阅读说明：本技术 用于高压处理系统的冷凝器系统 (Condenser system for high pressure processing system ) 是由 简·德尔马斯 于 2018-11-07 设计创作，主要内容包括：在本文中描述的实施方式涉及具有冷凝器的高压处理系统和用于利用所述高压处理系统的方法。处理系统包含：处理腔室、锅炉、冷凝器和一个或多个热交换器。所述锅炉产生流体(例如蒸气或超临界流体),并且将所述流体输送至处理基板所在的处理腔室。在处理基板之后,对系统进行减压并且将所述流体输送至冷凝器,在冷凝器对所述流体进行冷凝。(Embodiments described herein relate to a high pressure processing system having a condenser and a method for utilizing the high pressure processing system. The processing system comprises: a process chamber, a boiler, a condenser, and one or more heat exchangers. The boiler generates a fluid (e.g., a vapor or a supercritical fluid) and delivers the fluid to a process chamber in which a substrate is processed. After processing the substrate, the system is depressurized and the fluid is delivered to a condenser where it is condensed.)

1. A substrate processing system, comprising:

a processing chamber;

a boiler in fluid communication with the process chamber via a first conduit;

a first valve disposed on the first conduit between the boiler and the process chamber;

a condenser in fluid communication with the process chamber via a second conduit;

a second valve disposed on the second conduit between the condenser and the processing chamber;

a heat exchanger in fluid communication with the condenser via a third conduit; and

a third valve disposed on the third conduit between the condenser and the heat exchanger.

2. The system of claim 1, wherein the process chamber is a single substrate processing chamber.

3. The system of claim 1, wherein the processing chamber is a batch substrate processing chamber.

4. The system of claim 1, wherein the boiler is in fluid communication with one or more of a water source, a carbon dioxide source, or an ammonia source.

5. The system of claim 1, further comprising:

a second heat exchanger disposed on the second conduit between the process chamber and the condenser.

6. The system of claim 5, wherein the second valve is disposed on the second conduit between the process chamber and the second heat exchanger.

7. The system of claim 6, wherein a check valve is disposed on the second conduit between the second heat exchanger and the second valve.

8. The system of claim 5, further comprising:

a third heat exchanger disposed on a fourth conduit extending from the second conduit.

9. The system of claim 8, wherein a fourth valve is disposed on the fourth conduit between the second heat exchanger and the third heat exchanger.

10. The system of claim 1, wherein the condenser comprises: a heat sink.

11. The system of claim 1, further comprising:

a level sensor in operable communication with the condenser.

12. A substrate processing system, comprising:

a processing chamber;

a boiler in fluid communication with the process chamber via a first conduit;

a first valve disposed on the first conduit between the boiler and the process chamber;

a condenser in fluid communication with the process chamber via a second conduit;

a second valve disposed on the second conduit between the condenser and the processing chamber;

a first heat exchanger disposed on the second conduit between the process chamber and the condenser;

a fluid collection unit in fluid communication with the condenser via a third conduit;

a second heat exchanger disposed on the third conduit between the condenser and the fluid collection unit; and

a third valve disposed on the third conduit between the condenser and the second heat exchanger.

13. The system of claim 12, further comprising:

a third heat exchanger disposed on a fourth conduit extending from the second conduit.

14. The system of claim 13, wherein a fourth valve is disposed on the fourth conduit between the first heat exchanger and the third heat exchanger.

15. A method of processing a substrate, comprising:

heating a conduit extending from a process chamber;

heating a boiler in fluid communication with the processing chamber;

closing a valve disposed on a conduit located upstream of the process chamber;

opening a valve disposed on a conduit downstream of the process chamber;

disposing a substrate in the processing chamber;

heating the processing chamber;

closing a valve disposed on a conduit downstream of the process chamber;

opening a valve disposed on a conduit upstream of the process chamber to enable fluid produced by the boiler to pressurize the process chamber;

opening a valve disposed on a conduit downstream of the process chamber; and

flowing the fluid from the process to a condenser.

Description of the Related Art

Conventional substrate processing systems typically operate at reduced pressures during processing operations. Recent developments in certain processing techniques, such as substrate cleaning, utilize high pressure environments that are compatible with steam or supercritical fluids. However, conventional equipment is not equipped to accommodate the unique pressure regimes associated with supercritical fluid processing. Furthermore, conventional equipment cannot be easily retrofitted to accommodate high pressure operating environments without unnecessary risk of catastrophic equipment failure.

