阅读说明：本技术 一种用于电路板检测的定位点获取方法、定位方法和装置 (Positioning point acquisition method, positioning method and positioning device for circuit board detection ) 是由 赵盾 于 2020-04-15 设计创作，主要内容包括：本发明公开了一种用于电路板检测的定位方法,包括：获取待检测的电路板图像；对所述电路板图像中的作为特定标记点的第一金属区域添加第一标记特征,所述第一标记特征部分围绕所述第一金属区域,所述第一金属区域为非封闭区域；向所述第一金属区域与其它金属区域连接方向添加第二标记特征；添加第三标记特征用于封闭所述第一标记特征形成定位点区域,所述第三标记特征的两端为第二标记特征与第一标记特征连接处。可实现对任意不封闭的金属区域或者金属区域中连续的部分区域进行单独标注。(The invention discloses a positioning method for circuit board detection, which comprises the following steps: acquiring a circuit board image to be detected; adding a first marking feature to a first metal area serving as a specific marking point in the circuit board image, wherein the first marking feature partially surrounds the first metal area, and the first metal area is a non-closed area; adding a second marking characteristic to the connecting direction of the first metal area and other metal areas; and adding a third marking feature for sealing the first marking feature to form an anchor point region, wherein two ends of the third marking feature are the joint of the second marking feature and the first marking feature. The independent marking of any unclosed metal area or continuous partial area in the metal area can be realized.)

1. A positioning method for circuit board detection is characterized by comprising the following steps:

s1, acquiring a circuit board image to be detected;

s2, adding a first mark feature to a first metal area serving as a specific mark point in the circuit board image, wherein the first mark feature partially surrounds the first metal area, and the first metal area is a non-closed area;

s3, adding a second mark feature to the connecting direction of the first metal area and other metal areas;

and S4, adding a third marking feature for sealing the first marking feature to form an anchor point area, wherein two ends of the third marking feature are the joint of the second marking feature and the first marking feature.

2. The positioning method for circuit board inspection according to claim 1, wherein: the step S3 includes:

and adding two groups of second marking features to two sides of a second metal area, wherein the second metal area is a part of other metal areas connected with the first metal area, and the two groups of second marking features are respectively used for positioning the boundaries of the solder mask layer corresponding to two edges of the second metal area.

3. The positioning method for circuit board inspection according to claim 2, wherein:

when the first metal area comprises a corner, adding two groups of first marking features to the corner of the first metal area, wherein the two groups of first marking features are respectively used for positioning the boundary of the solder mask layer corresponding to two edges of the corner of the first metal area;

adding second marking features to two second metal areas at two ends of a corner connected with the first metal area respectively, wherein the second marking features are used for positioning the boundaries of the solder mask layer corresponding to two sides of other metal areas respectively;

and respectively adding third marking features to two ends of the corner for closing the metal areas enclosed by the two groups of first marking features to form positioning point areas, wherein two ends of each third marking feature are respectively the connecting positions of the second marking feature and the first marking feature on the side.

4. The positioning method for circuit board inspection according to claim 3, further comprising:

and S5, judging whether the solder mask boundary exists in the positioning point area, if not, performing feature filling on the positioning point area on the circuit board image, otherwise, not performing feature filling.

5. The positioning method for circuit board inspection according to any one of claims 1 to 4, further comprising:

and S6, acquiring the same positioning point region in the comparison circuit board image, and comparing and detecting the circuit board image to be detected and the comparison circuit board image by taking the positioning point region as a position reference point.

6. The positioning method for circuit board detection according to claim 5, wherein the step S6 specifically includes:

and acquiring the same positioning point region and a second marking characteristic thereof in the comparison circuit board image, and comparing and detecting the circuit board image to be detected and the comparison circuit board image by taking the positioning point region and the second marking characteristic as position reference points.

7. A locating point obtaining method for circuit board detection is characterized by specifically comprising the following steps:

using a first marking characteristic to mark the edge of a first metal area serving as a specific marking point on a circuit board image to be detected, wherein the first metal area is a non-closed area;

edge marking a part of other metal areas connected with the first metal area by using a second marking feature;

and closing the first marking feature surrounding area by using a third marking feature to form a positioning point area, wherein two ends of the third marking feature are respectively the connecting positions of the second marking feature and the first marking feature.

