阅读说明：本技术 一种接线端子 (Wiring terminal ) 是由 刘杰鹏 于 2020-04-07 设计创作，主要内容包括：本发明公开了一种接线端子,包括：壳体、接线柱、玻璃熔封件、第一绝缘件和/或第二绝缘件；所述第一绝缘件和/或所述第二绝缘件为环氧树脂材料。本发明所述接线端子通过在壳体上设置环氧树脂,对上下部位的玻璃进行有效保护,避免因玻璃裂纹或直接暴露吸潮引起的绝缘不良,同时较大地增加绝缘距离,从而提高绝缘性能；上、下表面均覆盖环氧树脂涂层,可有效提高封接的密封性能。而大规格端子内侧所受压力较小规格端子大,通过加入环氧树脂涂层可以很好提高大壳体内侧的耐压能力。(The invention discloses a wiring terminal, comprising: the glass fuse sealing part comprises a shell, a binding post, a glass fuse sealing part, a first insulating part and/or a second insulating part; the first insulating part and/or the second insulating part are/is made of epoxy resin materials. According to the wiring terminal, the epoxy resin is arranged on the shell, so that the glass at the upper part and the lower part is effectively protected, poor insulation caused by glass cracks or direct exposure and moisture absorption is avoided, and the insulation distance is greatly increased, so that the insulation performance is improved; the upper surface and the lower surface are covered with epoxy resin coatings, so that the sealing performance of sealing can be effectively improved. And the pressure on the inner side of the large-specification terminal is smaller, the specification terminal is large, and the pressure resistance of the inner side of the large shell can be well improved by adding the epoxy resin coating.)

1. A terminal, comprising:

the shell is provided with a first surface and a second surface opposite to the first surface, and the shell is provided with a sealing hole penetrating through the first surface and the second surface;

the binding post penetrates through the sealing hole;

the glass melt-sealing piece is used for sealing the shell and the wiring terminal;

the first insulating piece is arranged on the first surface and at least covers one end, close to the first surface, of the glass melt-sealing piece; and/or a second insulating piece, wherein the second insulating piece is arranged on the second surface and at least covers one end of the glass melt-sealing piece close to the second surface;

the first insulating part and/or the second insulating part are/is made of epoxy resin materials.

2. The connecting terminal according to claim 1, wherein the first insulating member and the second insulating member are each provided with a through hole for passing through the terminal, the first insulating member forms a sleeve along an extending direction of the terminal from a junction of the terminal and the first surface, and the sleeve is sleeved on the terminal to fix the first insulating member and the housing; the second insulating part forms a sleeve along the extending direction of the binding post from the joint of the binding post and the second surface, and the binding post is sleeved with the sleeve to fix the second insulating part and the shell.

3. The terminal of claim 1, wherein the epoxy material comprises an epoxy matrix, the epoxy matrix being at least one of bisphenol a epoxy, bisphenol F epoxy, bisphenol S epoxy, o-cresol novolac epoxy, and novolac epoxy.

4. A terminal as claimed in claim 3, wherein the epoxy resin matrix is present in the epoxy resin material in an amount of 15 to 65% by weight.

5. The terminal according to claim 3, wherein the epoxy resin matrix is a bisphenol A type epoxy resin and a bisphenol F type epoxy resin; preferably, the weight ratio of the bisphenol a type epoxy resin to the bisphenol F type epoxy resin is: bisphenol a type epoxy resin: 0.58-6: 1 of bisphenol F epoxy resin; more preferably, the weight ratio of the bisphenol a type epoxy resin and the bisphenol F type epoxy resin is: bisphenol a type epoxy resin: the bisphenol F epoxy resin is 1.5-6: 1.

6. The connection terminal according to claim 4, wherein the epoxy resin material comprises the following components in parts by weight: 0-65 parts of bisphenol A type epoxy resin, 0-65 parts of bisphenol F type epoxy resin, 10-40 parts of curing agent, 1-15 parts of accelerator, 0-50 parts of diluent, 0-3 parts of defoamer, 0-35 parts of filler and 0-3 parts of pigment; preferably, the epoxy resin material comprises the following components in parts by weight: 15-60 parts of bisphenol A epoxy resin, 10-26 parts of bisphenol F epoxy resin, 10-40 parts of curing agent, 1-15 parts of accelerator, 5-50 parts of diluent, 0.1-3 parts of defoaming agent, 7-35 parts of filler and 0-3 parts of pigment.

