阅读说明：本技术 显示面板及其制作方法、显示装置 (Display panel, manufacturing method thereof and display device ) 是由 刘俊领 于 2020-05-14 设计创作，主要内容包括：本申请提出了一种显示面板,其包括：微型发光二极管,微型发光二极管包括主体及自主体的周缘向外延伸的延伸部；阵列基板,微型发光二极管安装于阵列基板；封胶层,封胶层位于阵列基板上,并覆盖微型发光二极管的延伸部。(The application provides a display panel, it includes: the micro light-emitting diode comprises a main body and an extension part which extends outwards from the periphery of the main body; the array substrate is provided with the micro light-emitting diodes; and the sealing adhesive layer is positioned on the array substrate and covers the extension part of the micro light-emitting diode.)

1. A display panel, comprising:

the micro light-emitting diode comprises a main body and an extension part extending outwards from the periphery of the main body;

the array substrate is provided with the micro light-emitting diodes;

and the sealing adhesive layer is positioned on the array substrate and covers the extension part of the micro light-emitting diode.

2. The display panel of claim 1, wherein the extension is proximate to a bottom of the body adjacent to the array substrate.

3. The display panel of claim 2, wherein a thickness of a first side of the extension portion proximate to the main body portion is less than a thickness of a second side of the extension portion distal from the main body portion.

4. The display panel of claim 3, wherein the extension portion comprises a connection portion connected to the bottom of the main body and extending outward and a thickening member located on the connection portion, the thickening member is close to the second side, and the sealant layer covers the connection portion and the thickening member.

5. The display panel of claim 4, wherein the micro light emitting diode includes a chip portion, the chip portion includes the extension portion and the main body, the main body includes a bottom plate and an electrode on the bottom plate, the connection portion of the extension portion is connected to the bottom plate and extends outward, and the electrode is made of the same material as the thickened portion of the extension portion.

6. The display panel according to claim 4, wherein the micro light emitting diode includes a chip part and a package part packaging the chip part, wherein the chip part includes the main body and the package part includes the extension part, or wherein the chip part includes the main body and the connection part of the extension part and the package part includes the thickening of the extension part.

7. The display panel according to claim 3, wherein a thickness of the extension portion increases in a direction from the first side toward the second side.

8. The display panel of claim 1, wherein the body includes a top portion distal from the array substrate, the top portion of the body exposing the sealant layer.

9. A manufacturing method of a micro light-emitting diode display panel is characterized by comprising the following steps:

forming an array substrate;

installing a micro light-emitting diode on the array substrate, wherein the micro light-emitting diode comprises a main body and an extension part extending outwards from the bottom of the main body, and the thickness of a first side of the extension part close to the main body is smaller than that of a second side of the extension part far away from the main body;

and forming a sealing adhesive layer, wherein the sealing adhesive layer covers the extension part of the micro light-emitting diode and exposes the chip part away from the top of the array substrate.

10. A display device comprising the display panel according to any one of claims 1 to 8.

Technical Field

The present disclosure relates to the field of display panel technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.

Background

With the rapid development of display technology, Micro light emitting diode displays (Mini-LED displays and Micro-LED displays) have been developed gradually. In the conventional micro light emitting diode display panel, a micro light emitting diode is mounted on an array substrate, and a sealing adhesive layer on the array substrate covers the micro light emitting diode to prevent the micro light emitting diode from falling off. However, the existing sealing glue structure has the defects of insufficient strength or reduced optical quality.

Disclosure of Invention

The embodiment of the application provides a display panel, a manufacturing method thereof and a display device, and aims to solve the problem that the sealing glue strength in the existing micro light-emitting diode display panel is not enough.

The application provides a display panel, it includes:

the micro light-emitting diode comprises a main body and an extension part extending outwards from the periphery of the main body;

the array substrate is provided with the micro light-emitting diodes;

and the sealing adhesive layer is positioned on the array substrate and covers the extension part of the micro light-emitting diode.

In the display panel of the present application, the extension is near a bottom of the main body adjacent to the array substrate.

