阅读说明：本技术 显示面板和电子设备 (Display panel and electronic device ) 是由 长谷川英史 于 2020-01-08 设计创作，主要内容包括：本公开的一种实施方式的显示面板具备平坦化层和形成在平坦化层的表面侧的自发光元件。平坦化层具有第一开口部和第二开口部,第二开口部相比第一开口部形成在显示面板的边缘侧。该显示面板进一步具备1根或多根检测用布线。1根或多根检测用布线形成在与自发光元件的第一电极层同一的层内、与连接于自发光元件的第二电极层的第二布线同一的层内和第一电极层与第二布线之间的层内的任何一个层内,并且形成在第一电极层与平坦化层的第二开口部之间的区域。(A display panel according to one embodiment of the present disclosure includes a planarization layer and a self-light emitting element formed on a surface side of the planarization layer. The planarization layer has a first opening and a second opening, and the second opening is formed on the edge side of the display panel with respect to the first opening. The display panel further includes 1 or more detection wires. The 1 or more detection wirings are formed in any one of the same layer as the first electrode layer of the self-light emitting element, the same layer as the second wiring connected to the second electrode layer of the self-light emitting element, and a layer between the first electrode layer and the second wiring, and are formed in a region between the first electrode layer and the second opening portion of the planarization layer.)

1. A display panel is provided with:

a planarization layer having a first opening and a second opening, the second opening being formed on an edge side of the display panel with respect to the first opening;

a plurality of self-light emitting elements formed on a surface side of the planarization layer and including a first electrode layer, a light emitting layer, and a second electrode layer in this order from the planarization layer side;

a first wiring formed on the back surface side of the planarization layer and connected to the first electrode layer through the first opening;

a second wiring formed on the back surface side of the planarization layer and connected to the second electrode layer through the second opening; and

and 1 or more detection wires formed in the same layer as the first electrode layer, the same layer as the second wires, or a layer between the first electrode layer and the second wires, in a region between the first electrode layer and the second openings, and electrically separated from the first electrode layer, the second electrode layer, the first wires, and the second wires.

2. The display panel of claim 1,

the 1 or more detection wires are formed of the same material as the first electrode layer in the same layer as the first electrode layer.

3. The display panel of claim 1,

further comprises:

a drive circuit which is formed on a back surface side of the planarization layer and drives the plurality of self-light emitting elements; and

a protective layer formed on a back surface side of the planarization layer and covering all or a part of the driver circuit, the first wiring, and the second wiring,

the 1 or more detection wires are formed between the protective layer and the planarization layer.

4. The display panel of claim 1,

further comprises:

a drive circuit which is formed on a back surface side of the planarization layer and drives the plurality of self-light emitting elements; and

a protective layer formed on a back surface side of the planarization layer and covering all or a part of the driver circuit, the first wiring, and the second wiring,

the 1 or more detection wires are formed in the same layer as the second wire.

5. The display panel of claim 4,

the 1 or more detection wires are formed of the same material as the second wire.

6. The display panel according to any one of claim 1 to claim 5,

the 1 or more detection wires are configured to be corroded by moisture and to change in resistance value.

7. The display panel according to any one of claim 1 to claim 6,

the 1 or more detection wires are formed of a metal material containing aluminum.

8. The display panel according to any one of claim 1 to claim 7,

the 1 or more detection wires are formed along an outer edge of the display panel.

9. The display panel according to any one of claim 1 to claim 8,

the second opening portion is provided so as to surround a region including the plurality of self-light emitting elements,

a part of the second electrode layer covers an inner surface of the second opening.

10. An electronic device having a display panel on a display surface,

the display panel has:

a planarization layer having a first opening and a second opening, the second opening being formed on an edge side of the display panel with respect to the first opening;

a plurality of self-light emitting elements formed on a surface side of the planarization layer and including a first electrode layer, a light emitting layer, and a second electrode layer in this order from the planarization layer side;

a first wiring formed on the back surface side of the planarization layer and connected to the first electrode layer through the first opening;

a second wiring formed on the back surface side of the planarization layer and connected to the second electrode layer through the second opening; and

and 1 or more detection wires formed in the same layer as the first electrode layer, the same layer as the second wires, or a layer between the first electrode layer and the second wires, in a region between the first electrode layer and the second openings, and electrically separated from the first electrode layer, the second electrode layer, the first wires, and the second wires.

Technical Field

The present disclosure relates to a display panel and an electronic apparatus.

Background

In a display panel using a self-light emitting element such as an organic E L (Electro L luminescence) element, deterioration of the self-light emitting element occurs due to moisture intrusion from a frame portion of the display panel, and light emission luminance of the self-light emitting element is lowered and light emission is unstable, and since moisture intrusion from the frame portion of the display panel into the self-light emitting element is often required for several hundreds to several thousands hours, it is difficult to detect a display defect before shipment of the display panel and there is a fear that a display defect occurs after shipment.

Disclosure of Invention

However, in the invention described in patent document 1, even if there is practically no possibility of a display failure, the mechanism may detect moisture. Accordingly, it is desirable to provide a display panel capable of detecting with high accuracy a display failure that may occur with the intrusion of moisture from a frame portion, and an electronic apparatus including such a display panel.

