阅读说明：本技术 用于高可靠性应用的标准sac合金的低银锡基替代焊料合金 (Low silver-tin based replacement solder alloys for standard SAC alloys for high reliability applications ) 是由 穆德·哈斯宁 立克·韦·霍 于 2018-10-31 设计创作，主要内容包括：无铅的锡基焊料合金包含银、铜、钴以及任选地铋和锑。合金还可包含镍。银以按焊料的重量计2.0％至2.8％的量存在。铜以按焊料的重量计0.2％至1.2％的量存在。铋能够以按焊料的重量计0.0％至5.0％的量存在。在一些实施方案中,铋能够以按焊料的重量计约1.5％至3.2％的量存在。钴以按焊料的重量计0.001％至0.2％的量存在。锑能够以按焊料的重量计约0.0％至约0.09％的量存在。焊料的余量为锡。(A lead-free tin-based solder alloy comprises silver, copper, cobalt, and optionally bismuth and antimony. The alloy may also include nickel. Silver is present in an amount of 2.0% to 2.8% by weight of the solder. Copper is present in an amount of 0.2% to 1.2% by weight of the solder. Bismuth can be present in an amount of 0.0% to 5.0% by weight of the solder. In some embodiments, bismuth can be present in an amount of about 1.5% to 3.2% by weight of the solder. Cobalt is present in an amount of 0.001% to 0.2% by weight of the solder. Antimony can be present in an amount of about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.)

1. A lead-free solder alloy comprising:

2.0 to 2.8 wt% silver;

0.2 to 1.2% by weight of copper;

0.0 to 5.0 wt% bismuth;

0.001 to 0.2 wt% cobalt;

0.0 to 0.09 wt.% antimony; and

the balance tin, and any unavoidable impurities.

2. The lead-free solder alloy of claim 1, further comprising 0.01 to 0.1 wt.% nickel.

3. The lead-free solder alloy of claim 2, comprising 0.05 wt.% nickel.

4. The lead-free solder alloy of claim 1, comprising 2.5 wt% silver.

5. The lead-free solder alloy of claim 1, comprising 0.5 to 0.8 wt.% copper.

6. The lead-free solder alloy of claim 5, comprising 0.75 wt.% copper.

7. The lead-free solder alloy of claim 1, comprising 1.5 to 3.2 wt.% bismuth.

8. The lead-free solder alloy of claim 7, comprising 3.0 wt.% bismuth.

9. The lead-free solder alloy of claim 1, comprising 0.03 to 0.05 wt.% cobalt.

10. The lead-free solder alloy of claim 9, comprising 0.03 wt.% cobalt.

11. The lead-free solder alloy of claim 1, comprising 0.05 wt.% antimony.

Technical Field

The present disclosure generally relates to lead-free solder alloys for electronic applications.

Background

Solder alloys are widely used in the manufacture and assembly of various electronic devices. Traditionally, the solder alloy is a tin-lead based alloy. Tin-lead based alloys are used to prepare solders with desirable material properties, including suitable melting point and paste temperature ranges, wetting properties, ductility, and thermal conductivity. However, lead is a highly toxic, environmentally hazardous material that can lead to a wide range of deleterious effects. Accordingly, research has been directed to preparing lead-free solder alloys having desirable material properties.

The present disclosure relates to a low silver lead-free solder alloy that provides lower supercooling temperatures and improved solder joint drop/shock reliability. The alloy maintains thermal cycling performance relative to certain prior art alloys, including alloys containing 96.5 wt% tin, 3.0% silver, and 0.5 wt% copper ("SAC 305"), while allowing lower process temperatures and reduced aging effects during exposure to high temperatures.

Disclosure of Invention

According to one aspect of the present disclosure, a lead-free alloy includes: 2.0 to 2.8 wt% silver, 0.2 to 1.2 wt% copper; 0.0 to 5.0 wt% bismuth; 0.001 to 0.2 wt% cobalt; 0.0 to 0.1% by weight of antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy may further comprise 0.01 to 0.1 wt% nickel.

According to another aspect of the present disclosure, a lead-free alloy includes: 2.4 to 2.6 wt% silver, 0.5 to 0.8 wt% copper; 1.5 to 3.2 wt% bismuth; 0.03 to 0.05 wt% cobalt; 0.03 to 0.07% by weight of antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy may further comprise 0.03 wt.% to 0.07 wt.% nickel.