In the display panel of the present application, a thickness of a first side of the extension portion close to the main body portion is smaller than a thickness of a second side of the extension portion away from the main body portion.

In the display panel of this application, the extension including connect in the main part the bottom and the connecting portion that outwards extends and be located thickened piece on the connecting portion, thickened piece is close to the second side, the sealing compound layer covers connecting portion with thickened piece.

In the display panel of the present application, the micro light emitting diode includes a chip portion, the chip portion includes the extension portion and the main body, the main body includes a bottom plate and an electrode located on the bottom plate, the extension portion the connecting portion connect in the bottom plate and outwardly extend, the electrode with the material of the thickened part of the extension portion is the same.

In the display panel of the present application, the micro light emitting diode includes a chip portion and a package portion for packaging the chip portion, wherein the chip portion includes the main body, the package portion includes the extension portion, or the chip portion includes the main body and the connection portion of the extension portion, the package portion includes the extension portion of the thickening member.

In the display panel of the present application, a thickness of the extension portion increases in a direction from the first side toward the second side.

In the display panel of the present application, the main body includes a top portion away from the array substrate, and the sealant layer is exposed at the top portion of the main body.

The application provides a manufacturing method of a display panel, which comprises the following steps:

forming an array substrate;

installing a micro light-emitting diode on the array substrate, wherein the micro light-emitting diode comprises a main body and an extension part extending outwards from the bottom of the main body, and the thickness of a first side of the extension part close to the main body is smaller than that of a second side of the extension part far away from the main body;

and forming a sealing adhesive layer, wherein the sealing adhesive layer covers the extension part of the micro light-emitting diode and exposes the chip part away from the top of the array substrate.

The application also provides a display device which comprises any one of the display panels.

The beneficial effect of this application does: the extension part is arranged at the bottom of the chip or the packaging part of the micro light-emitting diode close to the array substrate, the micro light-emitting diode is fixed on the array substrate by the extension part and the sealing adhesive layer on the array substrate in a matched mode, and the surface of the chip far away from the top of the array substrate is exposed when the extension part is covered by the preferred sealing adhesive layer.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic view of a first structure of a micro light emitting diode according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a first structure of a display panel according to an embodiment of the present disclosure;

fig. 3 is a schematic view of a second structure of a micro light emitting diode according to an embodiment of the present disclosure;

fig. 4 is a schematic view of a second structure of a display panel according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a first semi-finished product of a micro light emitting diode according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a second semi-finished product of a micro light emitting diode according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a micro light emitting diode according to a second embodiment of the present application;

fig. 8 is a schematic view of a first structure of a micro light emitting diode according to a third embodiment of the present application;

fig. 9 is a schematic view of a second structure of a micro light emitting diode according to a third embodiment of the present application;

fig. 10 is a schematic structural diagram of an array substrate of a display panel according to a fourth embodiment of the present application;

fig. 11 is a schematic structural view illustrating a connection between an array substrate and a micro light emitting diode of a display panel according to a fourth embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of a display panel according to a fourth embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1 to 9, the present application provides a display panel 1000, where the display panel 1000 includes: the micro light emitting diode 10, the micro light emitting diode 10 includes a main body 200 and an extension portion 100 extending outward from the periphery of the main body 200; the array substrate 20, the miniature light emitting diode 10 is mounted on the array substrate 20; the sealing layer 340, the sealing layer 340 is located on the array substrate 20, and covers the extension portion 100 of the micro light emitting diode 10.

This application sets up the extension through the bottom that is close to array substrate at miniature emitting diode, the fixed miniature emitting diode of the sealing glue layer cooperation on extension and the array substrate is on array substrate, and expose the surface of keeping away from array substrate top with the chip when preferred sealing glue layer covers the extension, can strengthen the ability of the fixed chip of encapsulation through this kind of extension setting and sealing glue layer setting mode, promote steam and block the ability to improve miniature emitting diode display panel's reliability and product yield.

The technical solution of the present application will now be described with reference to specific embodiments.