阅读说明：本技术 一种硬脆复杂结构无主轴多极伺服研抛装置及研抛方法 (Hard and brittle complex structure spindle-free multi-polar servo polishing device and polishing method ) 是由 朱吴乐 韩放 居冰峰 孙安玉 陈诚 武璐 龚金禄 刘钧 于 2021-06-11 设计创作，主要内容包括：本发明公开了一种硬脆复杂结构无主轴多极伺服研抛装置及研抛方法,本发明通过X轴平移运动台、Z轴平移运动台、C轴工件转台和压电陶瓷C配合,实现平面螺旋加工轨迹,压电陶瓷C的微运动可以精确控制刀具的位置,实现复杂面形工件的微纳形貌追踪；通过压电陶瓷A、B的配合,刀具可以实现替代主轴功能,形成无主轴圆周旋转轨迹,并且可以在延性域加工工件,避免脆性断裂,提高面形质量。(The invention discloses a hard and brittle complex structure spindle-free multi-pole servo grinding and polishing device and a grinding and polishing method, wherein a plane spiral processing track is realized by matching an X-axis translation motion table, a Z-axis translation motion table, a C-axis workpiece turntable and a piezoelectric ceramic C, the micro-motion of the piezoelectric ceramic C can accurately control the position of a cutter, and the micro-nano topography tracking of a complex surface-shaped workpiece is realized; through the cooperation of piezoceramics A, B, the cutter can realize replacing the main shaft function, forms no main shaft circumference rotation orbit to can avoid brittle fracture at the work piece of ductility domain processing, improve the shape of face quality.)

1. A hard and brittle complex structure does not have multipolar servo polishing device of main shaft which characterized in that: the device comprises a non-main-shaft cutter mechanism (101), a vacuum adsorption disc (103), a workpiece rotary table (104), an X-axis translational motion table (106), a rack (107), a Z-axis translational motion table (108), a bottom adapter (109), a height adjuster (110), an adapter plate (111) and a height fine-adjusting piece (112);

the non-main-shaft cutter mechanism (101) is installed on a height fine-adjustment piece (112), the height fine-adjustment piece (112) is installed on an adapter plate (111), the adapter plate is installed on a height adjuster (110), the height adjuster (110) is installed on a bottom adapter (109), the bottom adapter (109) is installed on a Z-axis translational motion table (108), and the Z-axis translational motion table is installed on a rack; the vacuum adsorption disc is arranged on a workpiece rotary table, the workpiece rotary table is arranged on an X-axis motion platform through a support, and the X-axis motion platform is arranged on the rack;

the non-main-shaft cutter mechanism comprises a cutter head (201), a cutter head fixing frame (202), piezoelectric ceramics A (203), piezoelectric ceramics B (204), a gasket (205), a cutter frame (206), a flexible hinge (207), an end effector (208), piezoelectric ceramics C (209), an inner shaft (210), an end cover (211) and a displacement sensor (212);

the tool bit (201) is installed on a tool bit fixing frame (202), the tool bit fixing frame is fixedly arranged on piezoelectric ceramic A (203), the piezoelectric ceramic A is fixedly arranged on piezoelectric ceramic B (204), the piezoelectric ceramic B is fixedly arranged on a gasket (205), the gasket is fixedly arranged on a tool rest (206), the tool rest is fixedly connected with an end effector (208), and the end effector (208) is formed by integrally processing solid steel blocks and comprises fixing frames, flexible hinges (207) and execution blocks on the left side and the right side; the end effector (208) is connected with the fixing frame through a flexible hinge (207), the piezoelectric ceramic C (209) is a hollow cylinder, a hollow inner shaft (210) is arranged in the piezoelectric ceramic C (209), the outer diameter of the inner shaft is equal to the inner diameter of the piezoelectric ceramic C, a displacement sensor (212) is arranged between one end of the inner shaft and the end effector (208), the other end of the inner shaft is provided with an end cover, and the end cover is fixedly arranged on the fixing frame.

2. The hard, brittle, complex structured spindle-less multipole servo lapping and polishing device of claim 1, wherein: the flexible hinge is a straight round flexible hinge.

3. The hard, brittle, complex structured spindle-less multipole servo lapping and polishing device of claim 1, wherein: the tool bit fixing frame (202), the piezoelectric ceramics A (203) and the piezoelectric ceramics B (204) are fixed through glue.

