阅读说明：本技术 一种硅片清洗用的承载料框 (Bearing material frame for cleaning silicon wafer ) 是由 徐俊 于 2020-07-31 设计创作，主要内容包括：本发明公开了一种硅片清洗用的承载料框,包括矩形的盒体,盒体的右侧壁上成型有若干道水平的右出料槽,盒体的左侧壁上成型有与右出料槽相错位的左出料槽,盒体右侧的外壁上成型有右导向外框,右出料槽分布在右导向外框的内侧,所述盒体左侧的外壁上成型有左导向外框,左出料槽分布在左导向外框的内侧；所述左导向外框或右导向外框均插接有竖直的挡料条,挡料条的上端伸出左导向外框或右导向外框螺接有螺钉,螺钉抵靠在盒体的两侧外壁上；所盒体的上部插接有水平的挡料板。(The invention discloses a bearing material frame for cleaning silicon wafers, which comprises a rectangular box body, wherein a plurality of horizontal right discharge grooves are formed in the right side wall of the box body, a left discharge groove staggered with the right discharge groove is formed in the left side wall of the box body, a right guide outer frame is formed on the outer wall of the right side of the box body, the right discharge grooves are distributed on the inner side of the right guide outer frame, a left guide outer frame is formed on the outer wall of the left side of the box body, and the left discharge grooves are distributed on the inner side of the left guide outer frame; the left guide outer frame or the right guide outer frame is inserted with a vertical material blocking strip, the upper end of the material blocking strip extends out of the left guide outer frame or the right guide outer frame and is in threaded connection with a screw, and the screw abuts against the outer walls of the two sides of the box body; the upper part of the box body is inserted with a horizontal material baffle.)

1. The utility model provides a silicon chip washs bearing material frame of usefulness, includes framework (1) of rectangle, and the shaping has a plurality of fore-and-aft baffles (11) on the inner wall of framework (1) front and rear side, and the shaping has slot (12), its characterized in that between baffle (11): rectangular cutting grooves (13) are formed in the front side and the rear side of the lower end of the frame body (1), inserting seats (14) are formed between the cutting grooves (13), a plurality of transverse magnetic bearing rods (2) are inserted into the inserting seats (14), the magnetic bearing rods (2) are distributed between partition plates (11) on the front side and the rear side of the frame body (1), one end of each magnetic bearing rod (2) penetrates through the frame body (1) and is attracted to each permanent magnet block (3), each permanent magnet block (3) is fixed on the outer wall of the frame body (1), the other end of each magnetic bearing rod (2) penetrates through the frame body (1) and is fixed on a connecting rod (4), and a T-shaped lifting handle (41) is formed on each connecting rod (4);

a groove (15) opposite to the plug socket (14) is formed in the upper end face of the frame body (1), inclined clamping grooves (17) are formed in the partition plates (11) opposite to the front side and the rear side of the frame body (1), and a liquid discharge groove (16) communicated with the clamping grooves (17) is formed in the side wall of one side of the frame body (1); and an adhesive tape (5) with an isosceles trapezoid-shaped section is fixedly inserted into the clamping groove (17) of the frame body (1), and two side walls of the partition board (11) are exposed from two sides of the adhesive tape (5).

2. The carrier frame according to claim 1, wherein: the partition plates (11) are linearly and uniformly distributed in the frame body (1).

3. The carrier frame according to claim 1, wherein: the liquid discharge groove (16) on the frame body (1) is a chute, the end, communicated with the clamping groove (17), of the liquid discharge groove (16) is the bottom end of the clamping groove (17), and the liquid discharge groove (16) penetrates through the inner wall of the frame body (1).

4. The carrier frame according to claim 1, wherein: an inclined feeding groove (18) is formed on the upper side edge of the front end of the frame body (1).

5. The carrier frame according to claim 1, wherein: the distance from the upper bottom surface of the upper cutting groove (13) of the frame body (1) to the lower end surface of the frame body (1) is not more than the depth of the groove (15) on the frame body (1), and the width of the groove (15) is equal to the distance between the front cutting groove (13) and the rear cutting groove (13) of the frame body (1).

6. The carrier frame according to claim 1, wherein: a core strip (6) is embedded in the rubber strip (5), one end of the rubber strip (5) is inserted into the inner wall of the frame body (1), and the other end of the rubber strip (5) is inserted into the liquid discharge groove (16).