7. The connection terminal according to claim 3, wherein the number average degree of polymerization of the epoxy resin matrix is 3 to 14; preferably, the number average polymerization degree of the bisphenol A type epoxy resin and the bisphenol F type epoxy resin in the epoxy resin material is 3-14.

8. The terminal according to claim 6, wherein the filler is at least one of fine silica powder, talc powder and zirconium silicate; preferably, the filler is silicon powder, talcum powder and zirconium silicate.

9. The terminal according to claim 8, wherein the fine silica powder is contained in an amount by weight larger than that of talc powder or zirconium silicate; preferably, the weight ratio of the silicon micropowder, the talcum powder and the zirconium silicate is as follows: silicon micropowder: talc powder: 5-15% of zirconium silicate: 1-10: 1 to 10.

10. The connection terminal according to claim 6, wherein at least one of the following (a) to (h):

(a) the curing agent is an organic acid anhydride curing agent;

(b) the weight percentage of the curing agent in the epoxy resin material is 10-40%;

(c) the diluent is glycidyl ether epoxy active diluent;

(d) the weight percentage of the diluent in the epoxy resin material is 5-50%;

(e) the accelerant is tertiary amine;

(f) the defoaming agent is organic silicone oil;

(g) the weight percentage content of the filler in the epoxy resin material is 10-35%;

(h) the pigment accounts for 0.1-3% of the epoxy resin material in percentage by weight.

Technical Field

The invention relates to a wiring terminal, in particular to a wiring terminal for a compressor.

Background

At present, a conventional wiring terminal comprises a shell, a wiring terminal and a glass melting piece for sealing the shell and the wiring terminal, wherein the inside and the outside of the shell are not enough in insulation protection of glass, the insulation performance is relatively poor, and the hidden danger of flashover discharge generated in an extreme environment can not be effectively avoided.

In addition, there is also a plastic member bonded by a composite epoxy resin inside the terminal housing, in order to improve the insulation performance of the connection terminal by increasing the insulation distance inside the housing. In the scheme, the epoxy resin is mainly used as a binder, the improvement degree of the insulating property is limited, and the functional layer is a plastic piece. In addition, in the scheme, the plastic part can only be arranged on the inner side of the shell and cannot be applied to the outer side of the shell, namely, the electrical performance of the inner side of the shell can only be protected. Because the insulation distance outside the shell is not enough, the insulation performance is relatively poor, and the hidden danger of flashover discharge generated in the extreme environment cannot be effectively avoided. Moreover, the forming process is complex, a conventional terminal prefabricated part needs to be prepared by sintering, an epoxy resin ring prefabricated part is prepared by dry pressing, a plastic prefabricated part is prepared by injection molding, the epoxy resin prefabricated part, the plastic prefabricated part and the terminal prefabricated part are assembled, and then the epoxy resin prefabricated part, the plastic prefabricated part and the terminal prefabricated part are sintered and formed by a kiln; the process steps are complicated, the material cost is high, the resource consumption is high, and the risk of environmental pollution is high; the equipment investment is high and the cost is high.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide a connecting terminal.

In order to achieve the purpose, the invention adopts the technical scheme that: a wire terminal, comprising:

the shell is provided with a first surface and a second surface opposite to the first surface, and the shell is provided with a sealing hole penetrating through the first surface and the second surface;

the binding post penetrates through the sealing hole;

the glass melt-sealing piece is used for sealing the shell and the wiring terminal;

the first insulating piece is arranged on the first surface and at least covers one end, close to the first surface, of the glass melt-sealing piece;

and/or a second insulating piece, wherein the second insulating piece is arranged on the second surface and at least covers one end of the glass melt-sealing piece close to the second surface;

the first insulating part and/or the second insulating part are/is made of epoxy resin materials.