A display panel according to one embodiment of the present disclosure includes a planarization layer, a self-light emitting element, a first wiring, a second wiring, and 1 or more detection wirings. The planarization layer has a first opening and a second opening, and the second opening is formed on the edge side of the display panel with respect to the first opening. The self-light emitting element is formed on the surface side of the planarization layer, and includes a first electrode layer, a light emitting layer, and a second electrode layer in this order from the planarization layer side. The first wiring is formed on the back surface side of the planarization layer and is connected to the first electrode layer through the first opening. The second wiring is formed on the back surface side of the planarization layer and is connected to the second electrode layer through the second opening. The 1 or more detection wires are formed in the same layer as the first electrode layer, the same layer as the second wire, or any one of the layers between the first electrode layer and the second wire, and are formed in a region between the first electrode layer and the second opening, and are electrically separated from the first electrode layer, the second electrode layer, the first wire, and the second wire.

An electronic device according to an embodiment of the present disclosure includes a display panel according to an embodiment of the present disclosure on a display surface.

In the display panel and the electronic device according to the embodiment of the present disclosure, 1 or more detection wires are formed in any one of the same layer as the first electrode layer, the same layer as the second wire, and a layer between the first electrode layer and the second wire, and are formed in a region between the first electrode layer and the second opening portion. Thus, for example, in the case where there is a defect such as a crack or a hole in the inorganic insulating film covering the self-light emitting element, if moisture enters from the second opening portion via the defect of the inorganic insulating film, 1 or more detection wires provided closer to the second opening portion than the self-light emitting element will detect the moisture.

According to the display panel and the electronic device of one embodiment of the present disclosure, since 1 or more detection wirings are formed in any one of the same layer as the first electrode layer, the same layer as the second wiring, and a layer between the first electrode layer and the second wiring, and are formed in a region between the first electrode layer and the second opening portion; therefore, the display panel in which moisture enters from the second opening via the defect of the inorganic insulating film and reaches the self-light emitting element, and a display failure is likely to occur can be detected with high accuracy, as compared with the case where the detection wiring is provided in a structure completely different from the structure around the self-light emitting element. The above is an example of the present disclosure. The effects of the present disclosure are not limited to the above, and may be different effects, or may further include other effects.

Drawings

Fig. 1 is an example diagram showing a structure of a display device according to an embodiment of the present disclosure.

Fig. 2 is an illustration showing the pixel driving circuit of fig. 1.

Fig. 3 is an illustration showing a planar structure of the display area of fig. 1.

Fig. 4 is an illustration showing a sectional structure along the line IV-IV of fig. 3.

Fig. 5 is an illustration showing a sectional structure along the line V-V of fig. 3.

Fig. 6 is a diagram showing a variation of the planar structure of the display region of fig. 1.

Fig. 7 is a modified view showing a sectional structure along line IV-IV of fig. 3.

Fig. 8 is a modified view showing a sectional structure along the line V-V of fig. 3.

Fig. 9 is a modified view showing a sectional structure along line IV-IV of fig. 3.

Fig. 10 is a modified view showing a sectional structure along the line V-V of fig. 3.

Fig. 11 is a diagram showing a modification of the planar structure of the display region of fig. 1.

Fig. 12 is a diagram showing a modification of the planar structure of the display region of fig. 1.

Fig. 13 is a diagram showing a modification of the planar structure of the display region of fig. 1.

Fig. 14 is a diagram showing a variation of the planar structure of the display region of fig. 1.

Fig. 15 is an external view showing an electronic device as an application example of the display device.

Description of the symbols

10. 10R, 10G, 10B sub-pixel

10. 10r, 10g, 10b organic E L elements

11 base body

13 anode electrode layer

14 organic layer

16 cathode electrode layer

17 inorganic insulating layer

18 organic insulating layer

19 inorganic insulating layer

20 light emitting part

24 opening defining insulating film

100 display device

110 display panel

110A display area

110B peripheral region

111 substrate

112 pixel driving circuit forming layer

120 driver

121 signal line drive circuit

120A signal line

120B scanning line

122 scanning line driving circuit

124. 125 contact part

126 detection wiring

127 pad electrode

128 moisture blocking part

Opening part of 128A

130 controller

131 control substrate

132 mounting terminal

140 pixel driving circuit

200 electronic device

211G, 221G, 216D, 226D, 216S, 226S metal layer

212 gate insulating film

213. 223 channel layer

213R, 223R channel region

214. 224 channel protective film

215D, 225D drain

215S, 225S source

217 protective layer

218 planarization layer

218A opening

Cs capacitor

GND, Vcc power line

Tr1 drive transistor

Tr2 write transistor

Detailed Description

Embodiments for carrying out the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below all represent preferred specific examples of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions of constituent elements, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the components of the following embodiments, components that are not recited in the independent claims indicating the uppermost concept of the present invention will be described as arbitrary components. Each drawing is a schematic diagram, and the illustration is not necessarily strict. In the drawings, substantially the same components are denoted by the same reference numerals, and redundant description is omitted or simplified. The following description is made in the order described below.

1. Summary of the disclosure

2. Embodiment mode (display device)

3. Modification (display device)

4. Application example (electronic equipment)

<1. summary of the present disclosure >

A display panel according to one embodiment of the present disclosure includes a planarization layer, a self-light emitting element, a first wiring, a second wiring, and 1 or more detection wirings. The planarization layer has a first opening and a second opening, and the second opening is formed on the edge side of the display panel with respect to the first opening. The self-light emitting element is formed on the surface side of the planarization layer, and includes a first electrode layer, a light emitting layer, and a second electrode layer in this order from the planarization layer side. The first wiring is formed on the back surface side of the planarization layer and is connected to the first electrode layer through the first opening. The second wiring is formed on the back surface side of the planarization layer and is connected to the second electrode layer through the second opening.

The 1 or more detection wires are formed in the same layer as the first electrode layer, the same layer as the second wire, or any one of the layers between the first electrode layer and the second wire, and are formed in a region between the first electrode layer and the second opening, and are electrically separated from the first electrode layer, the second electrode layer, the first wire, and the second wire.