Accordingly, there is a need in the art for a condenser system for a high pressure processing system.

Disclosure of Invention

In one embodiment, a substrate processing system is provided. The system comprises: a processing chamber; a boiler in fluid communication with the process chamber via a first conduit; and a first valve disposed on the first conduit between the boiler and the process chamber. A condenser is in fluid communication with the process chamber via a second conduit, and a second valve is disposed on the second conduit between the condenser and the process chamber. A heat exchanger is in fluid communication with the condenser via a third conduit, and a third valve is disposed on the third conduit between the condenser and the heat exchanger.

In another embodiment, a substrate processing system is provided. The system comprises: a processing chamber; a boiler in fluid communication with the process chamber via a first conduit; and a first valve disposed on the first conduit between the boiler and the process chamber. A condenser is in fluid communication with the process chamber, and a second valve is disposed on the second conduit between the condenser and the process chamber. A first heat exchanger is disposed on the second conduit between the process chamber and the condenser, and a fluid collection unit is in fluid communication with the condenser via a third conduit. A second heat exchanger is disposed on the third conduit between the condenser and the fluid collection unit, and a third valve is disposed on the third conduit between the condenser and the second heat exchanger.

In yet another embodiment, a method of processing a substrate is provided. The method comprises the following steps: a conduit extending from a process chamber is heated, and a boiler in fluid communication with the process chamber is heated. Closing a valve disposed on a conduit located upstream of the process chamber and opening a valve disposed on a conduit located downstream of the process chamber. Positioning a substrate in the process chamber, heating the process chamber, closing a valve disposed on a conduit downstream of the process chamber, and opening a valve disposed on a conduit upstream of the process chamber to enable fluid produced by the boiler to pressurize the process chamber. Opening a valve disposed on a conduit downstream of the process chamber and flowing the fluid from the process chamber to a condenser.

Brief description of the drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. However, it should be noted that: the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the disclosure, for the disclosure may admit to other equally effective embodiments.

Fig. 1 is a schematic diagram of a high pressure processing system having a condenser according to embodiments described herein.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. Consider that: elements and features of one embodiment may be advantageously incorporated in other embodiments without further elaboration.

Detailed Description

Embodiments described herein relate to a high pressure processing system having a condenser and a method of using the high pressure processing system. The processing system comprises: a process chamber, a boiler, a condenser, and one or more heat exchangers. The boiler generates a fluid (such as a vapor or a supercritical fluid) and delivers the fluid to a process chamber in which a substrate is processed. After processing a substrate, the system is depressurized and the fluid is delivered to the condenser where it is condensed.

Fig. 1 is a schematic diagram of a high pressure processing system 100 having a condenser 150 according to embodiments described herein. The system 100 includes: a process chamber 132, a boiler 130, one or more heat exchangers 140, 152, 162, and a condenser 150. The boiler 130 is disposed in an upstream region 170 of the process chamber 132, and the heat exchangers 140, 152, 162 and the condenser 150 are disposed in a downstream region 180 of the process chamber 132.

The system 100 further comprises: a plurality of fluid sources 102, 104, 106. In one embodiment, the fluid source 102 is a source of treatment fluid (e.g., a water source); the fluid source 104 is a source of process gas (e.g., CO)₂Gas source or NH₃A gas source); and the fluid source 106 is a purge gas source (e.g., an inert gas source such as an argon gas source or a nitrogen gas source).

Fluid source 102 is in fluid communication with boiler 130 via conduit 108. Valve 110 is disposed on conduit 108 between fluid source 102 and boiler 130 to control fluid flow between fluid source 102 and boiler 130. Fluid source 104 is in fluid communication with boiler 130 via conduit 112. A valve 116 is disposed on conduit 112 between fluid source 104 and boiler 130 to control fluid flow between fluid source 104 and boiler 130. A check valve 114, such as a one-way flow valve, is also disposed on the conduit 112 between the valve 116 and the fluid source 104 to prevent backflow of fluid from the boiler to the fluid source 104.