According to another aspect of the present disclosure, a lead-free alloy includes: 2.5% by weight of silver, 0.75% by weight of copper; 3.0 wt% bismuth; 0.03 wt% cobalt; 0.05% by weight of antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy may also include 0.05 wt% nickel.

It is to be understood that both the foregoing general description and the following detailed description describe various embodiments, and are intended to provide an overview or framework for understanding the nature and character of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments described herein and together with the description serve to explain the principles and operations of the claimed subject matter.

Drawings

This patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the office upon request and payment of the necessary fee.

The following is a description of the embodiments depicted in the accompanying drawings. The figures are not necessarily to scale and certain features and certain views of the figures may be shown exaggerated in scale or in schematic for clarity or conciseness.

FIG. 1A is an SEM micrograph of a prior art SAC305 alloy in the as-cast condition.

FIG. 1B is an SEM micrograph of a prior art SAC305 alloy that has been aged at 125 ℃ for 24 hours.

Fig. 2A is an SEM micrograph of an alloy according to the present disclosure in the as-cast condition.

FIG. 2B is an SEM micrograph of an alloy according to the present disclosure that has been aged at 125 ℃ for 24 hours.

FIG. 3 is a Differential Scanning Calorimetry (DSC) profile of a prior art SAC305 alloy.

FIG. 4 is a Differential Scanning Calorimetry (DSC) profile of an alloy according to the present disclosure.

FIG. 5 is a Differential Scanning Calorimetry (DSC) profile of an alloy according to the present disclosure.

FIG. 6 is a Differential Scanning Calorimetry (DSC) profile of an alloy according to the present disclosure.

FIG. 7A is a bar graph showing a comparison between the wetting times of two alloys according to the present disclosure and a prior art SAC305 alloy.

FIG. 7B is a bar graph showing a comparison between the maximum wetting force of two alloys according to the present disclosure and a prior art SAC305 alloy.

FIG. 8A is a bar graph showing a comparison between the spreading rates of an alloy according to the present disclosure and a prior art SAC305 alloy.

FIG. 8B is a bar graph showing a comparison between the spreadability of an alloy according to the present disclosure and a prior art SAC305 alloy.

Fig. 9A is a bar graph showing the spreading rate of alloys according to the present disclosure on three different substrates.

Fig. 9B is a bar graph showing the spreadability of alloys according to the present disclosure on three different substrates.

FIG. 10A is a line graph showing a comparison between the dissolution rate of copper wire at 260 ℃ for an alloy according to the present disclosure and a prior art SAC305 alloy.

FIG. 10B is a line graph showing a comparison between the dissolution rate of copper wire at 280 ℃ for an alloy according to the present disclosure and a prior art SAC305 alloy.

FIG. 11A shows a series of comparative optical micrographs comparing the dissolution rate of copper wire at 260 ℃ for an alloy according to the present disclosure and a prior art SAC305 alloy.

FIG. 11B shows a series of comparative optical micrographs comparing the dissolution rate of copper wire at 280 ℃ for alloys according to the present disclosure and prior art SAC305 alloy.

FIG. 12A is a bar graph showing a comparison between the hardness of an alloy according to the present disclosure and a prior art SAC305 alloy.

FIG. 12B is a bar graph showing a comparison between the hardness of an alloy according to the present disclosure and a prior art SAC305 alloy, where both alloys have been isothermally aged at 150 ℃.

FIG. 13 is a line graph showing stress-strain curves for an alloy according to the present disclosure and a prior art SAC305 alloy.

FIG. 14 is a bar graph showing a comparison of the ultimate tensile strength of an alloy according to the present disclosure and a prior art SAC305 alloy.

FIG. 15 is a line graph showing creep strain as a function of time for an alloy according to the present disclosure and a prior art SAC305 alloy in the as-cast state and after aging at 150 ℃ for 144 hours.

Fig. 16A shows a series of photomicrographs of the interface between an alloy according to the present disclosure and an underlying copper substrate after aging at 150 ℃ for 240 hours, 720 hours, and 1440 hours.

Figure 16B shows a series of photomicrographs of the interface between the prior art SAC305 alloy and the underlying copper substrate after aging at 150 ℃ for 240 hours, 720 hours, and 1440 hours.