7. The carrier frame according to claim 1, wherein: pull rings (7) are fixed on two side walls of the frame body (1), and the pull rings (7) are distributed on the outer sides of the grooves (15).

Technical Field

The invention relates to the technical field of semiconductor cleaning machines, in particular to a bearing material frame for cleaning a silicon wafer.

Background

The integrated circuit chip made of the silicon chip is a conventional semiconductor product, and the silicon chip needs to be cleaned before the integrated circuit chip is made. The existing silicon wafer cleaning is firstly put into a liquid medicine tank for surface chemical treatment, and then is put into a cleaning tank (adopting pure water for cleaning, also called as a pure water tank) to clean the liquid medicine adhered to the surface. The specific cleaning method is to arrange the silicon wafer on a material frame bearing the silicon wafer, soak the material frame bearing the silicon wafer in a liquid medicine tank, lift the material frame, drain, and then put the material frame in a pure water tank for soaking and cleaning. Because more liquid medicine is adhered to the surface of the silicon wafer, the existing material frame does not have a structure for quickly eliminating the liquid medicine adhered to the surface of the silicon wafer, so that long time is usually consumed for draining to eliminate the liquid medicine adhered to the surface of the silicon wafer; therefore, the material frame needs to be improved so as to save time consumed by draining.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides a bearing material frame for cleaning a silicon wafer.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

a bearing material frame for cleaning a silicon wafer comprises a rectangular frame body, wherein a plurality of longitudinal partition plates are formed on the inner walls of the front side and the rear side of the frame body, slots are formed between the partition plates, rectangular cutting grooves are formed on the front side and the rear side of the lower end of the frame body, inserting seats are formed between the cutting grooves, a plurality of transverse magnetic bearing rods are inserted into the inserting seats, the magnetic bearing rods are distributed between the partition plates on the front side and the rear side of the frame body, one ends of the magnetic bearing rods penetrate through the frame body and are attracted to permanent magnet blocks, the permanent magnet blocks are fixed on the outer wall of the frame body, the other ends of the magnetic bearing rods penetrate through the frame body and are fixed on a connecting rod, and a T-shaped handle is formed on;

a groove opposite to the plug socket is formed on the upper end surface of the frame body, inclined clamping grooves are formed on the partition plates opposite to the front side and the rear side of the frame body, and a liquid discharge groove communicated with the clamping grooves is formed on the side wall of one side of the frame body; and adhesive tapes with isosceles trapezoid cross sections are fixedly inserted into the clamping grooves of the frame body, and two side walls of the partition plates are exposed from two sides of each adhesive tape.

Preferably, the partition plates are linearly and uniformly distributed in the frame body.

Preferably, the liquid discharge groove on the frame body is a chute, one end of the liquid discharge groove communicated with the clamping groove is the bottom end of the clamping groove, and the liquid discharge groove penetrates through the inner wall of the frame body.

Preferably, an inclined feeding groove is formed on the upper side edge of the front end of the frame body.

Preferably, the distance from the upper bottom surface of the cutting groove on the frame body to the lower end surface of the frame body is not more than the depth of the groove on the frame body, and the width of the groove is equal to the distance between the cutting grooves on the front side and the rear side of the frame body.

Preferably, a core strip is embedded in the rubber strip, one end of the rubber strip is inserted into the inner wall of the frame body, and the other end of the rubber strip is inserted into the liquid discharge groove.

Preferably, pull rings are fixed on two side walls of the frame body and distributed on the outer sides of the grooves.

The invention has the beneficial effects that: the liquid medicine on the surface of the silicon wafer is further removed by the material bearing frame, so that the draining time can be shortened, and the cleaning efficiency is improved.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is a schematic view of a half-section structure of the present invention.

In the figure: 1. a box body; 11. a partition plate; 12. a slot; 13. grooving; 14. a socket; 15. a groove; 16. a liquid discharge tank; 17. a card slot; 18. a feed chute; 2. a magnetic support rod; 3. permanent magnet blocks; 4. a connecting rod; 41. a handle; 5. an adhesive tape; 6. a core bar; 7. and (4) a pull ring.

Detailed Description