8. The localization point obtaining method according to claim 7, further comprising: and judging whether a solder mask boundary exists in the positioning point area, if not, performing feature filling on the positioning point area on the circuit board image, otherwise, not performing feature filling.

9. A positioning device for circuit board inspection, comprising:

the image acquisition device is used for acquiring a circuit board image to be detected;

image processing apparatus comprising a memory, a processor and a computer program stored in said memory and executable on said processor, characterized in that: the processor, when executing the computer program, realizes the steps of the method according to any of claims 1-6.

10. A computer-readable storage medium storing a computer program, characterized in that: the computer program realizing the steps of the method according to any of claims 1-6 when executed by a processor.

Technical Field

The invention relates to the technical field of circuit board detection, in particular to a positioning point acquisition method and device for circuit board detection and a readable storage medium.

Background

A Printed Circuit Board (PCB) is a hardware core of a current electronic product, and as functions of the current electronic product are increasingly complex, electronic components on the PCB are increasingly more and more complex, and circuits between devices are closer and closer, so that during Circuit soldering, short Circuit caused by Circuit tin connection and open Circuit caused by thermal shock or solder leakage are likely to occur, and these factors all cause corresponding device failure, so that functions of a finished Circuit Board are incomplete, and therefore the Circuit Board should be detected before the Circuit Board is assembled into a finished product, so as to intercept the Circuit Board with incomplete functions.

The conventional marking method can not be used for singly marking one unclosed metal area or a partial area in one metal area, but under some conditions, for example, due to the problems of the previous process or the view field of a camera, ideal marking points can not be found for positioning subsequent inspection, and the conventional marking method can not be used for singly marking the non-independent metal area.

Disclosure of Invention

The invention provides a positioning method for detecting a circuit board aiming at the defects in the prior art, which comprises the following specific steps: s1, acquiring a circuit board image to be detected; s2, adding a first mark feature to a first metal area serving as a specific mark point in the circuit board image, wherein the first mark feature partially surrounds the first metal area, and the first metal area is a non-closed area; s3, adding a second mark feature to the connecting direction of the first metal area and other metal areas; and S4, adding a third marking feature for sealing the first marking feature to form an anchor point area, wherein two ends of the third marking feature are the joint of the second marking feature and the first marking feature.

Preferably, the step S3 includes: and adding two groups of second marking features to two sides of a second metal area, wherein the second metal area is a part of other metal areas connected with the first metal area, and the two groups of second marking features are respectively used for positioning the boundaries of the solder mask layer corresponding to two edges of the second metal area.

Preferably, when the first metal region includes a corner, two sets of the first marking features are added to the corner of the first metal region, and the two sets of the first marking features are respectively used for positioning the boundary of the solder mask layer corresponding to two edges of the corner of the first metal region; adding second marking features to two second metal areas at two ends of a corner connected with the first metal area respectively, wherein the second marking features are used for positioning the boundaries of the solder mask layer corresponding to two sides of other metal areas respectively; and respectively adding third marking features to two ends of the corner for closing the metal areas enclosed by the two groups of first marking features to form positioning point areas, wherein two ends of each third marking feature are respectively the connecting positions of the second marking feature and the first marking feature on the side.

Preferably, the positioning method for circuit board detection further comprises: and S5, judging whether the solder mask boundary exists in the positioning point area, if not, performing feature filling on the positioning point area on the circuit board image, otherwise, not performing feature filling.

Preferably, the positioning method for circuit board detection further comprises: and S6, acquiring the same positioning point region in the comparison circuit board image, and comparing and detecting the circuit board image to be detected and the comparison circuit board image by taking the positioning point region as a position reference point.

Preferably, the step S6 specifically includes: and acquiring the same positioning point region and a second marking characteristic thereof in the comparison circuit board image, and comparing and detecting the circuit board image to be detected and the comparison circuit board image by taking the positioning point region and the second marking characteristic as position reference points.

The invention also discloses a positioning point obtaining method for detecting the circuit board, which specifically comprises the following steps: using a first marking characteristic to mark the edge of a first metal area serving as a specific marking point on a circuit board image to be detected, wherein the first metal area is a non-closed area; edge marking a part of other metal areas connected with the first metal area by using a second marking feature; and closing the first marking feature surrounding area by using a third marking feature to form a positioning point area, wherein two ends of the third marking feature are respectively the connecting positions of the second marking feature and the first marking feature.