FIG. 17 is a line graph showing the total IMC thickness of an alloy according to the present disclosure and a prior art SAC305 alloy as a function of aging time at 150 ℃.

FIG. 18 is Cu showing an alloy according to the present disclosure and a prior art SAC305 alloy₃Line graph of Sn IMC thickness as a function of aging time at 150 ℃.

The foregoing summary, as well as the following detailed description of embodiments, will be better understood when read in conjunction with the appended drawings. It should be understood that the claims are not limited to the arrangements and instrumentality shown in the drawings. Further, the appearance shown in the drawings is one of many decorative appearances that can be used to achieve a specified function of the device.

Detailed Description

In the following detailed description, specific details may be set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, to one skilled in the art, that the disclosed embodiments may be practiced without some or all of these specific details. Well-known features or methods may not be described in detail for the sake of brevity. Further, like or identical reference numerals can be used to identify common or similar elements.

Described below are novel lead-free solder alloy compositions suitable for various electronic applications, particularly portable electronic devices. These solder alloy compositions may be used in various forms. For example, the solder alloy composition may be used in the form of a rod, wire, solder powder, solder paste, or another predetermined preform. These solder alloy compositions are tin-based, particularly tin-silver-copper (sometimes referred to as "SAC").

The present disclosure relates to low-silver lead-free solder alloys that exhibit reduced undercooling temperatures, reduced process temperatures, suitable wetting and spreading properties, improved thermal cycling and drop/shock impact reliability, and reduced aging effects during high temperature exposure (compared to certain prior art alloys). Such solder alloys may be used in portable electronic devices, such as mobile phones and cameras.

The thermal cycling and drop/shock reliability of tin-silver-copper solders depends on the silver content in the solder. High silver content (. gtoreq.3%) tends to provide better thermal cycling reliability but relatively poor drop/shock performance, while low silver content (. ltoreq.2%) tends to show the opposite-poor thermal cycling reliability but relatively good drop/shock performance. Accordingly, there is a need to develop tin-silver-copper solder compositions that exhibit both good thermal cycling and good drop/shock reliability.

The addition of a small amount of cobalt to tin-silver-copper solder (containing ≦ 3 wt% silver) significantly reduces the undercooling temperature and reduces the larger Ag compared to certain prior art alloys₃Sn flakes form (which otherwise could lead to poor mechanical properties). In addition, the synergistic effect of adding bismuth and a small amount of silver improvesThe drop/shock reliability of the solder while maintaining thermal cycling performance equivalent to prior art alloys such as SAC 305. The addition of bismuth lowered the melting temperature of the solder to about 6-10 c below the melting temperature of SAC 305. This enables the process temperature to be limited, which reduces potential warping (deformation) of the printed circuit board on which the solder is deposited. Indeed, when using SAC305 solder, one major problem is that the higher process temperatures can damage the plates and components during assembly. Furthermore, the overall mechanical strength of the solder joint is improved. Thus, the low-silver lead-free solder compositions disclosed herein simultaneously exhibit reduced undercooling temperatures, reduced process temperatures, and improved thermal cycling and drop/shock impact reliability.

It has been found that the compositions shown in tables 1 and 2 exhibit desirable properties over certain prior art alloys, including SAC 305.

Table 1 provides several compositions according to the present disclosure that include tin, silver, copper, bismuth, cobalt, and antimony. Optionally, these compositions may also comprise nickel.

TABLE 1

Table 2 provides several further compositions according to the present disclosure shown as specific examples.

TABLE 2

Controlled addition of bismuth (Bi), antimony (Sb), cobalt (Co) and/or nickel (Ni) in the tin-silver-copper (Sn-Ag-Cu) system serves to refine the grain structure of the alloy and increase the mechanical strength of the alloy. More specifically, cobalt may be added to the alloy to refine the grain structure and reduce the undercooling temperature. As an additive to the tin-silver-copper system, both bismuth and antimony are dissolved in tin and can be added to the alloy to provide solid solution strengthening and thus improve the mechanical properties of the alloy and the thermal cycling reliability of any resulting solder joint, especially in harsh environments. Also, bismuth lowers the solidus temperature of the alloy and lowers its surface tension, thereby improving wettability. Antimony increases the mechanical strength of the alloy. The addition of antimony in small amounts (0-0.09 wt%) did not affect the melting characteristics of the alloy. The addition of antimony in larger amounts increases the melting temperature of the alloy. Optionally, nickel may be added to further improve the mechanical properties of the alloy. In addition, elements such as germanium or phosphorus may be added to improve the oxidation resistance of the alloy. Particularly in mobile electronic applications, the proper synergy between the above mechanisms, achieved by the specific compositional ranges claimed in this patent application, optimizes the mechanical properties of the alloy and the thermal cycling and drop/shock impact reliability of any resulting solder joint.

