The pump body forming and cooling device for the electromechanical device production according to claim 1, wherein a fixing mesh plate (17) is fixedly mounted on the inner wall of the heat dissipation port.

9. The pump body forming and cooling device for the electromechanical device production according to claim 1, wherein a filtering port is installed on one side of the main body (1) close to the air inlet pipe (7), and a hinged screen plate (8) is connected to the inner wall of the top end of the filtering port through a hinge.

10. The pump body forming and cooling device for electromechanical equipment production according to claim 1, wherein connecting pieces (23) are welded to the outer wall of one side of each rectangular branch pipe (20), and two to three annular rings (22) are welded to the end portions of the corresponding connecting pieces (23).

Technical Field

The invention relates to the technical field of pump body cooling forming, in particular to a pump body forming cooling device for electromechanical equipment production.

Background

The electromechanical equipment generally refers to machinery, electrical equipment and electrical automation equipment, and in a building, the electromechanical equipment is generally called machinery and pipeline equipment except for earthwork, carpentry, reinforcing steel bars and muddy water. With the continuous improvement of the living standard of people, people have more and more demands on electromechanical equipment in daily life, and the electromechanical equipment from vehicles to various household appliances, computers, printers and the like becomes indispensable electromechanical products in the life of people. The advanced electromechanical equipment can greatly improve the labor productivity, reduce the labor intensity, improve the production environment, complete the work which can not be completed by manpower, and has direct and important influence on the development of the whole national economy and the improvement of the science and technology and national defense strength. The pump is also an important basic electromechanical device, and in the production process of the pump, a pump body needs to be immersed in water for cooling quenching forming, and then a cooling forming device is needed.

For example, the chinese patent application No. CN2018206937346 discloses a cooling device for a large pump head forging, which comprises a cooling pool and steps, wherein the steps are fixedly connected to the tops of two sides of the cooling pool, a rail groove is fixedly arranged at the bottom of the inner cavity wall of the cooling pool, a gantry crane is movably arranged at the top of the rail groove, and a first motor is fixedly arranged at the bottom of one end of the gantry crane. But the solution design that above-mentioned patent to the temperature of coolant liquid can slowly rise the problem is comparatively simple, and thermal effluvium efficiency is not high, and the whole decline temperature of coolant liquid is lower, has certain limitation.

Disclosure of Invention

Based on the technical problem that most of traditional pump body cooling and forming devices are simple in structure, and the temperature of cooling liquid can be gradually increased along with the proceeding of cooling and forming operation so as to influence the forming effect, the invention provides a pump body forming and cooling device for electromechanical equipment production.

The invention provides a pump body forming and cooling device for electromechanical equipment production, which comprises a main body, wherein supporting legs are welded at four corners of the outer wall of the bottom of the main body, a U-shaped plate is welded on the inner wall of one side of the main body, a heat radiating opening is formed in one side, close to the U-shaped plate, of the main body, a forming cavity is formed at the top end of the main body and opposite to the U-shaped plate, a cooling end is formed at the bottom of the main body and opposite to the U-shaped plate, a mounting groove is formed at the bottom end of the cooling end, a heat conducting plate seat is welded on the inner wall of the mounting groove, a semiconductor refrigerator is fixed on the outer wall of the bottom of the heat conducting plate seat through screws, a heat exchanging end is welded on the outer wall of the top of the heat conducting plate seat, heat exchanging water channels distributed at equal intervals are formed at the heat exchanging end, and the air-cooled heat dissipation mechanism comprises a heat dissipation curved pipe arranged on the U-shaped plate, and one end of the U-shaped plate is fixed with a fan through a bolt.

Preferably, the relative one side of U template and main part all opens the mounting hole that has the equidistance and distributes, and corresponds the equal fixed mounting of inner wall of two mounting holes and have the intake pipe.

Preferably, one side fixed mounting that the main part is close to the shaping chamber has bucket shape end two, and one side fixedly connected with water pump two of bucket shape end two, the input of water pump two is connected with the curved tube that dispels the heat.

