阅读说明：本技术 一种具有良好热稳定性的保温板材 (Thermal insulation board with good thermal stability ) 是由 祝春夏 肖杰 于 2020-05-29 设计创作，主要内容包括：本发明公开一种具有良好热稳定性的保温板材,包括以下重量份的原料：90-110份改性酚醛树脂、10-13份氢氧化铝、10-15份沸石粉、20-24份聚乙二醇、4-6份羟丙基甲基纤维素醚；以改性酚醛树脂为基体,采用改性剂对酚醛树脂进行改性,具体为：首先,以1,1,3,3,5,5,7,7,9,9,11,11-十二甲基六硅氧烷和4-溴-1-丁烯为原料,在氯铂酸的催化下,发生硅氢加成反应,制备得到了改性剂,接着在碱催化剂碳酸铯的催化下,改性剂与酚醛树脂发生醚化反应,即得到了改性酚醛树脂,醚化降低了酚醛树脂的酸性,提高了酚醛树脂的韧性,另外,酚醛树脂上引入了高键能的有机硅,Si-O键的键能高于C-C键,进一步的提高了酚醛树脂的热稳定性,进而提高了改性酚醛树脂保温板材的耐高温性能。(The invention discloses a heat-insulation board with good thermal stability, which comprises the following raw materials in parts by weight: 90-110 parts of modified phenolic resin, 10-13 parts of aluminum hydroxide, 10-15 parts of zeolite powder, 20-24 parts of polyethylene glycol and 4-6 parts of hydroxypropyl methyl cellulose ether; the modified phenolic resin is used as a matrix, and is modified by a modifier, and the method specifically comprises the following steps: firstly, 1,3,3,5,5,7,7,9,9,11, 11-dodecamethylhexasiloxane and 4-bromo-1-butene are used as raw materials, hydrosilylation reaction is carried out under the catalysis of chloroplatinic acid to prepare a modifier, and then etherification reaction is carried out between the modifier and phenolic resin under the catalysis of an alkali catalyst cesium carbonate to obtain the modified phenolic resin, so that the acidity of the phenolic resin is reduced by etherification, the toughness of the phenolic resin is improved, in addition, organic silicon with high bond energy is introduced into the phenolic resin, the bond energy of an Si-O bond is higher than that of a C-C bond, the thermal stability of the phenolic resin is further improved, and the high temperature resistance of the modified phenolic resin insulation board is further improved.)

1. The utility model provides an insulation board with good heat stability which characterized in that: the feed comprises the following raw materials in parts by weight: 90-110 parts of modified phenolic resin, 10-13 parts of aluminum hydroxide, 10-15 parts of zeolite powder, 20-24 parts of polyethylene glycol and 4-6 parts of hydroxypropyl methyl cellulose ether.

2. An insulation board with good thermal stability as claimed in claim 1, wherein: the preparation method of the modified phenolic resin specifically comprises the following steps:

the reaction process is as follows:

s1 preparation of modifier

Weighing 100mmol of 1,1,3,3,5,5,7,7,9,9,11, 11-dodecamethylhexasiloxane and 205 + 210mmol of 4-bromo-1-butene, adding the mixture into a reaction kettle to neutralize 1L of isopropanol as a solvent, stirring and dissolving, introducing nitrogen for protection, then adding a metal platinum catalyst, continuously introducing nitrogen for keeping for 15-20min until air in the reaction kettle is completely replaced, closing the nitrogen, heating to 80-90 ℃ while stirring, carrying out hydrosilylation reaction for 9-12h, and after the reaction is finished, carrying out reduced pressure distillation to remove the solvent and unreacted 4-bromo-1-butene as a raw material, thus obtaining the modifier shown in the formula Q1;

s2 preparation of modified phenolic resin

Weighing 16-19g of modifier Q1, 120 g of solid phenolic resin powder and 140g of solvent tert-amyl alcohol 2L, adding into a reaction kettle, stirring and dissolving completely, adding an alkali catalyst, stirring and heating to 85-95 ℃ after adding, keeping the temperature for reaction for 4-6h, naturally cooling to room temperature after reaction, performing suction filtration, washing with water, and drying to obtain the modified phenolic resin shown in the formula Q.

3. An insulation board with good thermal stability as claimed in claim 2, wherein: in step S1, the metal platinum catalyst is chloroplatinic acid, and the addition amount of the chloroplatinic acid is 15-20 mmol.

4. An insulation board with good thermal stability as claimed in claim 2, wherein: in step S1, the hydrosilylation reaction time is 9 to 12 hours.

5. An insulation board with good thermal stability as claimed in claim 2, wherein: in step S2, the alkali catalyst is cesium carbonate, and the addition amount of the cesium carbonate is 6.5 to 8 g.

Technical Field

The invention belongs to the technical field of materials, and particularly relates to a heat-insulating plate with good thermal stability.