FIGS. 1A and 1B show scanning electron microscope ("SEM") micrographs of a surface region of a prior art SAC305 alloy comprising 96.5 wt% tin, 3.0% silver, and 0.5 wt% copper. Fig. 2A and 2B show SEM micrographs of surface areas of alloys according to the composition of example 2.3 shown in table 2. FIGS. 1A and 2A illustrate an as-cast alloy; while figures 1B and 2B show the alloy after aging at a temperature of 125 c for 24 hours. As can be seen from the SEM micrographs, the grain structure of the SAC305 alloy (shown in FIGS. 1A and 1B) coarsens during aging at high temperatures. In contrast, the example 2.3 alloy maintained its finer, more uniform grain structure during aging at 125 ℃ (compare fig. 2A with fig. 2B). The microstructure comprises Ag₃Sn and Cu₆Sn₅The precipitates, and bismuth and antimony each dissolve in the tin matrix, which provides solid solution strengthening. Cobalt is used as a micro-alloying element to refine the microstructure. Finely distributed Ag during aging at high temperatures₃Sn and Cu₆Sn₅Precipitates and solid solution strengthening stabilize the microstructure.

As shown in fig. 3 to 6, the melting characteristics of the solder alloy were measured by Differential Scanning Calorimetry (DSC). The degree of supercooling (i.e., the temperature difference between the heating start temperature and the cooling start temperature) of the solder alloy was measured. Supercooling occurs because precipitation of crystals is not spontaneous, but requires activation energy. FIG. 3 shows the DSC curve of a prior art SAC305 alloy containing 96.5 wt% tin, 3.0% silver, and 0.5 wt% copper. Fig. 4, 5 and 6 show DSC curves for alloys according to the compositions of examples 2.2, 2.3 and 2.5 shown in table 2, respectively. In addition, data of DSC analysis are shown in table 3.

TABLE 3

The deep undercooling behavior of tin-silver-copper (Sn-Ag-Cu) solder indicates that molten tin solder is difficult to solidify. Deep undercooling is attributed to the difficulty in nucleating the solid phase from the liquid phase. Deep undercooling can affect microstructural features such as tin dendrites, eutectic microstructures, primary intermetallic compounds (Ag)₃Sn，Cu₆Sn₅) This in turn affects the mechanical properties of the solder. Such undercooling can have a severe impact on the reliability of the solder joint and create the disadvantage that the joint solidifies at different times. This can lead to stress concentrations in the cured joint and mechanical failure.

As can be seen by comparing fig. 3 with fig. 4-6 and by examining table 3, several exemplary alloys exhibit a significant reduction in supercooling as compared to the prior art SAC305 alloy. For example, for the prior art SAC305 alloy, the heating onset (T-i) is 217 ℃ and the cooling onset (T-i)₂) Is 197 ℃ to provide a supercooling degree (. DELTA.T) of 20 ℃. For the example 2.3 alloy, Ti is about 212 ℃ and T₂About 205.6 c, thereby providing a degree of supercooling (at) in excess of 6 c. The supercooling of the alloy of example 2.5 is even less than about 5.5 ℃.

FIGS. 7A and 7B show a comparison between the wetting time (FIG. 7A) and the maximum wetting force (FIG. 7B) for a prior art SAC305 alloy, an example 2.3 alloy, and an example 2.5 alloy. The wetting experiments were carried out according to the IPC (International Association Connecting Electronics Industries) standard IPC-TM-650. This standard relates to the wetting balance test, which involves determining the total wetting time and maximum wetting force. Shorter wetting times correspond to higher wettability. Shorter wetting times and higher wetting forces reflect better wetting performance and are associated with spreading and fillet formation for a given welding process. Figures 7A and 7B show that the wetting characteristics of the example 2.3 and 2.5 alloys are superior to (or minimally equivalent to) the prior art SAC305 alloy.