According to the wiring terminal, the epoxy resin materials are arranged on the first surface and/or the second surface, so that the insulation distance between the upper part and the lower part of the wiring terminal is increased, the insulation performance is effectively improved, and the problem of insufficient insulation protection of the inner side and the outer side of the shell on glass is solved; the external force impact is effectively improved in the using process of the terminal, the pressure resistance of the terminal is improved, the pressure resistance is improved in a large-specification wiring terminal, and the pressure resistance is improved obviously; moreover, the insulating part covers the surface of the glass melt sealing part, so that the glass melt sealing part is further shielded and protected, and the glass melt sealing part is effectively prevented from being wetted.

Preferably, through holes are formed in the first insulating part and the second insulating part, the through holes are used for penetrating through the wiring terminal, a sleeve is formed in the first insulating part from the joint of the wiring terminal and the first surface along the extending direction of the wiring terminal, and the sleeve is sleeved on the wiring terminal to fix the first insulating part and the shell; the second insulating part forms a sleeve along the extending direction of the binding post from the joint of the binding post and the second surface, and the binding post is sleeved with the sleeve to fix the second insulating part and the shell.

Preferably, at least one end of the binding post is provided with a plug-in piece. The insert is an iron insert or an iron-copper composite insert.

Preferably, the epoxy resin material comprises an epoxy resin matrix, and the epoxy resin matrix is at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, o-cresol novolac epoxy resin and novolac epoxy resin; the weight percentage of the epoxy resin matrix in the epoxy resin material is 15-65%.

The content of the epoxy resin matrix is higher than 65 wt.%, and a large internal stress is generated in the curing process, so that adverse effects can be generated on a glass melt-sealed piece, and the airtightness of the terminal is influenced; moreover, the molded insulator has high brittleness, and mechanical properties such as reduced compressive strength and impact resistance of the terminal are poor. The epoxy resin is lower than 15 wt.%, the resin content in the system is too low, the filler content is too high, the viscosity of the system is large, the bonding force with the shell is low, the risk of exposing a partial region can occur, defects such as defect air holes, poor leveling property, poor component dispersion uniformity and difficulty in forming can be easily generated in the forming process, the mechanical property of the cured coating is poor, the appearance is poor, and the insulating properties such as air insulating distance and creepage distance can be reduced if the partial region is formed epoxy resin.

Preferably, the epoxy resin matrix is bisphenol a type epoxy resin and bisphenol F type epoxy resin.

The molecular frameworks of the bisphenol A type and the bisphenol F type epoxy resins enable the formed epoxy resin layer to have high strength and heat resistance, and the requirement that the terminal is used under the conditions of high pressure and high temperature in a compressor can be met. And functional groups such as methylene, hydroxyl, ether bond and the like in the molecule enable the formed epoxy resin layer to have good bonding force and flexibility, so that the insulating part and the terminal shell are ensured to have good bonding force and adhesion performance, and the terminal sealing performance is facilitated. If only bisphenol A epoxy resin is adopted, the viscosity of the epoxy resin system is high, the epoxy resin system is difficult to directly perform infusion molding, more diluents are required, the contractibility and the adhesiveness of the epoxy resin are increased, and small molecular compounds are generated in the curing process, so that the insulating property and the strength of a coating and the adhesion property of an insulating part and a shell are reduced. If only adopt bisphenol F type epoxy, this type of epoxy's system viscosity is lower, and the condition such as overflow appears easily in the forming process, and mobility is too strong to guarantee the regional shape of shaping and thickness homogeneity, leads to insulating part binding post stem and lid climbing height again lower, and terminal air insulation distance and creepage distance are shorter, and raw and other materials cost is higher. Therefore, the invention preferentially adopts a composite system scheme, the bisphenol A type epoxy resin and the bisphenol F type epoxy resin both belong to glycidyl ether type epoxy resin, the bisphenol A type epoxy resin and the bisphenol F type epoxy resin have similar carbon skeleton structures, the physical and chemical properties are similar, the compatibility is good, the combination of the bisphenol A type epoxy resin and the bisphenol F type epoxy resin is beneficial to subsequent molding and can effectively avoid the generation of molding defects.