Preferably, the locating point obtaining method for detecting the circuit board further includes: and judging whether a solder mask boundary exists in the positioning point area, if not, performing feature filling on the positioning point area on the circuit board image, otherwise, not performing feature filling.

The invention also discloses a positioning device for detecting the circuit board, which comprises: the image acquisition device is used for acquiring a circuit board image to be detected; image processing apparatus comprising a memory, a processor and a computer program stored in said memory and executable on said processor, characterized in that: the processor, when executing the computer program, realizes the steps of the method according to any of claims 1-6.

The invention also discloses a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to realize the steps of any one of the positioning methods for circuit board detection.

According to the invention, different marking characteristics are added to the selected non-closed first metal area serving as a specific marking point, and the area formed by the surrounding of the different marking characteristics is used as the positioning point area, so that the independent marking of the non-closed metal area or the continuous partial area in the metal area is realized. The method solves the problem that the existing marking method can only mark independent closed metal areas on the circuit board, but can not find ideal independent marking points to position the subsequent inspection, and can not select an unclosed metal area or a part of the metal area to be marked independently to serve as the independent marking points. The circuit board detection equipment applying the circuit board detection positioning method has the capability of solving the difficulty in marking the positioning mark points of the metal area of the circuit board caused by various processes or the vision problem of a camera, can adapt to the layout of various types of metal wires or bonding pads, and improves the reliability and the product adaptability of the detection equipment. Meanwhile, in the comparison of the circuit board to be detected and the reference circuit board, the comparison detection direction of the circuit board to be detected can be determined through the second comparison characteristic, the problem that the rotation angle of the circuit board cannot be judged under the condition that the positioning point area is circular is solved, the positioning and subsequent comparison analysis of the circuit board image are more accurate, the problem that the deflection angle of the circuit board to be detected is not consistent with that of the comparison reference circuit board image under the condition that the positioning point area of the circuit board to be detected is matched is solved, and the comparison detection accuracy of the circuit board image is improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:

fig. 1 is a schematic view of a conventional disc-shaped bare metal.

Fig. 2 is a schematic drawing showing a conventional L-type bare metal.

Fig. 3 is an image of a circuit board including exposed metal that is not sealed.

Fig. 4 is a schematic flowchart of a positioning method for circuit board inspection according to an embodiment of the present invention.

Fig. 5 is a schematic illustration of a non-closed disc-shaped bare metal according to an embodiment of the present invention.

Fig. 6 is a partial flowchart of a positioning method according to an embodiment of the disclosure.

FIG. 7 is a labeled schematic view of a bare metal with corners as disclosed in one embodiment of the present invention.

Fig. 8 is a partial flowchart of a positioning method according to another embodiment of the disclosure.

Fig. 9 is a schematic flow chart illustrating a positioning point obtaining method for circuit board inspection according to an embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a positioning device for circuit board inspection according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and claims of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one.

The conventional marking method can not mark an unclosed metal area or a partial area in a metal area separately, such as the unclosed metal area shown in fig. 3, but in some cases, for example, because of the problems of the previous process or the camera view, an ideal mark point cannot be found to position the subsequent inspection, and the conventional marking method cannot mark a non-independent metal area separately, such as the unclosed metal area shown in fig. 3, the positioning method for detecting the circuit board disclosed in the embodiment can mark the unclosed metal area or the partial area in the metal area separately, and the specific positioning method comprises the following steps:

and step S1, acquiring the circuit board image to be detected. The circuit board to be detected placed on the detection platform can be directly subjected to image acquisition through image acquisition devices such as a camera on the detection equipment.

Step S2, adding a first mark feature to a first metal area in the circuit board image, where the first metal area is a specific mark point, and the first mark feature partially surrounds the first metal area, where the first metal area is a non-closed area. Wherein the first metal area may be a metal wire or pad or a partial area thereof on the circuit board to be detected. Specifically, as the pad in fig. 5 is taken as the first metal region, it can be seen that the pad is a non-enclosed region, and the edge of the pad is marked with the first mark feature 3.