4. The hard, brittle, complex structured spindle-less multipole servo lapping and polishing device of claim 1, wherein:

the integral rigidity of the cutter mechanism without the main shaft is 10N/mum-200N/mum, so that resonance of the device in the working process is avoided; the stroke of the X translation motion platform is 100cm, and the stroke of the Z-axis translation motion platform is 30 cm; the piezoelectric ceramic C vibrates at low frequency, the frequency is 0-200Hz, the micro-motion is carried out along the Z-axis direction, and the stroke is 0-1000 μm.

5. The hard, brittle, complex-structured spindle-less multipole servo lapping and polishing device of claim 1, wherein:

the piezoelectric ceramic A, B vibrates in high frequency with the frequency of 1kHz-100kHz, the piezoelectric ceramic A realizes shearing micro-motion along the X-axis direction under the voltage excitation, the piezoelectric ceramic B realizes micro-motion along the Y-axis direction under the voltage excitation, the vibration amplitude of the two piezoelectric ceramics is 5-50 μm, and the equivalent rotating speed is adjustable within the interval of 0-3000 rpm.

6. The grinding and polishing method of the hard and brittle complex structure spindle-free multi-pole servo grinding and polishing device as claimed in claim 1, characterized in that:

the first-stage servo control is realized by an X-axis translation motion table, a Z-axis translation motion table, a workpiece rotary table and piezoelectric ceramics C; the workpiece is fixed on a vacuum adsorption disc of a workpiece rotary table, the workpiece rotary table drives the vacuum adsorption disc to rotate, a plane spiral machining track is formed by matching with an X-axis translation motion table, and a cutter machines the workpiece at any position in an XY plane; the Z-axis translation motion table controls the feeding of a cutter to form a basic low-frequency profile of a workpiece; the rotation signal of the vacuum adsorption disc is subdivided by an encoder, and the pulse signal triggers the piezoelectric ceramic C to generate micro motion to form a complex contour of a processed workpiece, so that the micro-nano topography tracking of the workpiece is realized;

the second-stage servo control is realized by piezoelectric ceramic A and piezoelectric ceramic B; the phase difference of the driving voltages of the piezoelectric ceramics A and the piezoelectric ceramics B is controlled to be pi/2, so that the tool bit circularly rotates in an XY plane without a spindle, and the function of replacing the spindle is realized; meanwhile, the overlapping of circular rotating motion tracks of the main shaft is avoided, so that the tool can process the workpiece in a ductility area, and the depth of the material removed by grinding is less than the critical depth.

7. The grinding and polishing method of the hard and brittle complex structure spindle-free multi-pole servo grinding and polishing device as claimed in claim 6, characterized in that: the integral rigidity of the cutter mechanism without the main shaft is 10N/mum-200N/mum, so that resonance of the device in the working process is avoided; the stroke of the X translation motion platform is 100cm, and the stroke of the Z-axis translation motion platform is 30 cm; the piezoelectric ceramic C vibrates at low frequency, the frequency is 0-200Hz, the micro-motion is carried out along the Z-axis direction, and the stroke is 0-1000 μm.

8. The grinding and polishing method of the hard and brittle complex structure spindle-free multi-pole servo grinding and polishing device as claimed in claim 6, characterized in that: the piezoelectric ceramic A, B vibrates in high frequency with the frequency of 1kHz-100kHz, the piezoelectric ceramic A realizes shearing micro-motion along the X-axis direction under the voltage excitation, the piezoelectric ceramic B realizes micro-motion along the Y-axis direction under the voltage excitation, the vibration amplitude of the two piezoelectric ceramics is 5-50 μm, and the equivalent rotating speed is adjustable within the interval of 0-3000 rpm.

Technical Field

The invention belongs to the field of ultra-precision grinding and polishing, and particularly relates to a hard and brittle complex-structure spindle-free multi-pole servo grinding and polishing device and a grinding and polishing method.

Background

The hard and brittle material is widely favored due to the unique performance, but because the difficulty of processing the hard and brittle material is high, and along with the development of the fields of optics, microelectronics and the like, the requirement of people on the micro-nano structure with the complex surface shape of the hard and brittle material is increasingly increased, and how to process the hard and brittle material with the micro-nano structure becomes the urgent task of the processing industry;

the scholars propose a series of methods for improving the processing of hard and brittle materials, for example, Peng et al adopt 21.9kHz ultrasonic vibration to assist processing, and the elliptical vibration between crystal grains and a workpiece eliminates peaks on the processing surface and reduces the surface roughness; wang et al proposed a rotational ultrasonic machining method and verified that the introduction of vibration can improve the machining quality; however, the methods all need a spindle which rotates rapidly, the spindle can increase the complexity and load of the mechanism, and the overall control difficulty is improved, so that the development of a system which does not use a high-speed spindle is significant;

therefore, a hard and brittle complex structure spindle-free multi-stage servo polishing method is provided: the X-axis translation motion table, the Z-axis translation motion table, the C-axis workpiece turntable and the piezoelectric ceramic C are matched to realize a plane spiral processing track, the position of a cutter can be accurately controlled by the micro motion of the piezoelectric ceramic C, and the micro-nano morphology tracking of a workpiece with a complex surface shape is realized; through the matching of the piezoelectric ceramics A, B, the cutter can realize the function of replacing a main shaft, form a circular rotating track without the main shaft, process a workpiece in a ductile region, avoid brittle fracture and improve the surface shape quality;

disclosure of Invention

The invention provides a hard and brittle complex structure spindle-free multi-polar servo polishing device and a polishing method aiming at the defects of the prior art.

The X-axis translation motion table, the Z-axis translation motion table, the C-axis workpiece rotary table and the piezoelectric ceramic C are matched to realize a plane spiral machining track, the position of a cutter is accurately controlled by the micro-motion of the piezoelectric ceramic C, and the micro-nano morphology tracking of the workpiece with the complex surface shape is realized; through the matching of the piezoelectric ceramics A, B, the cutter can realize the function of replacing a main shaft, form a circular rotating track without the main shaft, process a workpiece in a ductile region, avoid brittle fracture and improve the surface shape quality;

in order to achieve the purpose, the technical scheme of the invention is as follows:

a hard and brittle complex structure spindle-free multi-polar servo grinding and polishing device comprises a spindle-free cutter mechanism, a vacuum adsorption disc, a workpiece rotary table, an X-axis translation motion table, a rack, a Z-axis translation motion table, a bottom adapter, a height adjuster, an adapter plate and a height fine adjustment piece;

the non-main-shaft cutter mechanism is arranged on the height fine-adjustment piece, the height fine-adjustment piece is arranged on the adapter plate, the adapter plate is arranged on the height adjuster, the height adjuster is arranged on the bottom adapter, the bottom adapter is arranged on the Z-axis translation motion table, and the Z-axis translation motion table is arranged on the rack; the vacuum adsorption disc is arranged on a workpiece rotary table, the workpiece rotary table is arranged on an X-axis motion platform through a support, and the X-axis motion platform is arranged on the rack;

the main shaft-free cutter mechanism comprises a cutter head, a cutter head fixing frame, piezoelectric ceramics A, piezoelectric ceramics B, a gasket, a cutter rest, a flexible hinge, an end effector, piezoelectric ceramics C, an inner shaft, an end cover and a displacement sensor;

the tool bit is arranged on a tool bit fixing frame which is fixedly arranged on piezoelectric ceramic A, the piezoelectric ceramic A is fixedly arranged on piezoelectric ceramic B, the piezoelectric ceramic B is fixedly arranged on a gasket, the gasket is fixedly arranged on a tool rest, the tool rest is fixedly connected with an end effector, and the end effector is formed by integrally processing a solid steel block and comprises a fixing frame, a flexible hinge and an execution block which are arranged on the left side and the right side; the end effector is connected with the fixing frame through a flexible hinge, the piezoelectric ceramic C is a hollow cylinder, a hollow inner shaft is arranged in the piezoelectric ceramic C, the outer diameter of the inner shaft is equal to the inner diameter of the piezoelectric ceramic C, a displacement sensor is arranged between one end of the inner shaft and the end effector, the other end of the inner shaft is provided with an end cover, and the end cover is fixedly arranged on the fixing frame.