In the display panel according to one embodiment of the present disclosure, 1 or more detection wires may be provided in the same layer as the first electrode layer. In this case, 1 or more detection wires may be formed of the same material as the first electrode layer.

The display panel according to one embodiment of the present disclosure may further include a driving circuit formed on a back surface side of the planarization layer and driving the self-light emitting element; the protective layer is formed on the rear surface side of the planarization layer, and covers all or a part of the driver circuit, the first wiring, and the second wiring. In this case, 1 or more detection wires may be formed between the protective layer and the planarizing layer, or may be formed in the same layer as the second wires. In the case where 1 or more detection wires are formed in the same layer as the second wire, the 1 or more detection wires may be formed of the same material as the second wire.

In the display panel according to one embodiment of the present disclosure, 1 or more detection wires have a structure in which a resistance value changes due to moisture. In this case, 1 or more detection wires may be formed of a metal material containing aluminum. In the display panel according to one embodiment of the present disclosure, 1 or more detection wires may be formed along the outer edge of the display panel.

<2 > embodiment mode

[ Structure ]

Fig. 1 shows an example of the overall configuration of a display device 100 according to an embodiment of the present disclosure. The display device 100 includes a display panel 110, a driver 120, and a controller 130. In the display panel 110, a plurality of sub-pixels 10R, 10G, and 10B are arranged in a matrix. The sub-pixel 10R displays red, the sub-pixel 10G displays green, and the sub-pixel 10B displays blue. A plurality of sub-pixels of the same color are arranged in a line in the Y direction, and are sequentially arranged in the X direction in an overlapping manner: a plurality of red sub-pixels 10R aligned in a line in the Y direction, a plurality of green sub-pixels 10G aligned in a line in the Y direction, and a plurality of blue sub-pixels 10B aligned in a line in the Y direction. Therefore, one pixel (display pixel) is constituted by the 3 sub-pixels 10R, 10G, 10B arranged in the X direction. The driver 120 includes a signal line driving circuit 121 and a scanning line driving circuit 122 as drivers for video display.

The signal line driving circuit 121 supplies a signal voltage of a video signal, which corresponds to luminance information and is supplied from the controller 130, to the sub-pixels 10R, 10G, and 10B through the signal line 120A, and the sub-pixels 10R, 10G, and 10B are selected by the scanning line driving circuit 122. The scanning line driving circuit 122 is configured by a shift register or the like that sequentially transmits (transfers) a start pulse in synchronization with a clock pulse supplied from the controller 130. The scanning line driving circuit 122 sequentially supplies scanning signals to the respective scanning lines 120B, thereby scanning the respective sub-pixels 10R, 10G, and 10B in units of a row.

In the display panel 110, a pixel drive circuit 140 is provided, fig. 2 shows an example of the pixel drive circuit 140 (an example of a pixel circuit of the sub-pixels 10R, 10G, 10B), the pixel drive circuit 140 is an active type drive circuit, the pixel drive circuit 140 is formed in a lower layer of an anode electrode layer 13 described later (a pixel drive circuit forming layer 112 described later), specifically, formed on a back side of a planarizing layer 218, the pixel drive circuit 140 has a drive Transistor Tr1 and a write Transistor Tr2, and a capacitor (storage capacitor) Cs. provided therebetween, the pixel drive circuit 140 has, between a power supply line Vcc and a power supply line GND, an organic E L element 10R, an organic E L element 10G or an organic E L element 10B connected in series to the drive Transistor Tr1, the organic E L element 10R emits red light, the organic E L element 10G emits green light, the organic E L element 10B emits blue light, and the organic E L element 10R, the organic E L element 10G and the organic E L element 10G, the organic E L element 10B are generally referred to as top gate drive transistors Tr1, the inverted gate drive Transistor Tr 3985, the organic gate drive Transistor Tr 3970 Tr 3, the TFT (writing Transistor).

In the pixel drive circuit 140, a plurality of signal lines 120A extend in the column direction, and a plurality of scanning lines 120B extend in the row direction. Any 1 of the sub-pixels 10R, 10G, and 10B is provided corresponding to the intersection of each signal line 120A and each scanning line 120B. Each signal line 120A is connected to a signal line drive circuit 121, and the signal line drive circuit 121 supplies an image signal to the source of the write transistor Tr2 through the signal line 120A. Each of the scanning lines 120B is connected to a scanning line drive circuit 122, and the scanning line drive circuit 122 supplies a scanning signal to the gate of the write transistor Tr2 via the scanning line 120B.

[ example of planar Structure of display Panel 110 ]

Fig. 3 shows an example of a planar structure of the display panel 110, fig. 3 schematically shows a planar structure in a state where the cathode electrode layer 16, the inorganic insulating layer 17, the organic insulating layer 18, and the inorganic insulating layer 19 (all described later) are removed, the inorganic insulating layer 17 and the inorganic insulating layer 19 correspond to a specific example of the "protective layer" of the present disclosure, and as shown in fig. 3, in the display region 110A, the plurality of organic E L elements 10 are arranged in the X direction and the Y direction and are arranged in a matrix as a whole, more specifically, the plurality of organic E L elements 10 are separated from each other by an opening defining insulating film 24 (see fig. 4) described later, and 1 light emitting part 20 having a predetermined outline is provided for each of the sub-pixels 10R, 10G, and 10B.