Background

The resin with high heat resistance and high char yield is widely applied to the fields of ablation-resistant composite materials, carbon/carbon composite materials, high-temperature braking materials, friction materials, heat-insulating materials, adhesives, coatings and the like. The phenolic resin is used as one of three synthetic thermosetting resins, and has irreplaceable status in the fields of aerospace, military equipment, electronic and electrical appliances, transportation, manufacturing industry and the like due to the easily available raw materials, low cost, simple production process, low investment on manufacturing and processing equipment, good heat resistance, flame retardance, electrical insulation and chemical resistance, and is still used as a matrix resin of a composite material so far and is also an ablation-resistant material which is widely applied at present. However, the disadvantages of phenolic resins are also apparent. In addition to poor toughness, phenolic resin releases a large amount of small molecules during curing and has poor fluidity, so that the phenolic resin-based composite material needs higher curing temperature and pressure during curing and forming, and particularly when the phenolic resin-based composite material is used as an ablation-resistant material and a carbon/carbon composite material precursor, the lower thermal decomposition temperature and the carbon forming rate are difficult to satisfy.

The phenolic resin thermal insulation material belongs to an organic thermosetting efficient thermal insulation material, and particularly, the technical performance of the applied thermal insulation material is higher and the market demand is larger and larger as the energy saving rate of buildings is gradually improved in recent years. In the application of heat-insulating materials for building, not only the physical and technical properties are required to be high, but also the fire-proof performance must be achieved. The phenolic resin thermal insulation material produced by the phenolic resin has good fire penetration resistance, high temperature resistance and low smoke performance, but the phenolic resin thermal insulation material has the biggest defects of high brittleness and high acidity. Because the phenolic resin has low thermal decomposition temperature and low char yield, the inherent excellent fireproof performance cannot be well utilized, thereby influencing the expansion of the application technology of the product and bringing much inconvenience to transportation and construction. Because of the large acidity, the phenolic resin heat-insulating material can have certain corrosivity when contacting with metal and cement-based materials, and the application range of the phenolic resin heat-insulating material is limited.

Disclosure of Invention

The invention aims to provide a heat-insulating plate with good thermal stability.

The purpose of the invention can be realized by the following technical scheme:

a heat insulation board with good thermal stability comprises the following raw materials in parts by weight: 90-110 parts of modified phenolic resin, 10-13 parts of aluminum hydroxide, 10-15 parts of zeolite powder, 20-24 parts of polyethylene glycol and 4-6 parts of hydroxypropyl methyl cellulose ether.

Further, the preparation method of the modified phenolic resin specifically comprises the following steps:

the reaction process is as follows:

s1 preparation of modifier

Weighing 1 mmol, 1,3,3,5,5,7,7,9,9,11, 11-dodecamethylhexasiloxane and 210mmol of 205-bromo-1-butene, adding into a reaction kettle to neutralize 1L of isopropanol as a solvent, stirring and dissolving, introducing nitrogen for protection, then adding a metal platinum catalyst, continuing introducing nitrogen for keeping for 15-20min until air in the reaction kettle is completely replaced, closing the nitrogen, heating to 80-90 ℃ while stirring, carrying out hydrosilylation for 9-12h, and after the reaction is finished, carrying out reduced pressure distillation to remove the solvent and the unreacted 4-bromo-1-butene as a raw material, thus obtaining the modifier represented by the formula Q1;

s2 preparation of modified phenolic resin

Weighing 16-19g of modifier Q1, 120 g of solid phenolic resin powder and 140g of solvent tert-amyl alcohol 2L, adding into a reaction kettle, stirring and dissolving completely, adding an alkali catalyst, stirring and heating to 85-95 ℃ after adding, keeping the temperature for reaction for 4-6h, naturally cooling to room temperature after reaction, performing suction filtration, washing with water, and drying to obtain the modified phenolic resin shown in the formula Q.

Further, in step S1, the metal platinum catalyst is chloroplatinic acid, and the amount of the added chloroplatinic acid is 15 to 20 mmol.

Further, in step S1, the hydrosilylation reaction time is 9 to 12 hours.

Further, in step S2, the alkali catalyst is cesium carbonate, and the addition amount of cesium carbonate is 6.5 to 8 g.

The invention has the beneficial effects that:

the invention provides a heat insulation board with good thermal stability, which takes modified phenolic resin as a matrix and adopts a modifier to modify the phenolic resin, and specifically comprises the following steps: firstly, 1,3,3,5,5,7,7,9,9,11, 11-dodecamethylhexasiloxane and 4-bromo-1-butene are used as raw materials, hydrosilylation reaction is carried out under the catalysis of a metal platinum catalyst chloroplatinic acid to prepare a modifier, and then the modifier and phenolic resin are subjected to etherification reaction under the catalysis of an alkali catalyst cesium carbonate to obtain the modified phenolic resin, wherein the etherification reduces the acidity of the phenolic resin and improves the toughness of the phenolic resin.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.