阅读说明：本技术 金属基底的腐蚀防护 (Corrosion protection of metal substrates ) 是由 威廉·韦佛 马修·大卫·夏普 加文·约翰逊 于 2019-02-06 设计创作，主要内容包括：本发明公开了一种适用于涂覆易受腐蚀的金属基底的组合物,其中该组合物包括载体介质和石墨烯薄片,其中石墨烯薄片占涂层总重的0.002wt％～0.09wt％,且石墨烯薄片包括石墨烯纳米片、双层石墨烯纳米片、少层(few-layer)石墨烯纳米片和/或石墨薄片中的一种或两种及以上的混合物,其中石墨薄片具有纳米级尺寸和25层或更少的层数。(The invention discloses a composition suitable for coating a metal substrate susceptible to corrosion, wherein the composition comprises a support medium and graphene flakes, wherein the graphene flakes comprise 0.002 wt% to 0.09 wt% of the total weight of the coating, and the graphene flakes comprise one or a mixture of two or more of graphene nanoplatelets, bi-layer graphene nanoplatelets, few-layer (few-layer) graphene nanoplatelets and/or graphite flakes, wherein the graphite flakes have a nanoscale size and a number of layers of 25 or less.)

1. A composition suitable for coating a metal substrate susceptible to corrosion, wherein the composition comprises a support medium and graphene flakes, wherein the graphene flakes comprise from 0.002 wt% to 0.09 wt% of the total weight of the coating, and the graphene flakes comprise one or a mixture of two or more of graphene nanoplatelets, bi-layer graphene nanoplatelets, few-layer (few-layer) graphene nanoplatelets and/or graphite flakes, wherein the graphite flakes have a nanoscale size and a number of layers of 25 or less.

2. The composition of claim 1, wherein the graphene platelets comprise 0.002 wt% to 0.004 wt% of the total weight of the coating, 0.0026 wt% to 0.04 wt% of the total weight of the coating, 0.0026 wt% to 0.0035 wt% of the total weight of the coating, 0.006 wt% to 0.009 wt% of the total weight of the coating, about 0.003 wt% of the total weight of the coating, or about 0.03 wt% of the total weight of the coating.

3. The composition of claim 1 or 2, wherein the bulk density of the graphene flakes is sufficiently low such that a majority of the graphene flakes do not come into physical contact with any other graphene flakes.

4. A composition according to any one of claims 1 to 3, wherein the bulk density of the graphene flakes is sufficiently low that a majority of the graphene flakes do not make electrical contact with any other graphene flakes.

5. The composition of any one of claims 1 to 4, wherein the graphene flakes have a D50 particle size distribution of less than 30 μm, less than 20 μm, or less than 15 μm.

6. The composition of any one of claims 1 to 5, wherein more than 50% of the graphene platelets have a conductivity greater than about 2.15 × 10 at 20 ℃⁷S/m。

7. The composition of any one of claims 1 to 6, wherein more than 50% of the graphene platelets have a conductivity greater than about 3.5 × 10 at 20 ℃⁷S/m。

8. The composition of any one of claims 1 to 7, wherein at least 50 wt% of the graphene platelets comprise graphite platelets having a nanoscale size and 25 or fewer layers.

9. The composition of any one of claims 1 to 8, wherein the carrier medium is an insulator.

10. The composition of any of claims 1 to 9, wherein the carrier medium is selected from the group consisting of crosslinked resins, non-crosslinked resins, thermosetting acrylic resins, aminoplasts, urethanes, polyesters, epoxy resins, silicones, polyureas, silicates, polydimethylsiloxanes, and mixtures and combinations thereof.

11. The composition of any one of claims 1 to 10, wherein the carrier medium has plastic deformability once set/cured.

12. The composition of any one of claims 1-11, wherein the composition further comprises a solvent.

13. The composition of any one of claims 1 to 12, wherein the composition further comprises a dispersant.

14. A coating system for a metal substrate susceptible to corrosion, comprising a first coating layer formed on the metal substrate, and a second coating layer subsequently formed on the first coating layer, wherein the first coating layer comprises a composition according to any one of claims 1 to 13, and the second coating layer is formed from a second composition comprising a carrier medium and 2D material/graphite flakes, wherein the 2D material/graphite flakes comprise more than 0.1 wt% of the total weight of the second composition.

15. The coating system of claim 14, wherein the 2D material/graphite flakes of the second composition comprise one or a mixture of two or more of: graphene, graphene oxide, reduced graphene oxide nanoplatelets, hexagonal boron nitride, molybdenum disulfide, tungsten diselenide, silylene, germanene, graphdyne, borreliyne, phosphene, graphene oxide, reduced graphene oxide nanoplatelets, hexagonal boron nitride, molybdenum disulfide, tungsten diselenide, silylene, germanene, graphdyne, borreliene, phosphene, two or more 2D in-plane heterostructures, bi-layer graphene oxide, bi-layer reduced graphene oxide nanoplatelets, few-layer (few-layer) graphene, few-layer graphene oxide, few-layer reduced graphene oxide nanoplatelets, graphite, layered hexagonal boron nitride (hBN), molybdenum disulfide (MoS), and the like₂) Tungsten diselenide (WSe)₂) Silicon (Si), germanium (Ge), graphene (C), boron graphene (B), phosphorus graphene (P) and/or 2D vertical heterostructures of two or more of the foregoing materials, wherein the graphite flakes have a nanoscale size and a number of layers of 25 or less.

16. The coating system of claim 14 or 15, wherein the 2D material/graphite flakes of the second composition comprise 0.1 wt% to 20 wt% of the total weight of the coating, 0.1 wt% to 6.0 wt% of the total weight of the coating, or 0.1 wt% to 0.5 wt% of the total weight of the coating.

17. The coating system of any one of claims 14 to 16, wherein the electrical conductivity of more than 50% of the 2D material/graphite flake of the second coating is less than the electrical conductivity of more than 50% of the graphene flake of the first coating.

18. The coating system of any one of claims 14 to 17, wherein more than 50% of the 2D material/graphite flakes of the second composition have an electrical conductivity of about 2.0 × 10 or less at 20 ℃^-5S/m。

19. A method of treating a metal substrate, wherein the substrate is coated with the composition of any one of claims 1 to 13.

20. A method of treating a metal substrate, wherein the substrate is treated using the system of any one of claims 14 to 18.

21. The treatment process of claim 19 or 20, wherein the substrate is aluminum, an aluminum alloy, or a magnesium-based alloy.