A plurality of mounting terminals 129 are provided on one side of the peripheral region of the display panel 110. The plurality of mounting terminals 129 are electrically connected to the plurality of sub-pixels 10 and fpc (flexible Printed circuits) 132. The controller 130 and the driver 120 are mounted on the control substrate 131, and are electrically connected to the display panel 110 (the plurality of sub-pixels 10) through the FPC 132. The controller 130 and the driver 120 drive the display panel 110 (the plurality of sub-pixels 10) according to a video signal input from the outside.

In fig. 3, the rectangular broken line surrounding the light emitting section 20 indicates the region where the organic layer 14 (see fig. 4) is formed, the rectangular solid line surrounding the region where the organic layer 14 is formed indicates the region where the anode electrode layer 13 is formed, a part of the anode electrode layer 13 is provided in the contact section 124 (opening), the contact section 124 is provided to conduct with the metal layer 216S (first wiring) which is the source of the drive transistor Tr1, the rectangular solid line surrounding the display region 110A indicates the region where the cathode electrode layer 16 is formed, a part of the cathode electrode layer 16 is provided in the contact section 125 (opening), the contact section 125 is provided to conduct with the power supply line GND (second wiring), for example, the outer edge of the contact section 125 and the cathode electrode layer 16 is formed in the peripheral region 110b around the display region 110A, the number of subpixels arranged in the X direction and the Y direction may be arbitrarily set, and is not limited to the number shown in fig. 3, and, for example, subpixels displaying white may be further provided, and the number of subpixels including 1 pixel (354) of organic elements, E, may be set as the number of yellow elements.

[ Cross-sectional Structure of display Panel 110 ]

Fig. 4 shows a schematic structure of a YZ cross section taken along the line IV-IV shown in fig. 3 in the vicinity of the boundary between the display region 110A and the peripheral region 110B. Fig. 5 shows a schematic structure of an XZ cross section along the V-V line of the display region 110A shown in fig. 3.

As shown in fig. 4, in the display region 110A, a light-emitting element formation layer 12 is formed on a substrate 11, in the substrate 11, a pixel drive circuit formation layer 112 is provided on a substrate 111, the light-emitting element formation layer 12 includes a plurality of organic E L elements 10, in each of the organic E L elements 10, an inorganic insulating layer 17, an organic insulating layer 18, and an inorganic insulating layer 19 are provided in this order from the substrate 11 side, a plurality of organic E L elements 10 are formed on the uppermost layer of the pixel drive circuit formation layer 112, that is, on the surface side of a planarization layer 218, and are formed in contact with the surface of the planarization layer 218, a plurality of organic E L elements 10 are formed so as to include an anode electrode layer 13, an organic layer 14, and a cathode electrode layer 16 in this order from the planarization layer 218, the organic E L elements 10 are separated by an opening defining insulating film 24, the planarization layer 218 and the opening defining insulating film 24 are each made of a resin material having a good pattern accuracy, for example, polyimide, acrylic, or silicone, on the other hand, the cathode electrode layer 16 is provided in common to all the organic E2 elements 10, 387, and the pixel drive circuit formation layer 112, the pixel drive circuit formation Tr 64, is omitted from the detailed illustration of the.

The base 11 is formed by providing a pixel drive circuit forming layer 112 including a pixel drive circuit 140 on a substrate 111, the substrate 111 is a support on which a plurality of organic E L elements 10 are arranged and is formed of, for example, quartz, glass, metal foil, or a film or sheet made of resin, the material of the substrate 111 is preferably quartz or glass, the material of the resin material for the substrate 111 is, for example, a methacrylic resin represented by polymethyl methacrylate (PMMA), polyester such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), or polycarbonate resin, and in the case where the substrate 111 is formed of a film or sheet made of resin, the film or sheet made of resin is preferably a laminated structure in which water permeability and air permeability are suppressed, or the film or sheet made of resin is subjected to a surface treatment in which water permeability and air permeability are suppressed, and the surface of the film or sheet made of resin is covered with, for example, a metal layer 211G as a gate electrode of the drive transistor Tr1, a metal layer 221G as a gate electrode of the write transistor Tr2 (fig. 5, 221G), a silicon nitride insulating film, 212G, or the like.

Channel layers 213 and 223 made of a semiconductor thin film such as amorphous silicon are provided in regions corresponding to the metal layers 211G and 221G on the gate insulating film 212. Insulating channel protective films 214 and 224 are provided on the channel layers 213 and 223, and the channel protective films 214 and 224 occupy channel regions 213R and 223R, which are central regions of the channel layers 213 and 223. In regions on both sides of the channel protective films 214 and 224, drains 215D and 225D and sources 215S and 225S each formed of an n-type semiconductor thin film such as n-type amorphous silicon are provided. The drain electrodes 215D, 225D and the source electrodes 215S, 225S are separated from each other by channel protective films 214, 224, respectively, and end faces of the drain electrodes 215D, 225D and the source electrodes 215S, 225S are separated from each other by channel regions 213R, 223R, respectively. Also, metal layers 216D, 226D as drain wirings and metal layers 216S, 226S as source wirings are provided so as to cover the drains 215D, 225D and the sources 215S, 225S, respectively. The metal layers 216D, 226D and the metal layers 216S, 226S have a structure in which, for example, a titanium (Ti) layer, an aluminum (Al) layer, and a titanium layer are sequentially stacked. The metal layer 216S is connected to a connection wiring in the peripheral region 110B, and the connection wiring is connected to the outside of an FPC or the like.