And step S3, adding a second mark feature to the connecting direction of the first metal area and other metal areas. For example, in the pad shown in fig. 5, a gold wire is also connected to one side thereof. Marking is carried out from two sides of the connecting position of the gold wire lead and the bonding pad by using the second marking features 4, and a distance is marked by extending towards the metal lead, wherein the marking lengths of the second marking features 4 on two sides of the metal lead can be marked according to a preset distance, and the specific marking length can be preset.

And two groups of second marking features are added to two sides of a second metal area, the second metal area is a part of other metal areas connected with the first metal area, and the two groups of second marking features are respectively used for positioning the boundaries of the solder mask layer corresponding to two edges of the second metal area.

And step S4, adding a third marking feature for sealing the first marking feature to form an anchor point area, wherein two ends of the third marking feature are the joint of the second marking feature and the first marking feature. Specifically, for example, in the pad shown in fig. 5, the first mark feature 3 is sealed by marking the third mark feature 5, and a sealed region is formed as an anchor point region.

In a specific embodiment, the first mark feature 3, the second mark feature 4, and the third mark feature 5 may be marked with different colors, and each mark feature can be quickly identified by marking with different colors, and subsequent locating point regions can be identified. Meanwhile, for labels with different colors, the image processing software can conveniently identify the characteristics of each label according to the color.

In the embodiment, different marking features are added to the selected non-closed first metal area serving as the specific marking point, and the area formed by the surrounding of the different marking features serves as the positioning point area, so that the non-closed metal area or the continuous partial area in the metal area is marked separately. The method solves the problem that the existing marking method can only mark independent closed metal areas on the circuit board, but can not find ideal independent marking points to position the subsequent inspection, and can not select an unclosed metal area or a part of the metal area to be marked independently to serve as the independent marking points. The circuit board detection equipment applying the circuit board detection positioning method has the capability of solving the difficulty in marking the positioning mark points of the metal area of the circuit board caused by various processes or the vision problem of a camera, can adapt to the layout of various types of metal wires or bonding pads, and improves the reliability and the product adaptability of the detection equipment. Meanwhile, in the comparison of the circuit board to be detected and the reference circuit board, the comparison detection direction of the circuit board to be detected can be determined through the second comparison characteristic, the problem that the rotation angle of the circuit board cannot be judged under the condition that the positioning point area is circular is solved, the positioning and subsequent comparison analysis of the circuit board image are more accurate, the problem that the deflection angle of the circuit board to be detected is not consistent with that of the comparison reference circuit board image under the condition that the positioning point area of the circuit board to be detected is matched is solved, and the comparison detection accuracy of the circuit board image is improved.

Fig. 6 is a step of determining an anchor point region when the first metal region includes a corner in an implementation, which specifically includes:

and step S21, when the first metal area comprises a corner, adding two groups of first marking features to the corner of the first metal area, wherein the two groups of first marking features are respectively used for positioning the boundary of the solder mask layer corresponding to two edges of the corner of the first metal area. As shown particularly in fig. 7, the first metal region is marked on both sides with a first indexing feature 3, including the corner outer side and the inner side.

And step S31, adding second marking features 5 to two second metal areas at two ends of the corner connected with the first metal area respectively, wherein the second marking features are used for positioning the boundaries of the solder mask layer corresponding to two sides of other metal areas respectively. The second marking feature 5 may contact the first marking feature and extend a certain distance away from the first marking feature, and the extending distance may extend according to a predetermined length.

And step S41, adding third marking features to the two ends of the corner respectively for closing the metal areas sandwiched by the two groups of first marking features to form positioning point areas, wherein the two ends of the third marking features are respectively the connecting positions of the second marking features and the first marking features on the side.

Different marking characteristics are added to a first metal area containing corners, and areas formed by the surrounding of the different marking characteristics are used as positioning point areas, so that the independent marking of the corner part areas in continuous metal areas is realized, and the problem that an unclosed metal area or a partial area in one metal area cannot be selected to be singly marked as an independent marking point under the condition that the existing marking method only can mark independent closed metal areas on a circuit board but cannot find ideal independent marking points to position subsequent inspection is solved. The circuit board detection equipment applying the circuit board detection positioning method has the capability of solving the difficulty in marking the positioning mark points of the metal area of the circuit board caused by various processes or the vision problem of a camera, can adapt to the layout of various types of metal wires or bonding pads, and improves the reliability and the product adaptability of the detection equipment.