The wetting properties of solder can also be expressed in terms of spreading rate and spreadability. The spread area indicates how much solder is on the pad substrate and can be expressed as a spread rate. The spreading test was carried out according to IPC (IPC J-STD-004B, TM 2.4.46) and JIS Z3197 standards. The spreading rate and spreadability of three different substrates were studied: bare copper (Cu), Organic Solderability Preservative (OSP) coated copper, and Electroless Nickel Immersion Gold (ENIG) copper plating. A solder alloy (circular preform) is melted onto the substrate to be tested using a flux. The wetted area was measured using an optical microscope before and after the test. The spread rate was calculated by dividing the wetted area after reflow soldering/melting by the wetted area before reflow soldering/melting. The solder height was measured to calculate the spreadability (or spreading factor). Spreadability was calculated using the formula where SR ═ spreadability, D ═ solder diameter (assumed to be spherical), H ═ height of spread solder, and V ═ solder volume (g/cm)³) (estimated from the quality and density of the solder tested):

wherein D is 1.248 × V¹/3

Fig. 8A shows a comparison between the spreading rates of the example 2.3 alloy on bare copper substrates compared to the prior art SAC alloy at two different temperatures (260 ℃ and 300 ℃). FIG. 8B shows a comparison between the spreadability of the example 2.3 alloy compared to a SAC alloy of the prior art at two different temperatures (260 ℃ and 300 ℃).

Fig. 9A shows a comparison between the spreading rates of the example 2.3 alloy on three different copper substrates (OSP, bare copper and ENIG) at 255 ℃. Fig. 9B shows a comparison between the spreadability of the example 2.3 alloy on three different copper substrates (OSP, bare copper and ENIG) at 255 ℃.

FIGS. 10A, 10B, 11A and 11B show a comparison between the copper dissolution rates of the prior art SAC305 alloy and the example 2.3 alloy (alloy-B) at 260 deg.C (FIGS. 10A and 11A) and at 280 deg.C (FIGS. 10B and 11B). From these figures, it can be seen that the copper dissolution rate of the example 2.3 alloy is slower compared to the prior art SAC305 alloy. Copper dissolution testing was performed using pure copper wire that was washed with acid solution, degreased, cleaned, rinsed and dried. The test was performed at two temperatures: 260 ℃ and 280 ℃. The copper wire was exposed to the molten solder for 5 seconds, 10 seconds, and 20 seconds. The cross-section of the copper wire was analyzed by optical microscopy, including for area measurement and analysis.

FIG. 12A shows the hardness values of the example 2.3 alloy compared to the prior art SAC305 alloy. As can be seen from the bar graph, the hardness of the example 2.3 alloy is higher than the hardness of the prior art SAC305 alloy. Furthermore, the example 2.3 alloy retained its hardness after aging, in contrast to the prior art SAC305 alloy, as shown in FIG. 12B, which shows the hardness test results in the as-cast state, after aging at 150 ℃ for 144 hours, and after aging at 150 ℃ for 720 hours.

The Coefficient of Thermal Expansion (CTE) of the alloys according to the present disclosure was also measured. A mismatch between the CTE of the solder and the underlying substrate can lead to fatigue failure during cyclic loading. As the CTE mismatch increases, the shear strain also increases, which reduces the thermal cycle life of the component. Cracks can initiate and propagate at stress concentration sites due to CTE mismatch. Cracks in the solder joint can be reduced by reducing the difference between the CTE of the solder and the underlying substrate. Table 4 shows the CTE of the alloy according to the present disclosure compared to the prior art SAC305 alloy, and with reference to the CTE of the exemplary underlying substrate.

TABLE 4

A tensile stress-strain plot of an exemplary alloy according to the present disclosure (example 2.3 alloy) compared to a prior art SAC305 alloy is shown in FIG. 13. cast solder is processed and cut into rectangular pieces with dimensions 100mm × 6mm × 3 mm. the samples are isostatically aged at 150 ℃ for up to 720 hours^-2s^-1Is performed. The ultimate tensile strength and yield strength of the alloys are shown in table 5. The significant improvement in tensile strength shown by the alloy of example 2.3 can be attributed to the addition of bismuthAnd a solid solution strengthening effect. The example 2.3 alloy also shows to be more ductile than the prior art SAC305 alloy. The tensile strength properties of the example 2.3 alloy and the prior art SAC305 alloy after aging at 150 ℃ are shown in FIG. 14. Both the example 2.3 alloy and the prior art SAC305 alloy showed a decrease in ultimate tensile strength after aging at elevated temperatures, but such a decrease was significantly more pronounced for the prior art SAC305 alloy, which exhibited a decrease in tensile strength of about 42%.