The pixel drive circuit 140 is entirely covered with a protective layer (passivation film) 217, and the protective layer 217 is made of, for example, silicon oxide (SiO)_x) Silicon nitride (SiN)_x) Silicon oxynitride (SiN)_xO_y) Titanium oxide (TiO)_x) Or aluminum oxide (Al)_xO_y) And inorganic materials having low moisture permeability. A protective layer 217 is formed on the back surface side of the planarization layer 218, covering the pixel driving circuit 140, the metal layer 216S, and the power supply line GND. On the protective layer 217, a planarization layer 218 having an insulating property is provided. The planarization layer 218 preferably has extremely high planarity on its surface. Further, minute contact portions 124 and 125 (opening portions) are provided on the planarizing layer 218 and the protective layer 217 (fig. 4). The contact portion 125 is formed on the edge side of the display panel 110 than the contact portion 124. The contact portion 124 (first opening) is filled with a part of the anode electrode layer 13, and the anode electrode layer 13 is electrically connected to the metal layer 216S (first wiring) constituting the source of the drive transistor Tr1 through the contact portion 124. The contact portion 125 (second opening) is filled with a part of the cathode electrode layer 16, and the cathode electrode layer 16 is electrically connected to the power supply line GND (second wiring) through the contact portion 125. The power supply line GND is connected to a connection wiring connected to the outside of the FPC or the like in the peripheral region 110B.

The anode electrode layer 13 formed on the surface side of the planarization layer 218 also functions as a reflective layer. Therefore, in view of improving the light emission efficiency, the anode electrode layer 13 is preferably composed of a material having a high reflectance as much as possible. For this purpose, the anode electrode layer 13 may be made of, for example, aluminum (Al) or a metal material containing aluminum (Al). As the metal material for the anode electrode layer 13, there can be mentioned: for example, aluminum neodymium alloy (AlNd), aluminum nickel alloy (AlNi), aluminum indium alloy (AlIn), and the like. The anode electrode layer 13 may be formed of, for example: a laminate of an aluminum layer and a neodymium layer is stacked in this order from the planarizing layer 218 side, a laminate of an aluminum layer and a nickel layer is stacked in this order from the planarizing layer 218 side, or a laminate of an aluminum layer and an indium layer is stacked in this order from the planarizing layer 218 side.

In the peripheral area 110B, a moisture blocking portion 128 is provided so as to surround the display area 110A. Moisture blocking portion 128 includes opening 218A and a part of cathode electrode layer 16, and in opening 218A, planarizing layer 218 is removed so as to surround display region 110A; a part of cathode electrode layer 16 covers the inner surface of opening 218A (the end surface of planarizing layer 218 exposed from opening 218A). The moisture blocking portion 128 can prevent moisture from entering the display region 110A from the outer edge portion of the peripheral region 110B through the planarizing layer 218. Here, the opening provided in the planarization layer 218 in the contact portion 125 corresponds to the opening 218A. Therefore, the contact portion 125 and the power supply line GND are provided so as to surround the display region 110A, similarly to the opening portion 218A; cathode electrode layer 16 is in contact with power supply line GND so as to surround display region 110A in peripheral region 110B.

The thickness of the anode electrode layer 13 in the stacking direction (hereinafter simply referred to as thickness) is, for example, 10nm to 1000 nm. The material of the anode electrode layer 13 is not limited to the above-described material. The anode electrode layer 13 may be made of a single metal or an alloy of metal elements such as chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), and silver (Ag). The anode electrode layer 13 may have a stacked-layer structure of a metal film made of a single metal element or an alloy of metal elements such as chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), or silver (Ag), and a transparent conductive film made of a compound of Indium Tin Oxide (ITO), InZnO (indium zinc oxide), zinc oxide (ZnO), and aluminum (Al).

The opening defining insulating film 24 is provided to fill in the gap between the anode electrode layer 13 and the organic layer 14 of the adjacent organic E L element 10, that is, the gap between the light emitting parts 20, and the opening defining insulating film 24 is also called a partition wall, which ensures insulation between the anode electrode layer 13 and the cathode electrode layer 16 and accurately defines the outline of the light emitting part 20 of the organic E L element 10, that is, defines a light emitting region by the opening defining insulating film 24.

The organic layer 14 is formed without a gap over the entire surface of the light emitting section 20 defined by the opening defining insulating film 24. The organic layer 14 is a structure in which, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in this order from the planarization layer 218 side. The hole injection layer, the hole transport layer, the electron transport layer, or the electron injection layer may be omitted as needed.

The cathode electrode layer 16 is a common electrode provided to be shared by all the organic E L elements 10, and faces the anode electrode layer 13 of each organic E L element 10, the cathode electrode layer 16 covers not only the organic layer 14 but also the opening defining insulating film 24 and has a thickness of, for example, 2nm to 15nm, the cathode electrode layer 16 is a transparent electrode made of a conductive material that is transparent to light generated by the organic layer 14, and therefore, ITO, a compound containing indium, zinc (Zn), oxygen (e.g., IZO), ZnO (zinc oxide), and the like are preferable as a constituent material of the cathode electrode layer 16, the cathode electrode layer 16 may be a semi-permeable reflective film made of a single or an alloy of a metal element such as aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na), and the like, the cathode electrode layer 16 may be made of, for example, a magnesium-silver alloy (MgAg alloy) or an aluminum (Al) lithium (L i) alloy (Al L i alloy).