As shown in fig. 8, in some embodiments, the positioning method for circuit board inspection may further include a step S5, determining whether a solder mask boundary exists inside the positioning point region, performing feature filling on the positioning point region on the circuit board image if the solder mask boundary does not exist, otherwise, not performing feature filling. Wherein the feature filling may be to cover a specific color in the region of the anchor point. The characteristic filling and non-filling are carried out on the positioning point region by selecting whether a solder mask layer space exists in the positioning point region, so that the subsequent detection is more accurate according to the comparison of the positioning point region. When the unfilled feature is selected, the superposition comparison is only carried out according to the first mark feature or the first mark feature and the second mark feature of the positioning point region, the superposition comparison of the two positioning point regions is more accurate in the comparison mode, but the requirement on the identification accuracy of the similar point or the first mark feature of the image is higher. However, when the mode of filling the positioning point area is selected, the superposition comparison of a plurality of images can be carried out subsequently according to the filling features in the positioning point area, although the superposition comparison of the two images is not very accurate, the requirement on the precision of the similar points of the circuit board images to be detected is not so high, and the image comparison detection can be carried out more quickly.

And step S6, acquiring the same positioning point region in the comparison circuit board image, and comparing and detecting the circuit board image to be detected and the comparison circuit board image by taking the positioning point region as a position reference point. Wherein the steps may specifically include: and acquiring the same positioning point region and a second marking characteristic thereof in the comparison circuit board image, and comparing and detecting the circuit board image to be detected and the comparison circuit board image by taking the positioning point region and the second marking characteristic as position reference points. The coincidence comparison of the second mark characteristics is added to the coincidence comparison of the circuit board to be detected and the reference circuit board depending on the positioning point region to determine that the comparison detection directions of the circuit board images are consistent, so that the problem that the rotation angle of the circuit board cannot be judged under the condition that the positioning point region is circular and the like is avoided, the positioning and subsequent comparison analysis of the circuit board images are more accurate, the problem that the deflection angle of the circuit board to be detected is not consistent with that of the reference circuit board image under the condition that the positioning point region of the circuit board to be detected is matched is prevented, and the comparison detection accuracy of the circuit board images is improved.

Fig. 9 is a positioning point obtaining method for circuit board inspection according to another embodiment, where the method may specifically include:

step S201, edge marking is carried out on a first metal area serving as a specific marking point on a circuit board image to be detected by using a first marking feature, wherein the first metal area is a non-closed area. Wherein the first metal area may be a metal wire or pad or a partial area thereof on the circuit board to be detected. Specifically, as the pad in fig. 5 is taken as the first metal region, it can be seen that the pad is a non-enclosed region, and the edge of the pad is marked with the first mark feature 3.

In step S202, edge marking is performed on a portion of the other metal region connected to the first metal region by using the second marking feature. For example, in the pad shown in fig. 5, a gold wire is also connected to one side thereof. Marking is carried out from two sides of the connecting position of the gold wire lead and the bonding pad by using the second marking features 4, and a distance is marked by extending towards the metal lead, wherein the marking lengths of the second marking features 4 on two sides of the metal lead can be marked according to a preset distance, and the specific marking length can be preset. And two groups of second marking features are added to two sides of a second metal area, the second metal area is a part of other metal areas connected with the first metal area, and the two groups of second marking features are respectively used for positioning the boundaries of the solder mask layer corresponding to two edges of the second metal area.

Step S203, a third marking feature is used for sealing the first marking feature surrounding area to form a positioning point area, and two ends of the third marking feature are respectively the connecting positions of the second marking feature and the first marking feature. In the pad of the body, for example, as shown in fig. 5, the first mark feature 3 is sealed by marking the third mark feature 5, and a sealed area is formed as an anchor point area. In a specific embodiment, the first mark feature 3, the second mark feature 4, and the third mark feature 5 may be marked with different colors, and each mark feature can be quickly identified by marking with different colors, and subsequent locating point regions can be identified. Meanwhile, for labels with different colors, the image processing software can conveniently identify the characteristics of each label according to the color.

In particular, if the first metal region is of the isolated edge type, such as a light circle or ring of the type shown in fig. 1, the edge may be described by a closed continuous purple curve. If the first metal area is not of an independent edge type, the edge is drawn by a purple closed continuous curve, namely the first mark characteristic can also be called as 'actually measured drawing'; for the edge part which is not required by us, a small amount of non-closed curve is also used for 'extending and describing', namely the second mark characteristic; for the demarcation point, a third marking feature may be employed that "terminates" the desired edge delineated by a straight line.