In operation, boiler 130 receives fluid from one or both of fluid sources 102, 104 and heats and/or pressurizes the processing fluid to form vapor and/or supercritical fluid. Fluid flows from boiler 130 through conduit 124 to conduit 128, conduit 128 being in fluid communication with process chamber 132. A valve 126 is disposed on conduit 124 between conduit 128 and boiler 130 to control fluid flow between boiler 130 and process chamber 132.

The fluid source 106 is in fluid communication with the process chamber 132 via the conduit 118 and a conduit 128 coupled to the process chamber. A valve 122 is disposed on the conduit 118 between the fluid source 106 and the conduit 128 to control fluid flow between the fluid source 106 and the process chamber 132. A check valve 120 (e.g., a one-way flow valve) is also disposed on the conduit 118 between the valve 122 and the fluid source 106 to prevent back flow of fluid between the processing chamber 132 and the fluid source 106.

A portion of each of the conduits 108, 112, 118 disposed downstream of the valves 110, 116, 122, respectively, is condensation controlled. For example, the sections are jacketed and heated to prevent condensation of the fluid flowing through the sections. Alternatively, P-traps (P-trap) are provided for these sections to collect condensation of the fluid flowing through these sections. The conduits 124, 128 are also condensation controlled. Similar to the conduits 108, 112, 118, the conduits 124, 128 may be jacketed and the conduits 124, 128 heated and/or P-traps may be installed to substantially prevent or collect condensation of the fluid flowing through the conduits 124, 128.

The process chamber 132 is configured as a high pressure/high temperature vessel capable of operating at pressures utilized to maintain vapor and/or supercritical fluids for substrate processing. In one embodiment, the process chamber 132 is a single substrate processing chamber. In another embodiment, the processing chamber 132 is a batch processing chamber for processing multiple substrates at once. The process chamber 132 may also be configured for performing various substrate processing operations (e.g., substrate cleaning or the like). In one example, the processing chamber 132 is configured for performing a supercritical substrate cleaning process.

The condenser 150 is disposed in a downstream region 180 of the process chamber 132 in fluid communication with the process chamber 132. A conduit 134 extends from the process chamber 132 to a heat exchanger 140. A valve 136 is disposed on the conduit 134 between the process chamber 132 and the heat exchanger 140 to control fluid flow between the process chamber 132 and the heat exchanger 140. A check valve 138 (e.g., a one-way valve) is disposed on the conduit 134 between the valve 136 and the heat exchanger 140 to prevent backflow of fluid from the heat exchanger 140 to the process chamber 132.

The fluid flowing from the process chamber 132 is cooled using the heat exchanger 140. The fluid cooled by the heat exchanger 140 flows through a conduit 144 to a condenser 150. The heat exchanger 152 is also in fluid communication with the heat exchanger 140 via a conduit 142, the conduit 142 being coupled to a conduit 144. A conduit 142 is coupled to the conduit 144 between the condenser 150 and the heat exchanger 140.

A valve 148 (e.g., a throttle valve or the like) is disposed on conduit 144 between condenser 150 and conduit 142 to control the flow of fluid from heat exchanger 140 to condenser 150. A valve 146 is disposed on conduit 142 between conduit 144 and heat exchanger 152. When valve 148 is closed and valve 146 is open, fluid flows from heat exchanger 140 to heat exchanger 152. The fluid flow path incorporated into heat exchanger 152 is utilized to further cool and pressurize the gas exiting heat exchanger 140.

A conduit 154 extends from the heat exchanger 152 to a drain 156. The cooling gas at a reduced pressure from that used in the process chamber 132 is diverted (divert) before reaching the condenser 150. The exhaust 156 removes gas from the system 100, for example, by delivering the gas to a facility exhaust.

The conduit 134 is condensation controlled. In one embodiment, the conduit 134 is jacketed and the conduit 134 is heated to prevent condensation of the fluid flowing from the process chamber 132 to the heat exchanger 140. Alternatively, a P-trap is fitted to the conduit 134 to collect condensation of the fluid flowing from the process chamber 132 to the heat exchanger 140. Similar to conduit 134, conduit 142 is also condensation controlled. Similarly, a portion of conduit 144 between heat exchanger 140 and valve 148 is condensation controlled. By having condensation control over the aforementioned conduits 134, 142, 144, premature condensation of fluid flowing from the process chamber 132 to the condenser 150 is avoided or substantially reduced.