In the display panel 110, 1 or more detection wires 126 are provided in the same layer as the anode electrode layer 13 and in a region between the anode electrode layer 13 and the contact portion 125 (moisture blocking portion 128). In fig. 3, 4, and 5, the following are illustrated: in the same layer as the anode electrode layer 13, 1 detection wire 126 is provided in a region between the anode electrode layer 13 and the contact portion 125 (moisture blocking portion 128). The 1 or more detection wires 126 are formed along the outer edge of the display panel 110, for example, so as to surround the display region 110A of the display panel 110. To each of both ends of 1 or more detection wires 126, 1 pad electrode 127 formed in the peripheral region 110B of the display panel 110 is connected. The 1 or more detection wires 126 are electrically separated from the anode electrode layer 13, the cathode electrode layer 16, the metal layer 216S, and the power supply line GND.

In the present embodiment, the detection wiring 126 is formed along the outer edge of the display panel 110 from both ends of the mounting terminal 129. The detection wiring 126 may be formed not along the side where the mounting terminal 129 is arranged but only along the other 3 sides. When the direction in which the display panel 110 may be bent is predetermined, stress is applied to a side perpendicular to the bending direction, and the inorganic insulating layers 17 and 19 are likely to be broken. Therefore, in this case, the detection wiring 126 may be formed only on one side orthogonal to the direction in which the display panel 110 may be bent. In the case where there is a possibility that the display panel 110 is bent in a direction parallel to the side on which the mounting terminals 129 are provided, for example, the detection wires 126 may be provided on the side parallel to the side on which the mounting terminals 129 are provided without the mounting terminals 129, as shown in fig. 6.

In the present embodiment, 1 or more detection wires 126 are formed in the same layer as the anode electrode layer 13, and are formed of, for example, the same material as the anode electrode layer 13. The 1 or more detection wires 126 are configured to change in resistance value due to corrosion caused by moisture. In a structure in which the resistance value changes due to corrosion caused by moisture, a metal material containing aluminum (Al) is used. The 1 or more detection wires 126 are formed of, for example, aluminum neodymium alloy (AlNd), aluminum nickel alloy (AlNi), aluminum indium alloy (AlIn), or the like. The 1 or more detection wires 126 are, for example, a laminate in which an aluminum layer and a neodymium layer are laminated in this order from the planarization layer 218 side. The 1 or more detection wires 126 may be formed of, for example, a laminate in which an aluminum layer and a nickel layer are laminated in this order from the side of the planarizing layer 218. The 1 or more detection wires 126 may be formed of, for example, a laminate in which an aluminum layer and an indium layer are laminated in this order from the planarizing layer 218 side.

Covering with organic E LThe inorganic insulating layer 17 and the inorganic insulating layer 19 of the element 10 are made of, for example, silicon oxide (SiO)_x) Silicon nitride (SiN)_x) Silicon oxynitride (SiN)_xO_y) Titanium oxide (TiO)_x) Or aluminum oxide (Al)_xO_y) The inorganic insulating layer 17 and the inorganic insulating layer 19 are formed substantially in the same manner so as to cover not only the cathode electrode layer 16 but also the opening defining insulating film 24 and the planarizing layer 218, that is, the inorganic insulating layer 17 and the inorganic insulating layer 19 continuously cover the organic E L element 10, the opening defining insulating film 24, and the planarizing layer 218 from the display region 110A to the peripheral region 110B, however, in the peripheral region 110B, the inorganic insulating layer 17 and the inorganic insulating layer 19 are formed of organic materials having high moisture absorption, as described above, since it is necessary to prevent the moisture from penetrating into the interior of the organic E L element 10 by the organic insulating layer 24 and the planarizing layer 218, in the case where the opening defining insulating film 24 is not present in the peripheral region 110B, the inorganic insulating layer 17 and the planarizing layer 218 are formed of organic materials having high moisture absorption, and the inorganic insulating layer 17 and the inorganic insulating layer 19 may be formed of a single layer, or a plurality of inorganic insulating layers 17 and 19 may be formed of inorganic insulating layers, respectively, in order to alleviate the inorganic insulating layer 17 and the inorganic insulating layer 17.

The organic insulating layer 18 is a transparent resin layer formed substantially uniformly on the inorganic insulating layer 17, and is sandwiched between the inorganic insulating layer 17 and the inorganic insulating layer 19. The organic insulating layer 18 is made of, for example, an epoxy resin, an acrylic resin, or the like, and preferably made of a thermosetting resin, an ultraviolet curable resin, or the like.

Further, a sealing substrate may be provided on the organic insulating layer 18, for example, with an adhesive layer or the like interposed therebetween, the sealing substrate sealing the organic E L element 10, and the sealing substrate may be made of a material such as transparent glass having high transmittance for each color light emitted from the sub pixel 10R, the sub pixel 10G, and the sub pixel 10B.

[ Effect ]

Next, the effects of the display panel 110 of the present embodiment will be described.

In general, in a display panel using organic E L elements, moisture enters from the frame portion of the display panel, and the deterioration of the organic E L elements occurs, and the light emission luminance of the organic E L elements is lowered, and the light emission is unstable, and since moisture enters from the frame portion of the display panel into the organic E L elements, it takes several hundreds to several thousands of hours, and therefore, it is not easy to detect a display failure before shipment of the display panel, and there is a fear that a display failure occurs after shipment, and therefore, a mechanism for detecting moisture entering from the frame portion of the display panel is mounted on the display panel, and a display panel having a possibility of a display failure occurring after shipment is detected (for example, see patent document 1 above), but in the invention described in patent document 1, even if a display failure is not actually occurring, the mechanism can detect moisture.