Preferably, the weight ratio of the bisphenol a type epoxy resin to the bisphenol F type epoxy resin is: bisphenol a type epoxy resin: the bisphenol F epoxy resin is 0.58-6: 1. The ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is too high, and the problem caused by the large viscosity of the system when only the bisphenol A type epoxy resin is used also occurs. The ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is too low, the viscosity of the system is low, and the problem caused by the low viscosity of the system when only the bisphenol F type epoxy resin is used also occurs. More preferably, the weight ratio of the bisphenol a type epoxy resin and the bisphenol F type epoxy resin is: bisphenol a type epoxy resin: the bisphenol F epoxy resin is 1.5-6: 1.

Preferably, the epoxy resin material comprises the following components in parts by weight: 0-65 parts of bisphenol A type epoxy resin, 0-65 parts of bisphenol F type epoxy resin, 10-40 parts of curing agent, 1-15 parts of accelerator, 0-50 parts of diluent, 0-3 parts of defoaming agent, 0-35 parts of filler and 0-3 parts of pigment.

Preferably, the epoxy resin material comprises the following components in parts by weight: 15-60 parts of bisphenol A epoxy resin, 10-26 parts of bisphenol F epoxy resin, 10-40 parts of curing agent, 1-15 parts of accelerator, 5-50 parts of diluent, 0-3 parts of defoaming agent, 7-35 parts of filler and 0-3 parts of pigment. The material adopting the formula has the advantages of low-temperature curing (about 120 ℃), low volatility, high strength, no glue oil, excellent electrical property and good sealing property, and has good storage stability.

Preferably, the number average polymerization degree of the epoxy resin matrix is 3-14. Preferably, the number average polymerization degree of the bisphenol A type epoxy resin and the bisphenol F type epoxy resin is 3-14. The polymerization degree is too high, so that the viscosity of the wiring terminal is easily too high, even the epoxy resin is in a solid state, and the epoxy resin is not easy to spread on the surface of the wiring terminal shell; the epoxy resin matrix having a polymerization degree as described above is preferable because it has a low polymerization degree and a low viscosity, and it is likely to cause electrical leakage of the molded terminal.

Preferably, the filler is at least one of silica micropowder, talcum powder and zirconium silicate. More preferably, the filler is silica micropowder, talc powder and zirconium silicate. The filler can improve the processing performance; the size stability of the insulating part is improved, the curing shrinkage rate of the epoxy resin coating is reduced, the thermal expansion coefficient of the epoxy resin is reduced, and the damage of volume change caused by shrinkage to glass is reduced; improving the heat resistance of the epoxy resin coating; the mechanical properties such as the compressive strength of the coating are improved; effectively reducing the cost. During curing of the epoxy coating, the components due to the difference in the coefficients of thermal expansion will generate internal stresses in the coating, which stresses will be trapped between the filler and the epoxy. The particle size of the silicon powder, the talcum powder and the zirconium silicate is preferably 100nm-5 um. The particle size is too small, agglomeration is easy to generate, and dispersion is difficult; the particle size is too large, stress concentration is easy to generate, defects are easy to generate on the interface of the inorganic particles and the epoxy resin, so that the performances of impact resistance and the like of the coating are reduced, and the flatness of the coating is possibly influenced.

Preferably, the weight content of the silicon micro powder is larger than that of the talcum powder or the zirconium silicate. According to the invention, the silicon micropowder, the talcum powder and the zirconium silicate are preferably compounded, the silicon micropowder is taken as a main body, the linear expansion coefficient of the silicon micropowder is close to that of the sealing glass, the matching property of an epoxy resin system and the linear expansion coefficient of the sealing glass can be effectively improved, and the phenomenon that local stress is generated in the curing process or in the case of large temperature change due to the mismatch of the expansion coefficients to warp and even crack is avoided, so that the mechanical property and the insulating property of an insulating part are reduced, and the service life of a dielectric medium is shortened; and the generated stress can cause great damage to the sealing glass, and the sealing performance and the insulating and pressure-resistant performance of the glass are reduced. The addition of the talcum powder and the zirconium silicate can improve the adhesiveness of the silicon micropowder and the epoxy resin and further improve the insulativity of the insulating part. In addition, the addition of the talcum powder can also improve the toughness and the ductility of the insulating part, and the zirconium silicate is also beneficial to improving the heat resistance and the moisture resistance of the insulating part.