A grinding and polishing method of a hard and brittle complex structure multi-polar servo grinding and polishing device without a main shaft comprises the following steps:

the first-stage servo control is realized by an X-axis translation motion table, a Z-axis translation motion table, a workpiece rotary table and piezoelectric ceramics C; the workpiece is fixed on a vacuum adsorption disc of a workpiece rotary table, the workpiece rotary table drives the vacuum adsorption disc to rotate, a plane spiral machining track is formed by matching with an X-axis translation motion table, and a cutter machines the workpiece at any position in an XY plane; the Z-axis translation motion table controls the feeding of a cutter to form a basic low-frequency profile of a workpiece; the rotation signal of the vacuum adsorption disc is subdivided by an encoder, and the pulse signal triggers the piezoelectric ceramic C to generate micro motion to form a complex contour of a processed workpiece, so that the micro-nano topography tracking of the workpiece is realized;

the second-stage servo control is realized by piezoelectric ceramic A and piezoelectric ceramic B; the phase difference of the driving voltages of the piezoelectric ceramics A and the piezoelectric ceramics B is controlled to be pi/2, so that the tool bit circularly rotates in an XY plane without a spindle, and the function of replacing the spindle is realized; meanwhile, the tool can process a workpiece in a ductility area without overlapping of circular rotating motion tracks of the main shaft, the depth of a grinding and polishing removal material is less than the critical depth, the material is subjected to plastic deformation firstly, brittle fracture is avoided, the grinding and polishing acting force of the tool is reduced, the service life of the tool is prolonged, and the surface shape quality of a processed surface is improved.

Preferably, the overall rigidity of the cutter mechanism without the main shaft is 10N/mum-200N/mum, so that the resonance of the device in the working process is avoided; the stroke of the X translation motion platform is 100cm, and the stroke of the Z-axis translation motion platform is 30 cm; the piezoelectric ceramic C vibrates at low frequency, the frequency is 0-200Hz, the piezoelectric ceramic C moves slightly along the Z-axis direction, and the stroke is 0-1000 mu m;

preferably, the piezoelectric ceramic A, B vibrates in high frequency with the frequency of 1kHz-100kHz, the piezoelectric ceramic A realizes shearing micro-motion along the X-axis direction under the excitation of voltage, the piezoelectric ceramic B realizes micro-motion along the Y-axis direction under the excitation of voltage, the vibration amplitude of the two piezoelectric ceramics is 5-50 μm, and the equivalent rotating speed is adjustable within the interval of 0-3000 rpm.

Preferably, the flexible hinge is a straight circular flexible hinge.

Preferably, the tool bit fixing frame, the piezoelectric ceramics A and the piezoelectric ceramics B are fixed through glue.

The invention has the beneficial effects that:

compared with the existing vibration auxiliary processing device, the invention has the following most distinctive advantages: firstly, the traditional method for processing the hard and brittle materials generally needs a high-speed main shaft to maintain the rotation of the cutter, which can greatly increase the volume and the design complexity of the cutter, and the invention ensures that the driving voltage has pi/2 phase difference by the cooperation of the piezoelectric ceramics A, B, realizes the function of replacing the main shaft, so that the cutter forms a circular rotating track without the main shaft, can process workpieces in a ductility region and avoids brittle fracture; secondly, the micro-motion of the piezoelectric ceramic C can accurately control the position of a cutter, and the micro-nano structure of the surface of a workpiece is tracked when the workpiece with a complex surface shape is machined.

Drawings

FIG. 1 is a schematic view of a spindle-less multi-stage servo polishing device with a hard and brittle complex structure;

FIG. 2 is an exploded view of the spindle-less cutter mechanism;

FIG. 3 is a schematic view of a spindle-less cutter mechanism;

fig. 4 is a schematic diagram of the circular rotation path of a spindle-less tool.

Detailed Description

The invention is further described in detail below with reference to the drawings and examples.