On the other hand, in the present embodiment, 1 or a plurality of detection wires 126 are formed in the same layer as the anode electrode layer 13 and in the region between the anode electrode layer 13 and the contact portion 125 (moisture blocking portion 128), whereby, for example, in the case where there is a defect such as a crack or a hole in the inorganic insulating layer 17 and the inorganic insulating layer 19 covering the organic E L element 10, if moisture penetrates through the defect of the inorganic insulating layer 17 and the inorganic insulating layer 19 and through the contact portion 125 (moisture blocking portion 128), 1 or a plurality of detection wires 126 provided closer to the contact portion 125 (moisture blocking portion 128) than the organic E L element 10 will detect the moisture, as shown in fig. 3, in the case where 1 detection wire 126 is disposed around the display region 110A of the display panel 110, if the detection wire 126 starts to melt due to moisture, the detection wire 126 is broken, and the detection wire 126 is able to detect the moisture, and as a result, the resistance between 2 pad electrodes 127 is greatly increased as compared to the case where the detection wire 126 is not broken, the detection wire 126 is able to be provided in the case where the detection wire 126 is completely different from the display region where the moisture penetrating through the display region 125 and the display panel 10, the display element 125 is able to have a high accuracy, and the detection wire 6335, and the detection wire structure is set up to detect moisture in the display panel 10.

In the present embodiment, if 1 or more detection wires 126 are formed of the same material as the anode electrode layer 13 in the same layer as the anode electrode layer 13, 1 or more detection wires 126 and the anode electrode layer 13 can be formed at one time in the manufacturing process. Thus, a display panel having a high possibility of occurrence of a display failure can be detected with high accuracy without increasing the manufacturing cost.

In the present embodiment, 1 or more detection wires 126 have a structure in which the resistance value changes due to moisture, and specifically, when 1 or more detection wires 126 are formed of a metal material containing aluminum, if 1 or more detection wires 126 come into contact with moisture, aluminum contained in 1 or more detection wires 126 is melted in the moisture due to the moisture. Thus, the resistance of 1 or more detection wires 126 changes; therefore, by detecting the resistance change, the display panel having a high possibility of occurrence of a display failure can be detected with high accuracy.

In the present embodiment, 1 or more detection wires 126 are formed along the outer edge of the display panel 110. This enables the water entering from the end of the display panel 110 to be detected with high accuracy.

<3. modification >

[ modification A ]

In the above embodiment, as shown in fig. 7 and 8, for example, when there is a defect such as a crack or a hole in the inorganic insulating layer 17 and the inorganic insulating layer 19 covering the organic E L element 10, if moisture enters through the contact portion 125 (moisture blocking portion 128) via the defect in the inorganic insulating layer 17 and the inorganic insulating layer 19, the 1 or more detection wires 126 provided closer to the contact portion 125 than the organic E L element 10 detect the moisture, and as a result, the display panel in which the moisture reaches the organic E L element 10 via the defect in the inorganic insulating layer 17 and the inorganic insulating layer 19 and the contact portion 125 (moisture blocking portion 128) and a display failure occurs can be detected with high accuracy as compared with the case where the detection wires are provided in a structure completely different from the structure around the organic E L element 10.

[ modification B ]

In the above embodiment, 1 or more detection wires 126 may be formed in the same layer as the power supply line GND as shown in fig. 9 and 10, and thus, for example, when there is a defect such as a crack or a hole in the inorganic insulating layer 17 and the inorganic insulating layer 19 covering the organic E L element 10, if moisture enters through the defect of the inorganic insulating layer 17 and the inorganic insulating layer 19 and through the contact portion 125 (moisture blocking portion 128), 1 or more detection wires 126 provided closer to the contact portion 125 than the organic E L element 10 will detect the moisture, and as a result, a display panel in which moisture reaches the organic E L element 10 through the defect of the inorganic insulating layer 17 and the inorganic insulating layer 19 and through the contact portion 125 (moisture blocking portion 128) and a display defect occurs can be detected with high accuracy as compared to a case where a detection wire is provided in a structure completely different from the structure around the organic E L element 10.

In addition, in the present modification, if 1 or more detection wires 126 are formed of the same material as the power supply line GND in the same layer as the power supply line GND, 1 or more detection wires 126 and the power supply line GND can be formed at one time in the manufacturing process. Thus, a display panel having a high possibility of occurrence of a display failure can be detected with high accuracy without increasing the manufacturing cost.

[ modification C ]

In the above-described embodiment and modification A, B, a plurality of detection wires 126 may be provided in parallel with each other. In this case, as shown in fig. 11, in the 2 detection wires 126 arranged in parallel with each other, 1 pad electrode 127 may be connected to one end portion, respectively, and the other end portions may be connected to each other. At this time, if the detection wiring 126 starts to melt due to moisture, the detection wiring 126 is disconnected; the resistance between the 2 pad electrodes 127 is significantly larger than that when the detection wiring 126 is not disconnected. This makes it possible to detect the intrusion of moisture.

In the present modification, when the direction in which the display panel 110 may be bent is predetermined, stress is applied to the side orthogonal to the bending direction, and the inorganic insulating layers 17 and 19 are likely to be chipped. Therefore, in this case, the detection wiring 126 may be formed only on one side orthogonal to the direction in which the display panel 110 may be bent. In the case where there is a possibility that the display panel 110 is bent in a direction parallel to the side on which the mounting terminals 129 are provided, for example, the detection wires 126 may be provided on the side parallel to the side on which the mounting terminals 129 are provided without the mounting terminals 129, as shown in fig. 12.

As shown in fig. 13, in the 2 detection wires 126 arranged in parallel with each other, 1 pad electrode 127 may be connected to each of both end portions. At this time, if the detection wires 126 start to melt due to moisture and the melted wire material (e.g., aluminum) causes a short circuit between 2 detection wires 126 arranged in parallel with each other; the resistance between the 2 pad electrodes 127 is significantly reduced compared to the case where there is no short circuit between the 2 detection wirings 126 arranged in parallel. This makes it possible to detect the intrusion of moisture.

As shown in fig. 14, of the 2 detection wires 126 arranged in parallel with each other, one end may be open, and the other end may be connected to 1 pad electrode 127. At this time, if the detection wires 126 start to melt due to moisture and the melted wire material (e.g., aluminum) causes a short circuit between 2 detection wires 126 arranged in parallel with each other; the resistance between the 2 pad electrodes 127 is significantly reduced compared to the case where there is no short circuit between the 2 detection wirings 126 arranged in parallel. This makes it possible to detect the intrusion of moisture.

[ modification D ]

In the above embodiment and modification A, B, C, a light-emitting layer which emits light may be provided instead of the organic layer 14, and a self-light-emitting element may be provided instead of the organic E L element 10.

<4. application example >

Hereinafter, an application example of the display panel 110 according to the above embodiment and the modification thereof will be described. The display panel 110 of the above-described embodiment and its modified examples can be applied to electronic devices in all fields, such as mobile terminal devices including televisions, digital cameras, notebook personal computers, tablet personal computers, and cellular phones, and video cameras, which display video signals input from the outside or video signals generated inside in the form of images or videos.

Fig. 15 is an external perspective view showing an electronic device 200 according to the present application example. The electronic device 200 is, for example, a sheet-like personal computer having a display surface 220 on a main surface of a casing 210. The electronic device 200 includes the display device 100 according to the above-described embodiment and the modification thereof on the display surface 220, and the display device 100 according to the above-described embodiment and the modification thereof is disposed so that the image display surface faces the outside. In the present application example, since the display device 100 according to the above-described embodiment and the modification thereof is provided on the display surface 220, the electronic apparatus 200 in which dark spots are less likely to occur in the display device 100 can be obtained.

Although the present disclosure has been described above by way of a plurality of embodiments and application examples, the present disclosure is not limited to the embodiments and the like, and various changes may be made. The effects described in this specification are merely examples. The effects of the present disclosure are not limited to the effects described in the present specification. The present disclosure may have effects other than those described in the present specification.

In addition, the present disclosure can also adopt the following configuration.

(1)

A display panel is provided with:

a planarization layer having a first opening and a second opening, the second opening being formed on an edge side of the display panel with respect to the first opening;

a plurality of self-light emitting elements formed on a surface side of the planarization layer and including a first electrode layer, a light emitting layer, and a second electrode layer in this order from the planarization layer side;

a first wiring formed on the back surface side of the planarization layer and connected to the first electrode layer through the first opening;

a second wiring formed on the back surface side of the planarization layer and connected to the second electrode layer through the second opening; and

and 1 or more detection wires formed in the same layer as the first electrode layer, the same layer as the second wires, or a layer between the first electrode layer and the second wires, in a region between the first electrode layer and the second openings, and electrically separated from the first electrode layer, the second electrode layer, the first wires, and the second wires.

(2)

The display panel of (1), wherein,

the 1 or more detection wires are formed of the same material as the first electrode layer in the same layer as the first electrode layer.

(3)

The display panel of (1), wherein,

further comprises:

a drive circuit which is formed on a back surface side of the planarization layer and drives the plurality of self-light emitting elements; and

a protective layer formed on a back surface side of the planarization layer and covering all or a part of the driver circuit, the first wiring, and the second wiring,

the 1 or more detection wires are formed between the protective layer and the planarization layer.

(4)

The display panel of (1), wherein,

further comprises:

a drive circuit which is formed on a back surface side of the planarization layer and drives the plurality of self-light emitting elements; and

a protective layer formed on a back surface side of the planarization layer and covering all or a part of the driver circuit, the first wiring, and the second wiring,

the 1 or more detection wires are formed in the same layer as the second wire.

(5)

The display panel of (4), wherein,

the 1 or more detection wires are formed of the same material as the second wire.

(6)

The display panel of any one of the (1) to (5), wherein,

the 1 or more detection wires are configured to be corroded by moisture and to change in resistance value.

(7)

The display panel of any one of the (1) to (6), wherein,

the 1 or more detection wires are formed of a metal material containing aluminum.

(8)

The display panel of any one of the (1) to (7), wherein,

the 1 or more detection wires are formed along an outer edge of the display panel.

(9)

The display panel of any one of the (1) to (8), wherein,

the second opening portion is provided so as to surround a region including the plurality of self-light emitting elements,

a part of the second electrode layer covers an inner surface of the second opening.

(10)

An electronic device having a display panel on a display surface,

the display panel has:

a planarization layer having a first opening and a second opening, the second opening being formed on an edge side of the display panel with respect to the first opening;

a plurality of self-light emitting elements formed on a surface side of the planarization layer and including a first electrode layer, a light emitting layer, and a second electrode layer in this order from the planarization layer side;

a first wiring formed on the back surface side of the planarization layer and connected to the first electrode layer through the first opening;

a second wiring formed on the back surface side of the planarization layer and connected to the second electrode layer through the second opening; and

and 1 or more detection wires formed in the same layer as the first electrode layer, the same layer as the second wires, or a layer between the first electrode layer and the second wires, in a region between the first electrode layer and the second openings, and electrically separated from the first electrode layer, the second electrode layer, the first wires, and the second wires.

The present disclosure contains subject matter relating to the disclosure in japanese priority patent application JP2019-005922 filed in the japanese patent office on 1, 17, 2019, the entire content of which is incorporated herein by reference.

It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible in light of design requirements and other factors, but are intended to be included within the scope of the appended claims or their equivalents.