The condenser 150 is a temperature and pressure controlled vessel, and the condenser 150 condenses the fluid received from the process chamber 132 to more effectively collect the fluid as a liquid. By condensing the fluid into a liquid, the fluid may be filtered and reused in subsequent substrate processing operations. In one embodiment, the condenser 150 comprises: physical features for increasing the surface area of the material exposed to the fluid in the condenser 150. In one example, a porous shelf or porous filter is disposed within the condenser to increase the surface area over which fluid flows within the condenser 150. For example, the porous shelf or porous filter is formed from a sintered metal material. In another embodiment, extended and/or curved fluid flow channels are provided within the condenser 150 to further promote more efficient fluid condensation.

In one embodiment, the condenser 150 includes a heat sink to further cool the fluid delivered to the condenser 150. The heat sink may be temperature controlled to promote condensation of the fluid on the heat sink. In one embodiment, the heat sink is finned to increase the surface area within the condenser 150 to promote condensation. In various embodiments, the temperature of the condenser 150 and the heat sink structure is controlled to be lower than the condensation temperature of the fluid to be condensed within the condenser 150. It is also envisaged: as condensation proceeds, the pressure within the condenser drops, which may be used to facilitate the flow of condensed fluid out of the condenser 150.

The level sensor 164 is operatively coupled to the condenser 150. A level sensor 164 (e.g., a float or the like) determines the amount of condensed fluid within the condenser 150. In one embodiment, the valve 160 is operated using data from the level sensor 164 regarding the amount of fluid in the condenser 150, the valve 160 controlling the flow of fluid from the condenser 150 to the fluid collection unit 166 via the conduit 158. The fluid collection unit 166 collects the condensed fluid from the condenser 150 and may optionally filter the fluid to prepare the fluid for reuse. A heat exchanger 162 is also provided on the conduit 158 between the fluid collection unit 166 and the valve 160 to further cool the condensed fluid prior to delivery to the fluid collection unit 166.

In operation, a fluid is heated and/or pressurized in the boiler 130 and delivered to the process chamber 132 to process a substrate disposed in the process chamber 132. After processing the substrate, the fluid is delivered to the condenser 150 to be condensed and the condensed fluid is collected in the fluid collection unit 166. Various examples of fluid treatment protocols utilizing apparatus 100 are described in more detail below.

The pressure within the system 100 is controlled by the temperature of the boiler 130. In this embodiment, valve 136 is closed and valve 126 (valve 126 may be a throttle) is opened. The temperature of the boiler 130 is set such that the pressure of the boiler 130 is greater than the temperature of the process chamber 132. In this embodiment, the valve 126 functions as a pressure regulator and the valve 136 functions to bleed pressure from the process chamber 132 if the pressure of the process chamber 132 is above a predetermined threshold. In another embodiment, valve 126 functions as a flow restriction valve and valve 136 functions as a back pressure regulator to facilitate pressure control within process chamber 132. The embodiments described above may be implemented with or without active flow of fluid through the system, depending on the desired implementation.

In one embodiment, water is utilized to form the treatment fluid. In operation, the process chamber 132 is opened by closing the valve 126 and opening the valve 136 and the valve 160. The condensation controlled conduit described hereinabove is heated to a temperature between about 275 ℃ and about 300 ℃. The boiler 130 is pressurized to about 50 bar and heated to a temperature suitable to promote the formation of water vapor. The substrate is positioned in the processing chamber 132, the processing chamber 132 is closed, and the processing chamber 132 is purged by opening the valve 122 to deliver a purge gas from the fluid source 106. After purging, valve 122 is closed.

The process chamber 132 is heated to a temperature between about 450 ℃ and about 500 ℃, and the valve 136 and the valve 160 are closed before heating the process chamber 132, during heating the process chamber, or after heating the process chamber. The valve 126 is opened to pressurize the process chamber 132 by delivering the process fluid. Therefore, the pressure and temperature of the boiler 130 will decrease. The valve 126 is then closed while the boiler 130 is restored, and the valve 126 is reopened when the pressure of the boiler 130 is approximately equal to the pressure of the process chamber 132.