As shown in fig. 1, the device comprises a spindle-free tool mechanism 101, a workpiece 102, a vacuum chuck 103, a workpiece turntable 104, a triangular support 105, an X-axis translational motion table 106, a frame 107, a Z-axis translational motion table 108, a bottom adapter 109, a height adjuster 110, an adapter plate 111 and a height fine-adjusting part 112;

the non-main-shaft cutter mechanism is arranged on the height fine-adjustment piece, the height fine-adjustment piece is arranged on the adapter plate, the adapter plate is arranged on the height adjuster, the height adjuster is arranged on the bottom adapter, the bottom adapter is arranged on the Z-axis translation motion table, and the Z-axis translation motion table is arranged on the rack; the workpiece is fixed through a vacuum adsorption disc, the vacuum adsorption disc is installed on a workpiece rotary table, the workpiece rotary table is installed on a triangular support, the triangular support is installed on an X-axis motion platform, and the X-axis motion platform is installed on a rack;

as shown in fig. 2 and 3, the spindle-free cutter mechanism is composed of a cutter head 201, a cutter head holder 202, a piezoelectric ceramic a203, a piezoelectric ceramic B204, a gasket 205, a cutter holder 206, a flexible hinge 207, an end effector 208, a piezoelectric ceramic C209, an inner shaft 210, an end cap 211 and a displacement sensor 212;

the tool bit is arranged on a tool bit fixing frame which is fixedly arranged on piezoelectric ceramic A, the piezoelectric ceramic A is fixedly arranged on piezoelectric ceramic B, the piezoelectric ceramic B is fixedly arranged on a gasket, the gasket is fixedly arranged on a tool rest, the tool rest is fixedly connected with an end effector, and the end effector is formed by integrally processing a solid steel block and comprises a fixing frame, a flexible hinge and an execution block which are arranged on the left side and the right side; the end effector is connected with the fixed frame through a flexible hinge, the piezoelectric ceramic C is a hollow cylinder, a hollow inner shaft is arranged in the piezoelectric ceramic C, the outer diameter of the inner shaft is equal to the inner diameter of the piezoelectric ceramic C, a displacement sensor is arranged between one end of the inner shaft and the end effector, the other end of the inner shaft is provided with an end cover, and the end cover is fixedly arranged on the fixed frame; the whole mechanism is fixedly connected through bolts, and the whole design is compact.

The first-stage servo control is realized by an X-axis translation motion table, a Z-axis translation motion table, a C-axis workpiece turntable and piezoelectric ceramic C; the workpiece is fixed on a workpiece rotary table, the workpiece rotary table rotates around a C axis and is matched with an X-axis translation motion table to form a plane spiral processing track, and a cutter can process the workpiece at any position in an XY plane; the Z-axis translation motion table controls the feeding of a cutter to form a basic low-frequency profile of a workpiece; and then, a rotating signal of the workpiece turntable around the C axis is subdivided by the encoder, and the pulse signal triggers the piezoelectric ceramic C to generate micro motion, so that a complex contour of the processed workpiece is formed, and the micro-nano shape tracking of the workpiece is realized.

The second-stage servo control is realized by piezoelectric ceramic A and piezoelectric ceramic B; the method for realizing the non-main shaft cutter mechanism without the main shaft circumferential rotating track is described as follows: as shown in fig. 4, piezoelectric ceramic a is displaced along the X-axis direction under the excitation voltage, and piezoelectric ceramic B is displaced along the Y-axis direction under the excitation voltage; starting from the initial position, when the displacement of the piezoelectric ceramic A in the X-axis direction reaches half of the maximum measuring range Deltax, the piezoelectric ceramic B does not move, and the displacement is shown as 4.1; when the displacement of the piezoelectric ceramic A in the X-axis direction reaches the maximum range 2 delta X, the displacement of the piezoelectric ceramic B in the Y-axis direction reaches half delta Y of the maximum range, which is shown in 4.2; when the displacement of the piezoelectric ceramic A in the X-axis direction returns to half Δ X of the maximum range, the displacement of the piezoelectric ceramic B in the Y-axis direction reaches the maximum range 2 Δ Y, which is shown in 4.3; when the piezoelectric ceramic A returns to the initial position in the X-axis direction, that is, no displacement occurs, and the displacement of the piezoelectric ceramic B in the Y-axis direction returns to a half Δ Y of the maximum measurement range, which is shown in 4.4 at this time; the process is repeated subsequently, so that the circumferential rotating track without the main shaft is realized by the cooperation of the two pieces of piezoelectric ceramics under the condition that the tool does not have the main shaft; that is, the phase difference of the excitation voltage of the piezoelectric ceramic B is pi/2 relative to the excitation voltage of the piezoelectric ceramic A in the form of a motion equation;

the invention is not the best known technology.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.