Preferably, the circumference outer wall of heat dissipation bent pipe all is provided with the wind groove that the equidistance annular distributes, and the heat dissipation bent pipe is kept away from the one end of water pump two and is installed the connecting pipe with the relative one side of main part.

Preferably, the refrigerating end of the semiconductor refrigerator is in contact with the heat conducting plate seat.

Preferably, a partition plate is welded at one end of the main body close to the forming cavity and at the side opposite to the U-shaped plate.

Preferably, the first hopper-shaped end is fixedly installed on the partition plate, and a first water pump is fixedly installed on one side, opposite to the forming cavity, of the first hopper-shaped end.

Preferably, a fixed screen is fixedly installed on the inner wall of the heat dissipation opening.

Preferably, a filtering opening is installed on one side of the main body close to the air inlet pipe, and a hinged screen plate is connected to the inner wall of the top end of the filtering opening through a hinge.

Preferably, the connecting pieces are welded on the outer wall of one side of each rectangular branch pipe, and two to three annular rings are welded on the end portions of the corresponding connecting pieces.

The beneficial effects of the invention are as follows:

1. this pump body shaping cooling device is used in electromechanical device production, U-shaped board cooperation main part, water pump one and water pump two through the setting make the coolant liquid in the shaping intracavity pass through forced air cooling heat dissipation mechanism and cooling end in proper order for the shaping chamber can in time let in the forced air cooling heat dissipation mechanism with the heat that the pump body shaping was effused, and the coolant liquid after the cooling is constantly supplied to, with the shaping efficiency of effectively guaranteeing the device.

2. This pump body shaping cooling device is used in electromechanical device production mutually supports between heat conduction plate seat, heat transfer water course and the rectangle branch pipe through setting up, can effectively improve the area of contact of heat transfer end and coolant liquid, increases heat transfer area to improve the refrigeration effect to the coolant liquid, guarantee the cooling effect of the device to the pump body.

3. This pump body shaping cooling device is used in electromechanical device production runs through the intake pipe of inserting the cooling end through the setting, can utilize the coolant liquid after the cooling to cool down the processing to the air to the setting of cooperation wind channel, through the surface area that increases the curved pipe of heat dissipation, effectively improves its cold wind radiating effect.

4. According to the pump body forming and cooling device for electromechanical equipment production, the hinged screen plate and the fixed screen plate can effectively prevent external dust from being attached to the air inlet pipe and the radiating curved pipe, so that the heat exchange effect of the air inlet pipe and the radiating curved pipe is effectively ensured, and the heat radiating performance is ensured; through the connecting piece and the annular ring that set up, can further improve the area of heat transfer of contact of heat transfer end and coolant liquid to further improve the refrigeration effect to the coolant liquid.

The parts of the device not involved are the same as or can be implemented using prior art.

Drawings

FIG. 1 is a schematic view of the overall structure of a pump body forming and cooling device for the production of electromechanical equipment according to the present invention;

FIG. 2 is a schematic view of a partial three-dimensional structure of a heat exchange end of the pump body forming and cooling device for electromechanical device production according to the present invention;

FIG. 3 is a schematic cross-sectional view of a heat dissipation curved tube of the pump body forming and cooling device for electromechanical device production according to the present invention;

FIG. 4 is a schematic structural view of a half cross-sectional view of a main body of a pump body forming and cooling device for electromechanical device production according to the present invention;

fig. 5 is a schematic view of a partial structure of a heat exchange end of embodiment 2 of the pump body forming and cooling device for electromechanical device production according to the present invention.

In the figure: the heat-exchanging water-cooling heat-radiating structure comprises a main body 1, a heat-exchanging end 2, a semiconductor refrigerator 3, a heat-conducting plate seat 4, a fan 5, a cooling end 6, an air inlet pipe 7, a hinged screen plate 8, a partition plate 9, a hopper-shaped end I10, a water pump I11, a heat-radiating cavity 12, a U-shaped plate 13, a hopper-shaped end II 14, a water pump II 15, a heat-radiating curved pipe 16, a fixed screen plate 17, a connecting pipe 18, a heat-exchanging water channel 19, a rectangular branch pipe 20, an air groove 21.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.