The valve 126 is closed when the pressure within the process chamber 132 is between about 40 bar and about 50 bar. The substrate is processed for a predetermined amount of time and then the valve 136 is opened to depressurize the process chamber 132. The process fluid is condensed in condenser 150, with condenser 150 maintained at a temperature of about 50 ℃ to about 80 ℃ and a pressure of about 1 ATM. When the pressure within the process chamber 132 has stabilized, the valve 160 is opened and the condensed fluid is delivered to the fluid collection unit 166. When the processing chamber 132 has cooled, the processed substrate is removed.

In another embodiment, CO is utilized₂To form a treatment fluid. In operation, the process chamber 132 is "opened" (open) by closing the valve 126 and opening the valve 136 and the valve 160. The condensation-controlled conduit described hereinabove is heated to a temperature between about 30 ℃ and about 100 ℃. The condenser 150 is controlled to a temperature between about 8 c and about 10 c. The boiler 130 is heated to a temperature of about 100 ℃ and maintained at a temperature suitable to promote supercritical CO₂The pressure developed. The substrate is positioned in the processing chamber 132, the processing chamber 132 is closed, and the processing chamber 132 is purged by opening the valve 122 to deliver a purge gas from the fluid source 106. After purging, valve 122 is closed.

The process chamber 132 is pressurized to about 80 bar, heated to a temperature between about 100 ℃, and the valves 136 and 160 are closed. The valve 126 is opened to pressurize the process chamber 132 by delivering the process fluid. Therefore, the pressure and temperature of the boiler 130 will decrease. The valve 126 is then closed while the boiler 130 is restored, and the valve 126 is reopened when the pressure of the boiler 130 is approximately equal to the pressure of the process chamber 132.

The valve 126 is closed when the pressure within the process chamber 132 is between about 80 bar and about 100 bar. The substrate is processed for a predetermined amount of time and then the valve 136 is opened to depressurize the process chamber 132. The heat exchanger 140 reduces the temperature of the fluid flowing from the process chamber 132 from a temperature of about 100 c to a temperature of about 50 c. The process fluid is condensed in a condenser 150, the condenser 150 being maintained at a temperature between about 8 ℃ and about 10 ℃ and a pressure of about 45 bar. When the pressure within the process chamber 132 has stabilized, the valve 160 is opened and the condensed fluid is delivered to the fluid collection unit 166. One or both of conduits 142 and 154 are opened to remove gas and further depressurize system 100. When the processing chamber 132 has cooled, the processed substrate is removed.

In another embodiment, NH is utilized₃To form a treatment fluid. In operation, the process chamber 132 is "opened" by closing the valve 126 and opening the valve 136 and the valve 160. The condensation-controlled conduit described hereinabove is heated to a temperature of about 50 ℃. The condenser 150 is controlled at a temperature of-20 c. The boiler 130 is heated to a temperature of about 45 ℃ and maintained at a temperature suitable to promote supercritical NH₃The pressure developed. The substrate is positioned in the processing chamber 132, the processing chamber 132 is closed, and the processing chamber 132 is purged by opening the valve 122 to deliver a purge gas from the fluid source 106. After purging, valve 122 is closed.

Process chamber 132 is pressurized to about 10 bar, heated to a temperature of about 500 ℃, and valves 136 and 160 are closed. The valve 126 is opened to pressurize the process chamber 132 by delivering the process fluid. Therefore, the pressure and temperature of the boiler 130 will decrease. The valve 126 is then closed while the boiler 130 is restored, and the valve 126 is reopened when the pressure of the boiler 130 is approximately equal to the pressure of the process chamber 132.

The valve 126 is closed when the pressure within the process chamber 132 is between about 10 bar. The substrate is processed for a predetermined amount of time and then the valve 136 is opened to depressurize the process chamber 132. The heat exchanger 140 reduces the temperature of the fluid flowing from the process chamber 132 from a temperature of about 500 c to a temperature of about 50 c. The process fluid is condensed in a condenser 150, the condenser 150 being maintained at a temperature of about-20 ℃ and a pressure of about 2 bar. When the pressure within the process chamber 132 has stabilized, the valve 160 is opened and the condensed fluid is delivered to the fluid collection unit 166. One or both of conduits 142 and 154 are opened to remove gas and further depressurize system 100. When the processing chamber 132 has cooled, the processed substrate is removed.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.