More preferably, the weight ratio of the silicon micropowder, the talcum powder and the zirconium silicate is as follows: silicon micropowder: talc powder: 5-15% of zirconium silicate: 1-10: 1 to 10. The proportion is controlled to ensure that the curing shrinkage of the epoxy resin is between 2 and 10 percent, and the damage of volume change caused by shrinkage to glass is reduced.

Preferably, the curing agent is an organic acid anhydride curing agent. Preferably, the weight percentage content of the curing agent in the epoxy resin material is 10-40%; preferably, the diluent is a glycidyl ether epoxy reactive diluent. Preferably, the weight percentage of the diluent in the epoxy resin material is 5-50%, and preferably, the accelerator is a tertiary amine. Preferably, the defoaming agent is silicone oil.

Preferably, the weight percentage of the filler in the epoxy resin material is 10-35%. If the content of the filler is too high, on one hand, internal stress in the insulating part can cause internal microcracks to generate, the voltage resistance and the insulating property of the connecting terminal are influenced, and the service life of the dielectric is greatly shortened; on the other hand, the tensile strength and impact toughness are reduced, and the processability is not favorable. Too low a filler effect cannot be achieved.

Preferably, the pigment accounts for 0.1-3% of the epoxy resin material by weight. The epoxy resin coating is transparent and easy to age after being irradiated by ultraviolet light and heat, and the addition of the pigment can effectively shield ultraviolet light and improve the aging performance of the epoxy resin layer.

In addition, the invention also provides a preparation method of the connecting terminal, which comprises the following steps:

1) uniformly mixing various raw materials of the insulating part to form first insulating part slurry and/or second insulating part slurry;

2) overlapping the connecting terminal of the sealed glass melt-sealed piece with a corresponding mould, and pouring slurry;

3) and curing and molding the slurry at high temperature to obtain the wiring terminal.

Preferably, the step 1) further comprises the step of uniformly mixing the raw materials, wherein the temperature is controlled to be about 25 ℃ at room temperature; and the mixed coating slurry is placed in a vacuum drying box to remove air bubbles in the coating slurry, and the parameters of the vacuum drying box are set to be 25 ℃, 10kPa of vacuum degree and 10min of time.

Preferably, the step 2) further comprises the steps of cleaning the surface of the connecting terminal of the sealed glass sealing piece and preheating, wherein the preheating temperature is 135 ℃.

Preferably, in the step 3), the high-temperature curing molding parameters are set to be 60-180 ℃, and the curing time is 15-90 min.

The preparation method of the wiring terminal in the scheme of the invention has the advantages of simple forming process and lower cost investment, and completely meets the production requirements.

The invention has the beneficial effects that: the invention provides a wiring terminal, wherein an insulating part is arranged on a shell, and a wiring terminal is tightly surrounded in the insulating part, so that gaps among a glass melt sealing part, the wiring terminal and the shell are completely sealed, the glass at the upper part and the lower part is effectively protected, poor insulation caused by glass cracks is avoided, poor insulation caused by direct exposure and moisture absorption of the glass is avoided, and the sealing performance of sealing is effectively improved; meanwhile, the insulation distance of the terminal is greatly increased, and the insulation performance and the voltage resistance performance are effectively improved.

Drawings

Fig. 1 is a schematic structural view of a connection terminal according to embodiment 1;

FIG. 2 is a schematic structural view of a cross section A-A of the connection terminal of embodiment 1; wherein, 1, a shell; 2. a binding post; 3. a glass frit seal; 4. a first insulating member; 5. a second insulating member; 6. and (4) inserting sheets.

Detailed Description

To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples.