阅读说明：本技术 一种抛光设备空气颗粒尘埃抽排装置及其对应的抽排方法 (Polishing equipment air particle dust pumping device and corresponding pumping method thereof ) 是由 易德福 于 2020-06-11 设计创作，主要内容包括：本发明提供了一种抛光设备空气颗粒尘埃抽排装置,其确保将空气颗粒尘埃抽排出抛光机时、对抛光盘的划伤率低,提高沉底晶片抛光良品率。其包括抛光设备底座,所述抛光设备底座上布置有定盘转盘,所述定盘转盘上放置有陶瓷盘晶片载体,所述抛光设备底座通过上凸的弧板连接上部安装架,所述上部安装架上设置有若干个下露的抛光转盘,所述抛光转盘用于陶瓷盘晶片载体上的晶片的抛光,所述弧板上开设有至少一个抽排风口,每个所述抽排风口通过抽风管外接抽风动力装置,封闭原有的垂直抽排口。(The invention provides an air particle dust pumping and discharging device of polishing equipment, which ensures that when air particle dust is pumped and discharged out of a polishing machine, the scratching rate of a polishing disk is low, and the polishing yield of a bottom wafer is improved. It includes the polishing equipment base, the fixed plate carousel has been arranged on the polishing equipment base, ceramic plate wafer carrier has been placed on the fixed plate carousel, the polishing equipment base connects the upper portion mounting bracket through the arc board of epirelief, be provided with the polishing carousel that a plurality of exposes down on the mounting bracket of upper portion, the polishing carousel is used for the polishing of the wafer on the ceramic plate wafer carrier, at least one suction extraction wind gap has been seted up on the arc board, every the suction extraction wind gap passes through the external convulsions power device of exhaust column, seals original perpendicular suction extraction mouth.)

1. The utility model provides a polishing equipment air particle dust pump drainage device which characterized in that: it includes the polishing equipment base, the fixed plate carousel has been arranged on the polishing equipment base, ceramic plate wafer carrier has been placed on the fixed plate carousel, the polishing equipment base connects the upper portion mounting bracket through the arc board of epirelief, be provided with the polishing carousel that a plurality of exposes down on the mounting bracket of upper portion, the polishing carousel is used for the polishing of the wafer on the ceramic plate wafer carrier, at least one suction extraction wind gap has been seted up on the arc board, every the suction extraction wind gap passes through the external convulsions power device of exhaust column, seals original perpendicular suction extraction mouth.

2. A polishing tool air particle dust extraction assembly as recited in claim 1, further comprising: two suction and exhaust air ports are symmetrically arranged on the arc plate about the vertical plane of the arc plate.

3. A polishing tool air particle dust extraction assembly as recited in claim 1, further comprising: the height position of each air suction and exhaust port is 20-40 mm higher than the upper surface of the fixed disc turntable.

4. A polishing tool air particle dust extraction assembly as recited in claim 1, further comprising: the inner end of each air suction pipe penetrates through the air suction and exhaust port and is fixed, and the horizontal distance from the inner end of each air suction pipe to the corresponding surface of the fixed disc turntable is 25-35 mm.

5. A polishing tool air particle dust extraction assembly as recited in claim 4, further comprising: the horizontal distance from the inner end of each exhaust pipe to the corresponding surface of the fixed disc turntable is 30 mm.

6. A polishing tool air particle dust extraction assembly as recited in claim 1, further comprising: the polishing equipment base is provided with a turnover baffle plate relative to the front end face of the fixed disc turntable, and a transparent observation window is arranged on the turnover baffle plate.

7. A polishing equipment air particle dust pumping method is characterized in that: changing the pumping position of a pumping system, modifying the position of a pumping and exhausting air inlet in the side area of the fixed disc turntable, keeping the horizontal distance of the pumping and exhausting air inlet to the outermost side position of the corresponding position of the fixed disc turntable at 25-35 mm, and sealing the original vertical pumping and exhausting air inlet.

8. A method of exhausting airborne particulate dust from a polishing apparatus as recited in claim 7, wherein: two suction and exhaust air ports are arranged on the corresponding areas on the two sides of the arc plate, the inner end of each suction pipe penetrates through the suction and exhaust air port and is fixed, and the horizontal distance from the inner end of each suction pipe to the corresponding surface of the fixed disc turntable is 25-35 mm.

9. A method of exhausting airborne particulate dust from a polishing apparatus as recited in claim 7, wherein: the height position of each air suction and exhaust port is 20-40 mm higher than the upper surface of the fixed disc turntable.

Technical Field

The invention relates to the technical field of polishing machine pumping devices, in particular to an air particle dust pumping device of polishing equipment, and further provides an air particle dust pumping method of the polishing equipment.

Background

At present, sell on the market and practical burnishing machine pump drainage device, all design for the opening upwards and perpendicular and polishing dish top, and have about 0.4 meters high distance from the workstation quotation, lead to can't reach effectual getting rid of polishing dish in the pump drainage in-process and go up granule in the air, at the pump drainage in-process, the granule gathering is at the pump drainage wind gap, get into exhaust pipe by the pump drainage wind gap and be discharged, great granule is adhered to through the tension of the water in the polishing, the weight that has increased granule in the air causes the weightlessness to drop on the polishing dish, arouse that polishing in-process fish tail is bad, influence substrate wafer polishing yields.

Disclosure of Invention

Aiming at the problems, the invention provides an air particle dust pumping and discharging device for polishing equipment, which ensures that the scratch rate of a polishing disc is low when air particle dust is pumped and discharged out of a polishing machine, and improves the polishing yield of a bottom wafer.

The utility model provides a polishing equipment air particle dust pump drainage device which characterized in that: it includes the polishing equipment base, the fixed plate carousel has been arranged on the polishing equipment base, ceramic plate wafer carrier has been placed on the fixed plate carousel, the polishing equipment base connects the upper portion mounting bracket through the arc board of epirelief, be provided with the polishing carousel that a plurality of exposes down on the mounting bracket of upper portion, the polishing carousel is used for the polishing of the wafer on the ceramic plate wafer carrier, at least one suction extraction wind gap has been seted up on the arc board, every the suction extraction wind gap passes through the external convulsions power device of exhaust column, seals original perpendicular suction extraction mouth.

It is further characterized in that: two suction and exhaust openings are symmetrically arranged on the arc plate about the vertical plane of the arc plate;

the height position of each air suction and exhaust port is 20-40 mm higher than the upper surface of the fixed disc turntable;

the inner end of each air suction pipe penetrates through the air suction and exhaust port and is fixed, and the horizontal distance from the inner end of each air suction pipe to the corresponding surface of the fixed disc turntable is 25-35 mm;

preferably, the horizontal distance from the inner end of each exhaust pipe to the corresponding surface of the fixed disc turntable is 30 mm;

the polishing equipment base is provided with the upset baffle for the preceding terminal surface of fixed disk carousel, be provided with transparent observation window on the baffle that can overturn, when polishing, the upset baffle is in the closed condition, makes whole polishing go on in the closed environment, and through convulsions power device with air particle dust pump drainage burnishing machine, when needs get when putting the substrate wafer, open the upset baffle, put into corresponding air, get and put the substrate wafer, the air volume of its putting ensures going on in order of single pump drainage.

A method for pumping and exhausting air particle dust of polishing equipment is characterized by comprising the following steps: changing the pumping position of a pumping system, modifying the position of a pumping and exhausting air inlet in the side area of the fixed disc turntable, keeping the horizontal distance of the pumping and exhausting air inlet to the outermost side position of the corresponding position of the fixed disc turntable at 25-35 mm, and sealing the original vertical pumping and exhausting air inlet.

It is further characterized in that:

two suction and exhaust air ports are arranged on the corresponding areas on the two sides of the arc plate, the inner end of each suction pipe penetrates through the suction and exhaust air port and is fixed, and the horizontal distance from the inner end of each suction pipe to the corresponding surface of the fixed disc turntable is 25-35 mm;

the height position of each air suction and exhaust port is 20-40 mm higher than the upper surface of the fixed disc turntable.

After the technical scheme is adopted, the rear arc plate is provided with at least one suction and exhaust air port, each suction and exhaust air port is externally connected with a suction power device through a suction pipe to seal the original vertical suction and exhaust port, so that the exhaust air is more consistent with the air hydromechanics, particles with the particle size of more than 5.0 mu m can be more easily sucked, and the scratch problem caused by the fact that the particles in the air drop on the fixed plate due to weight loss is reduced; the polishing disk is low in scratching rate when air particle dust is pumped out of the polishing machine, and the polishing yield of the bottom-sinking wafer is improved.

Drawings

FIG. 1 is a schematic diagram of the front view structure of the present invention;

FIG. 2 is a schematic side view of the present invention;

the names corresponding to the sequence numbers in the figure are as follows:

the polishing device comprises a polishing device base 1, a fixed disc rotary table 2, a ceramic disc wafer carrier 3, an arc plate 4, an upper mounting frame 5, a polishing rotary table 6, a suction exhaust port 7, an exhaust pipe 8, an exhaust power device 9 and an overturning baffle plate 10.

Detailed Description

A polishing equipment air particle dust pumping device is shown in figures 1 and 2: it includes polishing equipment base 1, fixed disk carousel 2 has been arranged on polishing equipment base 1, ceramic plate wafer carrier 3 has been placed on fixed disk carousel 2, polishing equipment base 1 connects upper portion mounting bracket 5 through the arc board 4 of epirelief, be provided with the polishing carousel 6 that a plurality of exposes down on the mounting bracket 5 of upper portion, polishing carousel 6 is used for the polishing of the wafer on the ceramic plate wafer carrier 3, at least one suction and exhaust wind gap 7 has been seted up on arc board 4, every suction and exhaust wind gap 7 passes through 8 external convulsions power device 9 of exhaust column, seal original perpendicular suction and exhaust mouth.