TABLE 5

Creep deformation is the dominant failure mode of solder joints in microelectronic packages due to the high homologous temperatures involved. Due to the different Coefficients of Thermal Expansion (CTE) between the chip and other layers within the package, the solder experiences thermo-mechanical stress. These stresses can lead to plastic deformation over long-term use. The solder alloy may creep even at room temperature. In real life

In use, the electronic module can operate in a temperature range of-40 ℃ to +125 ℃, which is 0.48 to 0.87T_mThe creep deformation in lead-free solder is therefore a significant concern in the electronics packaging industry.A cast solder is processed and cut into rectangular pieces with dimensions of 120mm × 6mm × 3 mm.the sample is isostatically aged at 150 ℃ for up to 144 hours.the creep test is performed at room temperature and stress level of 10 MPa.As shown in FIG. 15, the example 2.3 alloy according to the present disclosure exhibits superior creep resistance compared to the prior art SAC305 alloy.the creep resistance exhibited by the example 2.3 alloy may be due to the addition of micro-alloys to refine the microstructure, as well as strengthening mechanisms such as solution and precipitation hardening.

During the soldering operation, material from the solid substrate melts and mixes with the solder, allowing the formation of intermetallic compounds (IMCs). A thin, continuous and uniform layer of IMC tends to be important for good soldering. Without IMC, the solder/conductor joint tends to be weak because no metallurgical interaction occurs in the solder. However, a thicker IMC layer at the interface may reduce the reliability of the solder joint, as a thicker IMC layer may be brittle. The IMC layer formed between the solder and the OSP substrate was examined as a function of exposure time and temperature. The solder alloy was melted on the OSP substrate and reflow soldered in an Electrovert OmniExcel 7 zone reflow oven using solder flux. The solder alloy samples were then exposed to an elevated temperature of 150 c for up to 1440 hours. The IMC layer was evaluated at different aging periods.

Fig. 16A and 16B show a comparison between IMC layer growth for the example 2.3 alloy and the SAC305 alloy after aging at 150 ℃ for up to 1440 hours. As can be seen from these figures, both the example 2.3 alloy and the SAC305 alloy exhibit IMC layer growth. However, the SAC305 alloy shows signs of brittleness, as indicated by the presence of kirschner pores (e.g., after 720 hours of aging). Both alloys show the formation of CueSn at the interface between the solder and the copper substrate₅And a CuaSn layer. Fig. 17 shows the total IMC thickness as a function of aging time. As shown in fig. 17, the IMC layer of the SAC305 alloy is much thicker than the IMC layer of the example 2.3 alloy. The addition of micro-alloys to refine the microstructure can limit diffusion and therefore also limit the overall IMC growth. The lower IMC thickness in the example 2.3 alloy may make the example 2.3 alloy suitable for longer life applications at high temperatures. FIG. 18 shows total Cu as a function of aging time₃And Sn thickness. In Cu₆Sn₅At the interface with the Cu substrate, Cu is formed for both alloys₃A new IMC layer of Sn. In the alloy of example 2.3, the addition of the microalloy inhibited Cu₃Sn growth, which may limit the formation of kirschner pores.

Some elements described herein are explicitly identified as optional, while other elements are not identified in this manner. Even if not so identified, it should be noted that in some embodiments, some of these other elements are not intended to be construed as essential, and will be understood by those skilled in the art as optional.

While the disclosure has been described with reference to certain implementations, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the inventive method and/or system. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the scope thereof. For example, the systems, blocks, and/or other components of the disclosed embodiments may be combined, divided, rearranged, and/or otherwise modified. Therefore, the present disclosure is not limited to the particular implementations disclosed. On the contrary, this disclosure is to cover all embodiments falling within the scope of the appended claims, both literally and under the doctrine of equivalents.