When the first metal area comprises a corner, adding two groups of first marking features to the corner of the first metal area, wherein the two groups of first marking features are respectively used for positioning the boundary of the solder mask layer corresponding to two edges of the corner of the first metal area. Referring specifically to fig. 7, the first metal region is marked on both sides with a first indexing feature 3, including the corner outer and inner sides. Second marking features 5 are then added to two second metal regions at both ends of the corner connecting to the first metal region, respectively, the second marking features being used to locate the boundaries of the solder mask corresponding to the two sides of the other metal regions, respectively. The second marking feature 5 may contact the first marking feature and extend a certain distance away from the first marking feature, and the extending distance may extend according to a predetermined length. And finally, adding third marking features to two ends of the rear corner respectively for closing the metal areas sandwiched by the two groups of first marking features to form positioning point areas, wherein two ends of each third marking feature are respectively the connecting positions of the second marking feature and the first marking feature on the side. In addition, whether a solder mask boundary exists in the positioning point area can be judged, if not, the characteristic filling is carried out on the positioning point area on the circuit board image, otherwise, the characteristic filling is not carried out.

Different marking characteristics are added to the selected non-closed first metal area serving as a specific marking point, and an area formed by the surrounding of the different marking characteristics serves as a positioning point area, so that the non-closed metal area or the continuous partial area in the metal area is marked separately. The method solves the problem that the existing marking method can only mark independent closed metal areas on the circuit board, but can not find ideal independent marking points to position the subsequent inspection, and can not select an unclosed metal area or a part of the metal area to be marked independently to serve as the independent marking points. The circuit board detection equipment applying the circuit board detection positioning method has the capability of solving the difficulty in marking the positioning mark points of the metal area of the circuit board caused by various processes or the vision problem of a camera, can adapt to the layout of various types of metal wires or bonding pads, and improves the reliability and the product adaptability of the detection equipment.

Specific contents and technical effects in this embodiment can be found in the foregoing embodiment of the positioning method for circuit board inspection, and a description thereof will not be repeated

The invention also provides a positioning device for circuit board detection, which comprises an image acquisition device 1 and an image processing device 2, wherein the image processing device 2 comprises a memory 21, a processor 22 and a computer program stored in the memory and capable of running on the processor, and the processor executes the computer program to realize the steps of the positioning method for circuit board detection as described in the embodiments.

The positioning device for circuit board detection may include, but is not limited to, a processor, a memory. It will be understood by those skilled in the art that the schematic diagram is merely an example of a positioning apparatus for circuit board inspection, and does not constitute a limitation of the positioning apparatus for circuit board inspection, and may include more or less components than those shown, or combine some components, or different components, for example, the positioning apparatus for circuit board inspection may further include an input-output device, a network access device, a bus, etc.

The Processor may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. The general purpose processor may be a microprocessor or the processor may be any conventional processor or the like, the processor is a control center of the positioning apparatus for circuit board inspection, and various interfaces and lines are used to connect various parts of the entire positioning apparatus for circuit board inspection.

The memory may be used to store the computer programs and/or modules, and the processor may implement the various functions of the positioning apparatus device for circuit board inspection by running or executing the computer programs and/or modules stored in the memory and calling the data stored in the memory. The memory may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required for at least one function, and the like, and the memory may include a high speed random access memory, and may further include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a flash memory Card (FlashCard), at least one magnetic disk storage device, a flash memory device, or other volatile solid state storage device.

The positioning device data management method for circuit board detection can be stored in a computer readable storage medium if the positioning device data management method is realized in the form of a software functional unit and sold or used as an independent product. Based on such understanding, all or part of the flow in the method according to the above embodiments may also be implemented by a computer program, which may be stored in a computer readable storage medium, to instruct related hardware, and when the computer program is executed by a processor, the computer program may implement the steps of implementing the embodiments of the positioning method for detecting the circuit board. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain content that is subject to appropriate increase or decrease as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media does not include electrical carrier signals and telecommunications signals as is required by legislation and patent practice.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

In summary, the above-mentioned embodiments are only preferred embodiments of the present invention, and all equivalent changes and modifications made in the claims of the present invention should be covered by the claims of the present invention.